KR102657348B1 - Display device - Google Patents

Abstract

A display device is disclosed. A display device includes: a display panel; a frame located behind the display panel and to which the display panel is coupled; And, it may include a board coupled to the frame and provided with a heating element, wherein the board includes: a layer located between the heating element and the frame, on which the heating element is mounted, and spaced apart from the frame. ; And, it may be formed by soldering on one surface of the layer facing the frame and include a plurality of protrusions spaced apart from the frame, and the plurality of protrusions may be formed on one side of the layer corresponding to the position of the heating element. It may be located in or adjacent to the area of the one surface, and may form a pattern.

Description

Display device {DISPLAY DEVICE}

This disclosure relates to display devices.

As the information society develops, the demand for display devices is increasing in various forms, and in response to this, in recent years, LCD (Liquid Crystal Display Device), ELD (Electro luminescent display), VFD (Vacuum Fluorescent Display), and OLED (Organic Light) have been developed. Various display devices such as Emitting Diodes and Micro LED are being researched and used.

Among these, the LCD panel has a TFT substrate and a color substrate that face each other with a liquid crystal layer in between, and can display images using light provided from a backlight unit. Additionally, OLED panels can display images by depositing an organic material layer capable of emitting light on its own on a substrate on which transparent electrodes are formed. In particular, display devices with OLED panels have the advantage of being ultra-thin because they do not require a backlight unit.

Recently, much research has been conducted on structures that can effectively remove heat generated when displaying high-definition images in large-screen, ultra-thin display devices.

The present disclosure aims to solve the above-described problems and other problems.

Another purpose may be to provide a display device that can remove heat from the heating element of the PCB through protrusions formed on the surface of the PCB through soldering.

Another purpose may be to provide a display device that can effectively remove heat from a heating element of a PCB through a pattern formed on the surface of the PCB by protrusions.

Another purpose may be to prevent contact or interference between protrusions and protrusions on the surface of the PCB and to provide a structure that can enlarge the pattern formed on the PCB pattern.

Another purpose may be to provide various protrusions that can increase the surface area of the surface of the PCB.

According to one aspect of the present disclosure to achieve the above or other objects, a display device includes: a display panel; a frame located behind the display panel and to which the display panel is coupled; And, it may include a board coupled to the frame and provided with a heating element, wherein the board includes: a layer located between the heating element and the frame, on which the heating element is mounted, and spaced apart from the frame. ; And, it may be formed by soldering on one surface of the layer facing the frame and include a plurality of protrusions spaced apart from the frame, and the plurality of protrusions may be formed on one side of the layer corresponding to the position of the heating element. It may be located in or adjacent to the area of the one surface, and may form a pattern.

The effects of the display device according to the present disclosure will be described as follows.

According to at least one of the embodiments of the present disclosure, a display device capable of removing heat from a heating element of a PCB through protrusions formed on the surface of the PCB through soldering can be provided.

According to at least one of the embodiments of the present disclosure, it is possible to provide a display device that can effectively remove heat from a heating element of a PCB through a pattern formed on the surface of a PCB by protrusions.

According to at least one of the embodiments of the present disclosure, it is possible to provide a structure that prevents contact or interference between protrusions on the surface of a PCB and enlarges a pattern formed on the pattern of the PCB.

According to at least one of the embodiments of the present disclosure, various protrusions that can increase the surface area of the surface of the PCB can be provided.

Additional scope of applicability of the present disclosure will become apparent from the detailed description that follows. However, since various changes and modifications within the spirit and scope of the present disclosure may be clearly understood by those skilled in the art, the detailed description and specific embodiments such as preferred embodiments of the present disclosure should be understood as being given only as examples.

1 to 11 are diagrams showing examples of display devices according to embodiments of the present disclosure.

Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings, but identical or similar components will be assigned the same reference numbers regardless of the reference numerals, and duplicate descriptions thereof will be omitted (Description will now be given in detail according to exemplary embodiments disclosed herein, with reference to the accompanying drawings. For the sake of brief description with reference to the drawings, the same or equivalent components may be denoted by the same reference numbers, and description thereof will not be repeated.).

