CN102956601A - Base plate structure with elastic lugs and manufacturing method of base plate structure - Google Patents
Base plate structure with elastic lugs and manufacturing method of base plate structure Download PDFInfo
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- CN102956601A CN102956601A CN2011102402354A CN201110240235A CN102956601A CN 102956601 A CN102956601 A CN 102956601A CN 2011102402354 A CN2011102402354 A CN 2011102402354A CN 201110240235 A CN201110240235 A CN 201110240235A CN 102956601 A CN102956601 A CN 102956601A
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- projection
- width
- protective layer
- insulation
- board structure
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Abstract
The invention relates to a base plate structure with elastic lugs. The base plate structure comprises a base plate, a plurality of insulation lug bodies and metal layers, wherein the base plate is provided with a surface, a circuit layer and a protective layer, the circuit layer is provided with a plurality of conduction ends, each conduction end is provided with an outer side wall and an upper surface, the protective layer is provided with a plurality of openings, each opening is provided with an inner side wall, a first holding space is formed between the inner side wall and the outer side wall, each insulation lug body is provided with a top surface, an inner side and an outer side and comprises a first body portion and a second body portion, the first portion is provided with a first width, the second body portion is arranged above the first body portion and projected out of the protective layer, and a second width is reserved between the inner side wall and the outer side wall and is not smaller than the first width. The metal layers form on the top sides and the inner sides of the insulation lug bodies and the upper surfaces of the conductive ends.
Description
Technical field
The invention relates to a kind of board structure, particularly relevant for a kind of board structure with elastic projection.
Background technology
As shown in Figure 1; existing known board structure 10 with projection includes a silicon substrate 11 and a gold medal projection 12; this silicon substrate 11 has a surperficial 11a, and is formed at the aluminium pad 11b of this surface 11a and the protective layer 11c of this aluminium pad of covering 11b; this protective layer 11c has an opening 11d to appear this aluminium pad 11b; this gold projection 12 is arranged at this aluminium pad 11b; because above-mentioned projection material with board structure 10 of projection is gold, so production cost is higher, is not inconsistent economic benefit.
This shows that above-mentioned existing board structure with projection obviously still has inconvenience and defective, and demands urgently further being improved in product structure, manufacture method and use.Therefore how to found a kind of new board structure with elastic projection and manufacture method thereof, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing board structure with projection exists, the inventor is based on being engaged in for many years abundant practical experience and professional knowledge of this type of product design manufacturing, and the utilization of cooperation scientific principle, positive research and innovation in addition, in the hope of founding a kind of new board structure with elastic projection and manufacture method thereof, can improve general existing board structure with projection, make it have more practicality.Through constantly research, design, and through after repeatedly studying sample and improvement, finally create the present invention who has practical value.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing board structure with projection exists, and a kind of new board structure with elastic projection and manufacture method thereof be provided, technical problem to be solved is to make it because this board structure with elastic projection replaces existing known golden projection with those insulation projection bodies, and form these metal levels to reach the purpose of electric connection at those insulation projection bodies, therefore have the effect that reduces production costs and save production cost, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of board structure with elastic projection according to the present invention's proposition, wherein comprise: a substrate, it has a surface, and is formed at the protective layer that this surperficial line layer and covers this line layer, this line layer has a plurality of guiding access, respectively this guiding access has a lateral wall and a upper surface, this protective layer have a plurality of openings and respectively this opening appear respectively this guiding access, respectively this opening has a madial wall, wherein has one first accommodation space between this madial wall and this lateral wall; A plurality of insulation projection bodies, it is formed at this surface and is positioned at this first accommodation space, respectively this insulation projection body has an end face, a medial surface and a lateral surface, respectively this insulation projection ontology definition has a First body and one second body, this the first noumenon section is positioned at this surface and this First body has one first width, this second body is positioned at this First body top and protrudes from this protective layer, have one second width between this madial wall and this lateral wall, this second width is not less than this first width; And a metal level, it is formed at this upper surface of this end face, this medial surface and this guiding access of this insulation projection body.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid board structure with elastic projection, wherein said this metal level more is formed at this lateral surface of this insulation projection body.
