CN102976635B - Method for connecting glass with copper or copper alloy - Google Patents
Method for connecting glass with copper or copper alloy Download PDFInfo
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- CN102976635B CN102976635B CN201210543587.1A CN201210543587A CN102976635B CN 102976635 B CN102976635 B CN 102976635B CN 201210543587 A CN201210543587 A CN 201210543587A CN 102976635 B CN102976635 B CN 102976635B
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Abstract
The invention relates to a method for connecting glass with copper or copper alloy, particularly a method for connecting glass with copper or copper alloy by soft soldering. The invention aims to solve the problems of complex technique, high connecting temperature and poor joint quality in the existing method for connecting glass with metal. The method comprises the following steps: 1. cleaning copper or copper alloy in acetone, cleaning with absolute ethanol and deionized water, carrying out blow-drying, and baking; 2. cleaning a sanded glass substrate in acetone, cleaning with absolute ethanol and deionized water, carrying out blow-drying, bombarding with an ion beam, coating a Cr film on the glass substrate by vaporization, and coating a Cu film by vaporization; 3. cleaning low-temperature solder in acetone, cleaning with absolute ethanol and deionized water, and carrying out blow-drying; 4. preparing a rosin zinc chloride-base soldering flux; 5. assembling a soldering workpiece by using a graphite plate; and 6. putting the soldering workpiece into a heating apparatus to carry out soldering. The invention has the advantages of lower connecting temperature, simple technique and better joint quality. The invention is applicable to soldering of glass and metal.
Description
Technical field
The present invention relates to a kind of soldering method of attachment connecting glass and copper or copper alloy.
Background technology
Glass and metal carry out being connected oneself and are widely used in the assembling of sensor, sealing and packaging.Compared with silicon piezoelectric transducer, the pressure transmitter made after glass is connected with metal can be applicable to harsh Working environment.Compared with plastic seal junctor, the junctor that glass and metal are formed by connecting has good physical strength, high thermal resistance and good stopping property, meets in space system engineering and strategy and tactics weapons system priming system the high precision of junctor, the requirement of high reliability.Glass is ceramic, is mainly ionic linkage and covalent bond structure, has highly stable electron pairing and chemical stability, has the different of essence from metal, therefore there is larger difficulty in the connection of glass and metal.At present, the main method of attachment of glass and metal has: soldering, diffusion welding, sealing by fusing and anode linkage.Vacuum diffusion bonding can obtain the connection of metal and glass, but diffusion welding craft cost is high and butt-welding fitting surface quality requirements harsh, higher Heating temperature (>700 DEG C) can produce larger unrelieved stress in postwelding joint, make joint mechanical property not high, as the patent No.: 200810243068.7, exercise question: glass and metal vacuum diffusion technology for welding.Vacuum brazing can obtain the good sealing-in joint of quality.But its method needs higher vacuum tightness and the heat-resisting fixture of special high temperature resistance, complex process and cost is higher, as the patent No.: 200910234678.5, exercise question: a kind of glass and metal vacuum brazing technique.The method of sealing by fusing connects glass and fernico, complex process, and joint tighness is bad, is difficult to meet glass and metal jointing specification of quality in piezoelectric transducer, as the patent No.: 200820124787.2, and exercise question: a kind of glass-metal hermetic seal connecting piece.The method of anode linkage can realize the connection connecting borosilicate glass and metal at relatively high temperatures, but the voltage needed for bonding is high and size that is requirement processing test specimen is little, as the patent No.: 201210145546.7, exercise question: based on the preparation method of the glass/silicon/glass three-layer structure material of electrostatic bonding.
Summary of the invention
The present invention seeks to the method for attachment complex process in order to solve existing glass and metal, connecting the problem that temperature is high and joint quality is low, and a kind of glass and copper or copper alloy method of attachment are provided.
