CN102982744B - Display module of LED (light emitting diode) - Google Patents
Display module of LED (light emitting diode) Download PDFInfo
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- CN102982744B CN102982744B CN201210550383.0A CN201210550383A CN102982744B CN 102982744 B CN102982744 B CN 102982744B CN 201210550383 A CN201210550383 A CN 201210550383A CN 102982744 B CN102982744 B CN 102982744B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The embodiment of the invention discloses a display module of an LED (light emitting diode), which is used for realizing seamless splicing of LED display screens. The display module provided by the embodiment of the invention comprises a circuit board formed by multiple layers of circuit boards, LED chips and IC (integrated circuit) plate chips, wherein the circuit board comprises an LED chip plate distribution region, a flexible printed circuit board bending region and an IC plate distribution region, wherein the length of the LED chip plate distribution region is an integral multiple of the distance of an LED dot matrix; two branches are formed at one end of the LED chip plate distribution plate region by the circuit board; one branch horizontally extends to a tail end; the other branch extends downwards into the flexible printed circuit board bending region; and the flexible printed circuit board bending region is completely covered by the LED chip plate distribution region, so that the flexible printed circuit board bending region is hidden below the LED chip plate distribution region.
Description
Technical field
The present invention relates to light emitting diode (LED, Light Emitting Diode) display technique field, especially relate to a kind of LED and show module.
Background technology
Along with the fast development of LED display technique, LED display curtain is come into indoor gradually from open air in recent years, and it shows that reticular density is more and more higher, and point is apart from doing less and less, and display resolution is more and more higher, and starts to initiate challenge to indoor other display systems.
In general, a large LED display curtain is made up of multiple little demonstration module splicings conventionally, and according to the difference such as manufacture craft, material, LED module is divided into polytype.Wherein, with flexible PCB (FPC, Flexible Printed Circuit) the LED module (showing module also referred to as flexible LED) of combination has that volume is little, thin thickness, the feature such as lightweight, flexible, bent, with printed circuit board (PCB) (PCB, PrintedCircuit Board) hardboard module compares, flexible LED shows that the distribution density of module is high, is particularly useful for the LED display curtain of high density dot matrix.At present, existing a kind of LED shows that modular structure (showing that taking flexible LED modular structure is as example) can be as shown in Figure 1a, comprises LED chip fabric swatch region A, bending region B, surface-mounted integrated circuit (IC, Integrated Circuit) is prohibited cloth region C, IC fabric swatch region D.During by flexible circuit plate development, along continuous straight runs order in each region is arranged, and as shown in Figure 1 b, bending region B prohibits between the C of cloth region at LED chip fabric swatch region A and IC.But in the time that two flexible LEDs show that module splices, bending region B will be present between contiguous concatenation module, the radius bend of flexible PCB (being generally 3-10 times of thickness of slab, about 0.5-2 millimeter) is by the splicing gap becoming between two modules.When LED display curtain pixel is apart from 3 millimeters or when following, the disappearance that image shows is can not ignore and is visually formed in this splicing gap, thereby affects final display effect.
Summary of the invention
The embodiment of the present invention provides a kind of LED to show module, for realizing the seamless spliced of LED display curtain.
In view of this, one aspect of the present invention provides a kind of LED to show module, can comprise wiring board, LED chip, surface-mounted integrated circuit IC chip, wherein:
Described wiring board is multilayer circuit board, and described wiring board comprises LED chip fabric swatch region, soft board bending region and IC fabric swatch region, and wherein, described LED chip fabric swatch zone length is the integral multiple of LED lattice point distance;
Described wiring board forms branch in one end, described LED chip fabric swatch region, wherein a branch extends horizontally to end, another branch extends to described soft board bending region downwards, described LED chip fabric swatch region hides described soft board bending region completely, and described soft board bending region is hidden under described LED chip fabric swatch region.
In the possible embodiment of the first, described wiring board is the hard and soft board that flexible PCB FPC or FPC are combined with printing board PCB, wherein, wiring board on described LED chip fabric swatch region is FPC or described hard and soft board, wiring board on described soft board bending region is FPC, and the wiring board on described IC fabric swatch region is FPC or described hard and soft board.
In the possible embodiment of the second, described LED chip is arranged at described LED chip fabric swatch region and is electrically connected with described wiring board; Described IC chip is arranged at described IC fabric swatch region and is electrically connected with described wiring board.
In conjunction with first aspect or first aspect the first or the possible embodiment of first aspect the second, in the third possible embodiment, described wiring board forms the branch of Y-shaped setting at isolated edge 1-2 millimeter place, one end, described LED chip fabric swatch region.
