CN101425491A - Elastic projection of sloped lateral wall and production method thereof - Google Patents
Elastic projection of sloped lateral wall and production method thereof Download PDFInfo
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- CN101425491A CN101425491A CN 200710165223 CN200710165223A CN101425491A CN 101425491 A CN101425491 A CN 101425491A CN 200710165223 CN200710165223 CN 200710165223 CN 200710165223 A CN200710165223 A CN 200710165223A CN 101425491 A CN101425491 A CN 101425491A
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- elastic projection
- sloped sidewall
- elasticity pedestal
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- elastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention relates to an elastic lug arranged on an integrated circuit package with a weld pad. The elastic lug is provided with an elastic base body positioned on the integrated circuit package and a surface metallic film positioned on the elastic base body and electrically connected with the weld pad. The elastic base body is provided with a top surface away from the integrated circuit package and two groups of opposite lateral walls, wherein one group of lateral walls are inclined lateral walls, and the inclination direction of the inclined lateral walls inclines inwards from the outer side of the elastic base body, so that a structural body of the elastic base body with narrower top surface and wider bottom surface is formed, and when metal layers are successively formed on the top surface of the elastic base body and the inclined lateral wall, the thickness uniformity of the metal layers can be improved, thereby a photo-resistance is advantageous to be tightly attached to the metal layers of the elastic lug, the dimension of the metal layer of the elastic lug is avoided being lessened or broken due to etching solution penetrating into the photo-resistance and a metal layer interface during the etching process, and the problem of the buckle and the rupture of the metal layers caused by the deformation of the elastic base body due to compressive stress can be improved during the mounting process of the elastic lug.
Description
Technical field
Relevant a kind of elastic projection structure of the present invention and manufacture method thereof, purpose is promoting the metal layer thickness uniformity, and after avoiding development and etch process, this metal level size decreases or part narrow down, and improve elastic projection problems such as metal level generation fold, fracture when structure is adorned.
Background technology
Elastic projection is one to be made in the convex structure body on the weld pad of integrated circuit (IC) chip, by flexible organic polymer core projection and coat its outer field metal film and constituted, be convenient to follow-up with chip and glass substrate encapsulation (Chip on Glass, COG) or chip and film substrate encapsulation (Chipon Film, structure dress mode such as COF) is sent to the line function of chip as its assemblies of arranging in pairs or groups such as flat-panel screens through weld pad, elastic projection, baseplate lead.
Wherein, this elasticity pedestal can have three kinds of aspects in the position on integrated circuit weld pad composition surface: first kind of aspect is shown in Figure 1A, and elasticity pedestal 21 is formed directly on the weld pad 12 of integrated circuit; Second kind of aspect is that elasticity pedestal 21 is formed on the sheath 11 of weld pad 12 peripheries, shown in Figure 1B; The third aspect is that elasticity pedestal 21 is to be formed on simultaneously on weld pad 12 and the sheath 11, shown in Fig. 1 C.
The elastic projection metal film on surface manufacturing process of commonly using as for elastic projection consists essentially of as Fig. 2 to step shown in Figure 7; With first kind of aspect is example, at first as shown in Figure 2, the composition surface that elasticity pedestal 21 is formed on integrated circuit package 10 is with respect on the weld pad 12, its molding mode as shown in Figure 3A, coating one photosensitive material layer 24 utilizes a light shield 25 with elasticity pedestal two-dimension projection shape, again shown in Fig. 3 B on this integrated circuit package 10 on this integrated circuit package 10, expose, developing manufacture process, then can on integrated circuit package 10, form elasticity pedestal 21; Again as shown in Figure 4, utilize physical gas phase deposition technology to form one deck at least in top, the composition surface of this integrated circuit package 10 and be connected in metal level 22 between each elasticity pedestal 21 and each weld pad 12, this metal level 22 comprises bottom can conduct electricity adhesion layer 221 and top layer metal level 222; Then as shown in Figure 5, finish the photoresistance pattern 23 that covers in order to the metal level on each elasticity pedestal 21 zone 22 with developing manufacture process; Afterwards as shown in Figure 6, utilize etch process to remove not to be coated with the metal level 22 of photoresistance pattern 23, only keep the metal level 22 that extends to corresponding weld pad 12 in the zone of each elasticity pedestal 21; At last as shown in Figure 7, photoresistance pattern 23 is removed, the metal level in each elasticity pedestal 21 zone is exposed, and become in order to constitute the metal film on surface 22 ' that electrically conducts of integrated circuit package 10.
