CN102962742A - Chamfering edge grinding machine for solar wafer - Google Patents
Chamfering edge grinding machine for solar wafer Download PDFInfo
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- CN102962742A CN102962742A CN2012104573361A CN201210457336A CN102962742A CN 102962742 A CN102962742 A CN 102962742A CN 2012104573361 A CN2012104573361 A CN 2012104573361A CN 201210457336 A CN201210457336 A CN 201210457336A CN 102962742 A CN102962742 A CN 102962742A
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- silicon wafers
- chamfer angle
- cutting spindle
- bistrique
- solar silicon
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Abstract
The invention relates to a chamfering edge grinding machine for a solar wafer. The chamfering edge grinding machine comprises a machine table, a grinding device and a feed mechanism; the grinding device is arranged on the machine table and is provided with a grinding head and a cutting main shaft which is used for driving the grinding head to rotate; the feed mechanism is arranged on the machine table and is staggered horizontally with the grinding device so as to drive a wafer to do feed movement towards the grinding head. The chamfering edge grinding machine provided by the invention can realize subsequent processing for chamfers and silicon wafers with broken edges through a mechanical transmission way, so that the investment of labor force is reduced; the standardization and formatting of the flow or product can be realized, and both the yield and the percent of pass can be effectively improved.
Description
Technical field
The present invention relates to the wafer chamfering processing technique field, particularly relate to a kind of solar silicon wafers chamfer angle edging machine.
Background technology
Silicon chip owing to there is the not SOL zone of through-wafer in the reasons such as steel wire, mortar, equipment, operation at silicon chip edge or surface after causing silicon chip cutting to be finished, is referred to as and is collapsed the limit in cutting process.This series products has considerable influence to conversion efficiency in follow-up solar panel manufacturing process, affect its overall aesthetics behind the series welding, and this series products does not meet quality requirements, is included into sub-quality products when product examine, and then causes product profit to reduce.Therefore, present technology is by manually the silicon chip that collapses the limit being carried out reconditioning, and the labour has high input, and output is little, and product percent of pass is low.
Summary of the invention
Based on this, be necessary to provide a kind of solar silicon wafers chamfer angle edging machine that can carry out Mechanized Processing to chamfering and the silicon chip that collapses the limit, reduce labour's input.
A kind of solar silicon wafers chamfer angle edging machine comprises: board; Lapping device is installed on the board, the cutting spindle that is provided with bistrique and rotates with rotary bistrique; Feed mechanism, be installed on the board and with the lapping device offset, do feed motion in order to drive silicon chip towards bistrique.
Therein among embodiment, described board comprise workbench, with the supporting leg that described workbench is connected, described feed mechanism and described lapping device are installed on the described workbench.
Therein among embodiment, described lapping device comprises the main shaft fixed support that is installed on the described workbench, described cutting spindle is installed on the described main shaft fixed support, and described bistrique is installed in an end of described cutting spindle, and the other end of described cutting spindle is in order to be connected with power set.
Therein among embodiment, described board is provided with the support of table in the below of described workbench, on the described support of table motor is installed, on the output shaft of described motor belt wheel is installed, the other end of described cutting spindle is equipped with synchronous pulley, and described conveyer belt links to each other described belt wheel with described synchronous pulley.
Among embodiment, on the described workbench motor is installed therein, the output shaft of described motor by shaft coupling be connected the other end of cutting spindle and connect.
Among embodiment, described workbench is provided with the water storage tank that is positioned at the bistrique below therein.
Among embodiment, the bottom of described water storage tank offers sewage draining exit therein, and described sewage draining exit place is equipped with blowoff valve.
Among embodiment, described bistrique is grinding wheel therein.
Therein among embodiment, described lapping device comprises the main shaft fixed support that is installed on the described board, described cutting spindle is installed on the described main shaft fixed support, and described bistrique is installed in an end of described cutting spindle, and the other end of described cutting spindle is in order to be connected with power set.
Above-mentioned solar silicon wafers chamfer angle edging machine can be realized chamfering and the following process that collapses the limit silicon chip are reduced the labour and drop into by mechanically operated mode; Thereby the standardization of realization flow or product, format allow output and qualification rate effectively be promoted.
