CN102969101A - Chip varistor - Google Patents
Chip varistor Download PDFInfo
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- CN102969101A CN102969101A CN201210311803XA CN201210311803A CN102969101A CN 102969101 A CN102969101 A CN 102969101A CN 201210311803X A CN201210311803X A CN 201210311803XA CN 201210311803 A CN201210311803 A CN 201210311803A CN 102969101 A CN102969101 A CN 102969101A
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- piezo
- resistance section
- sensitive resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
- H01C7/112—ZnO type
Abstract
A chip varistor is provided with a varistor section and a plurality of terminal electrodes. The varistor section is comprised of a sintered body containing ZnO as a major component, exhibits the nonlinear voltage-current characteristics, and has a pair of principal surfaces opposed to each other. The plurality of terminal electrodes are connected each to the varistor section. Each of the terminal electrodes has a first electrode portion connected to either of the principal surfaces and a second electrode portion connected to the first electrode portion.
Description
Technical field
The present invention relates to sheet voltage-sensitive resistor.
Background technology
As sheet voltage-sensitive resistor, known have a stacked sheet voltage-sensitive resistor, it possesses: the terminal electrode (for example, with reference to Japanese Patent Application Publication 2002-246207 communique) that has the piezo-resistance layer and be contacted with the piezo-resistance element body of the internal electrode that the piezo-resistance layer is configured, be configured with the form that is connected to corresponding to the internal electrode of piezo-resistance element end of body with the form of clamping piezo-resistance layer.In stacked sheet voltage-sensitive resistor, the zone of being carried out clamping by the internal electrode in the piezo-resistance layer is to exercise its function as the zone of embodying non-linear to voltage characteristic (the following situation that is referred to as " piezo-resistance characteristic " that also has).
Summary of the invention
About nearest high-speed interface, IC self constructs for ESD(Electrostatic Discharge in order to realize high speed: fragility static discharge) becomes.For this reason, the ESD countermeasure among the high-speed transfer class IC requires to be enhanced, thereby above-mentioned stacked sheet voltage-sensitive resistor uses as ESD countermeasure element.The desired characteristic of ESD countermeasure element of using as the high-speed transfer class must be that static capacity is low.If the static capacity that shows is large, then on level of signal, can have problems, it is impossible that the poorest situation probably is that communication will become.
As the method that the static capacity that makes stacked sheet voltage-sensitive resistor reduces, can consider to reduce the method for the area that is contacted with the part that internal electrode that the piezo-resistance layer is configured overlaps each other.By reducing the area of the part that internal electrode overlaps each other, thereby reduce the zone that static capacity shows and reduce static capacity.
Yet, if the area of the part that internal electrode overlaps each other (below be referred to as " overlapping area ") is little, can produces so-called tolerance for ESD (below be referred to as " ESD tolerance ") new problem that descends occurs.In the situation that applies the surge voltage (Surge voltage) as ESD, the Electric Field Distribution on the part that internal electrode overlaps each other concentrates on the end of the part that internal electrode overlaps each other.If the Electric Field Distribution of the part that internal electrode overlaps each other concentrates on the end, the rapider decline of the less then ESD of overlapping area tolerance.
Stacked sheet voltage-sensitive resistor possesses as previously discussed and is contacted with the internal electrode that the piezo-resistance layer is configured.For this reason, it will be difficult keeping well the ESD tolerance.
The objective of the invention is to be to provide a kind of sheet voltage-sensitive resistor that above-mentioned internal electrode but can be kept the ESD tolerance well that do not possess.
The present invention is sheet voltage-sensitive resistor, and be by ZnO is consisted of as the sintered body of principal component, possess the piezo-resistance section of embodying the non-linear to voltage characteristic and having a pair of interarea relative to each other, a plurality of terminal electrodes that are connected to piezo-resistance section, each terminal electrode has the first electrode part that is connected to each interarea, the second electrode part that is connected to the first electrode part.
In the present invention, terminal electrode is held and is connected in the first electrode part because have the first electrode part that is connected to each interarea of piezo-resistance section so embody the piezo-resistance section of piezo-resistance characteristic.Sheet voltage-sensitive resistor of the present invention and above-described stacked sheet voltage-sensitive resistor are different, do not possess to be contacted with the internal electrode that the piezo-resistance layer is configured and but can to embody the piezo-resistance characteristic.For this reason, even in the situation that applies the surge voltage as ESD, can not produce the place that Electric Field Distribution is concentrated in piezo-resistance section, and the ESD tolerance can not descend yet.
Piezo-resistance section comprises and has the first area be selected from least a element among alkali metal, Ag and the Cu, spread all over and extend between a pair of interarea and do not have the second area that is selected from the element among alkali metal, Ag and the Cu, and the first electrode part also can be connected to second area.