The suffixes “module” and “part” for components used in the following description are given or used interchangeably only for the ease of preparing the specification, and do not have distinct meanings or roles in themselves (In general, suffixes such as "module" and "unit" may be used to refer to elements or components. Use of such suffixes herein is merely intended to facilitate description of the specification, and the suffixes do not have any special meaning or function).

Additionally, in describing the embodiments disclosed in this specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in this specification, the detailed descriptions will be omitted. In addition, the attached drawings are only for easy understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings, and all changes included in the spirit and technical scope of the present invention are not limited. , it should be understood to include equivalents or substitutes (In the present disclosure, that which is well known to one of ordinary skill in the relevant art has generally been omitted for the sake of brevity. The accompanying drawings are used to assist in easy understanding of various technical features and it should be understood that the embodiments presented herein are not limited by the accompanying drawings.As such, the present disclosure should be construed to extend to any alterations, equivalents and substitutes in addition to those which are particularly set. out in the accompanying drawings).

Terms containing ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another (It will be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by These terms. These terms are only used to distinguish one element from another).

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it will be understood that no other components exist in between. element is referred to as being "connected with" another element, there may be intervening elements present. In contrast, it will be understood that when an element is referred to as being "directly connected with" another element, there are no intervening elements present. ).

A singular expression may include a plural representation unless context clearly indicates otherwise.

In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that it does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof (In the present application, it should be understood that the terms "comprises, includes," " has," etc. specify the presence of features, numbers, steps, operations, elements, components, or combinations thereof described in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof).

The direction indications of up (U), down (D), left (Le), right (Ri), front (F), and back (R) shown in the drawings are only for convenience of explanation, and are hereby used in this specification. The disclosed technical idea is not limited.

Referring to FIG. 1, the display device 1 may include a display panel 10. The display panel 10 can display a screen.

The display device 1 has a first long side (LS1), a second long side (LS2) opposite the first long side (LS1), a first long side (LS1), and a second long side (LS2). It may include a first short side (SS1) adjacent to and a second short side (SS2) opposite the first short side (SS1). Meanwhile, for convenience of explanation, the lengths of the first and second long sides LS1 and LS2 are shown and described as being longer than the lengths of the first and second short sides SS1 and SS2. It may be possible that the length of (LS1, LS2) is approximately the same as the length of the first and second short sides (SS1, SS2).

The direction in which the display panel 10 displays images may be referred to as the front (F, z), and the opposite direction may be referred to as the rear (R). The first long side (LS1) can be called the upper side (U, y). The second long side (LS2) can be called the lower side (D). The first short side (SS1) can be referred to as the left side (Le, x). The second short side (SS2) can be called the right side (Ri). The left and right directions can be said to be horizontal, and the up and down directions can be said to be vertical.

The first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) may be referred to as edges of the display device 1. Additionally, the point where the first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) meet each other may be called a corner.

For example, the point where the first short side SS1 and the first long side LS1 meet may be referred to as the first corner C1. The point where the first long side (LS1) and the second short side (SS2) meet may be referred to as the second corner (C2). The point where the second short side (SS2) and the second long side (LS2) meet may be referred to as the third corner (C3). The point where the second long side (LS2) and the first short side (SS1) meet may be referred to as the fourth corner (C4).

Referring to FIGS. 1 and 2, the display device 1 may include a display panel 10, a frame 20, a side frame 30, and a back cover 40.

The display panel 10 can form the front of the display device 1 and display an image forward. For example, display panel 10 may be an OLED panel, an LCD panel, or an LED panel. However, the display panel applicable to the present disclosure is not limited to this. The display panel 10 can divide an image into a plurality of pixels and output an image with color, brightness, and saturation for each pixel. The display panel 10 may be divided into an active area where images are displayed and a de-active area where images are not displayed. The display panel 10 can generate light corresponding to the colors of red, green, or blue depending on the control signal.

The frame 20 may be located behind the display panel 10, and the display panel 10 may be coupled to the frame 20. For example, the frame 20 may include a metal material. Meanwhile, the frame 20 may be referred to as a main frame or module cover.

The side frame 30 may extend along the perimeter of the frame 20. The frame 20 may be coupled to the side frame 30 at the front or rear of the side frame 30. The side frame 30 may cover the sides of the display panel 10 and the frame 20. Meanwhile, the side frame 30 may be referred to as a guide panel.