Glass of the present invention and copper or copper alloy method of attachment realize through the following steps:
One, the copper after polishing or copper alloy are put into acetone ultrasonic cleaning 8 ~ 15min, then use dehydrated alcohol and washed with de-ionized water respectively, put into drying baker after drying up and dry, obtain the copper after surface treatment or copper alloy;
Two, the glass substrate after polishing puts into acetone ultrasonic cleaning 8 ~ 15min, then dehydrated alcohol and washed with de-ionized water is used respectively, the glass substrate after cleaning is obtained after drying up, adopt the glass substrate 3 ~ 5min after ion beam bombardment cleaning, again on a glass substrate first with the Cr film that electron beam evaporation thickness is 250 ~ 350nm, evaporation thickness is the Cu film of 700 ~ 900nm again, obtains the glass substrate after plated film;
Three, low-temperature brazing filler metal is put into acetone ultrasonic cleaning 8 ~ 15min, then use dehydrated alcohol and washed with de-ionized water respectively, after drying up, obtain the low-temperature brazing filler metal after cleaning;
Four, the zinc chloride of 0.3 ~ 0.5g and the rosin of 0.5 ~ 0.7g are mixed with the alcohol of 8 ~ 12mL and the ethylene glycol of 2 ~ 4mL, leave standstill 50 ~ 85min and obtain rosin chlorination zinc-base brazing flux;
Five, the copper after surface treatment step one obtained or copper alloy are placed on lower graphite cake, on copper after surface treatment or copper alloy, the low-temperature brazing filler metal after cleaning is placed in alignment, then the rosin chlorination zinc-base brazing flux that upper step 4 obtains is dripped on low-temperature brazing filler metal surface after cleaning, make rosin chlorination zinc-base brazing flux uniform fold on low-temperature brazing filler metal surface, align glass substrate after stacking plated film again, be pressed in the upper surface of the glass substrate after plated film with graphite cake, obtain the welding work pieces assembled;
Six, the welding work pieces assembled that step 5 obtains is placed in heating installation, 90 ~ 110 DEG C are heated to stove, insulation 8 ~ 12min, then continues to be warming up to furnace cooling after 135 ~ 145 DEG C of insulation 8 ~ 12min, completes the connection of glass and copper or copper alloy;
Copper alloy wherein described in step one is brass, bronze or copper-nickel alloy;
The material of the glass substrate described in step 2 is chalcogenide glass, halide glass, silicate glass, borosilicate glass or phosphate glass;
Described in step 2 employing ion beam bombardment cleaning after glass substrate time ion source ion voltage be 90 ~ 110V, ionic current is 2.5 ~ 4A.
Glass of the present invention and copper or copper alloy method of attachment adopt soldering process to achieve the brazing of glass and copper and alloy thereof, welding temperature is at about 140 DEG C, connect temperature lower, energy efficient, the fixture that welding process uses is simple, heating installation used is soldering conventional equipment, and soldering processes are easy, and the maximum connection area of glass and copper and alloy thereof can reach 100 × 30mm
2, the shearing resistance of the welding joint obtained is 32MPa, demonstrates good joint quality.The present invention is mainly used in the soldering of glass and metal.
Accompanying drawing explanation
Fig. 1 is that schematic diagram is assembled in the soldering of embodiment one glass and copper or copper alloy, the upper graphite cake of 1-, 2-glass substrate, 3-low-temperature brazing filler metal, 4-copper or copper alloy, graphite cake under 5-.
Embodiment
Embodiment one: (please refer to accompanying drawing 1) present embodiment glass and copper or copper alloy method of attachment follow these steps to implement:
One, the copper after polishing or copper alloy are put into acetone ultrasonic cleaning 8 ~ 15min, then use dehydrated alcohol and washed with de-ionized water respectively, put into drying baker after drying up and dry, obtain the copper after surface treatment or copper alloy;
Two, the glass substrate after polishing puts into acetone ultrasonic cleaning 8 ~ 15min, then dehydrated alcohol and washed with de-ionized water is used respectively, the glass substrate after cleaning is obtained after drying up, adopt the glass substrate 3 ~ 5min after ion beam bombardment cleaning, again on a glass substrate first with the Cr film that electron beam evaporation thickness is 250 ~ 350nm, evaporation thickness is the Cu film of 700 ~ 900nm again, obtains the glass substrate after plated film;
Three, low-temperature brazing filler metal is put into acetone ultrasonic cleaning 8 ~ 15min, then use dehydrated alcohol and washed with de-ionized water respectively, after drying up, obtain the low-temperature brazing filler metal after cleaning;
Four, the zinc chloride of 0.3 ~ 0.5g and the rosin of 0.5 ~ 0.7g are mixed with the alcohol of 8 ~ 12mL and the ethylene glycol of 2 ~ 4mL, leave standstill 50 ~ 85min and obtain rosin chlorination zinc-base brazing flux;
Five, the copper after surface treatment step one obtained or copper alloy are placed on lower graphite cake, on copper after surface treatment or copper alloy, the low-temperature brazing filler metal after cleaning is placed in alignment, then the rosin chlorination zinc-base brazing flux that upper step 4 obtains is dripped on low-temperature brazing filler metal surface after cleaning, make rosin chlorination zinc-base brazing flux uniform fold on low-temperature brazing filler metal surface, align glass substrate after stacking plated film again, be pressed in the upper surface of the glass substrate after plated film with graphite cake, obtain the welding work pieces assembled;
Six, the welding work pieces assembled that step 5 obtains is placed in heating installation, 90 ~ 110 DEG C are heated to stove, insulation 8 ~ 12min, then continues to be warming up to furnace cooling after 135 ~ 145 DEG C of insulation 8 ~ 12min, completes the connection of glass and copper or copper alloy;
Copper alloy wherein described in step one is brass, bronze or copper-nickel alloy;
The material of the glass substrate described in step 2 is chalcogenide glass, halide glass, silicate glass, borosilicate glass or phosphate glass;
Described in step 2 employing ion beam bombardment cleaning after glass substrate time ion source ion voltage be 90 ~ 110V, ionic current is 2.5 ~ 4A.
