CN102978568A - OLED (organic light-emitting diode) evaporation cover and processing method thereof - Google Patents
OLED (organic light-emitting diode) evaporation cover and processing method thereof Download PDFInfo
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- CN102978568A CN102978568A CN2012105696388A CN201210569638A CN102978568A CN 102978568 A CN102978568 A CN 102978568A CN 2012105696388 A CN2012105696388 A CN 2012105696388A CN 201210569638 A CN201210569638 A CN 201210569638A CN 102978568 A CN102978568 A CN 102978568A
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- evaporation
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- 238000001704 evaporation Methods 0.000 title claims abstract description 150
- 230000008020 evaporation Effects 0.000 title claims abstract description 148
- 238000003672 processing method Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000005516 engineering process Methods 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000011521 glass Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000008187 granular material Substances 0.000 abstract 1
- 239000011368 organic material Substances 0.000 description 7
- 230000003245 working effect Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 230000003467 diminishing effect Effects 0.000 description 3
- 230000004304 visual acuity Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Electroluminescent Light Sources (AREA)
Abstract
The invention relates to an OLED (organic light-emitting diode) evaporation cover and a processing method thereof. The OLED evaporation cover comprises an evaporation plate, wherein the evaporation plate comprises an ITO (indium tin oxide) contact surface and an evaporation surface; the evaporation plate is provided with a plurality of evaporation holes in a central symmetry mode; the evaporation holes penetrate from the evaporation surface to the ITO contact surface; and the cross section of each hole gradually reduces. The invention overcomes the dead areas in the traditional technique; and thus, when the invention is applied to evaporation, organic light-emitting granules can reach to the preset positions on the glass substrate to a large extent, thereby improving the quality of the OLED display screen, enhancing the use rate and film-forming rate of the organic luminescent material, lowering the manufacturing cost of the OLED display screen and effectively prolonging the service life of the evaporation cover.
Description
Technical field
The present invention relates to OLED display screen manufacturing technology field, particularly a kind of OLED evaporation cover and working method thereof.
Background technology
Organic electroluminescence device has luminous, the reaction times is fast, the visual angle is wide, cost is low, manufacturing process is simple, resolving power is good and the multiple advantages such as high brightness, is considered to the emerging utilisation technology of follow-on flat-panel screens.At OLED(Organic Light-Emitting Diode, organic electroluminescent LED) in the technology, mask plate technology in the vacuum evaporation is an extremely important and crucial technology, and the grade of this technology directly affects quality and the manufacturing cost of OLED product.
When being applied to evaporation, the evaporation of traditional technology generally adopts positive and negative while etch process with mask plate, although can produce the opening with certain taper, but the reason owing to lateral erosion, so that being adjacent to the indium tin oxide contact surface opening of the indium tin oxide contact surface of evaporation ITO glass substrate, mask plate has back draught, the existence of this kind reversed cone angle, produce dead angle area, because the existence of this dead angle area, can't reach the evaporation thickness requirement, cause the one-tenth film uniformity of deposition material to reduce, affect evaporating quality, prolong the evaporation time, increased manufacturing cost.
General evaporation with the thickness of shadow mask (being mask plate) about 100 μ m, and the thickness of the organic material film of need evaporation is about 100nm, opening size minimum on the shadow mask can be 10 μ m, blocks so the sidewall of zero draft opening will certainly produce in evaporate process.On the other hand, if the method for the thickness by the attenuate shadow mask reduces the coverage extent of shadow mask, can affect again the work-ing life of shadow mask, because shadow mask is excessively thin, yielding, the use of the shadow mask of impact reduces evaporating quality.
Summary of the invention
Main purpose of the present invention is, for above-mentioned deficiency of the prior art, provides a kind of OLED evaporation cover and working method thereof, has rate of utilization and the yield polymer films that can improve luminous organic material, prolongs the work-ing life of evaporation cover and saves manufacture cost and other advantages.
For achieving the above object, the present invention by the following technical solutions.