Comprised by the piezo-resistance section that ZnO is consisted of as the sintered body of principal component and to have the first area that is selected from least a element among alkali metal, Ag and the Cu.In piezo-resistance section, existence is selected from the first area of at least a element among alkali metal, Ag and the Cu and compares with there not being the second area that is selected from the element among alkali metal, Ag and the Cu, and its conductivity is relatively low and relative dielectric constant is also relatively low.The static capacity of sheet voltage-sensitive resistor can be represented by the static capacity of the piezo-resistance section between terminal electrode.Therefore, comprise above-mentioned first area by piezo-resistance section, thereby just can reduce the static capacity of piezo-resistance section, and can seek the low direct capacitance quantification of sheet voltage-sensitive resistor.
Thereby the terminal electrode of electronic component generally is to form by carrying out sintering give on the plain body that consists of electronic component at the conductivity lotion that will contain metal and glass ingredient after.In the case, because terminal electrode contains glass ingredient, so the Metal Phase that is contained in terminal electrode may occur inhomogeneous for the coverage rate of plain body.If the metal coverage rate generation is inhomogeneous on the terminal electrode of sheet voltage-sensitive resistor, then the static capacity of sheet voltage-sensitive resistor can occur inhomogeneous.
Form in the situation of terminal electrode at the conductivity lotion such with the above, the conductivity lotion is to give around the form to the part of the end face of plain body and the side adjacent with this end face.Terminal electrode generally has the part that forms with around the form to the side, and in the inhomogeneous situation of the size generation of this part, the plated area that is contained in terminal electrode occurs inhomogeneous.Also the inhomogeneous of metal coverage rate can occur in this case, and the static capacity of sheet voltage-sensitive resistor occurs inhomogeneous.
That outer surface from the piezo-resistance section that is formed with terminal electrode makes in the situation that above-mentioned Elements Diffusion forms in the first area that existence is selected from least a element among alkali metal, Ag and the Cu, because around inhomogeneous and so that the size of first area is also inhomogeneous to the size of the part of terminal electrode side.Like this, the size in the first area of piezo-resistance section occurs in the inhomogeneous situation, and the static capacity of sheet voltage-sensitive resistor also will occur inhomogeneous.
As previously discussed in sheet voltage-sensitive resistor because various former thereby static capacity may occur inhomogeneous.To this, the first electrode part occurs inhomogeneous because be connected in the second area that piezo-resistance section comprises so can suppress static capacity.
The first electrode part also can be configured to cover each interarea.In this situation, can suppress effectively static capacity and occur inhomogeneous.
The first electrode part also can be by containing metal and not containing the conductivity lotion of glass ingredient and piezo-resistance section burns till simultaneously and formed.In the case, can suppress effectively static capacity occurs inhomogeneous.
At least a element among rare earth metal and the Bi of being selected from as accessory ingredient also can be contained in piezo-resistance section.
It can be the outer surface side that is positioned at piezo-resistance section with the form around the periphery of the second area of piezo-resistance section that the first area of piezo-resistance section is observed from the relative direction of a pair of interarea.In the case, because the conductivity of the outer surface side of piezo-resistance section is low, so surface current is difficult to flow at the outer surface of piezo-resistance section.Its result just can suppress the generation of leakage current.
Also can further possess the piezo-resistance section that is configured with clamping the first electrode form partly with piezo-resistance section.In the case, there is the first area that is selected from least a element among alkali metal, Ag and the Cu, even make in the situation that above-mentioned Elements Diffusion forms at the outer surface of the piezo-resistance section that never is formed with terminal electrode, the first electrode part also is connected in above-mentioned second area effectively.
To more completely understand the present invention by the detailed description and the accompanying drawing that hereinafter provide, these explanations and accompanying drawing only provide in the mode of example, therefore do not think limitation of the invention.
By the detailed description that hereinafter provides, further range of application of the present invention will become more clear.But, it should be understood that to describe in detail and instantiation that only the mode with example provides in the explanation preferred embodiment for the present invention, because describe in detail by these, those skilled in the art will clearer variations and modifications in aim of the present invention and scope.
Description of drawings
Fig. 1 is the perspective view that illustrates according to the sheet voltage-sensitive resistor of embodiment of the present invention.
Fig. 2 is be used to the figure that illustrates according to the cross-sectional configurations of the sheet voltage-sensitive resistor of execution mode.
Fig. 3 is be used to the figure that illustrates according to the cross-sectional configurations of the first electrode part of the sheet voltage-sensitive resistor of execution mode.
Fig. 4 is be used to the figure that illustrates according to the cross-sectional configurations of the first piezo-resistance section of the sheet voltage-sensitive resistor of execution mode.
Fig. 5 is be used to the figure that illustrates according to the configuration of the second piezo-resistance section of the sheet voltage-sensitive resistor of execution mode.
Fig. 6 is be used to the figure that illustrates according to the manufacturing process of the sheet voltage-sensitive resistor of execution mode.
Fig. 7 is be used to the figure that illustrates according to the manufacturing process of the sheet voltage-sensitive resistor of execution mode.
Fig. 8 is be used to the figure that illustrates according to the cross-sectional configurations of the sheet voltage-sensitive resistor of the variation of execution mode.
Embodiment
Preferred implementation of the present invention will be elaborated below with reference to accompanying drawing.The same parts that has identical function in the specification will represent with identical reference marks and not carry out unnecessary description.
