CN102969262A - Silicon wafer back-winding device - Google Patents
Silicon wafer back-winding device Download PDFInfo
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- CN102969262A CN102969262A CN2012105258792A CN201210525879A CN102969262A CN 102969262 A CN102969262 A CN 102969262A CN 2012105258792 A CN2012105258792 A CN 2012105258792A CN 201210525879 A CN201210525879 A CN 201210525879A CN 102969262 A CN102969262 A CN 102969262A
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Abstract
The invention discloses a silicon wafer back-winding device, and belongs to the technical field of integrated circuit manufacturing. The silicon wafer back-winding device comprises a substrate, a silicon wafer case fixing unit, a sliding rail, a sliding support and a pushing unit, wherein the silicon wafer case fixing unit is arranged on the substrate and is used for fixing silicon wafer cases for silicon wafer exchange; the sliding rail is arranged on the substrate and is located at one side of the silicon wafer case fixing unit; the sliding support is arranged on the sliding rail and can slide along the sliding rail; and the pushing unit is arranged on the sliding support and is used for aligning to a target silicon wafer and pushing the target silicon wafer among the silicon wafer cases for the silicon wafer exchange. According to the silicon wafer back-winding device disclosed by the invention, the silicon wafer cases for the silicon wafer exchange are fixedly arranged on the silicon wafer case fixing unit and can slide along the sliding rail by operating the sliding support on the sliding rail, so that the pushing unit aligns to and pushes the target silicon wafer among the silicon wafer cases for the silicon wafer exchange, and therefore, during the back-winding, single or a plurality of silicon wafers or all the silicon wafers in the cases can be operated.
Description
Technical field
The invention belongs to integrated circuit and make the field, specifically, relate to a kind of silicon chip rewinder.
Background technology
In the semiconductor integrated circuit manufacture process, silicon chip generally all is to be loaded in the box type container (film magazine), for the processing of silicon chip being carried out different process is processed, need to be at the silicon chip that exchanges between the different box type containers after different process is processed, this process can be referred to as the reviewing process.
At present, realize the device of reviewing, full-automatic rewinder and manual rewinder are arranged.But, from cost, floor space and whether the angle of demand motive force consider that the latter is than the former, some advantage, therefore, manually rewinder is in the industry cycle generally applicable.
Manual rewinder is broadly divided into two classes, and a class is the vacuum WAND rewinder, and another kind of is fully manual rewinder.In the vacuum WAND rewinder, need the vacuum WAND slices to carry out silicon chip exchange, i.e. so-called reviewing at two box type containers.But owing in the reviewing process, be actually by the manual operation vacuum WAND and carry out reviewing, because film magazine has 25 notches, notch density is larger.Therefore, can't realize accurately locating fast of silicon chip, mistake occur easily.In addition on the one hand, because the manual operation mistake can't firmly be adsorbed silicon chip, may fall easily sheet, and pollute silicon chip.Fig. 8 is the structural representation of manual rewinder in the prior art, as shown in Figure 8, participates in silicon box A, the B of silicon chip exchange, and wherein silicon box A is positioned at the left side as accepting silicon box, is silicon box; Silicon box B is as silicon box to be passed, be positioned at the right side, wherein layering is placed with silicon chip 100, be intended to the target silicon chip among the silicon box B of right side is pushed among the silicon box A of left side, the silicon chip rewinder can comprise: pedestal 601, spacing shelves 602, chute 603, slide handle 604, sliding support 605, cross bar 606, push jack shelves 607, when property is pushed to silicon box A together with silicon box B, grip slide handle 604 and promote sliding support 605 and slide along chute 603, thereby so that cross bar is moved to the left, and then so that push jack shelves 607 withstand all silicon chips 100 among the silicon box B, along with sliding support 605 moves to limiting block 602 places, silicon chip pushes in silicon box A among the silicon box B thereby finish.This shows that in the prior art, manually rewinder can only whole box reviewing, can not select a certain monolithic or multi-disc in the box to come reviewing.
