CN102982744A - Display module of LED (light emitting diode) - Google Patents
Display module of LED (light emitting diode) Download PDFInfo
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- CN102982744A CN102982744A CN2012105503830A CN201210550383A CN102982744A CN 102982744 A CN102982744 A CN 102982744A CN 2012105503830 A CN2012105503830 A CN 2012105503830A CN 201210550383 A CN201210550383 A CN 201210550383A CN 102982744 A CN102982744 A CN 102982744A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The embodiment of the invention discloses a display module of an LED (light emitting diode), which is used for realizing seamless splicing of LED display screens. The display module provided by the embodiment of the invention comprises a circuit board formed by multiple layers of circuit boards, LED chips and IC (integrated circuit) plate chips, wherein the circuit board comprises an LED chip plate distribution region, a flexible printed circuit board bending region and an IC plate distribution region, wherein the length of the LED chip plate distribution region is an integral multiple of the distance of an LED dot matrix; two branches are formed at one end of the LED chip plate distribution plate region by the circuit board; one branch horizontally extends to a tail end; the other branch extends downwards into the flexible printed circuit board bending region; and the flexible printed circuit board bending region is completely covered by the LED chip plate distribution region, so that the flexible printed circuit board bending region is hidden below the LED chip plate distribution region.
Description
Technical field
The present invention relates to light emitting diode (LED, Light Emitting Diode) display technique field, especially relate to a kind of LED and show module.
Background technology
Along with the fast development of LED display technique, the LED display curtain is come into indoor gradually from the open air in recent years, and it shows that reticular density is more and more higher, and point is apart from doing less and less, and display resolution is more and more higher, and beginning is initiated challenge to indoor other display systems.
In general, a large LED display curtain is comprised of a plurality of little demonstration module splicings usually, and according to differences such as manufacture craft, materials, the LED module is divided into polytype.Wherein, with flexible PCB (FPC, Flexible Printed Circuit) the LED module of combination (be also referred to as flexible LED show module) have that volume is little, thin thickness, the characteristics such as lightweight, flexible, bent, with printed circuit board (PCB) (PCB, PrintedCircuit Board) the hardboard module is compared, flexible LED shows that the distribution density of module is high, is particularly useful for the LED display curtain of high density dot matrix.At present, existing a kind of LED shows that modular structure (showing that take flexible LED modular structure is as example) can as shown in Figure 1a, comprise led chip fabric swatch zone A, bending region B, surface-mounted integrated circuit (IC, Integrated Circuit) is prohibited cloth zone C, IC fabric swatch zone D.Each regional along continuous straight runs is arranged sequentially during with the flexible circuit plate development, and shown in Fig. 1 b, bending region B prohibits between the C of cloth zone at led chip fabric swatch zone A and IC.But when two flexible LEDs show that module splices, bending region B will be present between the contiguous concatenation module, and the radius bend of flexible PCB (being generally 3-10 times of thickness of slab, about 0.5-2 millimeter) will become the splicing gap between two modules.When LED display curtain pixel apart from 3 millimeters or when following, the disappearance that image shows is can not ignore and is visually formed in this splicing gap, thereby affects final display effect.
Summary of the invention
The embodiment of the invention provides a kind of LED to show module, is used for realizing the seamless spliced of LED display curtain.
In view of this, one aspect of the present invention provides a kind of LED to show module, can comprise wiring board, led chip, surface-mounted integrated circuit IC chip, wherein:
Described wiring board is multilayer circuit board, and described wiring board comprises led chip fabric swatch zone, soft board bending region and IC fabric swatch zone, and wherein, described led chip fabric swatch zone length is the integral multiple of LED lattice point distance;
Described wiring board forms branch at described led chip fabric swatch zone one end, wherein a branch extends horizontally to end, another branch extends to described soft board bending region downwards, described led chip fabric swatch zone hides described soft board bending region fully, so that described soft board bending region is hidden under the described led chip fabric swatch zone.