At first, with reference to the configuration of figure 1 ~ 6 explanation according to the sheet voltage-sensitive resistor 1 of embodiment of the present invention.Fig. 1 is the perspective view that illustrates according to the sheet voltage-sensitive resistor of execution mode.Fig. 2 is be used to the figure that illustrates according to the cross-sectional configurations of the sheet voltage-sensitive resistor of execution mode.Fig. 3 is be used to the figure that illustrates according to the cross-sectional configurations of the first electrode part of the sheet voltage-sensitive resistor of execution mode.Fig. 4 is be used to the figure that illustrates according to the cross-sectional configurations of the first piezo-resistance section of the sheet voltage-sensitive resistor of execution mode.Fig. 5 is be used to the figure that illustrates according to the configuration of the second piezo-resistance section of the sheet voltage-sensitive resistor of execution mode.
As shown in Figure 1, sheet voltage-sensitive resistor 1 is provided with roughly plain body 3 and the pair of terminal electrode 5 of cuboid.Sheet voltage-sensitive resistor 1 is the minimum sheet voltage-sensitive resistor of size for example, have on its Y-direction in the drawings 0.4mm length, have the height of 0.2mm in the Z direction, have the width (being so-called 0402 size) of 0.2mm at directions X.
As illustrated in fig. 1 and 2, the first piezo-resistance section 7 is the parts that roughly are positioned at the cuboid of plain body 3 centres, and is made of sintered body (semiconductive ceramic), with performance piezo-resistance characteristic.The first piezo-resistance section 7 comprise a pair of on its thickness direction (or Y-direction of accompanying drawing) interarea 7a respect to one another, 7b.The thickness of the first piezo-resistance section 7 is arranged in the scope of about 150 ~ 900 μ m for example.
As illustrated in fig. 1 and 2, the second piezo-resistance section 11 is the parts that are positioned at the roughly cuboid of locating near two ends of plain body 3.The second piezo-resistance section 11 has the interarea 11a of the end face 3a, the 3b that consist of respectively plain body 3, and the interarea 11b relative with corresponding interarea 11a respectively.
The first and second piezo- resistance sections 7,11 comprise the ZnO(zinc oxide as principal component), the metal that also comprises accessory ingredient, for example Co, rare earth metal, IIIb family element (B, Al, Ga, In), Si, Cr, Mo, alkali metal (K, Rb, Cs) and alkaline-earth metal (Mg, Ca, Sr, Ba) or its oxide.In the present embodiment, the first and second piezo- resistance sections 7,11 comprise Co, Pr, Cr, Ca, K and Al as accessory ingredient.Be not particularly limited for the content of ZnO in the first and second piezo- resistance sections 7,11, but when the total content of composition the first and second piezo- resistance sections 7,11 all material is 100 quality %, be generally 99.8 ~ 69.0 quality %.
The effect that rare earth metal (for example Pr) serves as the material that represents the piezo-resistance characteristic.The content of rare earth metal in the first and second piezo- resistance sections 7,11 is arranged in the scope of about 0.01 ~ 10 atom % for example.
Each terminal electrode 5 has the first electrode part 5a, the second electrode part 5b.The first electrode part 5a is arranged between the first piezo-resistance section 7 and the second piezo-resistance section 11.Each the second electrode part 5b is connected to the first electrode part 5a and is configured in the two ends of plain body 3.
The first electrode part 5a is directly connected in each interarea 7a of the first piezo- resistance section 7,7b and be directly connected in the interarea 11b of the second piezo-resistance section 11.That is, the first electrode part 5a is by the first piezo-resistance section 7 and the second piezo-resistance section 11 clamping positions.The first electrode part 5a is each interarea 7a that covers the first piezo-resistance section 7, and the form of the interarea 11b integral body of 7b integral body and the second piezo-resistance section 11 forms.That is, the first electrode part 5a shape in the form of a substantially rectangular as shown in Figure 3.The end of the first electrode part 5a is exposed to 4 side 3c ~ 3f of plain body 3.The first electrode part 5a is made of metal (such as Pd, Ag or Ag-Pd alloy etc.).The first electrode part 5a consists of as the sintered body that contains the conductivity lotion of the powder, organic bond and the organic solvent that are made of above-mentioned metal.The conductivity lotion that is used to form the first electrode part 5a does not contain glass ingredient (such as glass dust etc.).
The second electrode part 5b is each end face 3a that covers plain body 3, the interarea 11a of 3b(the second piezo-resistance section 11) and near 4 each end face of side 3c ~ 3f 3a, the form of the part of 3b is formed multilayer.The second electrode part 5b also forms with the form of end of the first electrode part 5a that covering is exposed to 4 side 3c ~ 3f of plain body 3, and directly is connected with the first electrode part 5a.The second electrode part 5b comprises the first electrode layer 6a and the second electrode lay 6b.