The back cover 40 may be located at the rear of the frame 20 and may be coupled to the frame 20. For example, the back cover 40 may be an injection molded product made of resin. For another example, the back cover 40 may include a metal material.

Referring to FIG. 3, boards 50 may be mounted on the frame 20 at the rear or front of the frame 20. Board 50 may include a plurality of electronic devices. The board 50 may be a printed circuit board (PCB) and may be electrically connected to electronic components of a display device.

For example, the boards 50 include a power supply board 51 that provides power to each component of the display device, and a timing controller board 52 that provides an image signal to the display panel 10. board), and a main board (53) that controls the display device. For example, the main board 53 may be an AMP (amplifier) board.

Meanwhile, the S-PCB (11, see FIG. 2, Source PCB) may be adjacent to the bottom of the display panel 10 and may be coupled to the rear of the display panel 10. The cable C can pass through the cable hole CH formed in the lower part of the frame 20 and can be electrically connected to the S-PCB 11 and the timing controller board 52. Accordingly, the cable C can transmit digital video data and timing control signals from the timing controller board 52 to the S-PCB 11. For example, the cable (C) may be a flexible flat cable (FFC).

Referring to FIG. 4, the board 50 may be located at the rear of the frame 20. The board 50 may include layers 501 and 502, a heating element 503, and a plurality of protrusions 70. At this time, the layers 501 and 502 may be coupled to the frame 20 and may include an area spaced apart from the frame 20. For example, the layers 501 and 502 may include a first layer 501 and a second layer 502. Additionally, the layers 501 and 502 may include a third layer disposed between the first layer 501 and the second layer 502, etc.

The first layer 501 may be located at the rear of the frame 20. The surface 50a of the first layer 501 may form the rear surface of the layers 501 and 502. The first layer 501 may be referred to as a top layer, and the surface 50a of the first layer 501 may be referred to as a top silkscreen.

The second layer 502 may be located between the first layer 501 and the frame 20 and may be coupled to the front surface of the first layer 501. The second layer 502 may be spaced rearward from the frame 20. The surface 50b of the second layer 502 may form the front surface of the layers 501 and 502. The second layer 502 may be referred to as a bottom layer, and the surface 50b of the second layer 502 may be referred to as a bottom silkscreen.

At least one heating element 503 may be mounted on the first layer 501 at the rear of the first layer 501 . The heating element 503 may face the frame 20 with respect to the layers 501 and 502. The heating element 503 may be an element that generates heat when current flows. For example, the heating element 503 may be an element such as an AMP IC and an inductor provided on the main board 53 (see FIG. 3). The heating element 503 may be referred to as a heat source.

A plurality of protrusions 70 may protrude from the surface 50b of the second layer 502 toward the frame 20 and may be spaced apart from each other. The plurality of protrusions 70 may be spaced apart from the frame 20 . That is, air between the second layer 502 and the frame 20 may flow between the plurality of protrusions 70.

Referring to Figures 4 and 5, the first heating element 503C may be mounted on the surface 50a of the first layer 501. For example, the first heating element 503C may be an AMP IC. Additionally, a plurality of protrusions 5031, 5032, and 5033 and a plurality of protrusions 70 may be formed on the surface 50b of the second layer 502 and may be spaced apart from the frame 20. That is, the plurality of protrusions 5031, 5032, and 5033 and the plurality of protrusions 70 may face the first heating element 503C with respect to the layers 501 and 502.

For example, the protrusion 70 may include a lead material. For example, the protrusion 70 may be formed using solder cream. That is, the protrusions 70 may be formed by soldering the surface 50b of the second layer 502. The protrusion 70 may be referred to as a vertical protrusion 70, solder, or solder line.

Each of the plurality of protrusions 70 may extend in the vertical direction. Each of the plurality of protrusions 70 may have different lengths. The plurality of protrusions 70 may be spaced apart from each other. The plurality of protrusions 70 may be located in or adjacent to the area of the surface 50b of the second layer 502 corresponding to the position of the first heating element 503C. The plurality of protrusions 70 may be arranged above and below the first heating element 503C.

