CN102956579A - Fixing structure of radiating device - Google Patents
Fixing structure of radiating device Download PDFInfo
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- CN102956579A CN102956579A CN2011102367011A CN201110236701A CN102956579A CN 102956579 A CN102956579 A CN 102956579A CN 2011102367011 A CN2011102367011 A CN 2011102367011A CN 201110236701 A CN201110236701 A CN 201110236701A CN 102956579 A CN102956579 A CN 102956579A
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- fixed structure
- aforementioned
- heat abstractor
- retaining element
- heat
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A fixing structure of a radiating device comprises a body and a plurality of fixing elements. The body is provided with a chamber, the chamber is provided with a first side, a second side, a plurality of supports and working fluid, the supports are connected with the first side and the second side, a plurality of connecting portions corresponding to the supports of the chamber are concavely arranged on the outside of the body, and the fixing elements are connected with the connecting portions. The fixing structure has the advantages that air tightness of the chamber inside the body can be assuredly kept when the fixing elements are arranged on the radiating device, and the radiating device can be closely combined with other elements.
Description
Technical field
A kind of fixed structure of heat abstractor, a kind of fixed structure of heat abstractor espespecially, when it arranges fixed structure, get and do not destroy the body of this heat abstractor, and then can prevent that the chamber of this heat sink interior from producing the fixed structure that seepage affects the heat abstractor of hot transfer efficiency.
Background technology
Gradually with frivolous demand as bragging about, therefore each item all must dwindle its size thereupon, but the size of electronic equipment is dwindled the major obstacle that the thermal change of following and producing becomes electronic equipment and system enhancement performance with existing electronic equipment.The semiconductor dimensions that no matter forms electronic component is constantly dwindled, and still requires constantly to increase performance.
When semiconductor dimensions is dwindled, heat flux increases as a result, it only is all increases of heat that the challenge that heat flux increase cause is cooled off product surpasses, overheated because the increase of heat flux causes at different time and the meeting of different length size, may cause electronic failure or damage.
Temperature-uniforming plate is that the heat conduction of a kind of in a big way face and face is used, and it is different from the point-to-point heat exchange pattern of heat pipe, and is applicable to the comparatively narrow part use in space.
Temperature-uniforming plate has a heating surface and a cryosurface and a vacuum chamber and is filled with working fluid, have a plurality of support columns and capillary structure in this vacuum chamber, described support column connects heating surface and the cryosurface of this temperature-uniforming plate and supports this vacuum chamber, temperature-uniforming plate system is sticked by this heating surface and thermal source, the cryosurface of this temperature-uniforming plate opposite side then is connected the conduction heat with another heat abstractor, and this working fluid converts the working fluid of gaseous state in the evaporation of heating surface place absorption heat generation, this gaseous working fluid produces condensation in this cryosurface place, be converted to liquid state, the working fluid of this liquid state is back to heating surface by the capillary structure of chamber interior, and working fluid forms gas-liquid cycle conduction heat in this chamber.
Known system is combined with temperature-uniforming plate and a substrate and conduct by temperature-uniforming plate the heat of the heater element on this substrate, known technology mainly lies in the position that temperature-uniforming plate is avoided this chamber, namely the four coupling places of this temperature-uniforming plate respectively wear a copper post with internal screw thread, the position system that relative this temperature-uniforming plate of substrate arranges the copper post offers at least one hole, wear simultaneously described copper post by a screw lock element in the mode of screw lock again and hole is fixed in this temperature-uniforming plate on this substrate, but this fixed form is arranged at the four coupling places of this temperature-uniforming plate because of the copper post, distant with this heater element, this temperature-uniforming plate is fixed rear and heater element can't fit tightly, and then produces thermal chocking; For improving the aforementioned problem that can't fit tightly, then the dealer is arranged at the direct correspondence of copper post the adjacent place at the position that this temperature-uniforming plate and heater element be sticked, therefore described copper post is directly to run through the position that temperature-uniforming plate has chamber, though tightness prevents that thermal chocking from producing in the time of can increasing assembling, but the chamber of this temperature-uniforming plate loses air-tightness after being subjected to described copper post to run through destruction, its chamber interior no longer has vacuum state, and because running through, the copper post destroys this chamber, then the flow path of the working fluid of its inside may therefore interruptedly cause hot transfer efficiency to reduce, even seriously also may produce leakage, and then make this temperature-uniforming plate lose heat biography effectiveness; Therefore known technology has following shortcoming:
1. easily produce thermal chocking;
2. hot transfer efficiency reduces.
Summary of the invention
For this reason, for solving the shortcoming of above-mentioned known technology, the present invention's main purpose is that a kind of fixed structure that the combination tightness prevents the heat abstractor that thermal chocking produces that promotes is provided.