Summary of the invention
Technical problem to be solved by this invention provides a kind of silicon chip rewinder, operates for monolithic or multi-disc (also comprising whole box silicon chip) in order to be implemented in the reviewing process.
In order to solve the problems of the technologies described above, the invention provides a kind of silicon chip rewinder, this device comprises:
Pedestal;
The silicon box fixed cell is arranged on the described pedestal, is used for the fixing silicon box that participates in the silicon chip exchange;
Slide rail is arranged on the described pedestal and is positioned at a side of described silicon box fixed cell;
Sliding support is arranged on the described slide rail and also can slides along described slide rail;
Push unit is arranged on the described sliding support, in order to the silicon chip that aims at the mark, carries out the propelling movement of described target silicon chip between the silicon box that participates in the silicon chip exchange.
Preferably, in one embodiment of this invention, described silicon box fixed cell is a draw-in groove.
Preferably, in one embodiment of this invention, described push unit comprises:
Rotating shaft is fixed on the described sliding support;
The reviewing module is set in the described rotating shaft, is used for aiming at described silicon chip, and carries out the propelling movement of described target silicon chip between the silicon box that participates in the silicon chip exchange.
Preferably, in one embodiment of this invention, the quantity of described reviewing module is a plurality of, is set in the described rotating shaft according to from top to bottom direction, with the bank bit in the silicon box that can participate in for described target silicon chip the silicon chip exchange when the reviewing.
Preferably, in one embodiment of this invention, described rotating shaft be marked with to each described reviewing module compose with identification code.
Preferably, in one embodiment of this invention, the quantity of described reviewing module is one, be set in the described rotating shaft, and adjust the position of described reviewing module in described rotating shaft by sliding up and down, with the bank bit in the silicon box that can participate in for described target silicon chip the silicon chip exchange when the reviewing.
Preferably, in one embodiment of this invention, described reviewing module can be rotated around described rotating shaft.
Preferably, in one embodiment of this invention, described reviewing module is interdigital.
Preferably, in one embodiment of this invention, described interdigital propelling movement end is provided with arc groove, is used for firmly wrapping described target silicon chip.
Preferably, in one embodiment of this invention, described interdigital propelling movement end is provided with the wedge shape supporting plate, when being used for pushing described target silicon chip, inserts and hold up described target silicon chip.
Preferably, in one embodiment of this invention, described interdigital propelling movement end begins that away from a position of described arc groove direction circular hole is arranged.
Preferably, in one embodiment of this invention, describedly be provided with locating piece on interdigital, be used for aiming at described silicon chip to described interdigital location.
Preferably, in one embodiment of this invention, describedly be provided with shifting block on interdigital, be used for alloting described interdigital.
Preferably, in one embodiment of this invention, also be provided with limiting block on the described pedestal, be used for locating the position of described sliding support on described slide rail.
Preferably, in one embodiment of this invention, also be provided with slide handle on the described sliding support, operate described slide handle for the user described sliding support is slided along described slide rail.
Compare with existing scheme, among the present invention, the silicon box that participates in the silicon chip exchange is fixed on the silicon box fixed cell, and by the operation sliding support on described slide rail and can slide along described slide rail, thereby the silicon chip so that push unit aims at the mark, and between the silicon box that participates in the silicon chip exchange, carry out the propelling movement of described target silicon chip, and realized in the reviewing process, operating for monolithic or multi-disc, also can operate for whole box silicon chip.
Description of drawings
Fig. 1 is the silicon chip rewinder cutaway view of the embodiment of the invention one;
Fig. 2 is the silicon chip rewinder vertical view of the embodiment of the invention one;
Fig. 3 is as the interdigital cutaway view of reviewing module in the embodiment of the invention two;
Fig. 4 is as the interdigital vertical view of reviewing module in the embodiment of the invention two;
Fig. 5 is as the interdigital cutaway view of reviewing module in the embodiment of the invention three;
Fig. 6 is as the interdigital vertical view of reviewing module in the embodiment of the invention three;
Fig. 7 is the silicon chip rewinder cutaway view of the embodiment of the invention three;
Fig. 8 is the structural representation of manual rewinder in the prior art.