Aforesaid board structure with elastic projection, wherein said this second width is formed at this lateral wall of this guiding access greater than this first width and this metal level.
Aforesaid board structure with elastic projection, wherein said this First body has a First body medial surface, have one second accommodation space between this lateral wall of this First body medial surface and this guiding access, this metal level is formed at this second accommodation space.
Aforesaid board structure with elastic projection, wherein said this metal level more is formed at this surface of this substrate.
Aforesaid board structure with elastic projection, wherein said respectively this opening has a plurality of corners, and respectively this insulation projection body is positioned at respectively this corner.
Aforesaid board structure with elastic projection, wherein said adjacent respectively this insulation projection body can be connected to each other.
Aforesaid board structure with elastic projection, wherein said this second body extends to form in this protective layer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of manufacture of substrates with elastic projection according to the present invention's proposition, wherein comprise: a substrate is provided, this substrate has a surface, and is formed at the protective layer that this surperficial line layer and covers this line layer, this line layer has a plurality of guiding access, respectively this guiding access has a lateral wall and a upper surface, this protective layer have a plurality of openings and respectively this opening appear respectively this guiding access, respectively this opening has a madial wall, wherein has one first accommodation space between this madial wall and this lateral wall; Form a photoresist layer in this surface of this substrate and cover this line layer and this protective layer; This photoresist layer of patterning is to form a plurality of insulation projection bodies, this insulation projection body is formed at this surface and is positioned at this first accommodation space, respectively this insulation projection body has an end face, one medial surface and a lateral surface, respectively this insulation projection ontology definition has a First body and one second body, this the first noumenon section is positioned at this surface and this First body has one first width, this second body is positioned at this First body top and protrudes from this protective layer, have one second width between this madial wall and this lateral wall, this second width is not less than this first width; Form a metal level at this upper surface of this end face, this medial surface, this lateral surface, this protective layer and this guiding access of this insulation projection body; And remove this metal level that is positioned at this protective layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid manufacture of substrates with elastic projection, wherein said its includes in addition: this metal level that removes this lateral surface that is positioned at this insulation projection body.
The present invention compared with prior art has obvious advantage and beneficial effect.By above technical scheme as can be known; main technical content of the present invention is as follows: a kind of board structure with elastic projection is provided; it comprises a substrate; a plurality of insulation projection bodies and a metal level; this substrate has a surface; one is formed at the protective layer that this surperficial line layer and covers this line layer; this line layer has a plurality of guiding access; respectively this guiding access has a lateral wall and a upper surface; this protective layer have a plurality of openings and respectively this opening appear respectively this guiding access; respectively this opening has a madial wall; wherein has one first accommodation space between this madial wall and this lateral wall; those insulation projection bodies are formed at this surface and are positioned at this first accommodation space; respectively this insulation projection body has an end face; one medial surface and a lateral surface; respectively this insulation projection ontology definition has a First body and one second body; this the first noumenon section is positioned at this surface and this First body has one first width; this second body is positioned at this First body top and protrudes from this protective layer; has one second width between this madial wall and this lateral wall; this second width is not less than this first width, and this metal level is formed at respectively this end face of this insulation projection body; this medial surface reaches respectively this upper surface of this guiding access.Since this board structure with elastic projection with those insulation projections by technique scheme, board structure and manufacture method thereof that the present invention has elastic projection have following advantages and beneficial effect at least: because this board structure with elastic projection replaces existing known golden projection with those insulation projection bodies, and form these metal levels to reach the purpose of electric connection at those insulation projection bodies, therefore have the effect that reduces production costs and save production cost.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1: existing known board structure schematic diagram with projection.
Fig. 2: according to the first preferred embodiment of the present invention, a kind of board structure schematic diagram with elastic projection.
Fig. 3: according to the first preferred embodiment of the present invention, this has the substrate vertical view of elastic projection.
Fig. 4: according to the second preferred embodiment of the present invention, another kind has the substrate vertical view of elastic projection.