In the possible embodiment of the first, described wiring board is the hard and soft board that flexible PCB FPC or FPC are combined with printing board PCB, wherein, wiring board on the described led chip fabric swatch zone is FPC or described hard and soft board, wiring board on the described soft board bending region is FPC, and the wiring board on the described IC fabric swatch zone is FPC or described hard and soft board.
In the possible embodiment of the second, described led chip is arranged at described led chip fabric swatch zone and is electrically connected with described wiring board; Described IC chip is arranged at described IC fabric swatch zone and is electrically connected with described wiring board.
In conjunction with first aspect or first aspect the first or the possible embodiment of first aspect the second, in the third possible embodiment, described wiring board forms the branch of Y-shaped setting at one end isolated edge 1-2 millimeter place, described led chip fabric swatch zone.
In conjunction with first aspect or first aspect the first or the possible embodiment of first aspect the second, in the 4th kind of possible embodiment, the wiring board on the described soft board bending region is the FPC of 1-2 layer.
In the 5th kind of possible embodiment, described LED shows that module comprises that also IC prohibits the cloth zone, and the wiring board that described IC prohibits on the cloth zone is multilayer circuit board, between described soft board bending region and described IC fabric swatch zone.
As can be seen from the above technical solutions, the LED that the embodiment of the invention provides shows module, wiring board forms branch at led chip fabric swatch zone one end, wherein branch's downward bending is as the soft board bending region, so that described soft board bending region is hidden under the described led chip fabric swatch zone fully, therefore, LED shows when module splices, the soft board bending region that hides is conducive to eliminate the impact that the soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that led chip fabric swatch zone length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize the screen appreciation effect.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the invention, the below will describe to embodiment the simply introduction of accompanying drawing do of required use, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 a is the structural representation that existing a kind of flexible LED shows module;
Fig. 1 b is the structural representation that existing a kind of flexible LED shows the module horizontal development shown in Fig. 1 a;
A kind of LED that Fig. 2 a provides for the embodiment of the invention shows the structural representation of module;
A kind of LED that Fig. 2 b provides for the embodiment of the invention shows the structural representation of module horizontal development;
A kind of LED that Fig. 2 c provides for the embodiment of the invention shows the splicing synoptic diagram of module;
A kind of LED that Fig. 2 d provides for the embodiment of the invention shows another splicing synoptic diagram of module;
A kind of LED that Fig. 3 a provides for the embodiment of the invention shows another structural representation of module;
A kind of LED that Fig. 3 b provides for the embodiment of the invention shows another splicing synoptic diagram of module;
A kind of LED that Fig. 4 a provides for the embodiment of the invention shows another structural representation of module;
A kind of LED that Fig. 4 b provides for the embodiment of the invention shows another splicing synoptic diagram of module;
A kind of LED that Fig. 5 a provides for the embodiment of the invention shows another structural representation of module;
A kind of LED that Fig. 5 b provides for the embodiment of the invention shows another splicing synoptic diagram of module.
Embodiment
The embodiment of the invention provides a kind of LED to show module, is used for realizing the seamless spliced of LED display curtain.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other embodiment that obtain under the creative work prerequisite.
The embodiment of the invention provides a kind of LED to show module, can comprise wiring board, led chip, surface-mounted integrated circuit IC chip, wherein, described wiring board is multilayer circuit board, described wiring board comprises led chip fabric swatch zone, soft board bending region and IC fabric swatch zone, wherein, described led chip fabric swatch zone length is the integral multiple of LED lattice point distance; Described wiring board forms branch at described led chip fabric swatch zone one end, wherein a branch extends horizontally to end, another branch extends to described soft board bending region downwards, described led chip fabric swatch zone hides described soft board bending region fully, so that described soft board bending region is hidden under the described led chip fabric swatch zone.
Be understandable that in the embodiment of the invention, multilayer circuit board refers to have three layers or the circuit board more than 3 layers is suppressed the wiring board that stacks;
Wherein, described led chip is arranged at described led chip fabric swatch zone and is electrically connected with described wiring board; Described IC chip is arranged at described IC fabric swatch zone and is electrically connected with described wiring board.
