CN203517462U - Binding type flexible lamp band - Google Patents
Binding type flexible lamp band Download PDFInfo
- Publication number
- CN203517462U CN203517462U CN201320574886.1U CN201320574886U CN203517462U CN 203517462 U CN203517462 U CN 203517462U CN 201320574886 U CN201320574886 U CN 201320574886U CN 203517462 U CN203517462 U CN 203517462U
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- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- flat conductor
- lamp socket
- light band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses a binding type flexible lamp band which comprises a flexible circuit board. The flexible circuit board comprises an insulating layer, flat wires which are arranged side by side and a plurality of LEDs, wherein the flat wires are mutually attached to the insulating layer, and the flat wires are excised to form a circuit layer at a position needing to be cut off. Each LED comprises a lamp holder, a wafer and a metal wire, wherein the lamp holder is provided with a bowl cup, the wafer is arranged in the bowl cup, packaging glue for protecting the wafer is arranged in the bowl cup, and the lamp holder is formed at the position where the flat wires are cut off based on the injection technology. The LEDs and the flexible circuit board are of an integral structure. The binding type flexible lamp band is good in heat-dissipating performance, high in production efficiency and capable of solving the problems of poor welding and bridge connecting.
Description
Technical field
The utility model relates to decorative illumination lamp, relates in particular to a kind of nation fixed pattern flexible light band.
Background technology
The production technology of existing SMD flexible light band is generally: first adopting surface mounted LED encapsulated, then LED is welded on flexible circuit board, and in parallel with power line again according to user demand.There is following defect in this kind of lamp band: first, because adopting surface mounted LED inner space is very little, the structure and material of flexible circuit board is also unfavorable for heat radiation, and therefore long-time use easily causes LED excess Temperature and causes light decay; Secondly, on narrower flexible circuit board, weld intensive electronic component, may have the problems such as bad weldering and crossover; Finally, this kind of lamp band structure is complicated, and manufacture craft is complicated, can not meet Production requirement day by day efficiently.
Summary of the invention
The purpose of this utility model is to solve the problems of the technologies described above, and a kind of nation fixed pattern flexible light band is provided, and its heat dispersion is good, and production efficiency is high and eliminate the problem of bad weldering and crossover.
To achieve these goals, the scheme that the utility model adopts is:
Nation's fixed pattern flexible light band, is characterized in that, comprises
Flexible circuit board, described flexible circuit board comprises: insulating barrier; Juxtaposed flat conductor, described flat conductor and insulating barrier are fitted mutually, and the position that described flat conductor disconnects at needs is processed to form line layer by excision;
A plurality of LED; described LED comprises lamp socket, wafer and wire; described lamp socket is provided with bowl cup; described wafer is arranged in bowl cup; in described bowl cup, be provided with the packaging plastic of protection wafer; described lamp socket forms in by Shooting Technique the position that described flat conductor disconnects, and described LED and flexible circuit board are structure as a whole.
Further, described wafer is fixed on flat conductor, and the positive and negative electrode of described wafer is realized and being connected with flat conductor by wire.
Further, described LED is arranged on the one side of flexible circuit board, and flexible circuit board is run through in the bottom of described lamp socket.
Further, described lamp socket injection molded is in the upper surface of flexible circuit board, and the position of the corresponding lamp socket of the lower surface of described flexible circuit board is fixed with hardboard.
Further, the above and below of described flexible circuit board is all provided with LED.
Further, described LED forms upper and lower aligned fashion, and the lamp socket of upper and lower two LED of aligned fashion is structure as a whole.
Further, described LED forms and staggers upper and lower distribution.
Further, described insulating barrier is provided with openning
Further, the contact-making surface of described flat conductor and lamp socket is frosted shape.
Further, described flat conductor adopts circle line pressure to prolong and makes, or divides and cut into metal forming, metallic plate, metal tape.
Compared with prior art, the beneficial effects of the utility model are: 1.LED wafer is directly fixed on wire, and the heat that wafer produces can be directly conducted to flat conductor, are conducive to LED heat radiation, avoid because excess Temperature produces light decay; The die bond of 2.LED and nation establish a capital directly and carry out on flat conductor, have simplified production technology; 3. omitted LED has been welded in to the step on flexible circuit board, avoided the problem of bad weldering and crossover.