Since on take off and commonly use in the manufacturing process, this elasticity pedestal 21 is shaped to cubical structure, shown in Fig. 3 B, it has end face 211 and subvertical four sidewalls 212 away from integrated circuit package 10, make when carrying out physical vapour deposition (PVD) formation metal level 22, this metal level 22 takes shape in the end face 211 and sidewall 212 variable thickness of this elasticity pedestal, shown in Fig. 8 A, the thickness L2 of its sidewall 212 metal levels 22 is about 60～70% of end face 211 metal levels 22 thickness L1, that is L2=(0.6～0.7) L1, make that this metal level 22 is in uneven thickness, and cause the local electrical resistance value higher.
Moreover, developing, before etching forms metal film on surface, utilize the rotary coating mode to cover photoresistance and form photoresistance pattern 23 on the metal level 22 prior to elasticity pedestal 21, as shown in Figure 5, but because the sidewall 212 of this elasticity pedestal 21 is near vertical angle, so when the rotary coating photoresistance, make photoresistance be difficult for being close on the metal level 22 of this sidewall 212 easily, perhaps make 22 of this photoresistance pattern 23 and metal levels be easy to generate the slit, make when carrying out etching, etching solution infiltrates the interface of photoresistance pattern 23 and metal level 22 easily, even order is coated with the part metals layer 22 of photoresistance pattern 23 and still can be removed, and then make the metal film on surface 22 ' of moulding in sidewall size decreases even form neck shaped (necking) partly, shown in Fig. 8 B.
In addition, adorn in the process of pressing in structure at elastic projection, elastic projection is stress and being out of shape by compression, form wave structure, shown in Fig. 8 C, D, and the metal film on surface 22 ' in the wave trough position of this wave structure can be compressed stress and produce buckling deformation A, and the metal film on surface 22 ' in the crest location can be subjected to stretching stress and produce crack B even fracture, no matter be that buckling deformation A or crack B even fracture all can have bad influence to the conduction property of metal film on surface.
Summary of the invention
Main purpose of the present invention is promptly providing a kind of even metal layer thickness and compact dimensions thereof of obtaining, and can improve elastic projection sidewall surfaces metal film behind the structure dress, and the elastic projection and the manufacture method thereof of the sloped sidewall of problems such as fold, fracture takes place.
Take off purpose on reaching, elastic projection of the present invention is arranged at one to have on the integrated circuit package of weld pad, this elastic projection has an elasticity pedestal that is positioned on this integrated circuit package, an and metal film on surface that is positioned on this elasticity pedestal and electrically connects with this weld pad, this elasticity pedestal has end face and two groups of relative sidewalls away from this integrated circuit package, and wherein one group of sidewall that is covered by metal film on surface is a sloped sidewall, and the incline direction of this sloped sidewall is inwards tilted by the external side of spring support.
Particularly, the present invention has following effect:
1. the inclined side that elasticity pedestal of the present invention is had helps follow-uply during the forming metal layer, can guaranteeing this metal layer thickness uniformity on the sloped sidewall of elasticity pedestal, improves the higher problem of sidewall position metal level resistance value.
2. when being rotated the coating photoresistance, because of the comparatively mild and non-perpendicular angle of the sidewall of this this elasticity pedestal, photoresistance can evenly be coated on the metal level of elasticity pedestal, and help photoresistance to be close on the metal level of this elastic projection, avoid in the etch process because of etching solution infiltrates photoresistance and metal level interface, cause the metal level size decreases or the formation neck shaped of this elastic projection.
3. can improve elastic projection when structure is adorned, be out of shape problems such as the metal level fold that caused, fracture because of the elasticity pedestal bears compression stress, and then guarantee the conduction property of metal film on surface.