Present embodiment glass and Copper and its alloy method of attachment adopt soldering process to achieve the brazing of glass and copper and alloy thereof, welding temperature is at 135 ~ 145 DEG C, connect temperature lower, the copper used or the material of copper alloy can be fine copper, brass, bronze or copper-nickel alloy, the material of glass substrate can be chalcogenide glass, halide glass, silicate glass, borosilicate glass or phosphate glass, the applied range of glass and copper or copper alloy, soldering fixture used is simple, without the need to through complicated processing.
The rosin chlorination zinc-base brazing flux that present embodiment adopts is the oxide film in order to remove molten solder and mother metal surface, and in thin film layer uniform fold at brazing metal surfaces, effectively isolated air, reduces surface tension, promote the wetting and spreading of solder.
Embodiment two: present embodiment and embodiment one polish unlike step one after copper or copper alloy be use silicon carbide liquid honing, bruting process uses 80# sand paper successively, 240# silicon carbide waterproof abrasive paper, 400# sand paper, 600# sand paper, 800# sand paper, the order of 1000# sand paper is polished step by step.Other step and parameter identical with embodiment one.
Embodiment three: present embodiment and embodiment one or two polish unlike step 2 after glass substrate be use #80 silicon carbide liquid honing.Other step and parameter identical with embodiment one or two.
Embodiment four: one of present embodiment and embodiment one to three are In-48wt%Sn eutectic alloys unlike the low-temperature brazing filler metal in step 3.Other step and parameter identical with one of embodiment one to three.
Embodiment five: one of present embodiment and embodiment one to four are retort furnaces unlike the heating installation in step 6.Other step and parameter identical with one of embodiment one to four.
Embodiment six: then one of present embodiment and embodiment one to five continue to be warming up to furnace cooling after 140 DEG C of insulation 10min unlike step 6..Other step and parameter identical with one of embodiment one to five.
Embodiment seven: (please refer to accompanying drawing 1) present embodiment glass and copper method of attachment follow these steps to implement:
One, the fine copper after polishing is put into acetone ultrasonic cleaning 10min, then use dehydrated alcohol and washed with de-ionized water respectively, put into drying baker after drying up and dry, obtain the fine copper after surface treatment;
Two, acetone ultrasonic cleaning 10min put into by the chalcogenide glass substrate after polishing, then dehydrated alcohol and washed with de-ionized water is used respectively, the glass substrate after cleaning is obtained after drying up, adopt the glass substrate 3min after ion beam bombardment cleaning, again on a glass substrate first with the Cr film that electron beam evaporation thickness is 300nm, evaporation thickness is the Cu film of 800nm again, obtains the glass substrate after plated film;
Three, low-temperature brazing filler metal In-48wt%Sn eutectic alloy is put into acetone ultrasonic cleaning 10min, then use dehydrated alcohol and washed with de-ionized water respectively, after drying up, obtain the low-temperature brazing filler metal after cleaning;
Four, the zinc chloride of 0.35g and the rosin of 0.65g are mixed with the alcohol of 10mL and the ethylene glycol of 2.5mL, standing 60min obtains rosin chlorination zinc-base brazing flux;
Five, after surface treatment step one obtained, fine copper is placed on lower graphite cake, on fine copper after surface treatment, the low-temperature brazing filler metal after cleaning is placed in alignment, then the rosin chlorination zinc-base brazing flux that upper step 4 obtains is dripped on low-temperature brazing filler metal surface after cleaning, make rosin chlorination zinc-base brazing flux uniform fold on low-temperature brazing filler metal surface, align glass substrate after stacking plated film again, be pressed in the upper surface of the glass substrate after plated film with graphite cake, obtain the welding work pieces assembled;
Six, the welding work pieces assembled that step 5 obtains is placed in heating installation, is heated to 100 DEG C with stove, insulation 10min, then continue to be warming up to furnace cooling after 140 DEG C of insulation 10min, complete the connection of glass and copper;
Described in step 2 employing ion beam bombardment cleaning after glass substrate time ion source ion voltage be 100V, ionic current is 3A.