Accompanying drawing explanation
Fig. 1 is stereogram of the present utility model;
Fig. 2 is the stereogram of the single led and flexible circuit board of the utility model embodiment mono-;
Fig. 3 is the enlarged drawing of the A part of Fig. 2;
Fig. 4 is the side view of the single led and flexible circuit board of the utility model embodiment mono-;
Fig. 5 is the bottom view of the single led and flexible circuit board of the utility model embodiment bis-;
Fig. 6 is the side view of the utility model embodiment tri-;
Fig. 7 is the side view of the utility model embodiment tetra-;
Fig. 8 is the side view of the utility model embodiment five.
The specific embodiment
Below in conjunction with accompanying drawing, by embodiment, the utility model is described in further detail.Described embodiment only, for technical scheme of the present invention is described, does not form the restriction to rights protection scope of the present invention.
Referring to figs. 1 through Fig. 4, the utility model comprises flexible circuit board 1 and a plurality of LED2, and in embodiment mono-, flexible circuit board 1 comprises juxtaposed flat conductor 12, fits in the insulating barrier 11 of the above and below of flat conductor 12, and LED2 is arranged at the one side of flexible circuit board 1.The position that flat conductor 12 disconnects at needs is processed to form line layer by excision.LED2 comprises lamp socket 21, wafer 22 and wire 23, and lamp socket 21 is provided with bowl cup 14, and wafer 22 is arranged in bowl cup 14, is provided with the packaging plastic of protection wafer 22 in bowl cup 14.Lamp socket 21 forms in the open position on flat conductor 12 by Shooting Technique, and the bottom of lamp socket 21 runs through flexible circuit board 1, and LED2 and flexible circuit board 1 are structure as a whole.Wafer 22 is fixed on flat conductor 12, and the positive and negative electrode of wafer 22 is realized and being connected with flat conductor 12 by wire 23.
In process of production, first flat conductor 12 is fitted on insulating barrier 11, then to flat conductor 12, need the position disconnecting to excise processing to form line layer, the insulating barrier 11 of fitting again on flat conductor and insulating barrier again, then the open position on flat conductor 12 forms lamp socket 21 by injection moulding, finally in lamp socket inside, carries out that die bond, nation are fixed, sealing.
Between lamp socket 21 and flat conductor 12, can adopt glue bonding, preferably, can also in advance the contact-making surface of flat conductor and lamp socket be processed into frosted shape, increase roughness, bond more firm.In addition, insulating barrier 11 can be provided with openning, to avoid insulating barrier 11 to cover flat conductor completely, affects die bond and Bang Ding.
With reference to Fig. 5, embodiment bis-of the present utility model is unanimous on the whole with the structure of embodiment mono-, its distinctive points is that lamp socket 21 injection moldeds are in the upper surface of flexible circuit board 1, the position of the corresponding lamp socket 21 of lower surface of flexible circuit board 1 is fixed with hardboard 3, for preventing that wafer and the gold thread of LED from coming off because lamp band bends distortion.
With reference to Fig. 6, embodiment tri-of the present utility model makes improvements on the basis of embodiment mono-, at the upper and lower faces of flexible circuit board 1, is all provided with LED2, and LED2 forms consistency from top to bottom and distributes, and the lamp socket 21 of two LED of upper and lower alignment is structure as a whole.
With reference to Fig. 7, embodiment tetra-of the present utility model is unanimous on the whole with embodiment tri-, and distinctive points is that the LED2 formation interval of flexible circuit board 1 upper and lower faces is in staggered distribution, and other technologies main points are identical with embodiment tri-, at this, do not do to state more.
With reference to Fig. 8, the structure of the flexible circuit board of embodiment five of the present utility model is: the upper and lower faces of insulating barrier 11 is all fitted with flat conductor 12, the flat conductor 12 outsides insulating barrier 11 of fitting again, LED2 is distributed in the upper and lower faces of flexible circuit board, can form consistency from top to bottom or interval is in staggered distribution.
Be more than to description of the present utility model and non-limiting, other embodiments based on the utility model thought, all among protection domain of the present utility model.