In some embodiments, described wiring board is the hard and soft board that flexible PCB FPC or FPC are combined with printing board PCB, wherein, wiring board on the described led chip fabric swatch zone is FPC or described hard and soft board, wiring board on the described soft board bending region is FPC, and the wiring board on the described IC fabric swatch zone is FPC or described hard and soft board.
From the above, the LED that the embodiment of the invention provides shows module, wiring board forms branch at led chip fabric swatch zone one end, wherein branch's downward bending is as the soft board bending region, so that described soft board bending region is hidden under the described led chip fabric swatch zone fully, therefore, LED shows when module splices, the soft board bending region that hides is conducive to eliminate the impact that the soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that led chip fabric swatch zone length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize the screen appreciation effect.
Below show the difference of circuit sheet material matter in the module for LED, and the difference setting of each regional place on line structure shows that to the LED that provides module describes in detail:
In one embodiment, can be with reference to figure 2a, Fig. 2 a shows the modular structure synoptic diagram for a kind of LED that this embodiment provides, wherein, described LED shows that module can comprise:
Flexible PCB 1 (being that wiring board is FPC), led chip 2, IC chip 3.Described flexible PCB 1 comprises led chip fabric swatch zone A ', and soft board bending region B ', IC prohibit cloth zone C ' and IC fabric swatch zone D ', and IC prohibits cloth zone C ' and is positioned between described soft board bending region B ' and the described IC fabric swatch zone D '; Wherein, flexible PCB 1 plate body and led chip 2 electrical connections at led chip fabric swatch zone A ', in element electrical connections such as flexible PCB 1 plate body of IC fabric swatch zone D ' and IC chips 3, soft board bending region B ' prohibits on the regional C ' of cloth with IC electronic component all is not set.
Described flexible PCB 1 is multilayer circuit board, and the multilayer conductive layer is realized electrical connection by the plated-through-hole on the circuit board transversal section; Shown in Fig. 2 a, in the described flexible PCB 1 (multilayer circuit board), the wiring board on the B ' of soft board bending region is the FPC of 1-2 layer, all the other zones (A ', C ', D ') wiring board on is the FPC (such as the number of plies more than 3 layers or 3 layers) of multilayer;
Wherein, at A ' edge, led chip fabric swatch zone and soft board bending region B ' phase joining place, flexible PCB 1 (multilayer circuit board) forms branch, wherein the 1-2 layer basal plate near bottom branches out the soft board bending region B ' that is used as flexible PCB 1 from multilayer circuit board, branch's upper strata multilayer board out extends a bit of end as led chip fabric swatch zone A ', so that the length of led chip fabric swatch zone A ' is the integral multiple of LED point distance just; What expect easily in addition is that the multilayer board branch of extension still has electrical connection and plays a part support led chip 2 with led chip 2.
Further, at A ' edge, led chip fabric swatch zone and soft board bending region B ' phase joining place, (flexible PCB 1) multilayer circuit board forms branch, can be specially, multilayer circuit board forms the branch of Y-shaped setting at a led chip fabric swatch A ' end isolated edge 1-2 millimeter place, zone (namely with soft board bending region B ' phase joining place), be that soft board bending region B ' (FPC of 1-2 layer) is separating bending from an A ' end isolated edge 1-2 millimeter place, led chip fabric swatch zone with the upper strata multilayer board, so that soft board bending region B ' is hidden under the A ' of led chip fabric swatch zone, shown in Fig. 2 a; Soft board bending region B ' continues to extend to IC and prohibits C ' position, cloth zone, and flexible PCB 1 reverts to multiple-plate trace arrangements, and is retained to the D ' end of IC fabric swatch zone always.
