CN102962760A - Device for maintaining stable grinding rate and method thereof - Google Patents
Device for maintaining stable grinding rate and method thereof Download PDFInfo
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- CN102962760A CN102962760A CN2011102572622A CN201110257262A CN102962760A CN 102962760 A CN102962760 A CN 102962760A CN 2011102572622 A CN2011102572622 A CN 2011102572622A CN 201110257262 A CN201110257262 A CN 201110257262A CN 102962760 A CN102962760 A CN 102962760A
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Abstract
The invention provides a device for maintaining a stable grinding rate. The device comprises a regulator, a cantilever connected with the regulator, and a grinding pad, wherein the regulator is used for scraping the surface of the grinding pad, and an electric motor is arranged in the cantilever. The device for maintaining the stable grinding rate further comprises a detection and analysis unit and a control unit, wherein the detection and analysis unit is connected with the electric motor in a signalizing way, the detection and analysis unit is used for detecting the torque of the electric motor and regulating the formula setting of the regulator according to the torque of the electric motor; and the control unit is connected with the detection and analysis unit in a signalizing way for receiving the formula setting and controlling the rotation speed of the electric motor. The invention further provides a method for maintaining the stable grinding rate. According to the device for maintaining the stable grinding rate, according to the detection of the torque of the electric motor, the rotation speed of the electric motor is regulated by detecting the torque of the electric motor, thus the working of the cantilever where the electric motor in is enabled to be stable, scraping force on the grinding pad of the regulator connected with the cantilever is further enabled to be uniform, finally the coarseness of the surface of the grinding pad is enabled to maintain excellent, and the grinding rate can be guaranteed to be stable.
Description
Technical field
The present invention relates to the ic manufacturing technology field, relate in particular to a kind of stable devices and methods therefor of grinding rate that keeps.
Background technology
In the manufacture of semiconductor technology, flattening surface is an important technology processing the little shadow of high density, because the flat surfaces that does not have high low head just can be avoided the scattering that exposes, and reaches accurate design transfer (pattern transfer).Planarization mainly contains spin-on glasses method (Spin-on Glass; SOG) with two kinds of cmps (CMP), but enter millimicron (Sub-half-micron) afterwards in the manufacture of semiconductor technology, the spin-on glasses method can't satisfy required flatness, so the cmp technology is uniquely can provide ultra-large type IC (Very-Large Scale Integration now; ULSI) processing procedure, a kind of technology of " comprehensive planarization (global planarization) ".
Fig. 1 is the cross-sectional view of existing work-table of chemicomechanical grinding mill.With reference to Fig. 1, work-table of chemicomechanical grinding mill comprises grinding rotating disk 11; Grinding pad 13 is layered on and grinds on the rotating disk 11; Adjuster 14 is in order to scraping grinding pad 13; Adjuster cantilever 15 is connected with adjuster 14, in order to the rotation of controlled adjuster 14.When utilizing work-table of chemicomechanical grinding mill that wafer 16 is carried out cmp, at first utilize wafer grasping element 17 that the front of wafer 16 is pressed on the grinding pad 13, and between wafer 16 and grinding pad 13, be distributed with lapping liquid, to help polishing wafer 16 surfaces, adjuster 14 has sharp keen surface, by its sharp keen surface grinding pad 13 is carried out scraping, adjuster 14 carries out scraping with certain pressure to grinding pad 13, make grinding pad 13 can keep certain roughness, and then the frictional force between maintenance wafer 16 and the grinding pad 13 is to obtain comparatively stable grinding rate.
Yet because adjuster 14 also can wear and tear in the process of scraping gradually, can affect grinding rate the service life of adjuster 14.Fig. 2 is the schematic diagram that concerns between service life of adjuster and the cmp rate.With reference to Fig. 2, abscissa represents the service life of adjuster, and ordinate represents the cmp rate.In the starting stage 21 of adjuster 14, the sharpness of adjuster 14 is higher, can access higher grinding rate under certain pressure, yet the wearing and tearing of himself are also relatively large at this moment, the speed that starting stages 21 grinding rate descends; In the stabilization sub stage 22 of adjuster 14, the sharpness of adjuster 14 is relatively stable, can give grinding pad 13 sufficient scrapings, and the range of decrease of grinding rate is little; At the later stage 23 of adjuster 14, the wearing and tearing of adjuster 14 are larger, can't give grinding pad 13 sufficient scrapings, and grinding this moment rate significantly decreases.Adjuster 14 exceed the stage in service life 24, can't reach the requirement of production in this stage.
