CN201613496U - Silicon wafer clamping device - Google Patents
Silicon wafer clamping device Download PDFInfo
- Publication number
- CN201613496U CN201613496U CN2010201156137U CN201020115613U CN201613496U CN 201613496 U CN201613496 U CN 201613496U CN 2010201156137 U CN2010201156137 U CN 2010201156137U CN 201020115613 U CN201020115613 U CN 201020115613U CN 201613496 U CN201613496 U CN 201613496U
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- CN
- China
- Prior art keywords
- clamping device
- fixed head
- silicon wafer
- silicon chip
- end fixed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to a silicon wafer clamping device, in particular to a silicon wafer clamping edge-grinder. The silicon wafer clamping device comprises a far end fixing plate, a movable push plate, a sliding bar, a power source, a bottom plate, a back plate, a film gasket and a near end fixing plate, wherein the soft gasket is fixed on the inner sides of the far end fixing plate and the near end fixing plate so as to avoid damaging a wafer caused by pressing and collision, and hundreds of wafers can be simultaneously placed into a clamping space to be ground. The silicon wafer clamping device has the advantages that the whole clamping device is fixedly installed on an edge-grinder along with wafers which are pressed tightly in edge grinding process, one side of each of the wafers to be ground is aligned to an edge-grind part so as to grind the wafer to be smooth or trimming the wafer. The silicon wafer clamping device has the advantages of long service life, convenient operation, and capability of avoiding injuring human body caused by misoperation.
Description
Technical field
The utility model relates to a kind of clamping device, silicon chip clamping device in particularly a kind of photovoltaic field.
Background technology
At present, the edging device of most silicon chips, and what adopt is manual edging, operating process inconvenience, and cause the edging of silicon chip irregular easily, and the silicon chip behind the edging causes quality problems easily, and for example the silicon chip behind the edging is coarse, protruding thorn etc.Manual operations also may cause employee's scuffing, and inefficiency, cost height.
Summary of the invention
The purpose of the present utility model is to provide a kind of silicon chip clamping device, the long service life of this silicon chip clamping device, easy to operate, also can avoid the injury of maloperation to human body.And silicon chip edging yield rate is higher.
The technical solution of the utility model is:
A kind of silicon chip clamping device comprises far-end fixed head, movable push, slide bar, power source, base plate, near-end fixed head; Wherein: slide bar penetrates the through hole on the near-end fixed head; Power source and movable push link together by the slide bar activity.
A kind of silicon chip clamping device, wherein: an end of base plate is fixedlyed connected with far-end fixed head bottom, and the other end of base plate is fixedlyed connected with near-end fixed head bottom.
A kind of silicon chip clamping device, wherein: an end of base plate is connected with far-end fixed head bottom vertical fixing, and the other end of base plate is connected with near-end fixed head bottom vertical fixing.
A kind of silicon chip clamping device, wherein: also set up backplate, an end of backplate is fixedlyed connected with the side of far-end fixed head, and the other end of backplate is fixedlyed connected with the side of near-end fixed head.
Advantage of the present utility model: when work, the film cushion film is fixed on the inboard of fixed head earlier, and an amount of edging silicon chip for the treatment of placed in the groove, promote movable push after built-in silicon chip extruding is fixed to a certain degree by slide bar after waiting to connect power source, the one side alignment edging instrument of edging silicon chip will be treated, then silicon chip can be polished smooth or burr, finish silicon chip edging task smoothly.
In side cut process process, treat that the one side of edging silicon chip is close to the edging instrument, make the smooth no burr of silicon chip behind the edging.The long service life of this silicon chip clamping device, easy to operate, also can avoid the injury of maloperation to human body.
Description of drawings
Accompanying drawing 1 is the utility model perspective view;
Accompanying drawing 2 is the utility model Facad structure schematic diagrames.
Reference numeral: far-end fixed head 1, movable push 2, slide bar 3, power source 4, base plate 5, backplate 6, soft backing plate 7, near-end fixed head 8.