Accordingly, the plurality of protrusions 70 may increase the surface area of the surface 50b of the second layer 502. In this case, the heat of the first heating element 503C can be effectively released to the outside by air flowing between the second layer 502 and the frame 20. In addition, this flow of air can be smoothly achieved by the shape and arrangement of the plurality of protrusions 70.

Meanwhile, the plurality of protrusions 70 may be spaced apart from the plurality of protrusions 5031, 5032, and 5033. In other words, the plurality of protrusions 70 may be disposed to avoid the plurality of protrusions 5031, 5032, and 5033.

Referring to FIGS. 6 and 7, the first heating element 503C and the second heating element 503I may be mounted on the surface 50a (see FIG. 4) of the first layer 501. For example, the first heating element 503C may be an AMP IC, and the second heating element 503I may be an inductor. For example, the first heating element 503C may be spaced upward from the second heating element 503I. A plurality of protrusions 5031, 5032, 5033, and 5034 and a plurality of protrusions 60 may be formed on the surface 50b of the second layer 502 and be spaced apart from the frame 20 (see FIG. 4). You can. That is, the plurality of protrusions 5031, 5032, 5033, and 5034 and the plurality of protrusions 60 may face the heating elements 503C and 503I with respect to the layers 501 and 502 (see FIG. 4).

For example, the protrusion 60 may include a lead material. For example, the protrusions 60 may be formed using solder cream. That is, the protrusions 60 may be formed by soldering the surface 50b of the second layer 502. The protrusion 60 may be referred to as an inclined protrusion, solder, or solder line.

The plurality of protrusions 60 may be located in or adjacent to an area of the surface 50b of the second layer 502 corresponding to the positions of the heating elements 503C and 503I. The plurality of protrusions 60 may be arranged above and below the heating elements 503C and 503I. The plurality of protrusions 60 may include a first protrusion 61, a second protrusion 62, and a third protrusion 63. The first direction DR1 may be a direction crossing between the upper direction and the right direction. The second direction DR2 may be a direction that intersects the first direction DR1 and may be symmetrical to the first direction DR1 in the vertical direction. For example, the angle between the first direction DR1 and the vertical direction may be 45 degrees.

The first protrusion 61 may have a downward curved shape. The first part 61a of the first protrusion 61 may extend in the first direction DR1, and the second part 61b of the first protrusion 61 may extend in the second direction DR2. there is. For example, the length of the first part 61a and the length of the second part 61b may be substantially the same. For example, the angle (theta 1) between the first part 61a and the second part 61b may be about 90 degrees. The portion where the first part 61a and the second part 61b intersect may be referred to as a corner 61c of the first protrusion 61.

The second protrusion 62 may be adjacent to, but may be spaced apart from, the corner 61c of the first protrusion 61. The second protrusion 62 may extend in the second direction DR2 and may be aligned with the second part 61b of the first protrusion 61 in the second direction DR2. The third protrusion 63 may be adjacent to, but may be spaced apart from, the corner 61c of the first protrusion 61. The third protrusion 63 may extend in the first direction DR1 and may be aligned with the first part 61a of the first protrusion 61 in the first direction DR1. In this case, compared to the case where the second protrusion 62 and/or the third protrusion 63 intersect the corner 61c of the first protrusion 61, the phenomenon of lead clumping in the area of the corner 61c can be minimized.

And, the first protrusion 61, the second protrusion 62, and the third protrusion 63 may be grouped into main protrusions 61, 62, and 63. A plurality of main protrusions 61, 62, and 63 may be arranged in rows and columns on the surface 50b of the second layer 502. The plurality of main protrusions 61, 62, and 63 may form a mesh pattern (M1) on the surface 50b of the second layer 502. The mesh pattern M1 may be a set of virtual lines connecting a plurality of main protrusions 61, 62, and 63. At least a portion of the mesh pattern M1 may be located on an area of the surface 50b of the second layer 502 corresponding to the positions of the heating elements 503C and 503I.

Accordingly, the plurality of main protrusions 61, 62, and 63 can further increase the surface area of the surface 50b of the second layer 502. In this case, the heat of the heating elements 503C and 503I can be more effectively released to the outside by the air flowing between the second layer 502 and the frame 20. Additionally, this air flow can be achieved more smoothly by the shape and arrangement of the plurality of main protrusions 61, 62, and 63 forming the mesh pattern M1.