Fig. 5: according to the 3rd preferred embodiment of the present invention, another kind has the board structure schematic diagram of elastic projection.
Fig. 6: according to the 4th preferred embodiment of the present invention, another has the board structure schematic diagram of elastic projection.
Fig. 7: according to preferred embodiment of the present invention, another has the board structure schematic diagram of elastic projection.
Fig. 8 A to Fig. 8 E: according to the first preferred embodiment of the present invention, a kind of schematic cross-section with manufacture of substrates of elastic projection.
10: the substrate with projection cube structure
11: silicon substrate 11a: surface
11b: aluminium pad 11c: protective layer
11d: opening 12: projection
100: the board structure with elastic projection
110: substrate 111: surface
112: line layer 112a: guiding access
112b: lateral wall 112c: upper surface
113: protective layer 113a: opening
113b: madial wall 113c: corner
120: insulation projection body 121: end face
122: medial surface 123: lateral surface
124: the First body
124a: First body medial surface
125: the second bodies
130: metal level
A: photoresist layer D1: the first width
D2: the second width
S1: the first accommodation space S2: the second accommodation space
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the board structure with elastic projection and its embodiment of manufacture method, structure, method, step, feature and effect thereof to foundation the present invention proposes are described in detail as follows.
See also Fig. 2; its first preferred embodiment of the present invention; a kind of board structure 100 with elastic projection comprises a substrate 110; a plurality of insulation projection bodies 120 and a metal level 130; see also Fig. 2 and Fig. 3; this substrate 110 has a surface 111; one line layer 112 and that is formed at this surface 111 covers the protective layer 113 of this line layer 112; this line layer 112 has a plurality of guiding access 112a; respectively this guiding access 112a has a lateral wall 112b and a upper surface 112c; this protective layer 113 have a plurality of opening 113a and respectively this opening 113a appear respectively this guiding access 112a; respectively this opening 113a has a madial wall 113b; wherein has one first accommodation space S1 between this madial wall 113b and this lateral wall 112b; those insulation projection bodies 120 are formed at this surface 111 and are positioned at this first accommodation space S1; in the present embodiment; respectively this opening 113a has a plurality of corner 113c; respectively this insulation projection body 120 is positioned at respectively this corner 113c; perhaps; see also Fig. 4; in the second preferred embodiment, adjacent respectively this insulation projection body 120 can be connected to each other to form the larger insulation projection body 120 of area.
Please consult again Fig. 2 and Fig. 3; in the present embodiment; the material of this substrate 110 can be selected from glass substrate; silicon substrate; ceramic substrate or tellite etc.; respectively this insulation projection body 120 has an end face 121; one medial surface 122 and a lateral surface 123; respectively these insulation projection body 120 definition have a First body 124 and one second body 125; this First body 124 is positioned at this surface 111 and this First body 124 has one first width D 1; this second body 125 is positioned at these First body 124 tops and protrudes from this protective layer 113; in the present embodiment; this second body 125 extends to form in this protective layer 113; has one second width D 2 between this madial wall 113b and this lateral wall 112b; this second width D 2 is not less than this first width D 1; in the present embodiment; this second width D 2 equals this first width D 1; this metal level 130 is formed at respectively this end face 121 of this insulation projection body 120; this medial surface 122 reaches respectively this upper surface 112c of this guiding access 112a; perhaps; see also Fig. 5; in the 3rd preferred embodiment, this metal level 130 more is formed at this lateral surface 123 of this insulation projection body 120.
In addition, see also Fig. 6, in the 4th preferred embodiment, this second width D 2 is greater than this first width D 1, this First body 124 has a First body medial surface 124a, has one second accommodation space S2 between this lateral wall 112b of this First body medial surface 124a and this guiding access 112a, this metal level 130 is formed at this lateral wall 112b of this guiding access 112a, and this metal level 130 is formed at this second accommodation space S2, in the present embodiment, this metal level 130 more is formed at this surface 111 of this substrate 110.Perhaps, see also Fig. 7, in the 5th preferred embodiment, this metal level 130 more is formed at this lateral surface 123 of this insulation projection body 120.Because this board structure 100 with elastic projection replaces existing known golden projection with those insulation projection bodies 120, and form these metal levels 130 to reach the purpose of electric connection at those insulation projection bodies 120, therefore have the effect that reduces production costs and save production cost.