The invention provides a kind of OLED evaporation cover, comprise the evaporation plate, described evaporation plate comprises ITO contact surface and evaporation face, is provided with the evaporation hole of a plurality of shapes that are centrosymmetric on the described evaporation plate, described evaporation hole is through to described ITO contact surface from described evaporation face, and the cross section is and dwindles gradually situation.
Preferably, described evaporation hole comprises coaxial first paragraph and second segment, and described first paragraph is horn-like, and second segment is horn-like or taper.
Preferably, the thickness of described evaporation plate is 18～190 μ m.
Preferably, described evaporation hole is 35 ~ 45 degree at the inclination angle of first paragraph.
Preferably, described second segment is taper, and cone angle is 4 ~ 10 degree.
Preferably, the vertical depth of described second segment is 8～20 μ m.
Preferably, the vertical depth of described second segment is not more than the vertical depth of first paragraph.
Preferably, the material of described evaporation plate is any one in nickel cobalt (alloy), Rhometal, the indium watt alloy, and thickness is 18～45 μ m.
The present invention also provides a kind of working method of OLED evaporation cover, described OLED evaporation cover comprises the evaporation plate, the evaporation plate comprises ITO contact surface and evaporation face, be provided with the evaporation hole of a plurality of shapes that are centrosymmetric on the described evaporation plate, described evaporation hole is through to described ITO contact surface from described evaporation face, comprise first paragraph and second segment, described working method may further comprise the steps:
Adopt etch process to process the first paragraph in described evaporation hole at described evaporation face;
Adopt laser technology to process described second segment at described first paragraph end to described ITO contact surface, and make the coaxial setting of described first paragraph and second segment.
Preferably, the thickness of described evaporation plate is 18～190 μ m; Described evaporation hole is 35 ~ 45 degree at the inclination angle of first paragraph, and described second segment is taper, and cone angle is 4 ~ 10 degree.
The present invention adopts first etch process to process first paragraph evaporation hole at the evaporation face, adopt again laser technology to continue to process second segment evaporation hole along the end of first paragraph to the ITO contact surface, and make first paragraph and the coaxial setting of second segment, make the size in evaporation hole present diminishing situation at the evaporation plate, overcome the dead angle area that occurs in the traditional technology, so that when being applied to evaporation, the organic light emission particle can arrive the predetermined position on the glass substrate to large extent, thereby improved the quality of OLED display screen, rate of utilization and the yield polymer films of luminous organic material have been improved, reduce the manufacturing cost of OLED display screen, and can effectively prolong the work-ing life of evaporation cover.
Description of drawings
Fig. 1 is the structural representation of OLED evaporation cover in the embodiment of the invention.
Fig. 2 is the implementation result figure of OLED evaporation cover in the embodiment of the invention.
The realization of the object of the invention, functional characteristics and advantage are described further with reference to accompanying drawing in connection with embodiment.
Embodiment
Describe technical scheme of the present invention in detail below with reference to drawings and the specific embodiments, so as clearer, understand invention essence of the present invention intuitively.
Fig. 1 is the structural representation of OLED evaporation cover in the embodiment of the invention; Fig. 2 is the implementation result figure of OLED evaporation cover in the embodiment of the invention.
Shown in seeing figures.1.and.2, present embodiment provides a kind of OLED evaporation cover, it comprises evaporation plate 1, evaporation plate 1 comprises ITO contact surface 11 and evaporation face 12, be provided with the evaporation hole 2 of a plurality of shapes that are centrosymmetric on the evaporation plate 1, evaporation hole 2 is through to ITO contact surface 11 from evaporation face 12, and the cross section is and dwindles gradually situation.
Particularly, evaporation hole 2 comprises first paragraph 21 and the second segment 22 of coaxial setting, and wherein, first paragraph 21 is horn-like, and is positioned at a side of evaporation face 12; Second segment 22 is horn-like or taper, is positioned at a side of ITO contact surface 11.