The plurality of holes 50H may be formed by penetrating the layers 501 and 502 in the front-back direction and may be located between the plurality of main protrusions 61, 62, and 63. The plurality of holes 50H may be located in at least some of the diamonds constituting the mesh pattern M1. The hole 50H may be referred to as a via. Accordingly, the heat of the heating elements 503C and 503I can be more effectively removed by the plurality of holes 50H.

Meanwhile, the plurality of protrusions 60 may be spaced apart from the plurality of protrusions 5031, 5032, 5033, and 5034. In other words, the plurality of protrusions 60 may be disposed to avoid the plurality of protrusions 5031, 5032, 5033, and 5034. For example, the plurality of protrusions 60 may include a fourth protrusion 64, a fifth protrusion 65, a sixth protrusion 66, a seventh protrusion 67, and an eighth protrusion 68. You can.

The fourth protrusion 64 may have a shape bent to the left. The first part 64a of the fourth protrusion 64 may extend in the first direction DR1, and the second part 64b of the fourth protrusion 64 may extend in the second direction DR2. there is. For example, the length of the first part 64a and the length of the second part 64b may be substantially the same. For example, the angle theta 4 between the first part 64a and the second part 64b may be about 90 degrees. The portion where the first part 64a and the second part 64b intersect may be referred to as the corner 64c of the fourth protrusion 64. The plurality of fourth protrusions 64 may be adjacent to but spaced apart from the first protrusion 5031.

The fifth protrusion 65 may have a shape bent upward. The first part 65a of the fifth protrusion 65 may extend in the first direction DR1, and the second part 65b of the fifth protrusion 65 may extend in the second direction DR2. there is. For example, the length of the first part 65a and the length of the second part 65b may be substantially the same. For example, the angle theta 5 between the first part 65a and the second part 65b may be about 90 degrees. The portion where the first part 65a and the second part 65b intersect may be referred to as the corner 65c of the fifth protrusion 65. The plurality of fifth protrusions 65 may be adjacent to but spaced apart from the fourth protrusion 5034.

The sixth protrusion 66 may have a shape bent to the right. The first part 66a of the sixth protrusion 66 may extend in the first direction DR1, and the second part 66b of the sixth protrusion 66 may extend in the second direction DR2. there is. For example, the length of the first part 66a and the length of the second part 66b may be substantially the same. For example, the angle theta 6 between the first part 66a and the second part 66b may be about 90 degrees. The portion where the first part 66a and the second part 66b intersect may be referred to as the corner 66c of the sixth protrusion 66. The plurality of sixth protrusions 66 may be located in an area of the surface 50b of the second layer 502 corresponding to the position of the first heating element 503C, and the layers 501 and 502, see FIG. 4. ) may be spaced apart from a component of the first heating element 503C that protrudes onto the second layer 502.

The seventh protrusion 67 may have a shape bent upward. The first part 67a of the seventh protrusion 67 may extend in the first direction DR1, and the second part 67b of the seventh protrusion 67 may extend in the second direction DR2. there is. For example, the length of the first part 67a and the length of the second part 67b may be substantially the same. For example, the angle theta 7 between the first part 67a and the second part 67b may be about 90 degrees. The portion where the first part 67a and the second part 67b intersect may be referred to as the corner 67c of the seventh protrusion 67. The plurality of seventh protrusions 67 may be located in an area of the surface 50b of the second layer 502 corresponding to the position of the first heating element 503C, and the layers 501 and 502, see FIG. 4. ) may be spaced apart from a component of the first heating element 503C that protrudes onto the second layer 502.

The eighth protrusion 68 may have a shape bent to the left. The first part 68a of the eighth protrusion 68 may extend in the first direction DR1, and the second part 68b of the eighth protrusion 68 may extend in the second direction DR2. there is. For example, the length of the first part 68a and the length of the second part 68b may be substantially the same. For example, the angle theta 8 between the first part 68a and the second part 68b may be about 90 degrees. The portion where the first part 68a and the second part 68b intersect may be referred to as the corner 68c of the eighth protrusion 68. The plurality of eighth protrusions 68 may be adjacent to but spaced apart from the third protrusion 5033.