Then, see also Fig. 8 A to Fig. 8 E, its first preferred embodiment of the present invention, a kind of manufacture of substrates with elastic projection, it comprises the following step: at first, see also Fig. 3 and Fig. 8 A, one substrate 110 is provided, this substrate 110 has a surface 111, one line layer 112 and that is formed at this surface 111 covers the protective layer 113 of this line layer 112, this line layer 112 has a plurality of guiding access 112a, respectively this guiding access 112a has a lateral wall 112b and a upper surface 112c, this protective layer 113 have a plurality of opening 113a and respectively this opening 113a appear respectively this guiding access 112a, respectively this opening 113a has a madial wall 113b, wherein has one first accommodation space S1 between this madial wall 113b and this lateral wall 112b, and the material of this substrate 110 is selected from glass substrate, silicon substrate, ceramic substrate or tellite etc.; Then, see also Fig. 8 B, form a photoresist layer A in this surface 111 of this substrate 110 and cover this line layer 112 and this protective layer 113; Afterwards, see also Fig. 8 C, this photoresist layer of patterning A is to form a plurality of insulation projection bodies 120, this insulation projection body 120 is formed at this surface 111 and is positioned at this first accommodation space S1, respectively this insulation projection body 120 has an end face 121, one medial surface 122 and a lateral surface 123, respectively these insulation projection body 120 definition have a First body 124 and one second body 125, this First body 124 is positioned at this surface 111 and this First body 124 has one first width D 1, this second body 125 is positioned at these First body 124 tops and protrudes from this protective layer 113, has one second width D 2 between this madial wall 113b and this lateral wall 112b, this second width D 2 is not less than this first width D 1, in the present embodiment, this second width D 2 equals this first width D 1; Then, see also Fig. 8 D, form a metal level 130 at this end face 121 of this insulation projection body 120 respectively, this medial surface 122, this lateral surface 123, this protective layer 113 and this upper surface 112c of this guiding access 112a respectively; At last, see also Fig. 8 E, this metal level 130 that removes this lateral surface 123 that is positioned at this protective layer 113 and this insulation projection body 120 is to form a board structure 100 with elastic projection.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1. board structure with elastic projection is characterized in that it comprises:
One substrate, it has a surface, and is formed at the protective layer that this surperficial line layer and covers this line layer, this line layer has a plurality of guiding access, respectively this guiding access has a lateral wall and a upper surface, this protective layer have a plurality of openings and respectively this opening appear respectively this guiding access, respectively this opening has a madial wall, wherein has one first accommodation space between this madial wall and this lateral wall;
A plurality of insulation projection bodies, it is formed at this surface and is positioned at this first accommodation space, respectively this insulation projection body has an end face, a medial surface and a lateral surface, respectively this insulation projection ontology definition has a First body and one second body, this the first noumenon section is positioned at this surface and this First body has one first width, this second body is positioned at this First body top and protrudes from this protective layer, have one second width between this madial wall and this lateral wall, this second width is not less than this first width; And
One metal level, it is formed at this upper surface of this end face, this medial surface and this guiding access of this insulation projection body.
2. the board structure with elastic projection as claimed in claim 1 is characterized in that this metal level more is formed at this lateral surface of this insulation projection body.
3. the board structure with elastic projection as claimed in claim 1 is characterized in that this second width is formed at this lateral wall of this guiding access greater than this first width and this metal level.
4. the board structure with elastic projection as claimed in claim 3, it is characterized in that this First body has a First body medial surface, have one second accommodation space between this lateral wall of this First body medial surface and this guiding access, this metal level is formed at this second accommodation space.
5. the board structure with elastic projection as claimed in claim 3 is characterized in that this metal level more is formed at this surface of this substrate.
