CN107704024B - Display screen and terminal equipment - Google Patents

Display screen and terminal equipment Download PDF

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Publication number
CN107704024B
CN107704024B CN201710912211.6A CN201710912211A CN107704024B CN 107704024 B CN107704024 B CN 107704024B CN 201710912211 A CN201710912211 A CN 201710912211A CN 107704024 B CN107704024 B CN 107704024B
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China
Prior art keywords
photodiode
display
bonded
function layer
display screen
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CN201710912211.6A
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Chinese (zh)
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CN107704024A (en
Inventor
段俊杰
郭海涛
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Priority to CN201710912211.6A priority Critical patent/CN107704024B/en
Publication of CN107704024A publication Critical patent/CN107704024A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Abstract

The application discloses display screen and terminal equipment, this display screen includes: the display screen comprises a photodiode bound with a display module of the display screen and a special photoelectric integrated circuit connected with the photodiode and positioned on the back of the display module. According to the scheme of the embodiment of the application, the photo diode used for light induction in the photoelectric sensor is bonded to the display module, and the special photoelectric integrated circuit used for processing the optical signal is arranged on the back of the display module, so that the screen occupation ratio of the whole machine can be improved.

Description

Display screen and terminal equipment
Technical Field
The application relates to the field of terminals, in particular to a display screen and terminal equipment.
Background
With the rapid development of smart phones, the design of a full-screen has become the mainstream in the future, and devices on the front side of the smart phone need to be rearranged to realize the design of the full-screen, and an ambient light sensor and an infrared distance sensor are part of the full-screen. The ambient light sensor is used for detecting the brightness of ambient light so as to assist in adjusting the brightness of the screen backlight and realize the automatic adjustment of the backlight brightness. Due to the characteristic of light traveling along a straight line, the light intensity sensed at different angles is different. In order to accurately sense the light intensity sensed by human eyes, the ambient light sensor is usually required to be arranged on the upper part of the front face of the mobile phone, which conflicts with the requirement of a full-face screen; the infrared distance sensor is used for detecting that the ear is close to the mobile phone when the mobile phone receives a call, so that the screen is closed to prevent the touch screen from being operated by the face in a misoperation, and the infrared distance sensor also needs to be arranged on the upper part of the front face of the mobile phone to conflict with the design of the comprehensive screen.
Fig. 1 is a schematic diagram of a position of a photoelectric sensor in a terminal device according to an embodiment of the present application.
As shown in fig. 1, in the conventional design, an electric sensor is arranged on the front face of the mobile phone, so that the screen occupation ratio of the whole mobile phone is limited. In addition, the photoelectric sensor is usually mounted on the main board, and is made to correspond to the ink window at the cover glass through structural control, so that the assembly tolerance brings about the problem of consistency; in addition, by means of structural assembly, a safety gap is formed between the photoelectric sensor and the cover glass, which gap affects the optical efficiency and viewing angle of the photoelectric sensor. Therefore, the conventional layout mode of the photoelectric sensor has more defects.
However, for the full-screen design, there is no position of the complete photosensor on the front surface, and there is a problem how to arrange the photosensor.
Disclosure of Invention
The embodiment of the application aims to provide a display screen and a terminal device, and the screen occupation ratio of the whole terminal device is improved.
In a first aspect, a display screen is provided, which includes a photosensor, the photosensor including:
a photodiode bonded to the display module of the display screen, and
and the special photoelectric integrated circuit is connected with the photodiode and positioned on the back surface of the display module.
In a second aspect, a terminal device is provided, the terminal device comprising the display screen of the first aspect.