Description of drawings
Figure 1A, B, C are that general elasticity pedestal is in the position view on integrated circuit package composition surface;
The manufacture method schematic flow sheet that Fig. 2-Fig. 7 commonly uses for elastic projection;
Fig. 8 A is the structural representation of metal layer thickness on the end face of practising flexible pedestal and the sidewall;
Fig. 8 B is for practising the structural perspective of flexible projection;
Fig. 8 C, D are for practising flexible projection in structure dress pressing deformed configurations schematic diagram;
Fig. 9 is the structural representation of the elastic projection of medium dip sidewall of the present invention;
Figure 10 is the elastic projection manufacture method first embodiment flow chart of steps of medium dip sidewall of the present invention;
Figure 11-15 is the elastic projection manufacture method first embodiment schematic flow sheet of medium dip sidewall of the present invention;
Figure 16 is the structural perspective of medium dip sidewall elastic projection of the present invention;
Figure 17 is the elastic projection manufacture method second embodiment flow chart of steps of medium dip sidewall of the present invention;
Figure 18-20 is the elastic projection manufacture method first embodiment schematic flow sheet of medium dip sidewall of the present invention;
Figure 21 by gray-level mask among the present invention and the structural representation of formation elasticity pedestal.
[figure number explanation]
End face 211 sidewalls 212
Light shield 25 elastic projections 3
Metal film on surface 32 metal levels 32 '
Gray-level mask 5 light shielding parts 51
Embodiment
Characteristics of the present invention can be consulted the detailed description of the graphic and embodiment of this case and obtained to be well understood to.
The elasticity pedestal that the present invention is primarily aimed in the middle of the elastic projection is improved; Wherein, each elastic projection includes an elasticity pedestal, and be connected in spring support surface and this elasticity pedestal the elastic projection metal film on surface between the corresponding I/O weld pad, see through the elastic projection metal film on surface and constitute electrically conducting of integrated circuit package and external circuit.
As for, elastic projection 3 of the present invention is arranged at one to have on the integrated circuit package 4 of weld pad 41, as shown in Figure 9, this elastic projection 3 has an elasticity pedestal 31 that is positioned on this integrated circuit package 4, an and metal film on surface 32 that is positioned on this elasticity pedestal 31 and electrically connects with this weld pad 41, this elasticity pedestal 31 has end face 311 and two groups of relative sidewalls 312 away from this integrated circuit package 4,313, and this wherein one group of sidewall that is covered by metal film on surface be sloped sidewall 313, and the incline direction of this sloped sidewall 313 is inwards tilted by elasticity pedestal 31 outsides, forming the narrower and structure of bottom surface broad of elasticity pedestal end face, and make being shaped as of these elasticity pedestal 31 integral body trapezoidal.
In the present embodiment, the material of this elasticity pedestal 31 is a kind ofly to be electrically insulated and to have elastomeric macromolecule organic (organic polymer), can make for photosensitive type Polyimide (Photo-sensitive Polyimide), but not as limit, except having the photosensitive material (photo-sensitive material) that is applicable to the core (core) of making elastic projection 3 now, other Polyimide (polyimide) as non-photosensitive type, benzocyclobutene (benego cyclobutene), polypropylene vinegar (polyacrylates), rubber (rubber), and sensitization and non-photosensitive type silica gel (silicone) etc., also all be applicable among the present invention, as for its position that sets three kinds of aspects as the aforementioned, present embodiment is an example with first kind of aspect, being formed directly on the weld pad 12, but should be with limitation the present invention.
And this metal film on surface 32 is by two sloped sidewalls 313 of elasticity pedestal end face 311 coatings to this elasticity pedestal 31, and extend to weld pad 41, and this metal film on surface 32 comprises bottom adhesion layer 321 and top layer metal level 322, this bottom adhesion layer 321 in abutting connection with and be coated on this elasticity pedestal 31; This top layer metal level 322 then plating is located at outside this bottom adhesion layer 321.
As shown in figure 10, first embodiment of integral, flexible bump manufacturing method includes the following step in regular turn:
A, preparation one gray-level mask 5 with elasticity pedestal two-dimension projection shape, as shown in figure 11, wherein this gray-level mask 5 is provided with light shielding part 51, full transmittance section 52 and GTG portion 53, this GTG portion 53 is located at two avris of light shielding part 51, among the embodiment as shown in the figure, this GTG portion 53 is provided with plural printing opacity pattern 54, and the light transmittance of each printing opacity pattern 54 or area are inwards successively decreased by the outside, or the density of each printing opacity pattern 54 is inwards successively decreased by the outside.