The fourth protrusion 64, the fifth protrusion 65, the sixth protrusion 66, the seventh protrusion 67, and the eighth protrusion 68 are bent in a different direction from the above-described first protrusion 61. It can have a shape. The fourth protrusion 64, the fifth protrusion 65, the sixth protrusion 66, the seventh protrusion 67, and the eighth protrusion 68 have a plurality of protrusions 5031, 5032, 5033, and 5034. It may be placed away from the main pattern M1 and may form part of the main pattern M1.

Accordingly, the protrusions 64, 65, 66, 67, and 68 may not be interfered with by the protrusions 5031, 5032, 5033, and 5034, and the mesh pattern M1 described above can be enlarged. That is, the heat of the heating elements 503C and 503I can be more effectively removed by the protrusions 64, 65, 66, 67, and 68.

Referring to FIGS. 8 and 9, a plurality of vertical protrusions 70 may be formed on the surface 50b of the second layer 502 and may be spaced apart from each other. Each of the plurality of vertical protrusions 70 may be positioned between the plurality of protrusions 60 .

The plurality of vertical protrusions 70 may be arranged above and below the heating elements 503C and 503I.

Accordingly, the plurality of vertical protrusions 70 may form a vertical pattern (M2) crossing the above-described mesh pattern (M1) and further increase the surface area of the surface (50b) of the second layer (502). You can. The vertical pattern M2 may be a set of virtual lines connecting a plurality of vertical protrusions 70. Heat from the heating elements 503C and 503I can be removed more effectively by the plurality of vertical protrusions 70.

Meanwhile, depending on the embodiment, at least one horizontal protrusion 80 may be formed on the surface 50b of the second layer 502 and may increase the surface area of the surface 50b.

Referring to FIG. 10, a plurality of auxiliary horizontal protrusions 91 may be formed on the surface 50b of the second layer 502 and may be spaced apart from the frame 20 (see FIG. 4). Each of the plurality of auxiliary horizontal protrusions 91 may extend in the left and right directions. A plurality of horizontal protrusions 91 may be located between a plurality of main protrusions 61, 62, and 63. The plurality of horizontal protrusions 91 may be concentrated on the area of the surface 50b of the second layer 502 corresponding to the positions of the heating elements 503C and 503I and the area adjacent thereto. For example, the auxiliary horizontal protrusion 91 may include a lead material. For example, the auxiliary horizontal protrusion 91 may be formed using solder cream. That is, the auxiliary horizontal protrusion 91 may be formed by soldering the surface 50b of the second layer 502.

Accordingly, the heat of the heating elements 503C and 503I can be more effectively removed by the plurality of auxiliary horizontal protrusions 91.

Referring to FIG. 11, a plurality of auxiliary vertical protrusions 92 may be formed on the surface 50b of the second layer 502 and may be spaced apart from the frame 20 (see FIG. 4). Each of the plurality of auxiliary vertical protrusions 92 may extend in the vertical direction. A plurality of auxiliary vertical protrusions 92 may be located between the plurality of main protrusions 61, 62, and 63. The plurality of auxiliary vertical protrusions 92 may be concentrated on the area of the surface 50b of the second layer 502 corresponding to the positions of the heating elements 503C and 503I and the area adjacent thereto. For example, the auxiliary vertical protrusion 92 may include a lead material. For example, the auxiliary vertical protrusion 92 may be formed using solder cream. That is, the auxiliary vertical protrusion 92 may be formed by soldering the surface 50b of the second layer 502.

Accordingly, the heat of the heating elements 503C and 503I can be more effectively removed by the plurality of auxiliary vertical protrusions 92. Considering the characteristic that air whose temperature is raised by the heating elements 503C and 503I rises and is discharged to the outside, the shape and arrangement of these auxiliary vertical protrusions 92 are similar to the auxiliary horizontal protrusions described above with reference to FIG. 10. This may be more advantageous in removing heat from the heating elements 503C and 503I than from the heat generating elements 503C and 503I.

