CN102980066A - Substrate-free LED (Light-Emitting Diode) lamp and preparation method thereof - Google Patents
Substrate-free LED (Light-Emitting Diode) lamp and preparation method thereof Download PDFInfo
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- CN102980066A CN102980066A CN2012105103749A CN201210510374A CN102980066A CN 102980066 A CN102980066 A CN 102980066A CN 2012105103749 A CN2012105103749 A CN 2012105103749A CN 201210510374 A CN201210510374 A CN 201210510374A CN 102980066 A CN102980066 A CN 102980066A
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Abstract
The invention discloses a substrate-free LED (Light-Emitting Diode) lamp and a preparation method thereof. The substrate-free LED lamp comprises a base and a plurality of LED lamp beads arranged on a the base, wherein the base is provided with a metal plating a and a metal plating b; a circuit layer is formed on the metal plating a; a heat conducting layer is formed on the metal plating b; pins of the LED lamp beads are welded on the metal plating a; the LED lamp beads and the metal plating a construct a conducting circuit; and the bottoms of the LED lamp beads are tightly attached to the metal plating b, so that heat of the LED lamp beads is convenient to conduct. The substrate-free LED lamp has the advantages of simple structure and good radiating effect; the preparation method is simple and convenient; and the circuit layer and the heat conducting layer are formed on the base by adopting laser etching and electric chemical plating methods, so that the manufacturing cost is low.
Description
Technical field
The present invention relates to LED lamp technical field, particularly relate to a kind of without substrate and good heat dissipation effect without substrate LED lamp and preparation method thereof.
Background technology
Along with the development and maturation of LED technology, the index of LED improves day by day, and the LED illuminating product is long with its life-span, and the characteristics such as energy-conserving and environment-protective have obtained increasing application.Single LED lamp heating is relatively concentrated, and the heat of generation is larger, and it is crucial solving heat dissipation problem.
But at present mostly the LED lamp is the bead weld of LED lamp is connected on aluminium base or the ceramic substrate, again aluminium base or ceramic substrate are connected with bearing, therefore, between LED lamp pearl and the bearing every one deck aluminium base or ceramic substrate.Because the existence of aluminium base or ceramic substrate has increased the thermal resistance between LED lamp pearl and the bearing, reduced the effect of heat radiation, cause greatly shorten the service life of LED lamp pearl.In addition, cost height, complex manufacturing technology, the electrical insulation capability of aluminium base are relatively poor simultaneously; Ceramic substrate needs high temperature sintering moulding, complex process, expensive, bad mechanical property and frangible.Therefore, the complex structure of present LED lamp, manufacturing cost height, complex manufacturing technology and radiating effect are bad.
Summary of the invention
Based on this, be necessary the problem for the shortcoming of prior art, provide that a kind of it is simple in structure without substrate LED lamp and preparation method thereof, good heat dissipation effect, cost of manufacture is low, and the preparation method is simple, convenient.
A kind of without substrate LED lamp and preparation method thereof, comprise base and be located at some LED lamp pearls on the described base; Described base is provided with coat of metal a and coat of metal b, and described coat of metal a forms circuit layer, and described coat of metal b forms heat-conducting layer; The pin of described LED lamp pearl is welded on the described coat of metal a, and described LED lamp pearl and coat of metal a form conductive path, and described coat of metal b is close in the bottom of described LED lamp pearl, is convenient to the conduction of LED lamp pearl heat.
Therein among embodiment, described base is the ambroin of alternative metallization, high temperature resistant, high heat conduction.
Among embodiment, described ambroin adopts one or more in polyethylene, polypropylene, polystyrene, polyvinyl chloride, polymethyl methacrylate, PETG, polybutylene terephthalate (PBT), polyamide, Merlon, acrylonitrile-butadiene-styrene copolymer, polyimides, polyamide-imides, polyurethane, polyformaldehyde, polyether sulfone, polyphenylene sulfide, haloflex, s-B-S block polymer, the polyphenylene oxide therein.
Among embodiment, the thickness of described coat of metal a is 0.005mm ~ 0.2mm therein.
Among embodiment, the thickness of described coat of metal b is 0.05mm ~ 0.4mm therein.
Among embodiment, described coat of metal a is one or more among Cu, Au, Ni, Co, Fe, Zn, Pd, Pt, Ru, Rh, Re, Os, the Ir therein.