B, provide an integrated circuit package 4 with weld pad 41, and coating one can be used as the positive type light sensitive material layer 42 of elasticity pedestal on this integrated circuit package 4.
C, with exposure, developing manufacture process forms elasticity pedestal 31 on integrated circuit package 4, as shown in figure 12.
D, utilize physical gas phase deposition technology on this elasticity pedestal 31, to form at least one metal levels 32 ' that electrically connect with this weld pad 41, as shown in FIG. 13A, and make this metal level 32 ' be connected weld pad 41 and elasticity pedestal 31, can non-limiting use sputter technology or adopt evaporation coating technique, prior to the bottom adhesion layer 321 of formation one on this elasticity pedestal 31 with these weld pad 41 electric connections, form a top layer metal level 322 again on this bottom adhesion layer 321, the material of this bottom adhesion layer 321 is titanium-tungstens; The material of this top layer metal level 322 then is a gold.Certainly, the material of this bottom adhesion layer 321 and top layer metal level 322 is not as limit, and this bottom adhesion layer 321 also can be by chromium, titanium, tungsten, aluminium, copper, or its etc. the material of combination make; 322 of this top layer metal levels can be by gold, silver, with and etc. the material of combination make; And what deserves to be mentioned is, this metal level 32 ' moulding is covered in the end face 311 and the sloped sidewall 313 of elasticity pedestal, the incline direction of this sloped sidewall 313 is inwards tilted by elasticity pedestal 31 outsides, so when depositing metal layers 32 ', on its end face 311 on the thickness L3 of metal level 32 ' and the sloped sidewall 313 the thickness L4 of metal level 32 ' more consistent and even, shown in Figure 13 B.
E, remove the part this metal level to define this metal film on surface of this elastic projection, it more includes step (e-1) and defines this elastic projection 31 in-scopes with developing manufacture process in this metal level 32 ', that is finish the photoresistance pattern 43 that covers in order to the metal level on elasticity pedestal 31 zones 32 ', as Figure 14; And step (e-2) removes non-this metal level 32 ' of part that is positioned at these elastic projection 31 in-scopes with etch process, and as shown in figure 15, the metal level 32 ' that also soon is not coated with photoresistance pattern 43 removes; At last photoresistance pattern 43 is removed, the metal level in elasticity pedestal 31 zones is exposed, and become, as shown in Figure 9 in order to constitute the metal film on surface that electrically conducts 32 of integrated circuit package 4.
Wherein, this photoresistance pattern 43 utilizes the rotary coating mode to be covered on the metal level 32 ', as shown in figure 14, and the sloped sidewall 313 of this elasticity pedestal non-be vertical angle, so help photoresistance pattern 43 can be close on the metal level 32 ' of this sloped sidewall 313, in the subsequent etch processing procedure, can avoid infiltrating the interface of photoresistance pattern 43 and metal level 32 ' because of etching solution, and cause the situation of this metal level 32 ' size decreases even fracture to take place, to guarantee the size of moulding rear surface metal film 32, as shown in figure 16; And when elastic projection when structure is adorned, its elasticity pedestal end face is after being compressed stress, this sloped sidewall structure can change the buckling deformation shape, is out of shape problems such as the metal level fold that caused, fracture to improve the elasticity pedestal to bear compression stress.
As shown in figure 17, another embodiment for elastic projection manufacture method of the present invention, its step a～e is identical with first embodiment, and more include step f between step c and the d, and step e more includes step g afterwards, wherein step f can lift from the formula photoresist and be coated on all surface of integrated circuit package 4, and utilize exposure, developing technique, keep or remove the lifting of integrated circuit package composition surface ad-hoc location from formula photoresistance (as shown in figure 18, can lift be positioned at elasticity pedestal periphery) from the formula photoresistance; Wherein, can lift from the formula photoresist and can optionally select to use " positive photoresistance " or " negative photoresistance ", that is utilize the moon in the similar engraving to carve or sun skill at quarter, cooperate stopping of light mask image, remove or figure that reservation is corresponding or complementary with light mask image, main purpose is to keep lifting from the formula photoresistance of integrated circuit package composition surface ad-hoc location, make on the composition surface of integrated circuit package with respect to forming in elasticity pedestal periphery in order to each elastic projection metal film on surface being separated the photoresistance pattern 43 of (in Figure 18, forming as yet), and this photoresistance pattern 43 is through coating, the exposure and the adjustment of developing manufacture process parameter and be trapezoidal.