The first electrode layer 6a forms by the conductivity lotion being given the surperficial of plain body 3 and being carried out sintering.That is, the first electrode layer 6a is the sintered electrode layer.To mix the conductive paste body of glass ingredient, organic bond and organic solvent for the powder that is consisted of by metal (such as Pd, Cu, Ag or Ag-Pd alloy etc.).The second electrode lay 6b is formed on by galvanoplastic on the first electrode layer 6a.In the present embodiment, the second electrode lay 6b comprises the Ni electrodeposited coating that is formed on by electroplated Ni on the first electrode layer 6a, is formed on the plating Sn layer on this Ni electrodeposited coating by electroplating Sn.
Shown in Fig. 4 ~ 5, the first piezo-resistance section 7 and the second piezo-resistance section 11 comprise respectively first area 8a, 12a and second area 8b, 12b separately. First area 8a, 12a comprise at least a element that is selected from alkali metal, Ag and Cu.In first area 8a, 12a, at least a element that is selected from alkali metal, Ag and Cu is present in the ZnO crystal grain with the form of solid solution, or is present in the grain boundary of ZnO.In second area 8b, 12b, be not selected from the element of alkali metal, Ag and Cu.In the present embodiment, be alkali metal with the described element that uses, Li particularly.Li has relatively little ionic radius, and forms solid solution easily in ZnO crystal grain, and also has high diffusivity.In first area 8a, 12a, two or more elements that are selected from alkali metal, Ag and Cu may be arranged.
In the first piezo-resistance section 7, as shown in Figure 4, when seeing from the relative direction of a pair of interarea 7a, 7b, second area 8b roughly is positioned at the centre of the first piezo-resistance section 7.When seeing perpendicular to the direction of the relative direction of a pair of interarea 7a, 7b, second area 8b extends between interarea 7a and interarea 7b.That is, second area 8b extends between a pair of the first electrode part 5a and is connected to the first electrode part 5a.When seeing from the relative direction of a pair of interarea 7a, 7b, first area 8a is positioned at the outer surface side of the first piezo-resistance section 7, with the periphery around second area 8b.
In the second piezo-resistance section 11, second area 12b is the substantial middle that is positioned at the second piezo-resistance section 11 from observe interarea 11b perpendicular to the direction of interarea 11b as shown in Figure 5.Second area 12b is from perpendicular to a pair of interarea 11a, and the relative direction of 11b is seen, does not arrive interarea 11a.Second area 12b is connected to the first electrode part 5a.First area 12a is the outer surface side that is positioned at the second piezo-resistance section 11 with the form in the outside that centers on second area 12b.
When the element that is selected from alkali metal, Ag and Cu was present in the ZnO crystal grain with the form of solid solution, this element reduced and embodies as the alms giver among the ZnO of the semi-conductive characteristic of N-shaped.For this reason, ZnO becomes and has lower conductivity, and the more impossible characteristic that embodies piezo-resistance that becomes.Also consider, when above-mentioned element is present in the grain boundary of ZnO, the conductivity step-down.So first area 8a, 12a have than the lower conductivity of second area 8b, 12b and lower electric capacity.
In the first piezo-resistance section 7, second area 8b works as the zone of embodying the piezo-resistance characteristic.The first electrode part 5a is directly connected in the second area 8b that works as the zone of embodying the piezo-resistance characteristic.The piezo-resistance characteristic can not embody in each the second piezo-resistance section 11.
The embodiment of the method that manufacturing has the sheet voltage-sensitive resistor 1 of above-mentioned configuration will be described below with reference to Fig. 6 and 7.Fig. 6 and 7 is be used to the figure that illustrates according to the manufacturing process of the sheet voltage-sensitive resistor of execution mode.
At first, will as the ZnO of the first and second piezo- resistance sections 7,11 principal component and trace mineral supplement for example metal or the oxide of Co, Pr, Cr, Ca, K and Al carry out weighing with preset ratio separately, then these compositions are mixed to prepare piezoresistive material.Afterwards, with other additives for example organic bond, organic solvent and organic plasticizer add in this piezoresistive material, afterwards with the mixing such as ball mill and pulverize to obtain slurry.This slurry for example is applied to by known method such as scraping on the thin layer that the skill in using a kitchen knife in cookery is made of PETG, and dry to form the film of preset thickness (for example, about 30 μ m).The film that obtains is as mentioned above peeled off from thin layer, to obtain the first blank thin slice.
Then, will be formed at the blank thin slice corresponding to the electrode pattern of the first electrode part 5a.Electrode pattern corresponding to the first electrode part 5a is to form by having been mixed the conductivity lotion of the powder, organic bond and the organic solvent that are made of above-mentioned metal by print process printings such as silk screen printings and having made it drying.The powder that is made of metal is such as using the metal as principal component such as Pd, Ag or Ag-Pd alloy.
Then, overlap to form the blank thin slice of electrode pattern and be not formed with the blank thin slice of electrode pattern every regulation piece number.At this, each blank thin slice tegillum is stacked as, and clamping is formed with the blank thin slice of electrode pattern between the piezo-resistance blank material layer that is made of the multilayer blank thin slice that is not formed with electrode pattern.Afterwards, pressure is put on stacked blank thin slice and make the mutual pressing of each blank thin slice.The thickness of piezo-resistance blank material layer is to be adjusted by piece number of blank thin slice, and piece number that is formed with the blank thin slice of electrode pattern can be at least one piece.