When evaporation, ITO contact surface 11 up, fit with the glass substrate that needs the evaporation luminous organic material, evaporation face 12 down, in the face of evaporation source 3, luminous organic material particles in the evaporation source 3 enter evaporation hole 2 from various directions, and are built-up in the ITO(tin indium oxide of glass substrate through this evaporation hole 2) on the layer, the formation vapor-deposited film.The shape of vapor-deposited film and thickness uniformity coefficient directly affect briliancy and the resolving power of OLED display screen, therefore, shape and the specification in evaporation hole 2 are had very strict requirement.The evaporation hole 2 of present embodiment is designed to sectional dimension and is diminishing situation from evaporation face 12 to ITO contact surface 11, the global shape that makes evaporation hole 2 is up-narrow and down-wide horn-like, be conducive to receive the luminous organic material particle with wider angle, thereby the thickness uniformity coefficient of vapor-deposited film and shape can both be met design requirement.
In addition, the thickness of the evaporation plate 1 of present embodiment is 18～190 μ m, both can guarantee the intensity of evaporation cover, avoids can avoiding again the yield polymer films that affects vapor-deposited film because of blocked up because the excessively thin evaporation hole 2 that causes is out of shape the work-ing life that shortens the evaporation cover.
The evaporation hole 2 of present embodiment is 35 ~ 45 degree at the inclination angle of first paragraph 21, and simultaneously, the evaporation cover is that any one material in nickel cobalt (alloy), Rhometal, the indium watt alloy is made, and thickness is set to 18～45 μ m.For guaranteeing good article rate, improve working (machining) efficiency, cutting down finished cost, preferably the inclination angle of first paragraph 21 is set to 35 ~ 45 degree, and the cone angle of second segment 22 is set to 4 ~ 10 degree, in the situation that satisfies the actual production requirement, reduces production costs to greatest extent.
And the vertical depth of the second segment 22 of present embodiment is 8～20 μ m, and the vertical depth of second segment 22 is not more than the vertical depth of first paragraph 21.Because first paragraph 21 is horn-like, second segment 22 is horn-like or cone-shaped, and the dimension precision requirement of second segment 22 on ITO contact surface 11 is very high, therefore, can adopt etch process processing first paragraph 21, and the recycling laser technology processes second segment 22.Because the working accuracy of laser technology is high, but the hole of laser technology processing, its inclination angle is less, so the vertical depth of second segment 22 is unsuitable excessive.Consider precision and the intensity of evaporation cover, the vertical depth of second segment 22 is unsuitable too small again, in order to avoid affect the shape and size of evaporation hole 2 on ITO contact surface 11.
In addition, present embodiment also provides a kind of working method of OLED evaporation cover, this working method is the OLED evaporation cover that can process in embodiment illustrated in fig. 1, the OLED evaporation cover that is present embodiment comprises the evaporation plate, the evaporation plate comprises ITO contact surface and evaporation face, be provided with the evaporation hole of a plurality of shapes that are centrosymmetric on the evaporation plate, the evaporation hole is through to the ITO contact surface from the evaporation face, comprises first paragraph and second segment.And the thickness of evaporation plate is 18～190 μ m; The evaporation hole is 35 ~ 45 degree at the inclination angle of first paragraph, and second segment is taper, and cone angle is 4 ~ 10 degree.
The working method of present embodiment may further comprise the steps:
1: adopt etch process to process the first paragraph in evaporation hole at the evaporation face;
2: adopt laser technology to process second segment at the first paragraph end to the ITO contact surface, and make the coaxial setting of first paragraph and second segment.