Claims (10)
1.Yi Zhong nation fixed pattern flexible light band, is characterized in that, comprises
Flexible circuit board, described flexible circuit board comprises: insulating barrier; Juxtaposed flat conductor, described flat conductor and insulating barrier are fitted mutually, and the position that described flat conductor disconnects at needs is processed to form line layer by excision;
A plurality of LED; described LED comprises lamp socket, wafer and wire; described lamp socket is provided with bowl cup; described wafer is arranged in bowl cup; in described bowl cup, be provided with the packaging plastic of protection wafer; described lamp socket forms in by Shooting Technique the position that described flat conductor disconnects, and described LED and flexible circuit board are structure as a whole.
2. a kind of nation according to claim 1 fixed pattern flexible light band, is characterized in that: described wafer is fixed on flat conductor, and the positive and negative electrode of described wafer is realized and being connected with flat conductor by wire.
3. a kind of nation according to claim 2 fixed pattern flexible light band, is characterized in that: described LED is arranged on the one side of flexible circuit board, and flexible circuit board is run through in the bottom of described lamp socket.
4. a kind of nation according to claim 2 fixed pattern flexible light band, is characterized in that: described lamp socket injection molded is in the upper surface of flexible circuit board, and the position of the corresponding lamp socket of the lower surface of described flexible circuit board is fixed with hardboard.
5. a kind of nation according to claim 2 fixed pattern flexible light band, is characterized in that: the above and below of described flexible circuit board is all provided with LED.
6. a kind of nation according to claim 5 fixed pattern flexible light band, it is characterized in that: described LED forms upper and lower aligned fashion, and the lamp socket of two LED of upper and lower alignment is structure as a whole.
7. a kind of nation according to claim 5 fixed pattern flexible light band, is characterized in that: described LED forms and staggers upper and lower distribution.
8. according to a kind of nation fixed pattern flexible light band described in claim 1 to 7 any one, it is characterized in that: described insulating barrier is provided with openning.
9. a kind of nation fixed pattern flexible light band described in any one according to Claim 8, is characterized in that: the contact-making surface of described flat conductor and lamp socket is frosted shape.
10. a kind of nation according to claim 9 fixed pattern flexible light band, is characterized in that: described flat conductor adopts circle line pressure to prolong and makes, or divides and cut into metal forming, metallic plate, metal tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320574886.1U CN203517462U (en) | 2013-09-16 | 2013-09-16 | Binding type flexible lamp band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320574886.1U CN203517462U (en) | 2013-09-16 | 2013-09-16 | Binding type flexible lamp band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203517462U true CN203517462U (en) | 2014-04-02 |
Family
ID=50376392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320574886.1U Expired - Fee Related CN203517462U (en) | 2013-09-16 | 2013-09-16 | Binding type flexible lamp band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203517462U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465955A (en) * | 2014-12-26 | 2015-03-25 | 深圳万润科技股份有限公司 | LED lamp belt and manufacturing method thereof |
| CN109519742A (en) * | 2018-12-09 | 2019-03-26 | 江门朗天照明有限公司 | A kind of strip light with flip LED chips |
-
2013
- 2013-09-16 CN CN201320574886.1U patent/CN203517462U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465955A (en) * | 2014-12-26 | 2015-03-25 | 深圳万润科技股份有限公司 | LED lamp belt and manufacturing method thereof |
| CN109519742A (en) * | 2018-12-09 | 2019-03-26 | 江门朗天照明有限公司 | A kind of strip light with flip LED chips |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 529728 Jiangmen City, Heshan Province, Republican Town, Xianghe Road, No. H, building, 326 Patentee after: HESHAN TONGFANG LIGHTING TECHNOLOGY Co.,Ltd. Address before: 529728 Jiangmen City, Heshan Province, Republican Town, Xianghe Road, No. H, building, 326 Patentee before: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LIMITIED |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 529728 Area A, 42nd Floor, 301 Xianghe Road, Gonghe Town, Heshan City, Guangdong Province Patentee after: Guangdong Tongfang Science Park Co.,Ltd. Address before: 529728 H, 326 Xianghe Road, Gonghe Town, Heshan City, Jiangmen, Guangdong. Patentee before: HESHAN TONGFANG LIGHTING TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200219 Address after: 529728 43rd Floor, 301 Xianghe Road, Gonghe Town, Heshan City, Jiangmen City, Guangdong Province Patentee after: GUANGDONG TONGFANG DECORATIVE LIGHTING Co.,Ltd. Address before: 529728 Area A, 42nd Floor, 301 Xianghe Road, Gonghe Town, Heshan City, Guangdong Province Patentee before: Guangdong Tongfang Science Park Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 |