In the embodiment of the application, the photodiode used for light induction in the photoelectric sensor is bonded to the display module, and the special photoelectric integrated circuit used for processing the optical signal is arranged on the back of the display module, so that the screen occupation ratio of the whole machine can be improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic diagram of a position of a photoelectric sensor in a terminal device according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a display screen according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a display screen according to another embodiment of the present application.
Fig. 4 is a block diagram of a terminal device according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
To facilitate understanding of the embodiments of the present application, several elements that will be introduced in the description of the embodiments of the present application are first introduced herein.
Bonding: standard processes In Chip (IC) processing. The technology is mainly characterized in that panel and glass (most of the glass is glass coated with a metal coating, and one side or two sides of the glass) are combined together according to a certain working process to play a role in protecting and making images clear.
The application provides a display screen and a terminal device to solve the above mentioned problems.
Fig. 2 is a schematic structural diagram of a display screen according to an embodiment of the present application. As shown in fig. 2, the display screen includes:
a photodiode (photodiode) bonded to the display module of the display screen, and
and an Application Specific Integrated Circuits (ICs) connected to the photodiodes and located on the back of the display module.
In this application embodiment, through in being arranged in carrying out photoinduction photodiode bonding to the display module assembly among the photoelectric sensor, the photoelectricity application specific integrated circuit who will be used for handling optical signal sets up in the display module assembly back to can minimize photoelectric sensor's the area occupied that the front piles up, the screen of maximize complete machine compares.
In addition, the scheme of this application embodiment, through the mode of bonding photodiode in the display module assembly, absolute position and the clearance of control photodiode that can be accurate guarantee the uniformity of sensing effect.
In addition, according to the scheme of the embodiment of the application, the structural gap can be minimized through the bonding process, so that the optical efficiency and the visual angle of the photoelectric sensor are maximized.
In addition, the scheme of this application embodiment through the display module assembly who adopts the integration, has simplified the structure assembly process, can improve production efficiency to a certain extent.
It should be understood that the photodiode may be bonded to the display module, and in particular may be bonded to a layer within the display module.
Fig. 3 is a schematic structural diagram of a display screen according to another embodiment of the present application. As shown in fig. 3, the display module sequentially includes: the touch screen comprises a glass cover plate, an adhesive layer for adhering the glass cover plate and the polarizer, a touch screen sensor, a display function layer and a protective layer; the photodiode is bonded on the display function layer and is positioned between the display function layer and the touch screen sensor.
Further, the photodiode is bonded to an edge region of the display function layer. Specifically, the edge area of the display function layer bound by the photodiode is located in the black border area of the display screen.
As shown in fig. 2, the front side of the screen of the terminal device may include a display area, a black border area, and a middle frame in sequence from inside to outside. Optionally, the photodiode according to the embodiment of the present application may be located on a black edge area of the screen, and seamlessly merges with the black edge.
Optionally, the bonding position of the photodiode may include at least one of:
the photodiode is bonded to the left side of the upper edge of the display function layer when the display panel is placed upright toward the user; or
The photodiode is bonded to the middle portion of the upper edge of the display function layer when the display panel is placed upright toward the user; or
The photodiode is bonded to the right side of the upper edge of the display function layer when the display panel is placed upright toward the user; or
The photodiode is bonded to the left side of the lower edge of the display function layer when the display panel is placed upright towards a user; or
The photodiode is bonded to the middle portion of the lower edge of the display function layer when the display panel is placed upright toward the user; or
The photodiode is bonded to the right side of the lower edge of the display function layer when the display panel is placed upright towards the user; or
The photodiode is bonded on the upper side of the right edge of the display function layer when the display screen is placed towards the user; or
The photodiode is bonded to the middle portion of the right edge of the display function layer when the display panel is placed upright toward the user; or