Embodiment
Below will cooperate graphic and embodiment describes embodiments of the present invention in detail, by this to the present invention how the application technology means implementation procedure that solves technical problem and reach the technology effect can fully understand and implement according to this.
Among the following embodiment of the present invention, the silicon box that participates in the silicon chip exchange is fixed on the silicon box fixed cell, and by the operation sliding support on described slide rail and can slide along described slide rail, thereby the silicon chip so that push unit aims at the mark, and between the silicon box that participates in the silicon chip exchange, carry out the propelling movement of described target silicon chip, realized in the reviewing process, operating for monolithic or multi-disc.
Fig. 1 is the silicon chip rewinder cutaway view of the embodiment of the invention one.Fig. 2 is the silicon chip rewinder vertical view of the embodiment of the invention one.As depicted in figs. 1 and 2, in the present embodiment, participate in silicon box A, the B of silicon chip exchange, wherein silicon box A is positioned at the left side as accepting silicon box, is silicon box; Silicon box B is positioned at the right side as silicon box to be passed, and wherein layering is placed with silicon chip 100, is intended to the target silicon chip among the silicon box B of right side is pushed among the silicon box A of left side, need to prove that in silicon box A, B, silicon chip is that layering is deposited.In the present embodiment, the silicon chip rewinder can comprise: pedestal 101, silicon box fixed cell 102, slide rail 103, sliding support 104, push unit 105.Wherein:
Silicon box fixed cell 102 is arranged on the described pedestal 101, is used for fixing silicon box A, the B that participates in the silicon chip exchange; Preferably, described silicon box fixed cell 102 is a draw-in groove; Certainly, one of ordinary skill in the art will appreciate that, can be as silicon box fixed cell 102 as long as can realize participating in the structure of silicon box A, the B of silicon chip exchange, such as, to the public location structure in the bottom of silicon box, at pedestal 101 corresponding female location structure is set simultaneously, realizes participating in the silicon box A of silicon chip exchange, the location of B by the cooperation of male and female location structure.
Sliding support 104 is arranged on the described slide rail 103 and also can slides along described slide rail 103.Push unit 105 is arranged on the described sliding support 104, in order to the silicon chip that aims at the mark, carries out the propelling movement of described target silicon chip between the silicon box A, the B that participate in the silicon chip exchange.Need to illustrate; distance between sliding support 104 and the silicon box B is to guarantee sliding support 104 slip of turning left from the right side on guide rail 103; the target silicon chip can be pushed to the silicon box A from silicon box B; those of ordinary skills can need not can accomplish by creative work according to arts demand, not repeat them here.
Reviewing module 125 is set in the described rotating shaft 115, is used for aiming at described target silicon chip, and carries out the propelling movement of described target silicon chip between the silicon box A, the B that participate in the silicon chip exchange.Particularly, in the present embodiment, the quantity of described reviewing module 125 is a plurality of, be generally 26, but be not limited to this, be set in the described rotating shaft 115 according to from top to bottom direction, with can be for described target silicon chip at the silicon box A that participates in the silicon chip exchange, the bank bit among the B when the reviewing.The quantity of reviewing module 125 is relevant with the target silicon chip quantity of participation propelling movement among silicon box A, the B, because the target silicon chip is that layering is deposited in silicon box B, therefore, if the number of plies of the target silicon chip among the silicon box B is relevant, such as, there are three target silicon chips will be pushed among the silicon box A among the silicon box B, three reviewing modules 125 then can be set.Certainly, because the uncertainty of target silicon chip quantity has versatility in order to make device itself, can be according to the number of plies of depositing of silicon chip among the silicon box B, a reviewing module 125 arranges and a plurality of reviewing modules 125 of depositing the number of plies and equating, so that can only push for the silicon chip of certain one deck.In other words, can be with reference to the number that the number of plies arranges reviewing module 125 of depositing of silicon box silicon chip to be passed.