The result of above operation is, finishes the preparation of duplexer LB, and wherein as shown in Figure 6, piezo-resistance blank material layer L1, piezo-resistance blank material layer L2 and electrode pattern EL are stacked together.
Next, make duplexer LB dry, afterwards, as shown in Figure 7, be cut to patch unit and fire plain body 3 before to obtain a plurality of blank element body GC().For example using, scribing machine carries out the cutting of duplexer LB.
Next, at pre-conditioned lower (for example, 180 ~ 400 ℃, 0.5 ~ 24 hours) a plurality of blanks element body GC are heat-treated, to finish unsticking mixture (debindering), afterwards further at pre-conditioned time (for example, 1000 ~ 1400 ℃, 0.5 ~ 8 hour) carry out sintering.The result of this sintering circuit is, piezo-resistance blank material layer L1 becomes the first piezo-resistance section 7, piezo-resistance blank material layer L2 becomes the second piezo-resistance section 11 and electrode pattern EL becomes the first electrode part 5a, thereby obtain a plurality of plain bodies 3, wherein in each plain body 3, the first piezo-resistance section 7 is sandwiched between the first electrode part 5a, and the first electrode part 5a is sandwiched between the first piezo-resistance section 7 and the second piezo-resistance section 11.Piezo-resistance L1, L2 and electrode pattern EL are sintered jointly.After sintering circuit, if necessary, can polish plain body 3 by tumbling.Can before sintering, namely after the cutting of duplexer LB, carry out tumbling.
Then, (a pair of end face 3a, side 3c ~ 3f) diffusion is selected from least a element among alkali metal (such as Li, Na etc.), Ag and the Cu for 3b and 4 from the outer surface of plain body 3.At this, the example that makes the alkali metal diffusion is described.
At first make alkali metal compound be attached to the outer surface of plain body 3.In the attaching process of alkali metal compound, can use airtight rotary container.As the not special restriction of alkali metal compound, thereby but be preferably the compound that can spread from the surface of plain body 3 by heat treatment alkali metal, can use alkali-metal oxide, hydroxide, chloride, nitrate, borate, carbonate and oxalates etc.
Then, in the temperature of regulation and under the time, the plain voxel volume 3 that has adhered to this alkali metal compound is implemented heat treatment with electric furnace.Its result is from the outer surface of plain body 3 to diffusion inside from the alkali metal of alkali metal compound.Preferred heat treatment temperature is 700 ~ 1000 ℃, and heat-treating atmosphere is atmosphere.Heat treatment time (retention time) is preferably 10 minutes ~ and 4 hours.
Element body 3(the first piezo-resistance section 7 and the second piezo-resistance section 11) in the part that has the alkali metal diffusion be the first area 8a of alkali metal, 12a seeks as described above high resistance and low direct capacitance and quantizes.In the present embodiment, although alkali metal from end face 3a, 3b spreads, because the second piezo-resistance section 11 exists, so at terminal electrode 5 and the first 7(of piezo-resistance section second area 8b) be electrically connected in the process and obstacle can not occur.
Next, apply the conductivity lotion covering two end face 3a, 3b of each plain body 3, and heat-treat to toast conductivity lotion on plain body 3 to form the first electrode layer 6a of the second electrode part 5b.Afterwards, for example Ni electroplates and Sn electroplates to cover the first electrode layer 6a to carry out electroplating processes, thereby forms the second electrode lay 6b.The result is, at two distolateral formation terminal electrodes 5 of plain body 3.In plain body 3, terminal electrode 5 the first piezo-resistance section 7 be sandwiched in direction between the first electrode part 5a be formed on two distolateral.Being used to form the conductivity lotion of the first electrode layer 6a, can be the conductivity lotion that for example frit and organic color spreading agent is blended in the metal dust.This metal dust can be for example to contain Cu, Ag or Ag-Pd alloy as the metal dust of principal component.
Obtain sheet voltage-sensitive resistor 1 by these operations.
In the present embodiment, terminal electrode 5 is because have each interarea 7a that is connected to the first piezo-resistance section 7, and the first electrode part 5a of 7b is so the first piezo-resistance section 7 of embodiment piezo-resistance characteristic is by the first 5a clamping of electrode part and connection.Sheet voltage-sensitive resistor 1 is different from above-mentioned stacked sheet voltage-sensitive resistor, does not possess the internal electrode that is contacted with the piezo-resistance layer and disposes and can embody the piezo-resistance characteristic.For this reason, even in the situation that has applied the surge voltage as ESD, the place that Electric Field Distribution is concentrated can not result from the first piezo-resistance section 7 yet, and the ESD tolerance can not reduce.