The photodiode is bonded to the underside of the right edge of the display function layer when the display panel is placed upright toward the user; or
The photodiode is bonded on the upper side of the left edge of the display function layer when the display screen is placed towards the user; or
The photodiode is bonded to the middle portion of the left edge of the display function layer when the display panel is placed upright toward the user; or
The photodiode is bonded to the underside of the left edge of the display function layer when the display panel is placed upright toward the user.
Taking fig. 2 as an example, the optoelectronic bonding is performed on the rightmost portion of the upper edge of the display functional layer when the display panel is placed upright towards the user, or the optoelectronic bonding is performed on the rightmost portion of the upper edge of the black border area of the display module.
Optionally, a color filter layer (colorfilter) is further plated on a side of the front surface of the photodiode facing the front surface of the display module. It is understood that the color filter layer may have the function of the colorfilter module of the photosensor in the prior art terminal device. The color filter layer can be plated on a photodiode of the display module through a coating process so as to embed the photoelectric sensing area into the display module.
Optionally, a black dielectric layer is further disposed between the photodiode and the display function layer for performing optical isolation.
Optionally, the photodiode is used as a sensing region of an ambient light sensor.
It should be understood that the light received by the photodiode is the light transmitted directly from the glass cover plate; the received light is the external ambient light for the ambient light sensor. Detection of ambient light can be achieved by a photodiode.
Optionally, the photodiode comprises an infrared emitting diode and an infrared receiving diode for infrared ranging.
It should be understood that the light emitted by the infrared emitting diode can be emitted out of the whole machine through the glass cover plate; for the infrared receiving diode, the received light is the infrared light which is transmitted out and reflected back by the external shielding. The infrared distance detection can be realized through the infrared emitting diode and the infrared receiving diode.
Of course, it should be understood that the photodiode bonding at this time includes infrared emitting diode bonding and infrared receiving diode bonding.
Optionally, the display screen further includes a flexible printed circuit board, the flexible printed circuit board is connected to the photodiode and is bent around the edge of the display module to be attached to the back of the display module, and the optical electrical special integrated circuit is bonded to a portion of the flexible printed circuit board located on the back of the display module and is connected to the photodiode through the flexible printed circuit board.
The method for bonding the special photoelectric integrated circuit to the flexible circuit board can adopt a tape Chip On Film (COF) package (chip on film), and the like.
Further, the flexible circuit board is also connected to an application processor on a main board of the terminal device where the display screen is located, wherein the optical-electrical special integrated circuit performs filtering and amplification processing on the signal of the photodiode, converts the signal into a digital signal, and transmits the digital signal to the application processor through a connector of the flexible circuit board so as to perform photoelectric detection.
In the embodiment of the application, the separated signal is bonded to the flexible circuit board through a COF (chip on film) process and then connected to the photodiode in the display module through the flexible circuit board, the signal of the photodiode is filtered and amplified at the near end and is converted into a digital signal and transmitted to the application processor on the mainboard through the flexible circuit board connector, and accordingly, the optoelectronic detection of the industry is achieved.
According to the scheme of the embodiment of the application, on the premise that the terminal equipment has the functions of the photoelectric sensor (the ambient light sensor and the infrared distance sensor), the comprehensive screen design of more than 98% of screen occupation ratio can be supported theoretically.
In addition, the performance of the mobile terminal can be not weaker than that of the traditional scheme, the optical angle of the traditional environment light sensor can be optimized, the black hair effect of the traditional infrared distance sensor can be optimized, and the structure assembly flow can be simplified.
Fig. 4 is a schematic diagram of a terminal device according to an embodiment of the present application. As shown in fig. 4, the terminal device may include a display screen, which may be the display screen of the embodiment shown in fig. 2 or fig. 3.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (9)