1 to 11, the display device includes: a display panel; a frame located behind the display panel and to which the display panel is coupled; And, it may include a board coupled to the frame and provided with a heating element, wherein the board includes: a layer located between the heating element and the frame, on which the heating element is mounted, and spaced apart from the frame. ; And, it may be formed by soldering on one surface of the layer facing the frame and include a plurality of protrusions spaced apart from the frame, and the plurality of protrusions may be formed on one side of the layer corresponding to the position of the heating element. It may be located in or adjacent to the area of the one surface, and may form a pattern.

The board may be coupled to the frame at the rear of the frame, the heating element may be mounted on the rear of the board, the plurality of protrusions may be formed on the front of the board, and the layer may be: a first layer forming the back side of the board; And, it may further include a second layer that is coupled to the front surface of the first layer and forms the front surface of the board.

Each of the plurality of protrusions may extend in a vertical direction, and the plurality of protrusions may be spaced apart from each other and may be arranged above and below the heating element.

The plurality of protrusions may further include a plurality of first protrusions having a downwardly curved shape, and the plurality of first protrusions may be spaced apart from each other and may be arranged above and below the heating element.

The first protrusion includes: a first part extending from a corner of the first protrusion in a first direction; And, it may include a second part extending from the corner in a second direction intersecting the first direction, wherein the plurality of protrusions include: a plurality of second protrusions extending in the second direction; And, it may further include a plurality of third protrusions extending in the first direction, and the second protrusion may be adjacent to the corner in the second direction and aligned with the second part. 3 projections may be adjacent to the corner in the first direction and aligned with the first part.

The board may include: a main protrusion including the first protrusion, the second protrusion, and the third protrusion, and the main protrusion may be provided in plural numbers, and a mesh may be formed on the one surface of the layer. Patterns can be formed.

At least a portion of the mesh pattern may be located on an area of the one surface of the layer corresponding to the location of the heating element.

The board may further include: a protrusion protruding from the one surface of the layer toward the frame, and the plurality of protrusions: have a shape bent in a direction different from the direction in which the first protrusion is bent, and the protrusion It may further include a fourth protrusion adjacent to but spaced apart from it, and the fourth protrusion may form a part of the mesh pattern.

The board: is formed by soldering on the one surface of the layer, and may further include a plurality of vertical protrusions spaced apart from the frame, each of the plurality of vertical protrusions may extend in a vertical direction, and the plurality of The vertical protrusions may be spaced apart from each other, may be located between the plurality of protrusions, and may be arranged above and below the heating element.

The board: is formed by soldering on the one surface of the layer, extends in the left and right directions, and may further include at least one horizontal protrusion spaced apart from the frame.

The board may be formed by soldering to the one surface of the layer, and may further include a plurality of auxiliary horizontal protrusions spaced apart from the frame, and each of the plurality of auxiliary horizontal protrusions may extend in left and right directions, A plurality of auxiliary horizontal protrusions may be located between the plurality of main protrusions and may be located in an area of the one surface of the layer corresponding to the position of the heating element.

The board may: be formed by soldering on the one surface of the layer, and may further include a plurality of auxiliary vertical protrusions spaced apart from the frame, each of the plurality of auxiliary vertical protrusions may extend in a vertical direction, A plurality of auxiliary vertical protrusions may be located between the plurality of main protrusions and may be located in an area of the one surface of the layer corresponding to the position of the heating element.

The board may further include a plurality of holes formed through the layer and located in at least some of the diamonds constituting the mesh pattern.

The board may be a printed circuit board (PCB).

The heating element is: an inductor; In addition, it may further include an AMP IC spaced upward from the inductor.

Any or other embodiments of the present disclosure described above are not exclusive or distinct from each other. Certain embodiments or other embodiments of the present disclosure described above may have their respective components or functions combined or combined (Certain embodiments or other embodiments of the invention described above are not mutually exclusive or distinct from each other. Any or all elements of the embodiments of the invention described above may be combined or combined with each other in configuration or function).

For example, this means that configuration A described in a particular embodiment and/or drawing may be combined with configuration B described in other embodiments and/or drawings. In other words, even if the combination between configurations is not directly explained, this means that the combination is possible except in cases where the combination is described as impossible (For example, a configuration "A" described in one embodiment of the invention and the drawings and a configuration "B" described in another embodiment of the invention and the drawings may be combined with each other. Namely, although the combination between the configurations is not directly described, the combination is possible except in the case where it is described that the combination is impossible).