In the present embodiment, during with flexible PCB 1 horizontal development, soft board bending region B ' is positioned at below, A ' edge, led chip fabric swatch zone, can be in the lump with reference to figure 2b, and Fig. 2 b is the structural representation that LED shown in Fig. 2 a shows the module horizontal development; When using LED to show module, generally can be with IC fabric swatch zone D ' down or backward bending, only expose led chip fabric swatch zone A ', shown in Fig. 2 c and Fig. 2 d, the splicing synoptic diagram that shows module for the LED shown in Fig. 2 a and Fig. 2 b, such as Fig. 2 c, when LED shows that module splices, IC fabric swatch zone D ' down bending is fixed on the face vertical with led chip fabric swatch zone A ', can carry out showing the splicing that module soft board bending region B ' is relative at soft board bending region B ' and another LED, such as Fig. 2 d, can carry out soft board bending region B ' and show the splicing that the non-soft board of module bending region is relative with another LED; Shown in Fig. 2 c and Fig. 2 d, as long as the led chip fabric swatch zone A ' of splicing module can realize the seamless spliced of LED display curtain for the integral multiple of LED lattice point distance when LED shows that module splices shown in guaranteeing.
From the above, the LED that the embodiment of the invention provides shows module, wiring board forms branch at a led chip fabric swatch zone A ' end, wherein branch's downward bending is as soft board bending region B ', so that described soft board bending region B ' is hidden under the described led chip fabric swatch zone A ' fully, therefore, LED shows when module splices, the soft board bending region B ' that hides is conducive to eliminate the impact that the soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that led chip fabric swatch zone A ' length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize the screen appreciation effect.
In another embodiment, can be with reference to figure 3a, Fig. 3 a shows the modular structure synoptic diagram for a kind of LED that this embodiment provides, wherein, described LED shows that module can comprise:
Flexible PCB 1 (being that wiring board is FPC), led chip 2, IC chip 3.Described flexible PCB 1 comprises led chip fabric swatch zone A ', and soft board bending region B ', IC prohibit cloth zone C ' and IC fabric swatch zone D ', and IC prohibits cloth zone C ' and is positioned between described soft board bending region B ' and the described IC fabric swatch zone D '; Wherein, multilayer circuit board (FPC) on the A ' of led chip fabric swatch zone forms the branch of Y-shaped setting at its isolated edge 1-2 millimeter place, wherein a branch continues to extend the end as led chip fabric swatch zone A ', another branch's downward bending is as soft board bending region B ', so that soft board bending region B ' is hidden under the A ' of led chip fabric swatch zone.
In the present embodiment, IC chip 3 is arranged in the D ' outside, IC fabric swatch zone, shown in Fig. 3 a, flexible PCB 1 can be fixed on the back up pad 4 with the U-shaped bending, back up pad 4 upper surfaces are used for fixing and support led chip fabric swatch zone A ', the side of back up pad 4 is soft board bending region B ' and IC taboo cloth zone C ' fixedly, and the bottom surface of back up pad 4 is IC fabric swatch zone D ' fixedly;
Can be in the lump with reference to figure 3b, Fig. 3 b is a kind of splicing synoptic diagram that the LED shown in Fig. 3 a shows module, can carry out showing the splicing that module soft board bending region B ' is relative at soft board bending region B ' and another LED, what expect easily in addition is, also can carry out soft board bending region B ' and show the splicing that the non-soft board of module bending region is relative with another LED, not do to limit herein; Shown in Fig. 3 b, when showing the module splicing, two LED as long as guarantee that the led chip fabric swatch zone A ' of splicing module is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain.
Be understandable that LED shows in the module that the structure setting between led chip fabric swatch zone A ' and the soft board bending region B ' can be carried out specific implementation with reference to a upper embodiment, repeats no more herein.
From the above, the LED that the embodiment of the invention provides shows module, wiring board forms branch at a led chip fabric swatch zone A ' end, wherein branch's downward bending is as soft board bending region B ', so that described soft board bending region B ' is hidden under the described led chip fabric swatch zone A ' fully, therefore, LED shows when module splices, the soft board bending region B ' that hides is conducive to eliminate the impact that the soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that led chip fabric swatch zone A ' length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize the screen appreciation effect.