In the present embodiment, first area 8a is contained in the first piezo-resistance section 7.8a its conductivity of comparing with second area 8b in first area is relatively low, and relative dielectric constant is also relatively low.The static capacity of sheet voltage-sensitive resistor 1 can be represented by the static capacity of the first piezo-resistance section 7 between the first electrode part 5a of terminal electrode 5.Therefore, comprise first area 8a by the first piezo-resistance section 7, thus the static capacity step-down of the first piezo-resistance section 7, and the low direct capacitance that can seek sheet voltage-sensitive resistor 1 quantizes.
About stacked sheet voltage-sensitive resistor, owing to be made into the formation precision of the electrode pattern of piezo-resistance blank thin slice, the stacked off normal of piezo-resistance blank thin slice or the main causes such as shearing off normal of duplexer, the area of the part that internal electrode overlaps each other may occur inhomogeneous.If it is inhomogeneous that the area of the part that internal electrode overlaps each other occurs, then carry out mutually the static capacity that overlapping part embodies by internal electrode and can occur inhomogeneous.With respect to this, sheet voltage-sensitive resistor 1 is not as previously discussed because possess internal electrode, so can not result from static capacity inhomogeneous of internal electrode.
The terminal electrode of electronic component generally is to form by burning till after the conductivity lotion that will contain metal and glass ingredient is given plain body.In the case, because terminal electrode contains glass ingredient, so the Metal Phase that is contained in terminal electrode may occur inhomogeneous for the coverage rate of plain body.If the metal coverage rate generation is inhomogeneous on the terminal electrode of sheet voltage-sensitive resistor, then the static capacity of sheet voltage-sensitive resistor can occur inhomogeneous.
Forming with the conductivity lotion in the situation of terminal electrode, the conductivity lotion is to give plain body around the form to the part of the end face of plain body and the side adjacent with this end face.Terminal electrode has with around the part that forms to the form of side, and also occurs inhomogeneous at the area that the size of this part occurs to be covered by metal in the inhomogeneous situation.Metal coverage rate also occurs inhomogeneously in the case, and the static capacity of sheet voltage-sensitive resistor also occurs inhomogeneous.
As previously discussed about sheet voltage-sensitive resistor because various former thereby static capacity may occur inhomogeneous.Yet the first electrode part 5a occurs inhomogeneous because be to be connected to the second area 8b that the first piezo-resistance section 7 comprises so can suppress the static capacity of sheet voltage-sensitive resistor 1 in the present embodiment.
The first electrode part 5a is each interarea 7a that covers the first piezo-resistance section 7, and the form of the integral body of 7b is configured.The static capacity that thus, just can suppress effectively sheet voltage-sensitive resistor 1 occurs inhomogeneous.
The first electrode part 5a is by containing metal and not containing the conductivity lotion of glass ingredient and the first and second piezo- resistance section 7,11 burns till simultaneously and forms.Because the first electrode part 5a does not contain glass ingredient, so the metal coverage rate on the first electrode part 5a is difficult to occur inhomogeneous.The static capacity that thus, just can suppress effectively sheet voltage-sensitive resistor 1 occurs inhomogeneous.
The first electrode part 5a burns till simultaneously and forms by containing the powder that is made of metal and the conductivity lotion that does not contain glass ingredient and the first and second piezo-resistance section 7,11.Even also can suppress effectively thus the static capacity of sheet voltage-sensitive resistor 1 occurs inhomogeneous.
In the present embodiment, the first area 8a of the first piezo-resistance section 7 is from a pair of interarea 7a, and it is the outer surface side that is positioned at the first piezo-resistance section 7 with the form around the periphery of second area 8b that the relative direction of 7b is observed.Because the conductivity of the outer surface side of the first piezo-resistance section 7 is low, so surface current is difficult to flow through at the outer surface of the first piezo-resistance section 7.Its result just can be suppressed the generation of leakage current by sheet voltage-sensitive resistor 1.
In the present embodiment, (end face 3a, 3b and side 3c ~ 3f) make at least a Elements Diffusion that is selected among alkali metal, Ag and the Cu from the outer surface of plain body 3.For this reason, just can easily control the scope that a kind of element among alkali metal, Ag and the Cu spreads that is selected from.
In the present embodiment, the second piezo-resistance section 11 is configured with the form of clamping the first electrode part 5a with the first piezo-resistance section 7.Thus, even exist the first area 12a be selected from least a element among alkali metal, Ag and the Cu at the end face 3a from plain body 3,3b makes above-mentioned Elements Diffusion and in the situation about forming, also is difficult to from end face 3a, and 3b arrives the first electrode part 5a.Its result first electrode part 5a is connected to the second area 8b that the first piezo-resistance section 7 comprises effectively.
Then, be explained as follows with reference to Fig. 8 and with regard to the structure of the related sheet voltage-sensitive resistor 1 of modified embodiment of the present embodiment.Fig. 8 is the figure of the section constitution of the related sheet voltage-sensitive resistor of explanation modified embodiment of the present embodiment.
The related sheet voltage-sensitive resistor 1 of this variation also possesses roughly plain body 3 and the pair of terminal electrode 5 of rectangular shape.The related sheet voltage-sensitive resistor 1 of this variation is about first and second area 12a of the second piezo-resistance section 11, and the related sheet voltage-sensitive resistor 1 of the size of 12b and above-mentioned present embodiment is different.