Description of drawings
Fig. 1 is the structural representation of the solar silicon wafers chamfer angle edging machine of present embodiment.
The specific embodiment
Please refer to Fig. 1, the solar silicon wafers chamfer angle edging machine 100 of present embodiment comprises board 110, is installed in lapping device 120 and feed mechanism 130 on the board 110, and power set 140.
Be appreciated that power set 140 also can be installed on the workbench 112, can drive equally cutting spindle 124 rotations.As the other end that the output shaft of motor 142 is connected with cutting spindle by shaft coupling can being connected.
Below simple the process that the silicon chips that use 100 pairs in above-mentioned solar silicon wafers chamfer angle edging machine to need to grind are processed described.
At first choose the silicon chip that needs reconditioning, as collapse silicon chip or the undesirable silicon chip of chamfering on limit, silicon chip clamping in quantitative mould, then is installed to silicon chip and mould on the feed mechanism 130.
Next, open main power source and the water source of solar silicon wafers chamfer angle edging machine 100, starter motor 142, and then drive cutting spindle 124 High Rotation Speeds, feed mechanism 130 drives silicon chip and does feed motion towards bistrique 126 in the axial direction, feed mechanism 130 drives diametrically at the uniform velocity feeding of silicon chip simultaneously, so that 126 pairs of silicon chips of bistrique carry out reconditioning, cooling water valve opens that silicon chip and bistrique 126 are cooled off in the reconditioning process.Collapse limit situation difference according to silicon chip, aforementioned reconditioning process can be carried out repeatedly.At last, remove mould, silicon chip is tested.
The solar silicon wafers chamfer angle edging machine 100 of present embodiment is realized chamfering and the following process that collapses the limit silicon chip are reduced the labour and drop into by mechanically operated mode; Thereby the standardization of realization flow or product, format allow output and qualification rate effectively be promoted.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. a solar silicon wafers chamfer angle edging machine is characterized in that, comprising:
Board;
Lapping device is installed on the board, the cutting spindle that is provided with bistrique and rotates with rotary bistrique;
Feed mechanism, be installed on the board and with the lapping device offset, do feed motion in order to drive silicon chip towards bistrique.
2. solar silicon wafers chamfer angle edging machine according to claim 1 is characterized in that, described board comprise workbench, with the supporting leg that described workbench is connected, described feed mechanism and described lapping device are installed on the described workbench.
3. solar silicon wafers chamfer angle edging machine according to claim 2, it is characterized in that, described lapping device comprises the main shaft fixed support that is installed on the described workbench, described cutting spindle is installed on the described main shaft fixed support, described bistrique is installed in an end of described cutting spindle, and the other end of described cutting spindle is in order to be connected with power set.
4. solar silicon wafers chamfer angle edging machine according to claim 3, it is characterized in that, described board is provided with the support of table in the below of described workbench, on the described support of table motor is installed, on the output shaft of described motor belt wheel is installed, the other end of described cutting spindle is equipped with synchronous pulley, and described conveyer belt links to each other described belt wheel with described synchronous pulley.
5. solar silicon wafers chamfer angle edging machine according to claim 3 is characterized in that, on the described workbench motor is installed, the output shaft of described motor by shaft coupling be connected the other end of cutting spindle and connect.
6. the described solar silicon wafers chamfer angle edging of arbitrary claim machine in 5 according to claim 2 is characterized in that described workbench is provided with the water storage tank that is positioned at the bistrique below.
7. solar silicon wafers chamfer angle edging machine according to claim 6 is characterized in that the bottom of described water storage tank offers sewage draining exit, and described sewage draining exit place is equipped with blowoff valve.
8. solar silicon wafers chamfer angle edging machine according to claim 1 is characterized in that, described bistrique is grinding wheel.