F, utilize physical gas phase deposition technology on all surface of integrated circuit package 10, to form layer of metal layer 32 ' (as shown in figure 19) at least.
G, utilize the photoresistance remover with the lip-deep photoresistance pattern of integrated circuit package at last, remove together with the metal level that covers on the photoresistance pattern, as shown in figure 20, can the metal film on surface 32 that be connected with pairing weld pad 41 respectively be arranged in the 31 surperficial construction of elasticity pedestal.
And employed gray-level mask 5 among the step a wherein, form that can be as shown in figure 11, can also be as the form of Figure 21, this gray-level mask 5 is provided with light shielding part 51 equally, full transmittance section 52 and plural GTG portion 53, this GTG portion 53 is located at two avris of light shielding part 51, and 53 in each GTG portion is provided with light shielding part 51, and this GTG portion 53 is provided with plural printing opacity pattern 54 equally, and the light transmittance of each printing opacity pattern 54 or area are inwards reduced by the outside, or the density of each printing opacity pattern 54 inwards reduces by the outside, by 313 forms by a plurality of planar sections 314 and multistage inclined-plane that tilting section 315 constitutes of sloped sidewall of elastic projection that this embodiment forms.
The present invention has compared to habit and has following advantage:
1, this elasticity pedestal forms angled side walls except can be by gray-level mask, under also can allowing in the length of elasticity pedestal (considering the contact area of elastic projection end face), equally by the gray-level mask of different designs, and forms the elasticity pedestal on multistage inclined-plane.
2, the inclination that had of the elasticity pedestal of the present invention face that inclines during the forming metal layer, can be guaranteed this metal layer thickness uniformity in order to follow-up on the sloped sidewall of elasticity pedestal, improve the higher problem of sidewall position metal level resistance value.
When 3, being rotated the coating photoresistance, because of the sidewall of this elasticity pedestal comparatively mild, photoresistance can evenly be coated on the metal level of elasticity pedestal, and help photoresistance to be close on the metal level of this elastic projection, avoid in the etch process because of etching solution infiltrates photoresistance and metal level interface, cause the metal level size decreases of this elastic projection or formation neck shaped and the part is narrowed down.
4. can improve elastic projection when structure is adorned, be out of shape problems such as the metal level fold that caused, fracture because of the elasticity pedestal bears compression stress, and then guarantee the conduction property of metal film on surface.
Technology contents of the present invention and technical characterstic the sixth of the twelve Earthly Branches disclose as above, yet the personage who is familiar with this technology still may do various replacement and the modifications that do not deviate from this case invention spirit based on announcement of the present invention.Therefore, protection scope of the present invention should be not limited to those disclosed embodiments, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by following claim.
Claims (21)
1, a kind of elastic projection of sloped sidewall, this elastic projection is arranged at one to have on the integrated circuit package of weld pad, this elastic projection has an elasticity pedestal that is positioned on this integrated circuit package, and a metal film on surface that is positioned on this elasticity pedestal and electrically connects with this weld pad, this elasticity pedestal has end face and two groups of relative sidewalls away from this integrated circuit package; It is characterized in that:
This wherein one group of sidewall that is covered by metal film on surface be sloped sidewall, and the incline direction of this sloped sidewall is inwards tilted by the external side of spring support.
2, the elastic projection of sloped sidewall according to claim 1, wherein this elasticity pedestal be shaped as trapezoidal.
3, the elastic projection of sloped sidewall according to claim 1, wherein this metal film on surface is by two sloped sidewalls of elasticity pedestal end face coating to this elasticity pedestal, and extends to weld pad.
4, the elastic projection of sloped sidewall according to claim 1, wherein this metal film on surface comprises bottom adhesion layer and top layer metal level.
5, as the elastic projection of sloped sidewall as described in the claim 4, wherein the material of this bottom adhesion layer is to be selected from by following institute one of to constitute group, and this group comprises chromium, titanium, tungsten, aluminium, copper, with and etc. combination; Wherein the material of this top layer metal level is to be selected from by following institute one of to constitute group, and this group comprises gold, silver, with and etc. combination.