In addition, for the ease of operation, described rotating shaft 115 be marked with to each described reviewing module 125 compose with identification code 135 so that each reviewing module 125 is corresponding one by one with bank bit among silicon box A, the B.
Particularly, Fig. 3 be in the embodiment of the invention two as the interdigital cutaway view of reviewing module, Fig. 4 is as the interdigital vertical view of reviewing module in the embodiment of the invention two.As shown in Figure 3 and Figure 4, in the present embodiment, described reviewing module can adopt interdigital, and this is interdigital can to carry out 360 degree the rotating freely of orientation around described rotating shaft.Described interdigital propelling movement end C can be provided with arc groove 1251, is used for firmly wrapping described target silicon chip, in case slip limiting plate.Described interdigital propelling movement end can begin that away from a position of described arc groove direction circular hole 1252 is arranged, to alleviate the weight at whole interdigital cantilever place.Describedly can also be provided with locating piece 1253 on interdigital, be used for aiming at described target silicon chip to described interdigital location, this locating piece 1253 can have a plurality of, it specifically can adopt positioning convex point, such as shown in Fig. 3 and 4, is provided with positioning convex point at interdigital upper surface, at interdigital lower surface two lower positioning convex points are set, by the interoperation of these three positioning convex points, thus make interdigital around rotating shaft 115 rotation and navigate to correct position, to aim at described target silicon chip.Describedly can also be provided with shifting block 1254 on interdigital, be used for alloting described interdigital, around described rotating shaft 115 rotations, directly contact is interdigital to avoid hand, stains interdigital, and then pollution silicon chip.
Particularly, Fig. 5 be in the embodiment of the invention three as the interdigital cutaway view of reviewing module, Fig. 6 is as the interdigital vertical view of reviewing module in the embodiment of the invention three.As shown in Figure 5 and Figure 6, the described interdigital upper locating piece 2253 that is provided with equally, different with Fig. 4 from above-mentioned Fig. 3 is, in the present embodiment, interdigital propelling movement end C is provided with a wedge shape supporting plate 2251, when it pushes silicon chip, insert the bottom of silicon chip, the gradient of wedge shape supporting plate, the light silicon chip that holds up, be beneficial to silicon chip and between notch, slide, and be beneficial to interdigital location to silicon chip, be difficult for slide plate.Interdigital propelling movement end can begin to have two circular holes 2252 away from a position of wedge shape supporting plate 2253 directions, to alleviate the weight at whole interdigital cantilever place.
Need to prove, because in the present embodiment, the interdigital side that silicon box A, the B of participation silicon chip exchange is positioned at as reviewing module 125 is the left side, therefore, specifically can there be 0 degree location and 180 degree location in interdigital location in rotary course, under 0 degree positioning states, target silicon chip among the interdigital sensing silicon box B is to aim at the target silicon chip among the silicon box B; And if other silicon chips do not participate in pushing, then need the interdigital fixed of its correspondence rotated to 180 location, the non-target silicon chip among the interdigital dorsad silicon box B prevents misoperation non-target silicon chip also is pushed among the silicon box A.Certainly, to those skilled in the art, in order to realize the propelling movement of target silicon chip in the reviewing process, interdigital positioning states as reviewing module 125 also is not limited to this two states, also other positioning states can be arranged, as long as guarantee can the realize target silicon chip propelling movement, and the mistake of non-target silicon chip pushes and gets final product.
In the present embodiment, can also be provided with slide handle 107 on the described sliding support 104, operate described slide handle 107 for the user described sliding support 104 is slided along described slide rail 103.Sliding distance for accurate control sliding support can also be provided with limiting block 106 on the described pedestal 101, is used for locating the position of described sliding support 104 on described slide rail 103.