1. A display screen comprising a photosensor, the photosensor comprising:
a photodiode arranged in a display module of the display screen and bonded with the display module of the display screen, and
the photoelectric special integrated circuit is connected with the photodiode and positioned on the back of the display module;
the display screen further comprises a flexible circuit board which is connected to the photodiode and is bent to bypass the edge of the display module to be attached to the back face of the display module, and the photoelectric special integrated circuit is bonded to the part of the flexible circuit board, which is positioned on the back face of the display module, and is connected to the photodiode through the flexible circuit board;
the flexible circuit board is further connected to an application processor on a main board of the terminal device where the display screen is located, wherein the photoelectric special integrated circuit filters and amplifies signals of the photodiode, converts the signals into digital signals and transmits the digital signals to the application processor through a connector of the flexible circuit board so as to perform photoelectric detection.
2. The display screen of claim 1,
the display module assembly includes in proper order: the touch screen comprises a glass cover plate, an adhesive layer for adhering the glass cover plate and the polarizer, a touch screen sensor, a display function layer and a protective layer;
the photodiode is bonded on the display function layer and is positioned between the display function layer and the touch screen sensor.
3. The display screen of claim 2,
the photodiode is bonded to an edge region of the display function layer.
4. A display screen in accordance with claim 3, wherein the photodiode is bonded to the left of the upper edge of the display function layer when the display panel is placed upright toward a user; or
The photodiode is bonded to the middle part of the upper edge of the display function layer when the display panel is placed to the user in an upright mode; or
The photodiode is bonded to the right side of the upper edge of the display function layer when the display panel is placed upright towards a user; or
The photodiode is bonded on the left side of the lower edge of the display function layer when the display panel is placed upright towards a user; or
The photodiode is bonded to the middle part of the lower edge of the display function layer when the display panel is placed to the user; or
The photodiode is bonded to the right side of the lower edge of the display function layer when the display panel is placed upright towards a user; or
The photodiode is bonded on the upper side of the right edge of the display function layer when the display screen is placed towards the user; or
The photodiode is bonded to the middle part of the right edge of the display function layer; or
The photodiode is bonded to the lower side of the right edge of the display function layer when the display panel is placed upright towards a user; or
The photodiode is bonded on the upper side of the left edge of the display function layer when the display screen is placed towards the user; or
The photodiode is bonded to the middle part of the left edge of the display function layer when the display panel is placed to the user in an upright mode; or
The photodiode is bonded to the underside of the left edge of the display function layer.
5. A display screen in accordance with claim 3,
the edge area of the display function layer bound by the photodiode is located in the black edge area of the display screen.
6. The display screen of claim 2,
and a black dielectric layer is also arranged between the photodiode and the display function layer and used for optical isolation.
7. The display screen of claim 2,
and a color filter layer is also plated on one side of the photodiode facing the touch screen sensor.
8. The display screen of claim 1,
the photodiode comprises an infrared emitting diode and an infrared receiving diode and is used for infrared distance measurement.
9. A terminal device characterized by comprising a display screen according to any one of claims 1-8.
CN201710912211.6A 2017-09-29 2017-09-29 Display screen and terminal equipment Active CN107704024B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN107704024B true CN107704024B (en) 2020-02-14

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CN108462769B (en) * 2018-03-09 2021-05-28 Oppo广东移动通信有限公司 Electronic device and method for manufacturing the same
CN108494908B (en) * 2018-03-09 2021-07-23 Oppo广东移动通信有限公司 Electronic device and manufacturing method
CN108512956A (en) * 2018-03-09 2018-09-07 广东欧珀移动通信有限公司 Electronic device and its manufacturing method
CN108833615B (en) * 2018-03-29 2020-08-21 Oppo广东移动通信有限公司 Electronic device
CN108712523A (en) * 2018-03-30 2018-10-26 广东欧珀移动通信有限公司 Electronic device and its manufacturing method
CN108712525B (en) * 2018-04-18 2021-01-15 北京小米移动软件有限公司 Mobile terminal
CN108665815A (en) * 2018-05-15 2018-10-16 珠海格力电器股份有限公司 A kind of display device
CN108932024A (en) * 2018-06-26 2018-12-04 维沃移动通信有限公司 A kind of mobile terminal
CN110570794A (en) * 2019-08-29 2019-12-13 维沃移动通信有限公司 Display module, terminal equipment and manufacturing method of display module

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CN105334911A (en) * 2014-06-26 2016-02-17 联想(北京)有限公司 Electronic device

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