In conjunction with first aspect or first aspect the first or the possible embodiment of first aspect the second, in the 4th kind of possible embodiment, the wiring board on described soft board bending region is the FPC of 1-2 layer.
In the 5th kind of possible embodiment, described LED shows that module also comprises that IC prohibits cloth region, and the wiring board that described IC prohibits on cloth region is multilayer circuit board, between described soft board bending region and described IC fabric swatch region.
As can be seen from the above technical solutions, the LED that the embodiment of the present invention provides shows module, wiring board forms branch in one end, LED chip fabric swatch region, wherein branch's downward bending is as soft board bending region, described soft board bending region is hidden under described LED chip fabric swatch region completely, therefore, LED shows when module splices, hiding soft board bending region is conducive to eliminate the impact that soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that LED chip fabric swatch zone length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize screen appreciation effect.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, below the accompanying drawing of embodiment being described to required use is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 a is the structural representation that existing a kind of flexible LED shows module;
Fig. 1 b is the structural representation that shown in Fig. 1 a, existing a kind of flexible LED shows module horizontal development;
A kind of LED that Fig. 2 a provides for the embodiment of the present invention shows the structural representation of module;
A kind of LED that Fig. 2 b provides for the embodiment of the present invention shows the structural representation of module horizontal development;
A kind of LED that Fig. 2 c provides for the embodiment of the present invention shows the splicing schematic diagram of module;
A kind of LED that Fig. 2 d provides for the embodiment of the present invention shows another splicing schematic diagram of module;
A kind of LED that Fig. 3 a provides for the embodiment of the present invention shows another structural representation of module;
A kind of LED that Fig. 3 b provides for the embodiment of the present invention shows another splicing schematic diagram of module;
A kind of LED that Fig. 4 a provides for the embodiment of the present invention shows another structural representation of module;
A kind of LED that Fig. 4 b provides for the embodiment of the present invention shows another splicing schematic diagram of module;
A kind of LED that Fig. 5 a provides for the embodiment of the present invention shows another structural representation of module;
A kind of LED that Fig. 5 b provides for the embodiment of the present invention shows another splicing schematic diagram of module.
Embodiment
The embodiment of the present invention provides a kind of LED to show module, for realizing the seamless spliced of LED display curtain.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention provides a kind of LED to show module, can comprise wiring board, LED chip, surface-mounted integrated circuit IC chip, wherein, described wiring board is multilayer circuit board, described wiring board comprises LED chip fabric swatch region, soft board bending region and IC fabric swatch region, wherein, described LED chip fabric swatch zone length is the integral multiple of LED lattice point distance; Described wiring board forms branch in one end, described LED chip fabric swatch region, wherein a branch extends horizontally to end, another branch extends to described soft board bending region downwards, described LED chip fabric swatch region hides described soft board bending region completely, and described soft board bending region is hidden under described LED chip fabric swatch region.
Be understandable that, in the embodiment of the present invention, multilayer circuit board refers to and haves three layers or circuit boards that 3 layers above are suppressed the wiring board stacking;
Wherein, described LED chip is arranged at described LED chip fabric swatch region and is electrically connected with described wiring board; Described IC chip is arranged at described IC fabric swatch region and is electrically connected with described wiring board.
In some embodiments, described wiring board is the hard and soft board that flexible PCB FPC or FPC are combined with printing board PCB, wherein, wiring board on described LED chip fabric swatch region is FPC or described hard and soft board, wiring board on described soft board bending region is FPC, and the wiring board on described IC fabric swatch region is FPC or described hard and soft board.
From the above, the LED that the embodiment of the present invention provides shows module, wiring board forms branch in one end, LED chip fabric swatch region, wherein branch's downward bending is as soft board bending region, described soft board bending region is hidden under described LED chip fabric swatch region completely, therefore, LED shows when module splices, hiding soft board bending region is conducive to eliminate the impact that soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that LED chip fabric swatch zone length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize screen appreciation effect.
Show below the difference of circuit sheet material matter in module for LED, and the difference setting of each region place on line structure, the LED providing is shown to module describes in detail:
In one embodiment, can be with reference to figure 2a, a kind of LED demonstration modular structure schematic diagram that Fig. 2 a provides for this embodiment, wherein, described LED shows that module can comprise:
Flexible PCB 1 (being that wiring board is FPC), LED chip 2, IC chip 3.Described flexible PCB 1 comprises LED chip fabric swatch region A ', soft board bending region B ', and IC prohibits cloth region C ' and IC fabric swatch region D ', and IC prohibits cloth region C ' and is positioned between described soft board bending region B ' and described IC fabric swatch region D '; Wherein, flexible PCB 1 plate body and LED chip 2 at LED chip fabric swatch region A ' are electrically connected, in the element such as flexible PCB 1 plate body and IC chip 3 electrical connection of IC fabric swatch region D ', soft board bending region B ' prohibits on the C ' of cloth region electronic component is not all set with IC.