For production can be carried out in comparatively stable grinding rate, with the film thickness that obtains expecting, usually adopt following method to address the above problem: to limit the service life of adjuster 14, grinding can not entered into exceed the stage in service life 24; Result according to product grinds considers the variation of grinding rate, by calculating milling time is compensated.Yet these two kinds of methods all are based on the control to the grinding rate, if the grinding rate changes greatly, two kinds of methods are all inapplicable.In addition, can also adjust the pressure setting of adjuster 14, but present this pressure adjustment is normally experienced, and inaccuracy.
Summary of the invention
Technical problem to be solved by this invention has provided a kind of stable devices and methods therefor of grinding rate that keeps, and how to keep the stable problem of grinding rate to solve.
In order to solve the problems of the technologies described above, technical scheme of the present invention is: a kind of stable device of grinding rate that keeps is provided, comprise adjuster, the cantilever, the grinding pad that are connected with described adjuster, described adjuster is in order to the described grinding pad of scraping surface, has motor in the described cantilever, keep the stable device of grinding rate also to comprise: to detect analytic unit, be connected with described motor signal, described detection analytic unit is in order to detecting the moment of torsion of described motor, and sets according to the formula that the moment of torsion of described motor is adjusted described adjuster; Control module is connected with described detection analytic unit signal, receives the rotating speed that described motor was set and controlled to described formula.
Further, in keeping the stable device of grinding rate, described detection analytic unit comprises torque sensor and data-analyzing machine, and described torque sensor is connected with described motor signal, and described torque sensor is connected with described data-analyzing machine signal.
Further, in keeping the stable device of grinding rate, described formula is set and is comprised that described adjuster is to the pressure of described grinding pad and the distance between described adjuster and the described grinding pad.
The invention provides also provides a kind of stable method of grinding rate that keeps, and comprising: utilize and detect the moment of torsion that analytic unit detects motor, and adjust the formula setting of adjuster according to the moment of torsion of described motor; Control module receives the rotating speed that described motor was set and controlled to described formula.
Further, in the stable method of described maintenance grinding rate, described detection analytic unit comprises torque sensor and data-analyzing machine, and described torque sensor detects the moment of torsion of motor, and the described moment of torsion that described data-analyzing machine obtains according to detection is adjusted the formula of described adjuster and set.
Further, in the stable method of described maintenance grinding rate, described data-analyzing machine is adjusted the pressure of described grinding pad according to described moment of torsion.
Further, in the stable method of described maintenance grinding rate, described data-analyzing machine is adjusted distance between described adjuster and the described grinding pad according to described moment of torsion.
The stable device of maintenance grinding rate provided by the invention, thereby adjust the rotating speed of motor by the moment of torsion that detects motor, the work of motor place cantilever is tended towards stability, further make the adjuster that is connected with cantilever balanced to the scraping dynamics of grinding pad, finally make the roughness on grinding pad surface keep evenly good, can guarantee that the grinding rate is stable.
The stable method of maintenance grinding rate provided by the invention, the final thin layer grinding of the moment of torsion rate by detecting motor stable, and the detection technique of moment of torsion is relatively ripe, equipment needed thereby is also uncomplicated, is easy to be combined with existing technique board; Adjust in real time the formula of adjuster according to the moment of torsion of motor and set, be conducive to obtain comparatively stable grinding rate; By setting the Motor torque empirical value, but during the exceptional value that occurs not being inconsistent with empirical value when measuring, in time shutdown inspection reduces the loss in the production.
Further, the formula of described adjuster comprises described adjuster to the pressure of described grinding pad in setting, and adjusts described adjuster self pressure size, can be used for compensating the wearing and tearing of himself, prolongs to a certain extent the service life of adjuster.
Description of drawings
Fig. 1 is the cross-sectional view of existing work-table of chemicomechanical grinding mill;
Fig. 2 is the schematic diagram that concerns between service life of adjuster and the cmp rate;
Fig. 3 is the modular structure schematic diagram of the stable device of the maintenance grinding rate that provides of the embodiment of the invention;
Fig. 4 is for being the flow chart of steps of the stable method of the maintenance grinding rate that provides of the embodiment of the invention.
The specific embodiment
Below in conjunction with the drawings and specific embodiments a kind of stable devices and methods therefor of grinding rate that keeps that the present invention proposes is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-accurately ratio, only be used for convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Core concept of the present invention is, a kind of stable device of grinding rate that keeps is provided, thereby adjust the rotating speed of motor by the moment of torsion that detects motor, the work of motor place cantilever is tended towards stability, further make the adjuster that is connected with cantilever balanced to the scraping dynamics of grinding pad, finally make the roughness on grinding pad surface keep evenly good, can guarantee that the grinding rate is stable.The stable method of maintenance grinding rate provided by the invention, the final thin layer grinding of the moment of torsion rate by detecting motor stable, and the detection technique of moment of torsion is relatively ripe, equipment needed thereby is also uncomplicated, is easy to be combined with existing technique board; Adjust in real time the formula of adjuster according to the moment of torsion of motor and set, be conducive to obtain comparatively stable grinding rate; By setting the Motor torque empirical value, but during the exceptional value that occurs not being inconsistent with empirical value when measuring, in time shutdown inspection reduces the loss in the production.