The course of work to the silicon chip rewinder in above-described embodiment is described as follows:
At first, the operator determines the target silicon chip, namely determine from silicon box B, to be pushed to the silicon chip among the silicon box A, as shown in fig. 1 among the silicon box B from layer 5 begin to 25 layers silicon chip as the target silicon chip, participate in pushing, and the silicon chip of four layers of ground floors to the does not participate in pushing as non-target silicon chip;
Secondly, determine this target silicon chip described in the silicon box B the layer, be to begin to 25 layers from layer 5 among the silicon box B, and according to the layer at the target silicon chip place of determining, determine that those are as interdigital these target silicon chips of aligning that need of reviewing module 125 in the push unit 105, in the present embodiment, owing to be the interdigital identification code sign of carrying out to each reviewing module 125, therefore, determine these reviewing module 125 interdigital propelling movements that need to participate in the target silicon chip of conduct that 6-the 26th identification code indicates, need to begin to 25 layers silicon chip from layer 5 among the aligning silicon box B.
Therefore, stirring corresponding shifting block on interdigital makes interdigital rotation begin to 25 layers silicon chip from layer 5 to pointing among the silicon box B, and by the locating piece on interdigital, make the interdigital 0 degree positioning states that is in, make the silicon chip of the interdigital rotation of residue four layers of ground floors to the to the silicon box B dorsad as non-target silicon chip and stir the shifting block of residue on interdigital, and by the locating piece on interdigital, make the interdigital 180 degree positioning states that are in.
Afterwards, the manual slide handle 107 of manual operation makes sliding support 104 slide along guide rail, and utilize limiting block 106 on the pedestal, stretch among the silicon box B thereby make as the interdigital of reviewing module 125, will be among the silicon box B begin to be pushed in the layer corresponding the silicon box A to 25 layers silicon chip from layer 5, thereby finish reviewing from silicon box B to silicon box A.
Fig. 7 is the silicon chip rewinder cutaway view of the embodiment of the invention three.As shown in Figure 5, the silicon chip rewinder still comprises pedestal 101, silicon box fixed cell 102, slide rail 103, sliding support 104, push unit 105.Different is, in embodiment illustrated in fig. 1, push unit 105 comprises a plurality of reviewing modules 125, also just can begin to operate simultaneously to 25 layers silicon chip to a plurality of target silicon chips among the silicon box B such as layer 5 simultaneously, and in the present embodiment, reviewing module 125 only has one, therefore, when equally beginning to operate to 25 layers silicon chip for layer 5, reviewing module 125 need to slide up and down in rotating shaft 115, with several times for the bank bit of target silicon chip in silicon box B namely in the position of target silicon chip, and just can finish several times layer 5 and begin to the propelling movement in the silicon box A from silicon box B of 25 layers silicon chip.In addition, owing to only have a reviewing module 125, at every turn can only be for a target silicon chip, the situation that does not therefore also just exist mistake to push, the positioning states of reviewing module 125 also just only has a kind of, such as the degree of 0 in above-described embodiment location.
In the present embodiment, in order accurately to locate the upright position of reviewing module 125 in rotating shaft 115, in rotating shaft 115 different gear 145 is set, to aim at the bank bit of the every one deck silicon chip among the silicon box B.
The course of work of silicon chip rewinder can be joined foregoing in the present embodiment, repeats no more in detail.
Above-mentioned explanation illustrates and has described some preferred embodiments of the present invention, but as previously mentioned, be to be understood that the present invention is not limited to the disclosed form of this paper, should not regard the eliminating to other embodiment as, and can be used for various other combinations, modification and environment, and can in invention contemplated scope described herein, change by technology or the knowledge of above-mentioned instruction or association area.And the change that those skilled in the art carry out and variation do not break away from the spirit and scope of the present invention, then all should be in the protection range of claims of the present invention.
Claims (15)
1. a silicon chip rewinder is characterized in that, comprising:
Pedestal;
The silicon box fixed cell is arranged on the described pedestal, is used for the fixing silicon box that participates in the silicon chip exchange;
Slide rail is arranged on the described pedestal and is positioned at a side of described silicon box fixed cell;
Sliding support is arranged on the described slide rail and also can slides along described slide rail;
Push unit is arranged on the described sliding support, in order to the silicon chip that aims at the mark, carries out the propelling movement of described target silicon chip between the silicon box that participates in the silicon chip exchange.