Described flexible PCB 1 is multilayer circuit board, and multilayer conductive layer is realized electrical connection by the plated-through-hole on circuit board transversal section; As shown in Figure 2 a, in described flexible PCB 1 (multilayer circuit board), the wiring board on the B ' of soft board bending region is the FPC of 1-2 layer, all the other regions (A ', C ', D ') on wiring board be the FPC (if the number of plies is more than 3 layers or 3 layers) of multilayer;
Wherein, at A ' edge, LED chip fabric swatch region and soft board bending region B ' phase joining place, flexible PCB 1 (multilayer circuit board) forms branch, wherein from multilayer circuit board, branch out near the 1-2 layer basal plate of bottom the soft board bending region B ' that is used as flexible PCB 1, branch's upper strata multilayer board out extends a bit of end as LED chip fabric swatch region A ', and the length that makes LED chip fabric swatch region A ' is the integral multiple of LED point distance just; Separately easily expect, the multilayer board branch of extension is still electrically connected with LED chip 2 and plays a part support LED chip 2.
Further, at A ' edge, LED chip fabric swatch region and soft board bending region B ' phase joining place, (flexible PCB 1) multilayer circuit board forms branch, can be specially, at isolated edge 1-2 millimeter place, A ' one end, LED chip fabric swatch region, (with soft board bending region B ' phase joining place) forms the branch of Y-shaped setting to multilayer circuit board, be that soft board bending region B ' (FPC of 1-2 layer) is separating bending from isolated edge 1-2 millimeter place, A ' one end, LED chip fabric swatch region with upper strata multilayer board, soft board bending region B ' is hidden under LED chip fabric swatch region A ', as shown in Figure 2 a, soft board bending region B ' continues to extend to IC and prohibits C ' position, cloth region, and flexible PCB 1 reverts to multiple-plate trace arrangements, and is retained to IC fabric swatch region D ' end always.
In the present embodiment, during by flexible PCB 1 horizontal development, soft board bending region B ' is positioned at below, A ' edge, LED chip fabric swatch region, can be in the lump with reference to figure 2b, and Fig. 2 b is the structural representation that LED shown in Fig. 2 a shows module horizontal development, while using LED to show module, generally can be by IC fabric swatch region D ' down or bending backward, only expose LED chip fabric swatch region A ', as shown in Fig. 2 c and Fig. 2 d, for the splicing schematic diagram of the LED demonstration module shown in Fig. 2 a and Fig. 2 b, as Fig. 2 c, in the time that LED shows that module splices, IC fabric swatch region D ' down bending is fixed on the face vertical with LED chip fabric swatch region A ', can carry out showing with another LED the splicing that module soft board bending region B ' is relative at soft board bending region B ', as Fig. 2 d, can carry out soft board bending region B ' and show with another LED the splicing that the non-soft board of module bending region is relative, as shown in Fig. 2 c and Fig. 2 d, in the time that LED shows that module splices as long as shown in ensureing, splice the LED chip fabric swatch region A ' of module for the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain.
From the above, the LED that the embodiment of the present invention provides shows module, wiring board forms branch in A ' one end, LED chip fabric swatch region, wherein branch's downward bending is as soft board bending region B ', described soft board bending region B ' is hidden under described LED chip fabric swatch region A ' completely, therefore, LED shows when module splices, hiding soft board bending region B ' is conducive to eliminate the impact that soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that LED chip fabric swatch region A ' length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize screen appreciation effect.
In another embodiment, can be with reference to figure 3a, a kind of LED demonstration modular structure schematic diagram that Fig. 3 a provides for this embodiment, wherein, described LED shows that module can comprise:
Flexible PCB 1 (being that wiring board is FPC), LED chip 2, IC chip 3.Described flexible PCB 1 comprises LED chip fabric swatch region A ', soft board bending region B ', and IC prohibits cloth region C ' and IC fabric swatch region D ', and IC prohibits cloth region C ' and is positioned between described soft board bending region B ' and described IC fabric swatch region D '; Wherein, multilayer circuit board (FPC) on LED chip fabric swatch region A ' forms the branch of Y-shaped setting at its isolated edge 1-2 millimeter place, wherein a branch continues to extend the end as LED chip fabric swatch region A ', another branch's downward bending, as soft board bending region B ', is hidden under LED chip fabric swatch region A ' soft board bending region B '.