Because the concentration of etching solution constantly reduces, adopt etch process can corrode the larger perforated wall in inclination angle, so that larger in the size in the evaporation hole of evaporation face one side, and more past interior dimensions is just less, forms horn-like.And when adopting laser technology to scribe the evaporation hole, because the decay of laser energy intensity is less, can form the taperings of 4 ~ 10 degree, therefore, first paragraph adopts etch process processing, and second segment adopts laser technology to continue processing along the machine direction of first paragraph, and the vertical depth of second segment should be the smaller the better.But consider the requirement of strength of evaporation cover, the vertical depth of second segment is unsuitable too small, in order to avoid the evaporation hole that causes because second segment is excessively thin processing on the ITO contact surface deforms, is good so the vertical depth of second segment is 8～20 μ m.
The shape that adopts the evaporation hole that above-mentioned technique processes is substantially close to desirable splayed or in the conical in shape of cone angle, thereby can go out preferably vapor-deposited film of quality by evaporation, thereby produces the OLED display screen of better quality.
In sum, the present invention adopts first etch process to process first paragraph evaporation hole at the evaporation face, adopt again laser technology to continue to process second segment evaporation hole along the end of first paragraph to the ITO contact surface, and make first paragraph and the coaxial setting of second segment, make the size in evaporation hole present diminishing situation at the evaporation plate, overcome the dead angle area that occurs in the traditional technology, so that when being applied to evaporation, the organic light emission particle can arrive the predetermined position on the glass substrate to large extent, thereby improved the quality of OLED display screen, rate of utilization and the yield polymer films of luminous organic material have been improved, reduce the manufacturing cost of OLED display screen, and can effectively prolong the work-ing life of evaporation cover.
The above only is the preferred embodiments of the present invention; be not so limit its claim; every equivalent structure and flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to do; directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. OLED evaporation cover, comprise the evaporation plate, described evaporation plate comprises ITO contact surface and evaporation face, is provided with the evaporation hole of a plurality of shapes that are centrosymmetric on the described evaporation plate, it is characterized in that: described evaporation hole is through to described ITO contact surface from described evaporation face, and the cross section is and dwindles gradually situation.
2. OLED evaporation cover as claimed in claim 1, it is characterized in that: described evaporation hole comprises coaxial first paragraph and second segment, and described first paragraph is horn-like, and second segment is horn-like or taper.
3. OLED evaporation cover as claimed in claim 2, it is characterized in that: the thickness of described evaporation plate is 18～190 μ m.
4. OLED evaporation cover as claimed in claim 2 is characterized in that: described evaporation hole is 35 ~ 45 degree at the inclination angle of first paragraph.
5. OLED evaporation cover as claimed in claim 2, it is characterized in that: described second segment is taper, and cone angle is 4 ~ 10 degree.
6. OLED evaporation cover as claimed in claim 5, it is characterized in that: the vertical depth of described second segment is 8～20 μ m.
7. OLED evaporation cover as claimed in claim 6, it is characterized in that: the vertical depth of described second segment is not more than the vertical depth of first paragraph.
8. OLED evaporation cover as claimed in claim 2, it is characterized in that: the material of described evaporation plate is any one in nickel cobalt (alloy), Rhometal, the indium watt alloy, and thickness is 18～45 μ m.
9. the working method of an OLED evaporation cover, OLED evaporation cover comprises the evaporation plate, the evaporation plate comprises ITO contact surface and evaporation face, be provided with the evaporation hole of a plurality of shapes that are centrosymmetric on the described evaporation plate, it is characterized in that: described evaporation hole is through to described ITO contact surface from described evaporation face, comprise first paragraph and second segment, described working method may further comprise the steps:
Adopt etch process to process the first paragraph in described evaporation hole at described evaporation face;
Adopt laser technology to process described second segment at described first paragraph end to described ITO contact surface, and make the coaxial setting of described first paragraph and second segment.