Fig. 3 is the modular structure schematic diagram of the stable device of the maintenance grinding rate that provides of the embodiment of the invention.With reference to Fig. 3, keeping grinding stable device comprises: adjuster, the cantilever, the grinding pad that are connected with described adjuster, described adjuster is in order to the described grinding pad of scraping surface, has motor 31 in the described cantilever, keep the stable device of grinding rate also to comprise: to detect analytic unit 32, be connected with described motor 31 signals, described detection analytic unit 32 is in order to detecting the moment of torsion of described motor 31, and sets according to the formula that the moment of torsion of described motor 31 is adjusted described adjuster; Control module 33 is connected with described detection analytic unit 32 signals, receives the rotating speed that described motor 31 was set and controlled to described formula.
In the present embodiment, described detection analytic unit 32 comprises torque sensor 321 and data-analyzing machine 322, and described torque sensor 321 is connected with described motor 31 signals, and described torque sensor 321 is connected with described data-analyzing machine 322 signals.Data-analyzing machine 322 is set the formula that calculates and is sent to control module 33, by the rotating speed of control module 33 according to the formula setup control motor 31 that receives, further controlled the transfer rate of belt in the cantilever by the rotating speed of motor 31, the final rotary speed that affects adjuster and adjuster are to the pressure of grinding pad, make controller action behind grinding pad, it is evenly good that the roughness on grinding pad surface can keep.
In the present embodiment, described formula is set and is comprised that described adjuster is to the pressure of described grinding pad and the distance between described adjuster and the described grinding pad.
Fig. 4 is for being the flow chart of steps of the stable method of the maintenance grinding rate that provides of the embodiment of the invention.With reference to Fig. 2, keep the stable method of grinding rate, comprising:
S41, utilization detect the moment of torsion that analytic unit detects motor, and adjust the formula setting of adjuster according to the moment of torsion of described motor;
S42, control module receive the rotating speed that described motor was set and controlled to described formula.
Particularly, at first utilize the torque sensor 321 that detects in the analytic unit 32 to measure the moment of torsion of motor 31, detect the moment of torsion that data-analyzing machine 322 analysis to measure in the analytic unit 32 obtain, calculate corresponding adjusted value, in the present embodiment, corresponding adjusted value comprises that adjuster is to the pressure of described grinding pad and the distance between described adjuster and the described grinding pad.Data-analyzing machine 322 is connected with control module 33 signals, the adjustment result that data-analyzing machine 322 draws transfers to control module 33, described control module 33 is positioned at the control centre of board, information output after will adjusting by control module 33, make motor 31 have a stable rotating speed, then make and rely on motor 31 to be the adjuster of power source, scraping dynamics to grinding pad is balanced, finally make the roughness on grinding pad surface keep evenly good, in the process of cmp, grinding pad contacts with the front of wafer to be ground, utilize the surface of grinding pad polishing wafer, the grinding pad that adopts the embodiment of the invention to provide has evenly good rough surface, can guarantee that the grinding rate is stable.
Will be understood by those skilled in the art that, not only be confined to adopt the torque sensor method in the method for the moment of torsion of measurement motor, can also be other such as electric power meter method and eddy current dynamic testing power method etc.
Obviously, those skilled in the art can carry out various changes and modification to invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (7)
1. one kind keeps the stable device of grinding rate, comprises adjuster, the cantilever, the grinding pad that are connected with described adjuster, and described adjuster has motor in order to the described grinding pad of scraping surface in the described cantilever, it is characterized in that, also comprises:
Detect analytic unit, is connected with described motor signal, described detection analytic unit is in order to detecting the moment of torsion of described motor, and adjusts the formula setting of described adjuster according to the moment of torsion of described motor;
Control module is connected with described detection analytic unit signal, receives the rotating speed that described motor was set and controlled to described formula.
2. the stable device of maintenance grinding rate according to claim 1, it is characterized in that, described detection analytic unit comprises torque sensor and data-analyzing machine, and described torque sensor is connected with described motor signal, and described torque sensor is connected with described data-analyzing machine signal.
3. the stable device of maintenance grinding rate according to claim 1 and 2 is characterized in that, described formula set comprise set described adjuster to the pressure of described grinding pad and set described adjuster and described grinding pad between distance.
4. a using method of utilizing maintenance grinding rate stabilising arrangement claimed in claim 1 is characterized in that, comprising:
Utilize and detect the moment of torsion that analytic unit detects motor, and adjust the formula setting of adjuster according to the moment of torsion of described motor;
Control module receives the rotating speed that described motor was set and controlled to described formula.