Among embodiment, described coat of metal b is one or more among Cu, Au, Ni, Co, Fe, Zn, Pd, Pt, Ru, Rh, Re, Os, the Ir therein.
Among embodiment, above-mentioned preparation method without substrate LED lamp comprises the steps: therein
1., at first described base is made in alternative metallization, ambroin injection moulding high temperature resistant, high heat conduction;
2., complete the on computers circuit of coat of metal a and coat of metal b on the described base;
3., with laser instrument the laser focusing bundle is incident upon on the described base, and according to above-mentioned circuit described base is carried out laser-induced thermal etching, physical-chemical reaction occurs in the place that described base is crossed by laser projection, restores metal ion, forms the metal nucleus; And form one by etching and increase the subordinate list face, make coat of metal a and coat of metal b and base bonding more firm;
4., adopt the method for chemical plating to form described coat of metal a and coat of metal b in the laser-induced thermal etching district;
5., after described coat of metal a and coat of metal b form, described coat of metal b is close in the bottom of described LED lamp pearl, and the pin of described LED lamp pearl is welded on the described coat of metal a, make between described LED lamp pearl and the described coat of metal a and form conductive path;
6., finish preparation without substrate LED lamp.
Therein among embodiment, it is 1000nm that wavelength is adopted in the laser-induced thermal etching of described preparation process in 3., and energy is 200mJ/cm
2Laser beam.
Above-mentioned without substrate LED lamp and preparation method thereof, its reasonable in design, simple, do not need to use circuit substrate, only need to offer circuit layer and heat-conducting layer gets final product at described base, the pin of described LED lamp pearl is welded on the described circuit layer, described heat-conducting layer is close in the bottom of described LED lamp pearl, so that the heat of described LED lamp pearl conduction.
Cost of manufacture of the present invention is low, good heat dissipation effect, and manufacture craft is simple, reliable.Described LED lamp pearl by described coat of metal b heat conduction, has been saved material and production cost by described coat of metal a conducting.
Description of drawings
Fig. 1 is structure side view of the present invention;
Fig. 2 is structure top view of the present invention.
Below be parts sign flag explanation of the present invention:
The specific embodiment
For further understanding feature of the present invention, technological means and the specific purposes that reach, function, resolve the advantages and spirit of the present invention, by below in conjunction with accompanying drawing and the specific embodiment detailed description of the present invention being further understood.
A kind of without substrate LED lamp and preparation method thereof, comprise base 10 and be located at some LED lamp pearls 20 on the described base 10.Described base 10 is provided with coat of metal a11 and coat of metal b12, and coat of metal a11 forms the circuit layer that makes 20 conductings of described LED lamp pearl, and coat of metal b12 forms heat-conducting layer.The pin 21 of LED lamp pearl 20 is welded on the coat of metal a11, forms conductive path with coat of metal a11.Coat of metal b12 is close in the bottom of LED lamp pearl 20, and what be convenient to LED lamp pearl 20 heats conducts to base 10.
This base 10 is the ambroin of selective metallization, high temperature resistant, high heat conduction.Ambroin adopts one or more in polyethylene, polypropylene, polystyrene, polyvinyl chloride, polymethyl methacrylate, PETG, polybutylene terephthalate (PBT), polyamide, Merlon, acrylonitrile-butadiene-styrene copolymer, polyimides, polyamide-imides, polyurethane, polyformaldehyde, polyether sulfone, polyphenylene sulfide, haloflex, s-B-S block polymer, the polyphenylene oxide.Ambroin preferred polyamide, its resistance to elevated temperatures can make base 10 at high temperature not yielding; Its high-termal conductivity, the heat of being convenient to these LED lamp pearl 20 generations distributes by base 10 fast, prolongs the service life of LED lamp.
The power of described LED lamp pearl 20 is 0.5～10W.This coat of metal a11 and coat of metal b12 interval arrange, and the thickness of coat of metal a11 is 0.005mm ~ 0.2mm; The thickness of coat of metal b12 is 0.05mm ~ 0.4mm.
This coat of metal a is one or more among Cu, Au, Ni, Co, Fe, Zn, Pd, Pt, Ru, Rh, Re, Os, the Ir.