6, the elastic projection of sloped sidewall according to claim 1, wherein the material of this elasticity pedestal is a kind ofly to be electrically insulated and to have elastomeric macromolecule organic, its.
7, the elastic projection of sloped sidewall according to claim 1, wherein the material of this elasticity pedestal can be Polyimide, benzocyclobutene, polyacrylate, rubber or silica gel.
8, the elastic projection of sloped sidewall according to claim 1, wherein this sloped sidewall is made of a plurality of planar sections and tilting section.
9, a kind of elastic projection manufacture method of sloped sidewall includes the following step in regular turn:
A, preparation one gray-level mask with elasticity pedestal two-dimension projection shape;
B, provide an integrated circuit package with weld pad, and on this integrated circuit package coating one photosensitive material layer;
C, with gray-level mask exposes, developing manufacture process forms the tool sloped sidewall on integrated circuit package elasticity pedestal; And
D, on this elasticity pedestal, form a metal level that electrically connects with this weld pad, and make this metal level be connected weld pad and elasticity pedestal.
10, as the elastic projection manufacture method of sloped sidewall as described in the claim 9, wherein this steps d is to finish with the processing procedure of physical vapour deposition (PVD) processing procedure.
11, as the elastic projection manufacture method of sloped sidewall as described in the claim 9, wherein this steps d comprises the following step:
(d-1) the bottom adhesion layer that formation one and this weld pad electrically connect on this elasticity pedestal; And
(d-2) on this bottom adhesion layer, form a top layer metal level.
12, as the elastic projection manufacture method of sloped sidewall as described in the claim 9, wherein more include the following step after this steps d:
E, remove the part this metal level to define this metal film on surface of this elastic projection.
13, as the elastic projection manufacture method of sloped sidewall as described in the claim 12, wherein this step e comprises the following step:
(e-1) define this elastic projection in-scope with developing manufacture process in this metal level; And
(e-2) remove non-this metal level of part that is positioned at this elastic projection in-scope with etch process.
14, as the elastic projection manufacture method of sloped sidewall as described in the claim 12, wherein more comprise the following step between this step c and the steps d:
F, can lift, form the photoresistance pattern in elasticity pedestal periphery from formula photoresist utilization coating, exposure, developing manufacture process.
15, as the elastic projection manufacture method of sloped sidewall as described in the claim 14, wherein this photoresistance pattern is to be trapezoidal through the adjustment of coating, exposure and developing manufacture process parameter.
16, as the elastic projection manufacture method of sloped sidewall as described in the claim 14, wherein more include the following step behind this step e:
G, utilize the photoresistance remover that the photoresistance pattern is removed together with the metal level that covers on the photoresistance pattern.
17, as the elastic projection manufacture method of sloped sidewall as described in the claim 9, wherein this gray-level mask is provided with light shielding part, full transmittance section and GTG portion.
18, as the elastic projection manufacture method of sloped sidewall as described in the claim 17, wherein this GTG portion is located at two avris of light shielding part.
19, as the elastic projection manufacture method of sloped sidewall as described in the claim 17, wherein this gray-level mask is provided with plural GTG portion, and each GTG portion is located at two avris of light shielding part, and is provided with light shielding part between each GTG portion.
20, as the elastic projection manufacture method of sloped sidewall as described in the claim 17,18 or 19, wherein this GTG portion is provided with plural printing opacity pattern.
21, as the elastic projection manufacture method of sloped sidewall as described in the claim 20, when wherein this elasticity pedestal material is the positive type light sensitive material, the light transmittance or the area of each printing opacity pattern are inwards reduced by the outside, and perhaps, the density of each printing opacity pattern is inwards successively decreased by the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710165223 CN101425491A (en) | 2007-10-31 | 2007-10-31 | Elastic projection of sloped lateral wall and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200710165223 CN101425491A (en) | 2007-10-31 | 2007-10-31 | Elastic projection of sloped lateral wall and production method thereof |
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| CN101425491A true CN101425491A (en) | 2009-05-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956601A (en) * | 2011-08-18 | 2013-03-06 | 颀邦科技股份有限公司 | Base plate structure with elastic lugs and manufacturing method of base plate structure |
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2007
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956601A (en) * | 2011-08-18 | 2013-03-06 | 颀邦科技股份有限公司 | Base plate structure with elastic lugs and manufacturing method of base plate structure |
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Open date: 20090506 |