In another embodiment, can be with reference to figure 4a, Fig. 4 a shows the modular structure synoptic diagram for a kind of LED that this embodiment provides, wherein, described LED shows that module can comprise:
Wiring board, led chip 2, IC chip 3, wherein, wiring board comprises flexible PCB (FPC) 1 and the PCB hardboard 5 of multilayer.Described flexible PCB 1 comprises led chip fabric swatch zone A ", soft board bending region B ", described PCB hardboard 5 comprises IC fabric swatch zone D "; Wherein, led chip fabric swatch zone A " on multilayer circuit board form the branch of Y-shaped setting at its isolated edge 1-2 millimeter place; wherein a branch continues to extend as led chip fabric swatch zone A " end, another branch's downward bending is as soft board bending region B " so that soft board bending region B " be hidden in led chip fabric swatch zone A " under.
In the present embodiment, LED shows that module is the mode that adopts the rigid-flex combination, wherein, flexible PCB 1 is fixed on the PCB hardboard 5 with the U-shaped bending, PCB hardboard 5 upside down are fixed with the back and are supported led chip fabric swatch zone A ", soft board bending region B " be connected with PCB hardboard 5 along PCB hardboard 5 side edge bendings to pcb board interface 51 places.
Can be in the lump with reference to figure 4b, Fig. 4 b is a kind of splicing synoptic diagram that the LED shown in Fig. 4 a shows module, can carry out at soft board bending region B " show module soft board bending region B with another LED " relative splicing, what expect easily in addition is, also can carry out soft board bending region B " show the splicing that the non-soft board of module bending region is relative with another LED, do not do to limit herein; Shown in Fig. 4 b, two LED need only the led chip fabric swatch zone A that guarantees the splicing module when showing the module splicing " be the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain.
Be understandable that LED shows in the module, led chip fabric swatch zone A " and soft board bending region B " between structure setting can carry out specific implementation with reference to the first embodiment, repeat no more herein.
From the above, the LED that the embodiment of the invention provides shows module, wiring board is at led chip fabric swatch zone A " end formation branch; wherein branch's downward bending is as soft board bending region B ", so that described soft board bending region B " be hidden in described led chip fabric swatch zone A fully " under, therefore, LED shows when module splices, the soft board bending region B that hides " be conducive to eliminate the impact that the soft board radius bend is brought; solve the imperfect discontinuous problem of stitching image; add led chip fabric swatch zone A " length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimizes the screen appreciation effect.
In another embodiment, can be with reference to figure 5a, Fig. 5 a shows the modular structure synoptic diagram for a kind of LED that this embodiment provides, wherein, described LED shows that module can comprise:
Wiring board, led chip 2, IC chip 3, wherein, wiring board is the flex-rigid wiring board 6 of the multilayer that combines of FPC and PCB, and described flex-rigid wiring board 6 comprises led chip fabric swatch zone A " '; soft board bending region B " ', IC prohibits cloth zone C " ' and the regional D of IC fabric swatch " '.Described led chip fabric swatch zone A " ' on multilayer circuit board comprise PCB hardboard 61 and FPC soft board 62; at led chip fabric swatch zone A " ' 1-2 millimeter place, edge, rigid-flex forms the branch of Y-shaped setting, wherein PCB hardboard 61 branches continue to extend as led chip fabric swatch zone A " ' end; FPC soft board 62 branches are as soft board bending region B " ' downward bending, be hidden in led chip fabric swatch zone A ' " under.
Can be in the lump with reference to figure 5b, Fig. 5 b is a kind of splicing synoptic diagram that the LED shown in Fig. 5 a shows module, can carry out at soft board bending region B " ' show module soft board bending region B with another LED " ' relative splicing, what expect easily in addition is, also can carry out soft board bending region B " ' show the non-soft board of module bending region B with another LED " ' relative splicing, do not do to limit herein; Shown in Fig. 5 b, two LED need only the led chip fabric swatch zone A that guarantees the splicing module when showing the module splicing " ' be the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain.