2. require 1 described device according to claim, it is characterized in that, described silicon box fixed cell is a draw-in groove.
3. require 1 described device according to claim, it is characterized in that, described push unit comprises:
Rotating shaft is fixed on the described sliding support;
The reviewing module is set in the described rotating shaft, is used for aiming at described silicon chip, and carries out the propelling movement of described target silicon chip between the silicon box that participates in the silicon chip exchange.
4. device according to claim 3 is characterized in that, the quantity of described reviewing module is a plurality of, is set in the described rotating shaft according to from top to bottom direction, with the bank bit in the silicon box that can participate in for described target silicon chip the silicon chip exchange when the reviewing.
5. device according to claim 4 is characterized in that, described rotating shaft be marked with to each described reviewing module compose with identification code.
6. device according to claim 3, it is characterized in that, the quantity of described reviewing module is one, be set in the described rotating shaft, and adjust the position of described reviewing module in described rotating shaft by sliding up and down, with the bank bit in the silicon box that can participate in for described target silicon chip the silicon chip exchange when the reviewing.
7. any described device is characterized in that according to claim 3 ~ 6, and described reviewing module can be rotated around described rotating shaft.
8. device according to claim 7 is characterized in that, described reviewing module is interdigital.
9. device according to claim 8 is characterized in that, described interdigital propelling movement end is provided with arc groove, is used for firmly wrapping described target silicon chip.
10. device according to claim 8 is characterized in that, described interdigital propelling movement end is provided with the wedge shape supporting plate, when being used for pushing described target silicon chip, inserts and hold up described target silicon chip.
11. device according to claim 8 is characterized in that, described interdigital propelling movement end begins that away from a position of described arc groove direction circular hole is arranged.
12. device according to claim 8 is characterized in that, describedly is provided with locating piece on interdigital, is used for aiming at described silicon chip to described interdigital location.
13. device according to claim 8 is characterized in that, describedly is provided with shifting block on interdigital, is used for alloting described interdigital.
14. device according to claim 1 is characterized in that, also is provided with limiting block on the described pedestal, is used for locating the position of described sliding support on described slide rail.
15. device according to claim 1 is characterized in that, also is provided with slide handle on the described sliding support, operates described slide handle for the user described sliding support is slided along described slide rail.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210525879.2A CN102969262B (en) | 2012-12-07 | 2012-12-07 | Silicon chip rewinder |
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| CN201210525879.2A CN102969262B (en) | 2012-12-07 | 2012-12-07 | Silicon chip rewinder |
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| CN102969262B CN102969262B (en) | 2017-03-01 |
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| CN104505361A (en) * | 2014-12-30 | 2015-04-08 | 苏州日月新半导体有限公司 | Wafer transfer tool |
| CN105865402A (en) * | 2016-05-30 | 2016-08-17 | 江苏有则科技集团有限公司 | Silicon wafer box detection frame |
| CN106128989A (en) * | 2016-08-25 | 2016-11-16 | 麦斯克电子材料有限公司 | A kind of rewinder of the reviewing that misplaces between silicon chip film magazine |
| CN112670221A (en) * | 2020-12-22 | 2021-04-16 | 宁波南大光电材料有限公司 | Silicon wafer transfer device |
| CN116504697A (en) * | 2023-06-29 | 2023-07-28 | 日月新半导体(昆山)有限公司 | Apparatus for integrated circuit package product operation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116504697A (en) * | 2023-06-29 | 2023-07-28 | 日月新半导体(昆山)有限公司 | Apparatus for integrated circuit package product operation |
| CN116504697B (en) * | 2023-06-29 | 2023-09-15 | 日月新半导体(昆山)有限公司 | Apparatus for integrated circuit package product operation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102969262B (en) | 2017-03-01 |
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