9. solar silicon wafers chamfer angle edging machine according to claim 1, it is characterized in that, described lapping device comprises the main shaft fixed support that is installed on the described board, described cutting spindle is installed on the described main shaft fixed support, described bistrique is installed in an end of described cutting spindle, and the other end of described cutting spindle is in order to be connected with power set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104573361A CN102962742A (en) | 2012-11-14 | 2012-11-14 | Chamfering edge grinding machine for solar wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104573361A CN102962742A (en) | 2012-11-14 | 2012-11-14 | Chamfering edge grinding machine for solar wafer |
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| CN102962742A true CN102962742A (en) | 2013-03-13 |
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| CN2012104573361A Pending CN102962742A (en) | 2012-11-14 | 2012-11-14 | Chamfering edge grinding machine for solar wafer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419106A (en) * | 2013-07-16 | 2013-12-04 | 陈仲礼 | Electric ceramic edge polishing machine |
| CN105195765A (en) * | 2015-10-30 | 2015-12-30 | 江苏耀阳电子有限公司 | Slicer main shaft structure for machining solar cell panel |
| WO2017063528A1 (en) * | 2015-10-12 | 2017-04-20 | 广东汉能薄膜太阳能有限公司 | Combined solar cell edge grinding machine and primary cleaning machine anti-chip-blocking system |
| CN107855866A (en) * | 2017-12-05 | 2018-03-30 | 洛阳晶联光电材料有限责任公司 | A kind of round ceramic target beveler |
| CN109822432A (en) * | 2019-03-14 | 2019-05-31 | 成都青洋电子材料有限公司 | Tumbling mill is used in a kind of polishing of monocrystalline silicon piece section |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4637168A (en) * | 1982-06-09 | 1987-01-20 | Wernicke & Co. Gmbh | Spectacle lens edge grinding machine |
| CN201239907Y (en) * | 2008-07-28 | 2009-05-20 | 比亚迪股份有限公司 | Edger unit |
| CN201613496U (en) * | 2010-02-21 | 2010-10-27 | 晶科能源有限公司 | Silicon wafer clamping device |
| CN201776697U (en) * | 2010-07-16 | 2011-03-30 | 浙江曙光实业有限公司 | Automobile hub polishing dust absorption platform |
| CN201922323U (en) * | 2010-11-03 | 2011-08-10 | 亚克先进科技股份有限公司 | Chamfering machine for silicon ingot |
| CN202147209U (en) * | 2011-06-22 | 2012-02-22 | 苏州东茂纺织实业有限公司 | Grinder |
| CN202985288U (en) * | 2012-11-14 | 2013-06-12 | 扬州协鑫光伏科技有限公司 | Edge grinding machine for chamfers of solar silicon wafers |
-
2012
- 2012-11-14 CN CN2012104573361A patent/CN102962742A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4637168A (en) * | 1982-06-09 | 1987-01-20 | Wernicke & Co. Gmbh | Spectacle lens edge grinding machine |
| CN201239907Y (en) * | 2008-07-28 | 2009-05-20 | 比亚迪股份有限公司 | Edger unit |
| CN201613496U (en) * | 2010-02-21 | 2010-10-27 | 晶科能源有限公司 | Silicon wafer clamping device |
| CN201776697U (en) * | 2010-07-16 | 2011-03-30 | 浙江曙光实业有限公司 | Automobile hub polishing dust absorption platform |
| CN201922323U (en) * | 2010-11-03 | 2011-08-10 | 亚克先进科技股份有限公司 | Chamfering machine for silicon ingot |
| CN202147209U (en) * | 2011-06-22 | 2012-02-22 | 苏州东茂纺织实业有限公司 | Grinder |
| CN202985288U (en) * | 2012-11-14 | 2013-06-12 | 扬州协鑫光伏科技有限公司 | Edge grinding machine for chamfers of solar silicon wafers |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103419106A (en) * | 2013-07-16 | 2013-12-04 | 陈仲礼 | Electric ceramic edge polishing machine |
| WO2017063528A1 (en) * | 2015-10-12 | 2017-04-20 | 广东汉能薄膜太阳能有限公司 | Combined solar cell edge grinding machine and primary cleaning machine anti-chip-blocking system |
| CN105195765A (en) * | 2015-10-30 | 2015-12-30 | 江苏耀阳电子有限公司 | Slicer main shaft structure for machining solar cell panel |
| CN107855866A (en) * | 2017-12-05 | 2018-03-30 | 洛阳晶联光电材料有限责任公司 | A kind of round ceramic target beveler |
| CN109822432A (en) * | 2019-03-14 | 2019-05-31 | 成都青洋电子材料有限公司 | Tumbling mill is used in a kind of polishing of monocrystalline silicon piece section |
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Application publication date: 20130313 |