This coat of metal b is one or more among Cu, Au, Ni, Co, Fe, Zn, Pd, Pt, Ru, Rh, Re, Os, the Ir.
Above-mentioned preparation method without substrate LED lamp comprises the steps:
1., at first with the exhausted plastic injection-moulded base 10 of making of selective metallization, high temperature resistant, high heat conduction;
2., draw on computers the circuit of coat of metal a and coat of metal b on the base;
3., to adopt laser instrument be 1000nm with wavelength, energy is 200mJ/cm
2The laser focusing bundle be incident upon on the described base 10, and under the sweep speed of 0.5mm/s, according to above-mentioned circuit described base 10 is carried out laser-induced thermal etching, physical-chemical reaction occurs in the place that described base 10 is crossed by laser projection, restores metal ion, forms the metal nucleus; And form one by etching and increase the subordinate list face, make coat of metal a11 and coat of metal b12 and ambroin bonding more firm;
4., adopt the method for chemical plating to form several coats of metal a11 and coat of metal b12 in the laser-induced thermal etching district, the thickness of coat of metal a11 is 0.1mm; The thickness of coat of metal b12 is 0.2mm; Adopt the method for chemical plating so that the uniformity of coat of metal a11 and coat of metal b12 is better, can improve corrosion resistance and the service life of LED lamp;
5., after described coat of metal a11 and coat of metal b12 form, beginning is on base 10 welding LED lamp pearls 20, coat of metal b12 is close in the bottom of LED lamp pearl 20, and the pin 21 of described LED lamp pearl 20 is welded on the described coat of metal a11, make between LED lamp pearl 20 and the coat of metal a11 and form conductive path;
6., finish preparation without substrate LED lamp.
In sum, reasonable in design of the present invention, simple, and manufacture craft is simple, reliable, does not need to use circuit substrate only needs to offer circuit layer and heat-conducting layer gets final product at described base 10.The pin 21 of described LED lamp pearl 20 is welded on the described circuit layer, and described heat-conducting layer is close in the bottom of described LED lamp pearl 20, and not only the preparation method is simple, convenient, and is convenient to the heat conduction of LED lamp pearl 20, good heat dissipation effect.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (7)
1. one kind without substrate LED lamp, it is characterized in that, comprises base and is located at some LED lamp pearls on the described base; Described base is provided with coat of metal a and coat of metal b, and described coat of metal a forms circuit layer, and described coat of metal b forms heat-conducting layer; The pin of described LED lamp pearl is welded on the described coat of metal a, and described LED lamp pearl and coat of metal a form conductive path, and described coat of metal b is close in the bottom of described LED lamp pearl, is convenient to the conduction of LED lamp pearl heat.
2. according to claim 1ly it is characterized in that without substrate LED lamp that described base is the ambroin of selective metallization, high heat-resisting, high heat conduction.
3. according to claim 2 without substrate LED lamp, it is characterized in that described ambroin adopts one or more in polyethylene, polypropylene, polystyrene, polyvinyl chloride, polymethyl methacrylate, PETG, polybutylene terephthalate (PBT), polyamide, Merlon, acrylonitrile-butadiene-styrene copolymer, polyimides, polyamide-imides, polyurethane, polyformaldehyde, polyether sulfone, polyphenylene sulfide, haloflex, s-B-S block polymer, the polyphenylene oxide.
4. according to claim 1 without substrate LED lamp, it is characterized in that, the thickness of described coat of metal a is 0.005mm ~ 0.2mm, and described coat of metal a is one or more among Cu, Au, Ni, Co, Fe, Zn, Pd, Pt, Ru, Rh, Re, Os, the Ir.
5. according to claim 1ly it is characterized in that without substrate LED lamp the thickness of described coat of metal b is 0.05mm ~ 0.4mm, described coat of metal b is one or more among Cu, Au, Ni, Co, Fe, Zn, Pd, Pt, Ru, Rh, Re, Os, the Ir.