In the second piezo-resistance section 11, second area 12b is identical with the second area 8b of the first piezo-resistance section 7, and from a pair of interarea 11a, it is the substantial middle that is positioned at the second piezo-resistance section 11 that the relative direction of 11b is observed.Second area 12b is from perpendicular to a pair of interarea 11a, and the direction of the relative direction of 11b is observed, and spreads all between interarea 11a and the interarea 11b and extends.Second area 12b is connected to the first electrode part 5a and the second electrode part 5b(the first electrode layer 6a).First area 12a is from a pair of interarea 11a, and the relative direction of 11b is observed, and is the outer surface side that is positioned at the second piezo-resistance section 11 with the form around the periphery of second area 12b.
Then, just an example of the manufacture process of the related sheet voltage-sensitive resistor 1 of represented this variation of Fig. 8 is explained as follows.Until it is identical to obtain the manufacture process of the related sheet voltage-sensitive resistor 1 of process and above-mentioned present embodiment till a plurality of plain bodies 3, in that their description is omitted.
After obtaining a plurality of plain bodies 3, to cover the both ends of the surface 3a of plain body 3, the form of 3b is given the conductivity lotion, and by implementing heat treatment the conductivity lotion is sintered in plain body 3, thereby forms the first electrode layer 6a of the second electrode part 5b.Afterwards, with the form that covers the first electrode layer 6a and by implementing electroplated Ni and electroplate the electroplating processes such as Sn to form the second electrode lay 6b.
Then, (4 side 3c ~ 3f) make at least a Elements Diffusion that is selected from alkali metal (such as Li and Na etc.), Ag and the Cu from the exposing surface of plain body 3.Make the gimmick that is selected from least a Elements Diffusion among alkali metal, Ag and the Cu identical with gimmick in the above-mentioned execution mode.
Thereby obtain the related sheet voltage-sensitive resistor of this variation 1 by these processes.
In this variation also with above-mentioned execution mode in the same manner, can either keep well the ESD tolerance and can seek again low direct capacitance and quantize and can conscientiously suppress static capacity to occur inhomogeneous.
The related sheet voltage-sensitive resistor 1 of present embodiment and variation is that the relative direction with the first electrode part 5a becomes the form that parallels with installed surfaces such as external substrate and installs by welding.
More than described preferred implementation of the present invention, but should be noted that the present invention always is not limited to above-mentioned execution mode, can change in many ways and do not depart from the scope of the present invention and aim.
The first electrode part 5a might not be necessary each interarea 7a of the first piezo-resistance section 7 that covers, the form of 7b integral body and forming.But inhomogeneous for the static capacity generation that suppresses sheet voltage-sensitive resistor 1, the first electrode part 5a is preferably and covers at least each interarea 7a, the zone corresponding to second area 8b on the 7b.Certainly, in order to be connected with the second electrode part 5b, be necessary that at least a portion of the first electrode part 5a is exposed to 4 side 3c ~ 3f of plain body 3.The first electrode part 5a also can be divided into a plurality of formation.
The first piezo-resistance section 7 also can replace rare earth metal and contain Bi.Rare earth metal and Bi can be contained in the first piezo-resistance section 7.
In present embodiment and this variation, first area 8a, 12a is from a pair of end face 3a, and the relative direction of 3b is observed, and is with around second area 8b, and the form of the periphery of 12b is positioned at the outer surface side of plain body 3, but is not limited thereto.For example, also can be arranged in the side of 4 side 3c ~ 3f or two sides of 4 side 3c ~ 3f etc.
At least a element that is selected among alkali metal (such as Li and Na etc.), Ag and the Cu also can not be spread in plain body 3.
From the present invention of describing as can be known, the present invention can do the variation of various ways.These change and not to be regarded as exceeding aim of the present invention and scope, and all these are that obviously modification all is comprised in the scope of claim of the present invention for a person skilled in the art.
Claims (7)
1. sheet voltage-sensitive resistor is characterized in that:
Possess:
The non-linear to voltage characteristic by ZnO is consisted of as the sintered body of principal component, and embodies in piezo-resistance section, and has a pair of interarea relative to each other;
A plurality of terminal electrodes are connected to described piezo-resistance section;
Each described terminal electrode has the first electrode part that is connected to each described interarea, the second electrode part that is connected to described the first electrode part.
2. sheet voltage-sensitive resistor as claimed in claim 1 is characterized in that:
Described piezo-resistance section comprises and has the first area that is selected from least a element among alkali metal, Ag and the Cu, spread all over and extend between the described a pair of interarea and do not have a second area that is selected from the element among alkali metal, Ag and the Cu,
Described the first electrode partly is connected to described second area.
3. sheet voltage-sensitive resistor as claimed in claim 1 or 2 is characterized in that:
Described the first electrode part disposes with the form that covers each described interarea.
4. such as the described sheet voltage-sensitive resistor of any one in the claim 1 ~ 3, it is characterized in that:
Described the first electrode part is by containing metal and not containing the conductivity lotion of glass ingredient and described piezo-resistance section burns till simultaneously and forms.