6. the board structure with elastic projection as claimed in claim 1 is characterized in that respectively this opening has a plurality of corners, and respectively this insulation projection body is positioned at respectively this corner.
7. the board structure with elastic projection as claimed in claim 1 is characterized in that adjacent respectively this insulation projection body can be connected to each other.
8. the board structure with elastic projection as claimed in claim 1 is characterized in that this second body extends to form in this protective layer.
9. manufacture of substrates with elastic projection is characterized in that it comprises:
One substrate is provided, this substrate has a surface, and is formed at the protective layer that this surperficial line layer and covers this line layer, this line layer has a plurality of guiding access, respectively this guiding access has a lateral wall and a upper surface, this protective layer have a plurality of openings and respectively this opening appear respectively this guiding access, respectively this opening has a madial wall, wherein has one first accommodation space between this madial wall and this lateral wall;
Form a photoresist layer in this surface of this substrate and cover this line layer and this protective layer;
This photoresist layer of patterning is to form a plurality of insulation projection bodies, this insulation projection body is formed at this surface and is positioned at this first accommodation space, respectively this insulation projection body has an end face, one medial surface and a lateral surface, respectively this insulation projection ontology definition has a First body and one second body, this the first noumenon section is positioned at this surface and this First body has one first width, this second body is positioned at this First body top and protrudes from this protective layer, have one second width between this madial wall and this lateral wall, this second width is not less than this first width;
Form a metal level at this upper surface of this end face, this medial surface, this lateral surface, this protective layer and this guiding access of this insulation projection body; And
Remove this metal level that is positioned at this protective layer.
10. the manufacture of substrates with elastic projection as claimed in claim 9 is characterized in that it includes in addition: this metal level that removes this lateral surface that is positioned at this insulation projection body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102402354A CN102956601A (en) | 2011-08-18 | 2011-08-18 | Base plate structure with elastic lugs and manufacturing method of base plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102402354A CN102956601A (en) | 2011-08-18 | 2011-08-18 | Base plate structure with elastic lugs and manufacturing method of base plate structure |
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| CN102956601A true CN102956601A (en) | 2013-03-06 |
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| CN2011102402354A Pending CN102956601A (en) | 2011-08-18 | 2011-08-18 | Base plate structure with elastic lugs and manufacturing method of base plate structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105376934A (en) * | 2014-09-02 | 2016-03-02 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method of the circuit board |
| CN108400124B (en) * | 2017-02-06 | 2019-11-22 | 南亚科技股份有限公司 | Encapsulating structure and its manufacturing method |
| WO2019242752A1 (en) * | 2018-06-21 | 2019-12-26 | 矽创电子股份有限公司 | Bump structure |
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| CN101170089A (en) * | 2006-10-23 | 2008-04-30 | 台湾薄膜电晶体液晶显示器产业协会 | A contact structure with flexible protruding block and testing area and its making method |
| CN101388376A (en) * | 2007-09-14 | 2009-03-18 | 全懋精密科技股份有限公司 | Semi-conductor package substrate construction |
| CN101425491A (en) * | 2007-10-31 | 2009-05-06 | 福葆电子股份有限公司 | Elastic projection of sloped lateral wall and production method thereof |
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| US6809262B1 (en) * | 2003-06-03 | 2004-10-26 | Via Technologies, Inc. | Flip chip package carrier |
| CN101170089A (en) * | 2006-10-23 | 2008-04-30 | 台湾薄膜电晶体液晶显示器产业协会 | A contact structure with flexible protruding block and testing area and its making method |
| CN101388376A (en) * | 2007-09-14 | 2009-03-18 | 全懋精密科技股份有限公司 | Semi-conductor package substrate construction |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105376934A (en) * | 2014-09-02 | 2016-03-02 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method of the circuit board |
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| CN108400124B (en) * | 2017-02-06 | 2019-11-22 | 南亚科技股份有限公司 | Encapsulating structure and its manufacturing method |
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| WO2019242752A1 (en) * | 2018-06-21 | 2019-12-26 | 矽创电子股份有限公司 | Bump structure |
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Application publication date: 20130306 |