10. working method as claimed in claim 9, it is characterized in that: the thickness of described evaporation plate is 18～190 μ m; Described evaporation hole is 35 ~ 45 degree at the inclination angle of first paragraph, and described second segment is taper, and cone angle is 4 ~ 10 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105696388A CN102978568A (en) | 2012-12-25 | 2012-12-25 | OLED (organic light-emitting diode) evaporation cover and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105696388A CN102978568A (en) | 2012-12-25 | 2012-12-25 | OLED (organic light-emitting diode) evaporation cover and processing method thereof |
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| CN102978568A true CN102978568A (en) | 2013-03-20 |
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| CN2012105696388A Pending CN102978568A (en) | 2012-12-25 | 2012-12-25 | OLED (organic light-emitting diode) evaporation cover and processing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103556112A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Mask plate and production method thereof |
| CN104096975A (en) * | 2013-04-10 | 2014-10-15 | 昆山思拓机器有限公司 | Method for manufacturing opening in OLED (organic light emitting diode) metal mask plate |
| CN105349947A (en) * | 2015-10-27 | 2016-02-24 | 唐军 | Machining method for high-accuracy metal mask plate |
| CN106399933A (en) * | 2015-07-31 | 2017-02-15 | 三星显示有限公司 | Method of manufacturing a mask |
| CN108198956A (en) * | 2017-12-28 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | Evaporation mask plate |
| CN111455342A (en) * | 2019-01-18 | 2020-07-28 | 北京铂阳顶荣光伏科技有限公司 | Evaporation coating equipment, evaporation coating system and evaporation coating control method |
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| JP3164800U (en) * | 2010-10-05 | 2010-12-16 | Tdk株式会社 | mask |
| CN202576542U (en) * | 2012-01-16 | 2012-12-05 | 昆山允升吉光电科技有限公司 | Evaporation mask plate |
| CN202576545U (en) * | 2012-01-16 | 2012-12-05 | 昆山允升吉光电科技有限公司 | Grooved mask plate for evaporation |
| CN203021642U (en) * | 2012-12-25 | 2013-06-26 | 唐军 | OLED (Organic Light Emitting Diode) evaporating hood |
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2012
- 2012-12-25 CN CN2012105696388A patent/CN102978568A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3164800U (en) * | 2010-10-05 | 2010-12-16 | Tdk株式会社 | mask |
| CN202576542U (en) * | 2012-01-16 | 2012-12-05 | 昆山允升吉光电科技有限公司 | Evaporation mask plate |
| CN202576545U (en) * | 2012-01-16 | 2012-12-05 | 昆山允升吉光电科技有限公司 | Grooved mask plate for evaporation |
| CN203021642U (en) * | 2012-12-25 | 2013-06-26 | 唐军 | OLED (Organic Light Emitting Diode) evaporating hood |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104096975A (en) * | 2013-04-10 | 2014-10-15 | 昆山思拓机器有限公司 | Method for manufacturing opening in OLED (organic light emitting diode) metal mask plate |
| CN103556112A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Mask plate and production method thereof |
| CN106399933A (en) * | 2015-07-31 | 2017-02-15 | 三星显示有限公司 | Method of manufacturing a mask |
| CN106399933B (en) * | 2015-07-31 | 2020-07-10 | 三星显示有限公司 | Method for manufacturing mask |
| CN105349947A (en) * | 2015-10-27 | 2016-02-24 | 唐军 | Machining method for high-accuracy metal mask plate |
| CN105349947B (en) * | 2015-10-27 | 2018-01-12 | 深圳浚漪科技有限公司 | High-precision metal mask plate processing method |
| CN108198956A (en) * | 2017-12-28 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | Evaporation mask plate |
| CN111455342A (en) * | 2019-01-18 | 2020-07-28 | 北京铂阳顶荣光伏科技有限公司 | Evaporation coating equipment, evaporation coating system and evaporation coating control method |
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Effective date of registration: 20140311 Address after: 429 room 210000, building C, No. 606, Ning six road, Nanjing chemical industry park, Jiangsu, China Applicant after: Nanjing ultra Photoelectric Technology Co., Ltd. Address before: 3, building A12, building 518000, an industrial zone, Ho Ho, Ho Ho Ho, Shenzhen, Guangdong Applicant before: Tang Jun Applicant before: Qian Chao |
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