6. the preparation method without substrate LED lamp is characterized in that, described preparation method comprises the steps:
1., at first base is made in selective metallization, high ambroin injection moulding heat-resisting, high heat conduction;
2., the circuit of coat of metal a and coat of metal b on the drawn base on computers;
3., adopt laser instrument that the laser focusing bundle is incident upon on the base, and according to above-mentioned circuit base is carried out laser-induced thermal etching, physical-chemical reaction occurs in the place that base is crossed by laser projection, restores metal ion, forms the metal nucleus; And form one by etching and increase the subordinate list face, make coat of metal a and coat of metal b and base bonding more firm;
4., adopt the method for chemical plating to form coat of metal a and coat of metal b in the laser-induced thermal etching district;
5., after coat of metal a and coat of metal b form, coat of metal b is close in the bottom of LED lamp pearl, and the pin of LED lamp pearl is welded on the coat of metal a, make between LED lamp pearl and the coat of metal a and form conductive path;
6., finish preparation without substrate LED lamp.
7. the preparation method without substrate LED lamp according to claim 6 is characterized in that, it is 1000nm that wavelength is adopted in the laser-induced thermal etching of described preparation process in 3., and energy is 200mJ/cm
2Laser beam.
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| CN201210510374.9A CN102980066B (en) | 2012-12-03 | 2012-12-03 | Without substrate LED and preparation method thereof |
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| CN201210510374.9A CN102980066B (en) | 2012-12-03 | 2012-12-03 | Without substrate LED and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104329597A (en) * | 2014-09-10 | 2015-02-04 | 东莞市信诺橡塑工业有限公司 | Non-substrate LED (Light Emitting Diode) lamp and preparation method thereof |
| CN106641952A (en) * | 2016-09-30 | 2017-05-10 | 武汉通畅汽车电子照明有限公司 | Mounting support for automobile signal lamp |
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| CN101963336A (en) * | 2009-07-24 | 2011-02-02 | 乐金显示有限公司 | Apparatus for radiating heat of light emitting diode and liquid crystal display using the same |
| CN102775768A (en) * | 2012-07-13 | 2012-11-14 | 东莞市信诺橡塑工业有限公司 | High-conductivity insulated polyamide 6 composition capable of being directly molded by laser and used for LED (light-emitting diode) light source substrate and preparation method thereof |
| CN202972657U (en) * | 2012-12-03 | 2013-06-05 | 东莞市信诺橡塑工业有限公司 | Substrate-free LED (Light Emitting Diode) lamp |
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| CN101963336A (en) * | 2009-07-24 | 2011-02-02 | 乐金显示有限公司 | Apparatus for radiating heat of light emitting diode and liquid crystal display using the same |
| CN101709858A (en) * | 2009-09-27 | 2010-05-19 | 广州南科集成电子有限公司 | LED lighting high-efficiency heat-radiating aluminum baseplate, LED light source and making methods thereof |
| CN102775768A (en) * | 2012-07-13 | 2012-11-14 | 东莞市信诺橡塑工业有限公司 | High-conductivity insulated polyamide 6 composition capable of being directly molded by laser and used for LED (light-emitting diode) light source substrate and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104329597A (en) * | 2014-09-10 | 2015-02-04 | 东莞市信诺橡塑工业有限公司 | Non-substrate LED (Light Emitting Diode) lamp and preparation method thereof |
| WO2016037387A1 (en) * | 2014-09-10 | 2016-03-17 | 东莞市信诺橡塑工业有限公司 | Substrate-less led light and manufacturing method therefor |
| CN104329597B (en) * | 2014-09-10 | 2016-11-23 | 广东中塑新材料有限公司 | A kind of without substrate LED and preparation method thereof |
| CN106641952A (en) * | 2016-09-30 | 2017-05-10 | 武汉通畅汽车电子照明有限公司 | Mounting support for automobile signal lamp |
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Address after: 355 No. 523850 Guangdong city in Dongguan Province town of Changan Wusha Cun BBK Avenue Patentee after: GUANGDONG SINOPLAST ADVANCED MATERIAL CO.,LTD. Address before: 355 No. 523850 Guangdong city in Dongguan Province town of Changan Wusha Cun BBK Avenue Patentee before: DONGGUAN SINOPLAST INDUSTRIAL Ltd. |
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Address after: 523850 Baibugao Avenue, Wushajiang, Chang'an Town, Dongguan City, Guangdong Province, 355 Patentee after: Guangdong Sinoplast New Materials Co.,Ltd. Address before: 523850 Baibugao Avenue, Wushajiang, Chang'an Town, Dongguan City, Guangdong Province, 355 Patentee before: GUANGDONG SINOPLAST ADVANCED MATERIAL CO.,LTD. |