Specific implementation method
Operation principle: when work, soft pad 7 can be fixed on earlier far, the inboard of nearly fixed head, and the edging silicon chip for the treatment of of suitable quantity placed in the clamping space, after waiting to connect power source 4 back and promoting movable push 2 a plurality of silicon chips are compressed by slide bar 3, the silicon chip that whole clamping device is related after compressing is fixedly mounted on the edge polisher, silicon chip is treated then silicon chip to be polished smooth the one side alignment edging parts of edging or burr, finish silicon chip edging task smoothly.
Because of the alignment effect of the clamping of far-end fixed head 1, base plate 5 and near-end fixed head 8 and base plate 5, backplate 6 good, so high efficiency, the yield rate of carrying out edging than traditional-handwork also increase.
Claims (4)
1. a silicon chip clamping device comprises far-end fixed head (1), movable push (2), slide bar (3), power source (4), base plate (5), near-end fixed head (8); It is characterized in that: slide bar (3) penetrates the through hole on the near-end fixed head (8); Power source (4) links together by slide bar (3) versatilely with movable push (2).
2. a kind of silicon chip clamping device as claimed in claim 1 is characterized in that: an end of base plate (5) is fixedlyed connected with far-end fixed head (1) bottom, and the other end of base plate (5) is fixedlyed connected with near-end fixed head (8) bottom.
3. a kind of silicon chip clamping device as claimed in claim 1 is characterized in that: an end of base plate (5) is connected with far-end fixed head (1) bottom vertical fixing, and the other end of base plate (5) is connected with near-end fixed head (1) bottom vertical fixing.
4. as claim 1 or 2 or 3 described a kind of silicon chip clamping devices, it is characterized in that: also set up backplate (6), one end of backplate (6) is fixedlyed connected with the side of far-end fixed head (1), and the other end of backplate (6) is fixedlyed connected with the side of near-end fixed head (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201156137U CN201613496U (en) | 2010-02-21 | 2010-02-21 | Silicon wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201156137U CN201613496U (en) | 2010-02-21 | 2010-02-21 | Silicon wafer clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201613496U true CN201613496U (en) | 2010-10-27 |
Family
ID=42999868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201156137U Expired - Lifetime CN201613496U (en) | 2010-02-21 | 2010-02-21 | Silicon wafer clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201613496U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102267085A (en) * | 2011-07-21 | 2011-12-07 | 浙江大学 | Device suitable for grinding fragile workpiece |
| CN102765024A (en) * | 2012-08-09 | 2012-11-07 | 北京石晶光电科技股份有限公司济源分公司 | Processing method for verticality of non-magnetic sheet-shaped material |
| CN102962742A (en) * | 2012-11-14 | 2013-03-13 | 扬州协鑫光伏科技有限公司 | Chamfering edge grinding machine for solar wafer |
| CN104227523A (en) * | 2013-06-19 | 2014-12-24 | 晶科能源有限公司 | Silicon wafer grinding process and equipment |
| CN109822432A (en) * | 2019-03-14 | 2019-05-31 | 成都青洋电子材料有限公司 | Tumbling mill is used in a kind of polishing of monocrystalline silicon piece section |
-
2010
- 2010-02-21 CN CN2010201156137U patent/CN201613496U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102267085A (en) * | 2011-07-21 | 2011-12-07 | 浙江大学 | Device suitable for grinding fragile workpiece |
| CN102765024A (en) * | 2012-08-09 | 2012-11-07 | 北京石晶光电科技股份有限公司济源分公司 | Processing method for verticality of non-magnetic sheet-shaped material |
| CN102962742A (en) * | 2012-11-14 | 2013-03-13 | 扬州协鑫光伏科技有限公司 | Chamfering edge grinding machine for solar wafer |
| CN104227523A (en) * | 2013-06-19 | 2014-12-24 | 晶科能源有限公司 | Silicon wafer grinding process and equipment |
| CN109822432A (en) * | 2019-03-14 | 2019-05-31 | 成都青洋电子材料有限公司 | Tumbling mill is used in a kind of polishing of monocrystalline silicon piece section |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101027 |