5. the stable method of maintenance grinding rate according to claim 4, it is characterized in that, described detection analytic unit comprises torque sensor and data-analyzing machine, described torque sensor detects the moment of torsion of motor, and the described moment of torsion that described data-analyzing machine obtains according to detection is adjusted the formula of described adjuster and set.
6. the stable method of maintenance grinding rate according to claim 4 is characterized in that described data-analyzing machine is adjusted the pressure of described grinding pad according to described moment of torsion.
7. the stable method of maintenance grinding rate according to claim 4 is characterized in that, described data-analyzing machine is adjusted distance between described adjuster and the described grinding pad according to described moment of torsion.
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| CN2011102572622A CN102962760A (en) | 2011-09-01 | 2011-09-01 | Device for maintaining stable grinding rate and method thereof |
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| CN2011102572622A CN102962760A (en) | 2011-09-01 | 2011-09-01 | Device for maintaining stable grinding rate and method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103753379A (en) * | 2013-11-22 | 2014-04-30 | 上海华力微电子有限公司 | Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time |
| CN104117901A (en) * | 2013-04-24 | 2014-10-29 | 中原大学 | Drill point grinding and detecting system and detecting method and drill point locating device |
| CN107932290A (en) * | 2017-11-20 | 2018-04-20 | 深圳市普盛旺科技有限公司 | Torsion control method and device, the polishing machine system of polishing wheel |
| CN108673293A (en) * | 2018-05-15 | 2018-10-19 | 华南理工大学 | A kind of intelligence grinder |
| CN114986380A (en) * | 2022-05-30 | 2022-09-02 | 上海华力微电子有限公司 | Method for improving grinding efficiency and grinding system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6113462A (en) * | 1997-12-18 | 2000-09-05 | Advanced Micro Devices, Inc. | Feedback loop for selective conditioning of chemical mechanical polishing pad |
| US6517416B1 (en) * | 2000-01-05 | 2003-02-11 | Agere Systems Inc. | Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher |
| US6517419B1 (en) * | 1999-10-27 | 2003-02-11 | Strasbaugh | Shaping polishing pad for small head chemical mechanical planarization |
| CN1147379C (en) * | 1999-10-20 | 2004-04-28 | 泰科姆公司 | Automated drill bit re-sharpening and verification system |
| US6953382B1 (en) * | 2004-06-24 | 2005-10-11 | Novellus Systems, Inc. | Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing |
| US20100035525A1 (en) * | 2008-08-07 | 2010-02-11 | Sameer Deshpande | In-situ performance prediction of pad conditioning disk by closed loop torque monitoring |
-
2011
- 2011-09-01 CN CN2011102572622A patent/CN102962760A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6113462A (en) * | 1997-12-18 | 2000-09-05 | Advanced Micro Devices, Inc. | Feedback loop for selective conditioning of chemical mechanical polishing pad |
| CN1147379C (en) * | 1999-10-20 | 2004-04-28 | 泰科姆公司 | Automated drill bit re-sharpening and verification system |
| US6517419B1 (en) * | 1999-10-27 | 2003-02-11 | Strasbaugh | Shaping polishing pad for small head chemical mechanical planarization |
| US6517416B1 (en) * | 2000-01-05 | 2003-02-11 | Agere Systems Inc. | Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher |
| US6953382B1 (en) * | 2004-06-24 | 2005-10-11 | Novellus Systems, Inc. | Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing |
| US20100035525A1 (en) * | 2008-08-07 | 2010-02-11 | Sameer Deshpande | In-situ performance prediction of pad conditioning disk by closed loop torque monitoring |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104117901A (en) * | 2013-04-24 | 2014-10-29 | 中原大学 | Drill point grinding and detecting system and detecting method and drill point locating device |
| CN104117901B (en) * | 2013-04-24 | 2017-03-01 | 中原大学 | Drill point grinds detecting system, detection method and drill point positioner |
| CN103753379A (en) * | 2013-11-22 | 2014-04-30 | 上海华力微电子有限公司 | Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time |
| CN107932290A (en) * | 2017-11-20 | 2018-04-20 | 深圳市普盛旺科技有限公司 | Torsion control method and device, the polishing machine system of polishing wheel |
| CN107932290B (en) * | 2017-11-20 | 2020-05-22 | 深圳市普盛旺科技有限公司 | Polishing wheel torque force control method and device and polishing machine system |
| CN108673293A (en) * | 2018-05-15 | 2018-10-19 | 华南理工大学 | A kind of intelligence grinder |
| CN114986380A (en) * | 2022-05-30 | 2022-09-02 | 上海华力微电子有限公司 | Method for improving grinding efficiency and grinding system |
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Application publication date: 20130313 |