Present embodiment glass substrate is of a size of 10 × 10 × 3mm, and pure copper sheet is of a size of 10 × 10 × 1mm, and the shearing resistance of the welding joint obtained is 32MPa.
The connection soldering of present embodiment glass and copper assembles schematic diagram as shown in Figure 1.
Claims (4)
1. glass and copper or a copper alloy method of attachment, is characterized in that glass and copper or copper alloy method of attachment realize through the following steps:
One, the copper after polishing or copper alloy are put into acetone ultrasonic cleaning 8 ~ 15min, then use dehydrated alcohol and washed with de-ionized water respectively, put into drying baker after drying up and dry, obtain the copper after surface treatment or copper alloy;
Two, the glass substrate after polishing puts into acetone ultrasonic cleaning 8 ~ 15min, then dehydrated alcohol and washed with de-ionized water is used respectively, the glass substrate after cleaning is obtained after drying up, adopt the glass substrate 3 ~ 5min after ion beam bombardment cleaning, again on a glass substrate first with the Cr film that electron beam evaporation thickness is 250 ~ 350nm, evaporation thickness is the Cu film of 700 ~ 900nm again, obtains the glass substrate after plated film;
Three, low-temperature brazing filler metal is put into acetone ultrasonic cleaning 8 ~ 15min, then use dehydrated alcohol and washed with de-ionized water respectively, after drying up, obtain the low-temperature brazing filler metal after cleaning;
Four, the zinc chloride of 0.3 ~ 0.5g and the rosin of 0.5 ~ 0.7g are mixed with the alcohol of 8 ~ 12mL and the ethylene glycol of 2 ~ 4mL, leave standstill 50 ~ 85min and obtain rosin chlorination zinc-base brazing flux;
Five, the copper after surface treatment step one obtained or copper alloy are placed on lower graphite cake, on copper after surface treatment or copper alloy, the low-temperature brazing filler metal after cleaning is placed in alignment, then the rosin chlorination zinc-base brazing flux that upper step 4 obtains is dripped on low-temperature brazing filler metal surface after cleaning, make rosin chlorination zinc-base brazing flux uniform fold on low-temperature brazing filler metal surface, align glass substrate after stacking plated film again, be pressed in the upper surface of the glass substrate after plated film with graphite cake, obtain the welding work pieces assembled;
Six, the welding work pieces assembled that step 5 obtains is placed in heating installation, 90 ~ 110 DEG C are heated to stove, insulation 8 ~ 12min, then continues to be warming up to furnace cooling after 135 ~ 145 DEG C of insulation 8 ~ 12min, completes the connection of glass and copper or copper alloy;
Copper alloy wherein described in step one is brass, bronze or copper-nickel alloy;
The material of the glass substrate described in step 2 is chalcogenide glass, halide glass, silicate glass, borosilicate glass or phosphate glass;
Described in step 2 employing ion beam bombardment cleaning after glass substrate time ion source ion voltage be 90 ~ 110V, ionic current is 2.5 ~ 4A;
Glass substrate after step 2 polishing uses #80 silicon carbide liquid honing; Low-temperature brazing filler metal in step 3 is In-48wt%Sn eutectic alloy.
2. a kind of glass according to claim 1 and copper or copper alloy method of attachment, it is characterized in that silicon carbide liquid honing used by the copper after step one polishing or copper alloy, bruting process uses 80# sand paper successively, 240# silicon carbide waterproof abrasive paper, 400# sand paper, 600# sand paper, 800# sand paper, the order of 1000# sand paper is polished step by step.
3. a kind of glass according to claim 1 and copper or copper alloy method of attachment, is characterized in that the heating installation in step 6 is retort furnace.
4. a kind of glass according to claim 3 and copper or copper alloy method of attachment, is characterized in that then step 6 continues to be warming up to furnace cooling after 140 DEG C of insulation 10min.
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| CN201210543587.1A CN102976635B (en) | 2012-12-14 | 2012-12-14 | Method for connecting glass with copper or copper alloy |
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| CN201210543587.1A CN102976635B (en) | 2012-12-14 | 2012-12-14 | Method for connecting glass with copper or copper alloy |
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| CN102976635B true CN102976635B (en) | 2015-03-11 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103273157B (en) * | 2013-05-31 | 2015-08-19 | 哈尔滨工业大学 | A kind of method accelerating Zr bast block metal glass and Sn base solder metallurgical binding |
| CN110246769B (en) * | 2019-05-10 | 2020-09-11 | 太原理工大学 | Eutectic bonding method based on in-situ metallization of cation conductive metal and glass surface |
| CN114349321B (en) * | 2022-01-08 | 2022-10-18 | 江苏博联硕焊接技术有限公司 | Vacuum diffusion welding equipment for high-light-transmittance borosilicate glass and using method thereof |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
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