In the present embodiment, IC chip 3 is arranged in IC fabric swatch region D ' outside, as shown in Figure 3 a, flexible PCB 1 can be fixed in back up pad 4 with U-shaped bending, back up pad 4 upper surfaces are for fixing and support LED chip fabric swatch region A ', the fixing soft board bending region B ' of side and the IC of back up pad 4 prohibit cloth region C ', the fixing IC fabric swatch region D ' in bottom surface of back up pad 4;
Can be in the lump with reference to figure 3b, Fig. 3 b is the one splicing schematic diagram that the LED shown in Fig. 3 a shows module, can carry out showing with another LED the splicing that module soft board bending region B ' is relative at soft board bending region B ', what separately easily expect is, also can carry out soft board bending region B ' and show with another LED the splicing that the non-soft board of module bending region is relative, not do to limit herein; As shown in Figure 3 b, when showing module splicing, two LED as long as ensure that the LED chip fabric swatch region A ' of splicing module is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain.
Be understandable that, LED shows that in module, the structure setting between LED chip fabric swatch region A ' and soft board bending region B ' can be carried out specific implementation with reference to a upper embodiment, repeats no more herein.
From the above, the LED that the embodiment of the present invention provides shows module, wiring board forms branch in A ' one end, LED chip fabric swatch region, wherein branch's downward bending is as soft board bending region B ', described soft board bending region B ' is hidden under described LED chip fabric swatch region A ' completely, therefore, LED shows when module splices, hiding soft board bending region B ' is conducive to eliminate the impact that soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, add that LED chip fabric swatch region A ' length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize screen appreciation effect.
In another embodiment, can be with reference to figure 4a, a kind of LED demonstration modular structure schematic diagram that Fig. 4 a provides for this embodiment, wherein, described LED shows that module can comprise:
Wiring board, LED chip 2, IC chip 3, wherein, wiring board comprises flexible PCB (FPC) 1 and the PCB hardboard 5 of multilayer.Described flexible PCB 1 comprises LED chip fabric swatch region A ", soft board bending region B ", described PCB hardboard 5 comprises IC fabric swatch region D "; Wherein, LED chip fabric swatch region A " on multilayer circuit board form the branch of Y-shaped setting at its isolated edge 1-2 millimeter place; wherein a branch continues to extend as LED chip fabric swatch region A " end, another branch's downward bending is as soft board bending region B ", make soft board bending region B " be hidden in LED chip fabric swatch region A " under.
In the present embodiment, LED shows that module is the mode that adopts rigid-flex combination, wherein, flexible PCB 1 is fixed on PCB hardboard 5 with U-shaped bending, PCB hardboard 5 upside down are fixed with back and are supported LED chip fabric swatch region A ", soft board bending region B " be connected with PCB hardboard 5 along PCB hardboard 5 side edge bendings to pcb board interface 51 places.
Can be in the lump with reference to figure 4b, Fig. 4 b is the one splicing schematic diagram that the LED shown in Fig. 4 a shows module, can carry out at soft board bending region B " show module soft board bending region B with another LED " relative splicing, what separately easily expect is, also can carry out soft board bending region B " show with another LED the splicing that the non-soft board of module bending region is relative, do not do to limit herein; As shown in Figure 4 b, two LED need only the LED chip fabric swatch region A that ensures splicing module while showing module splicing " be the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain.
Be understandable that, LED shows in module, LED chip fabric swatch region A " and soft board bending region B " between structure setting can carry out specific implementation with reference to the first embodiment, repeat no more herein.
From the above, the LED that the embodiment of the present invention provides shows module, wiring board is at LED chip fabric swatch region A " one end formation branch, wherein branch's downward bending is as soft board bending region B ", make described soft board bending region B " be hidden in described LED chip fabric swatch region A completely " under, therefore, LED shows when module splices, hiding soft board bending region B " be conducive to eliminate the impact that soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, adding LED chip fabric swatch region A " length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize screen appreciation effect.
In another embodiment, can be with reference to figure 5a, a kind of LED demonstration modular structure schematic diagram that Fig. 5 a provides for this embodiment, wherein, described LED shows that module can comprise:
Wiring board, LED chip 2, IC chip 3, wherein, wiring board is the flex-rigid wiring board 6 of the multilayer that combines of FPC and PCB, and described flex-rigid wiring board 6 comprises LED chip fabric swatch region A " '; soft board bending region B " ', IC prohibits cloth region C " ' and IC fabric swatch region D " '.Described LED chip fabric swatch region A " ' on multilayer circuit board comprise PCB hardboard 61 and FPC soft board 62; at LED chip fabric swatch region A " ' 1-2 millimeter place, edge, rigid-flex forms the branch of Y-shaped setting, wherein PCB hardboard 61 branches continue to extend as LED chip fabric swatch region A " ' end; FPC soft board 62 branches are as soft board bending region B " ' downward bending, be hidden in LED chip fabric swatch region A ' " under.