5. such as the described sheet voltage-sensitive resistor of any one in the claim 1 ~ 4, it is characterized in that:
At least a element among rare earth metal and the Bi of being selected from as accessory ingredient is contained in described piezo-resistance section.
6. sheet voltage-sensitive resistor as claimed in claim 2 is characterized in that:
When seeing from the relative direction of described a pair of interarea, the described first area of described piezo-resistance section is positioned at the outer surface side of described piezo-resistance section with the form around the periphery of the described second area of described piezo-resistance section.
7. such as the described sheet voltage-sensitive resistor of any one in the claim 1 ~ 6, it is characterized in that:
Further possesses the piezo-resistance section with the form configuration of described the first electrode part of clamping with described piezo-resistance section.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-186184 | 2011-08-29 | ||
| JP2011186184A JP5799672B2 (en) | 2011-08-29 | 2011-08-29 | Chip varistor |
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| CN102969101A true CN102969101A (en) | 2013-03-13 |
| CN102969101B CN102969101B (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210311803.XA Active CN102969101B (en) | 2011-08-29 | 2012-08-29 | Sheet voltage-sensitive resistor |
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|---|---|
| US (1) | US8552831B2 (en) |
| JP (1) | JP5799672B2 (en) |
| CN (1) | CN102969101B (en) |
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| JPH0193704A (en) * | 1987-10-06 | 1989-04-12 | Sumitomo Electric Ind Ltd | Coating remover for ribbonlike multicore optical fiber |
| JP2006344751A (en) * | 2005-06-08 | 2006-12-21 | Tdk Corp | Stacked chip varistor and its manufacturing method |
| CN1942981A (en) * | 2004-04-02 | 2007-04-04 | 松下电器产业株式会社 | Component with countermeasure to static electricity |
| US20100117782A1 (en) * | 2008-05-13 | 2010-05-13 | Tdk Corporation | Varistor |
| JP4552443B2 (en) * | 2004-01-27 | 2010-09-29 | 富士ゼロックス株式会社 | Surface emitting semiconductor laser array |
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| JPS5877004U (en) * | 1981-11-17 | 1983-05-24 | 松下電器産業株式会社 | Barista |
| JPH0193704U (en) * | 1987-12-14 | 1989-06-20 | ||
| JP2983096B2 (en) * | 1991-10-29 | 1999-11-29 | マルコン電子株式会社 | Manufacturing method of laminated voltage non-linear resistor |
| JPH09205005A (en) * | 1996-01-24 | 1997-08-05 | Matsushita Electric Ind Co Ltd | Electronic component and manufacture thereof |
| JP3555563B2 (en) * | 1999-08-27 | 2004-08-18 | 株式会社村田製作所 | Manufacturing method of multilayer chip varistor and multilayer chip varistor |
| JP3822798B2 (en) | 2001-02-16 | 2006-09-20 | 太陽誘電株式会社 | Voltage nonlinear resistor and porcelain composition |
| JP4082696B2 (en) * | 2004-04-09 | 2008-04-30 | Ｔｄｋ株式会社 | Multilayer electronic component and manufacturing method thereof |
| JP2006245367A (en) * | 2005-03-04 | 2006-09-14 | Matsushita Electric Ind Co Ltd | Varistor and its production process |
| US7940155B2 (en) | 2005-04-01 | 2011-05-10 | Panasonic Corporation | Varistor and electronic component module using same |
| JP4074299B2 (en) | 2005-04-14 | 2008-04-09 | Ｔｄｋ株式会社 | Multilayer chip varistor |
| JP2007165639A (en) | 2005-12-14 | 2007-06-28 | Tdk Corp | Varistor and method of manufacturing varistor |
| US8508325B2 (en) * | 2010-12-06 | 2013-08-13 | Tdk Corporation | Chip varistor and chip varistor manufacturing method |
-
2011
- 2011-08-29 JP JP2011186184A patent/JP5799672B2/en active Active
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2012
- 2012-08-16 US US13/587,310 patent/US8552831B2/en active Active
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| JPH0193704A (en) * | 1987-10-06 | 1989-04-12 | Sumitomo Electric Ind Ltd | Coating remover for ribbonlike multicore optical fiber |
| JP4552443B2 (en) * | 2004-01-27 | 2010-09-29 | 富士ゼロックス株式会社 | Surface emitting semiconductor laser array |
| CN1942981A (en) * | 2004-04-02 | 2007-04-04 | 松下电器产业株式会社 | Component with countermeasure to static electricity |
| JP2006344751A (en) * | 2005-06-08 | 2006-12-21 | Tdk Corp | Stacked chip varistor and its manufacturing method |
| US20100117782A1 (en) * | 2008-05-13 | 2010-05-13 | Tdk Corporation | Varistor |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130049922A1 (en) | 2013-02-28 |
| US8552831B2 (en) | 2013-10-08 |
| JP5799672B2 (en) | 2015-10-28 |
| CN102969101B (en) | 2015-11-25 |
| JP2013048175A (en) | 2013-03-07 |
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