The above detailed description should not be construed as restrictive in any respect and should be considered illustrative. The scope of the present invention should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the present invention are included within the scope of the present invention (Although embodiments have been described with reference to a number of illustrative embodiments Thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the scope of the principles of this disclosure.More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art).

Claims (15)

display panel;
a frame located behind the display panel and to which the display panel is coupled; and,
It is coupled to the frame and includes a board having a heating element,
The board is:
a layer located between the heating element and the frame, on which the heating element is mounted, and spaced apart from the frame; and,
It is formed by soldering on one side of the layer facing the frame and includes a plurality of protrusions spaced apart from the frame,
The plurality of protrusions are,
Located in or adjacent to the area of the one surface of the layer corresponding to the position of the heating element, forming a pattern,
The plurality of protrusions are,
It further includes a plurality of first protrusions having a curved shape on one side,
The plurality of first protrusions are,
Display devices spaced apart from each other and arranged above and below the heating element. According to claim 1,
The board is coupled to the frame at the rear of the frame,
The heating element is mounted on the rear of the board,
The plurality of protrusions are formed on the front surface of the board,
The above layers are:
a first layer forming the backside of the board; and,
A display device further comprising a second layer coupled to the front side of the first layer and forming the front side of the board. According to claim 1,
Each of the plurality of protrusions extends in the vertical direction,
The plurality of protrusions are,
Display devices spaced apart from each other and arranged above and below the heating element. delete According to claim 1,
The first protrusion is:
a first part extending from a corner of the first protrusion in a first direction; and,
a second part extending from the corner in a second direction intersecting the first direction;
The plurality of protrusions are:
a plurality of second protrusions extending in the second direction; and,
Further comprising a plurality of third protrusions extending in the first direction,
The second protrusion is,
in the second direction, adjacent to the corner and aligned with the second part,
The third protrusion is,
A display device adjacent to the corner and aligned with the first part in the first direction. According to clause 5,
The board is:
It includes a main protrusion including the first protrusion, the second protrusion, and the third protrusion,
The main protrusion is,
A display device provided in plural pieces and forming a mesh pattern on the one surface of the layer. According to clause 6,
At least part of the mesh pattern is,
A display device located on an area of the one surface of the layer corresponding to the position of the heating element. According to clause 6,
The board is:
Further comprising a protrusion protruding from the one surface of the layer toward the frame,
The plurality of protrusions are:
It has a shape bent in a direction different from the direction in which the first protrusion is bent, and further includes a fourth protrusion adjacent to but spaced apart from the protrusion,
The fourth protrusion is,
A display device forming part of the mesh pattern. According to clause 6,
The board is:
It is formed by soldering on the one surface of the layer and further includes a plurality of vertical protrusions spaced apart from the frame,
Each of the plurality of vertical protrusions extends in a vertical direction,
The plurality of vertical protrusions are,
Display devices spaced apart from each other, located between the plurality of protrusions, and arranged above and below the heating element. According to clause 9,
The board is:
The display device further includes at least one horizontal protrusion formed by soldering on the one surface of the layer, extending in the left and right directions, and spaced apart from the frame. According to clause 6,
The board is:
It is formed by soldering on the one surface of the layer and further includes a plurality of auxiliary horizontal protrusions spaced apart from the frame,
Each of the plurality of auxiliary horizontal protrusions extends in the left and right directions,
The plurality of auxiliary horizontal protrusions are,
A display device located between the plurality of main protrusions and located in an area of the one surface of the layer corresponding to the position of the heating element. According to clause 6,
The board is:
Further comprising a plurality of auxiliary vertical protrusions that protrude from the one surface of the layer toward the frame and are spaced apart from the frame,
Each of the plurality of auxiliary vertical protrusions extends in the vertical direction,
The plurality of auxiliary vertical protrusions are,
A display device located between the plurality of main protrusions and located in an area of the one surface of the layer corresponding to the position of the heating element. According to clause 6,
The board is:
The display device is formed through the layer and further includes a plurality of holes in at least some of the diamonds constituting the mesh pattern. According to claim 1,
The board is a display device that is a printed circuit board (PCB). According to claim 1,
The heating element is:
inductor; and,
A display device further comprising an AMP IC spaced upward from the inductor.

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