Can be in the lump with reference to figure 5b, Fig. 5 b is the one splicing schematic diagram that the LED shown in Fig. 5 a shows module, can carry out at soft board bending region B " ' show module soft board bending region B with another LED " ' relative splicing, what separately easily expect is, also can carry out soft board bending region B " ' show the non-soft board of module bending region B with another LED " ' relative splicing, do not do to limit herein; As shown in Figure 5 b, two LED need only the LED chip fabric swatch region A that ensures splicing module while showing module splicing " ' be the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain.
Be understandable that, LED shows in module, LED chip fabric swatch region A ' " and soft board bending region B " ' between structure setting can carry out specific implementation with reference to the first embodiment, repeat no more herein.
From the above, the LED that the embodiment of the present invention provides shows module, wiring board is at LED chip fabric swatch region A ' " one end formation branch, wherein branch's downward bending is as soft board bending region B " ', make described soft board bending region B " under ' be hidden in completely described LED chip fabric swatch region A " ', therefore, LED shows when module splices, hiding soft board bending region B " ' be conducive to eliminate the impact that soft board radius bend is brought, solve the imperfect discontinuous problem of stitching image, adding LED chip fabric swatch region A ' " length is the integral multiple of LED lattice point distance, can realize the seamless spliced of LED display curtain, optimize screen appreciation effect.
Above a kind of LED provided by the present invention is shown to module is described in detail, for one of ordinary skill in the art, according to the thought of the embodiment of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (6)
1. LED shows a module, comprises wiring board, LED chip, surface-mounted integrated circuit IC chip, it is characterized in that:
Described wiring board is multilayer circuit board, and described wiring board comprises LED chip fabric swatch region, soft board bending region and IC fabric swatch region;
Described wiring board forms branch in one end, described LED chip fabric swatch region, wherein a branch extends horizontally to end, and another branch extends to described soft board bending region downwards; Described LED chip fabric swatch zone length is the integral multiple of LED lattice point distance; Described LED chip fabric swatch region hides described soft board bending region completely, and described soft board bending region is hidden under described LED chip fabric swatch region.
2. LED according to claim 1 shows module, it is characterized in that, described wiring board is the hard and soft board that flexible PCB FPC or FPC are combined with printing board PCB, wherein, wiring board on described LED chip fabric swatch region is FPC or described hard and soft board, wiring board on described soft board bending region is FPC, and the wiring board on described IC fabric swatch region is FPC or described hard and soft board.
3. LED according to claim 1 shows module, it is characterized in that,
Described LED chip is arranged at described LED chip fabric swatch region and is electrically connected with described wiring board;
Described IC chip is arranged at described IC fabric swatch region and is electrically connected with described wiring board.
4. show module according to the LED described in claims 1 to 3 any one, it is characterized in that,
Described wiring board forms the branch of Y-shaped setting at isolated edge 1-2 millimeter place, one end, described LED chip fabric swatch region.
5. show module according to the LED described in claims 1 to 3 any one, it is characterized in that,
Wiring board on described soft board bending region is the FPC of 1-2 layer.
6. LED according to claim 1 shows module, it is characterized in that, described LED shows that module also comprises that IC prohibits cloth region, and the wiring board that described IC prohibits on cloth region is multilayer circuit board, between described soft board bending region and described IC fabric swatch region.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550383.0A CN102982744B (en) | 2012-12-17 | 2012-12-17 | Display module of LED (light emitting diode) |
| PCT/CN2013/089079 WO2014094562A1 (en) | 2012-12-17 | 2013-12-11 | Light-emitting diode (led) display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550383.0A CN102982744B (en) | 2012-12-17 | 2012-12-17 | Display module of LED (light emitting diode) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102982744A CN102982744A (en) | 2013-03-20 |
| CN102982744B true CN102982744B (en) | 2014-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210550383.0A Active CN102982744B (en) | 2012-12-17 | 2012-12-17 | Display module of LED (light emitting diode) |
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| CN (1) | CN102982744B (en) |
| WO (1) | WO2014094562A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| TWI601104B (en) * | 2015-04-02 | 2017-10-01 | 元太科技工業股份有限公司 | Display panel |
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| WO2014094562A1 (en) | 2014-06-26 |
| CN102982744A (en) | 2013-03-20 |
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