Be understandable that LED shows in the module, led chip fabric swatch zone A ' " and soft board bending region B " ' between structure setting can carry out specific implementation with reference to the first embodiment, repeat no more herein.
From the above, the LED that the embodiment of the invention provides shows module, wiring board is at led chip fabric swatch zone A ' " end formation branch; wherein branch's downward bending is as soft board bending region B " ', so that described soft board bending region B " under ' be hidden in fully described led chip fabric swatch zone A " ', therefore, LED shows when module splices, the soft board bending region B that hides " ' be conducive to eliminate the impact that the soft board radius bend is brought; solve the imperfect discontinuous problem of stitching image; add led chip fabric swatch zone A ' " length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimizes the screen appreciation effect.
More than a kind of LED provided by the present invention is shown that module is described in detail, for one of ordinary skill in the art, thought according to the embodiment of the invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (6)
1. a LED shows module, comprises wiring board, led chip, surface-mounted integrated circuit IC chip, it is characterized in that:
Described wiring board is multilayer circuit board, and described wiring board comprises led chip fabric swatch zone, soft board bending region and IC fabric swatch zone, and wherein, described led chip fabric swatch zone length is the integral multiple of LED lattice point distance;
Described wiring board forms branch at described led chip fabric swatch zone one end, wherein a branch extends horizontally to end, another branch extends to described soft board bending region downwards, described led chip fabric swatch zone hides described soft board bending region fully, so that described soft board bending region is hidden under the described led chip fabric swatch zone.
2. LED according to claim 1 shows module, it is characterized in that, described wiring board is the hard and soft board that flexible PCB FPC or FPC are combined with printing board PCB, wherein, wiring board on the described led chip fabric swatch zone is FPC or described hard and soft board, wiring board on the described soft board bending region is FPC, and the wiring board on the described IC fabric swatch zone is FPC or described hard and soft board.
3. LED according to claim 1 shows module, it is characterized in that,
Described led chip is arranged at described led chip fabric swatch zone and is electrically connected with described wiring board;
Described IC chip is arranged at described IC fabric swatch zone and is electrically connected with described wiring board.
4. according to claim 1 to 3 each described LED demonstration modules, it is characterized in that,
Described wiring board forms the branch of Y-shaped setting at one end isolated edge 1-2 millimeter place, described led chip fabric swatch zone.
5. according to claim 1 to 3 each described LED demonstration modules, it is characterized in that,
Wiring board on the described soft board bending region is the FPC of 1-2 layer.
6. LED according to claim 1 shows module, it is characterized in that, described LED shows that module comprises that also IC prohibits the cloth zone, and the wiring board that described IC prohibits on the cloth zone is multilayer circuit board, between described soft board bending region and described IC fabric swatch zone.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550383.0A CN102982744B (en) | 2012-12-17 | 2012-12-17 | Display module of LED (light emitting diode) |
| PCT/CN2013/089079 WO2014094562A1 (en) | 2012-12-17 | 2013-12-11 | Light-emitting diode (led) display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550383.0A CN102982744B (en) | 2012-12-17 | 2012-12-17 | Display module of LED (light emitting diode) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102982744A true CN102982744A (en) | 2013-03-20 |
| CN102982744B CN102982744B (en) | 2014-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210550383.0A Active CN102982744B (en) | 2012-12-17 | 2012-12-17 | Display module of LED (light emitting diode) |
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| Country | Link |
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| CN (1) | CN102982744B (en) |
| WO (1) | WO2014094562A1 (en) |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| US10416950B2 (en) | 2014-04-07 | 2019-09-17 | Samsung Electronics Co., Ltd. | Tiled display system and method for processing images thereof |
| CN104978901B (en) * | 2014-04-07 | 2019-06-25 | 三星电子株式会社 | Splice displaying system and its method for handling image |
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| CN106163080B (en) * | 2015-04-14 | 2018-08-31 | 常熟精元电脑有限公司 | Flexible circuit board |
| CN106163080A (en) * | 2015-04-14 | 2016-11-23 | 常熟精元电脑有限公司 | Flexible circuit board |
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| CN108269495A (en) * | 2017-01-04 | 2018-07-10 | 昆山国显光电有限公司 | Flexible display screen |
| CN107886852A (en) * | 2017-04-14 | 2018-04-06 | 深圳市微阵技术有限公司 | Display strip and splicing display system with same |
| CN107886852B (en) * | 2017-04-14 | 2024-04-12 | 深圳市微阵技术有限公司 | Display strip and spliced display system with same |
| CN107704024A (en) * | 2017-09-29 | 2018-02-16 | 维沃移动通信有限公司 | Display screen and terminal device |
| CN107704024B (en) * | 2017-09-29 | 2020-02-14 | 维沃移动通信有限公司 | Display screen and terminal equipment |
| WO2019075809A1 (en) * | 2017-10-20 | 2019-04-25 | 武汉华星光电半导体显示技术有限公司 | Backplane for flexible display panel and flexible display device |
| CN107564417B (en) * | 2017-10-20 | 2020-05-19 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel backboard and flexible display |
| CN107564417A (en) * | 2017-10-20 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels backboard and flexible display |
| CN107632475A (en) * | 2017-10-31 | 2018-01-26 | 武汉天马微电子有限公司 | Display panel and display device |
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| CN110325005A (en) * | 2018-03-29 | 2019-10-11 | 群创光电股份有限公司 | Splice electronic device |
| WO2020001356A1 (en) * | 2018-06-27 | 2020-01-02 | 维沃移动通信有限公司 | Terminal |
| KR102466713B1 (en) | 2018-06-27 | 2022-11-11 | 비보 모바일 커뮤니케이션 컴퍼니 리미티드 | terminal |
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| US10468394B1 (en) | 2018-06-28 | 2019-11-05 | Au Optronics Corporation | Display device |
| CN111667776B (en) * | 2019-03-08 | 2022-08-23 | 群创光电股份有限公司 | Tiled display device |
| CN111667776A (en) * | 2019-03-08 | 2020-09-15 | 群创光电股份有限公司 | Tiled display device |
| US11545508B2 (en) | 2019-03-25 | 2023-01-03 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel and fabrication method thereof, and display device |
| CN110136587A (en) * | 2019-05-29 | 2019-08-16 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels |
| CN110379322A (en) * | 2019-07-15 | 2019-10-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display module and display device |
| CN111221182A (en) * | 2020-01-20 | 2020-06-02 | 深圳市华星光电半导体显示技术有限公司 | Backlight source and preparation method thereof |
| CN111221181A (en) * | 2020-01-20 | 2020-06-02 | 深圳市华星光电半导体显示技术有限公司 | Backlight source and preparation method thereof |
| CN113365412A (en) * | 2020-03-05 | 2021-09-07 | 宏启胜精密电子(秦皇岛)有限公司 | Composite circuit board and manufacturing method thereof |
| WO2021189433A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Strip-shaped display structure, display panel and display device |
| TWI753715B (en) * | 2020-08-24 | 2022-01-21 | 錼創顯示科技股份有限公司 | Display apparatus |
| US11495149B2 (en) | 2020-08-24 | 2022-11-08 | PlayNitride Display Co., Ltd. | Display apparatus |
| WO2024041342A1 (en) * | 2022-08-26 | 2024-02-29 | 成都辰显光电有限公司 | Display panel and display device |
| CN115793323A (en) * | 2022-12-07 | 2023-03-14 | 惠科股份有限公司 | Backlight module and display device |
| CN115793323B (en) * | 2022-12-07 | 2024-03-19 | 惠科股份有限公司 | Backlight module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102982744B (en) | 2014-09-24 |
| WO2014094562A1 (en) | 2014-06-26 |
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