Secondary objective of the present invention is to provide a kind of not destroy the heat abstractor body when retaining element is set, and guarantees the fixed structure of the heat abstractor of chamber vacuum-tightness.
For reaching above-mentioned purpose, the present invention system provides a kind of fixed structure of heat abstractor, is to comprise: a body, a plurality of retaining element;
Described body has a chamber, this chamber has one first side and one second side and a plurality of supporter and working fluid, and this first and second side has a capillary structure layer, described supporter connects aforementioned first and second side, the position that relative this chamber of described body exterior arranges supporter is arranged with a plurality of connecting portions, the corresponding aforementioned supporter setting of described connecting portion;
Described retaining element has a hole, and an end connects the connecting portion of aforementioned body.
Particularly, the invention provides. a kind of fixed structure of heat abstractor comprises:
One body, has a chamber, this chamber has one first side and one second side and a plurality of supporter and working fluid, and this first and second side has a capillary structure layer, described supporter connects aforementioned first and second side, and relative this chamber of described body exterior arranges described supporter place and is arranged with a plurality of connecting portions;
A plurality of retaining elements, described retaining element has a hole, and an end connects the connecting portion of aforementioned body.
Preferably, the fixed structure of described heat abstractor has internal thread in the hole of described retaining element.
Preferably, the fixed structure of described heat abstractor, the complete aforementioned cavity that is attached to of described capillary structure layer.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by welding processing.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by point discharge processing.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by the ultrasonic waves welding.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by machining.
Preferably, the fixed structure of described heat abstractor, described body is corresponding to be sticked with a substrate, this body is convexly equipped with at least one heat affected zone and contacts with at least one thermal source on this substrate, the all sides of described thermal source are provided with a plurality of holes, described hole is corresponding with aforementioned retaining element, and opposite this heat affected zone one side of described body connects a radiator.
Preferably, the fixed structure of described heat abstractor has also that a lock member wears aforementioned hole and aforementioned retaining element is fixed described body and substrate.
Preferably, the fixed structure of described heat abstractor, described body exterior is convexly equipped with at least one heat affected zone, the adjacent described connecting portion in described heat affected zone.
Preferably, the fixed structure of described heat abstractor, described body also have one first plate body and one second plate body correspondence covers and jointly define aforementioned cavity.
The effect that the fits tightly when fixed structure of the heat abstractor by the present invention not only can increase this heat abstractor and treat the heat-dissipating thing combination is avoided outside thermal chocking produces, more because the present invention's retaining element and this body group are established the chamber that does not run through and destroy this body, the internal work fluid does not produce leakage therefore this chamber is still possessed vacuum-tightness; Therefore the present invention has following advantages:
1. conjugation is good for thermal chocking;
2. do not produce leakage;
3. useful life is longer.
Description of drawings
Fig. 1 is the first embodiment three-dimensional exploded view of the fixed structure of heat abstractor of the present invention;
Fig. 2 is the first embodiment three-dimensional combination figure of the fixed structure of heat abstractor of the present invention;
Fig. 3 is first embodiment A-A cutaway view of the fixed structure of heat abstractor of the present invention;
Fig. 4 is the stereogram of the second embodiment of fixed structure of the present invention's heat abstractor;
Fig. 5 is the three-dimensional exploded view of the 3rd embodiment of fixed structure of the present invention's heat abstractor;
Fig. 6 is the three-dimensional combination figure of the 3rd embodiment of fixed structure of the present invention's heat abstractor;
Fig. 7 is the three-dimensional exploded view of the 4th embodiment of fixed structure of the present invention's heat abstractor;
Fig. 8 is the B-B cutaway view of the 4th embodiment of fixed structure of the present invention's heat abstractor.
[main element symbol description]
Body 1
The first plate body 1a
The second plate body 1b
The first side 111
The second side 112
Supporter 113
Connecting portion 115
Heat affected zone 116
Retaining element 2
Hole 21
Internal thread 22
Working fluid 3
Lock member 5
Radiator 6
Embodiment
Characteristic on the present invention's above-mentioned purpose and structure thereof and the function will be explained according to appended graphic preferred embodiment.
Seeing also Fig. 1, Fig. 2, Fig. 3, is the first embodiment stereo decomposing and constitutional diagram and the A-A cutaway view of the fixed structure of heat abstractor of the present invention, and as shown in the figure, the fixed structure of the present invention's heat abstractor is to comprise: a body 1, a plurality of retaining element 2;
Described body 1 has a chamber 11, this chamber 11 has one first side 111 and one second side 112 and a plurality of supporter 113 and working fluid 3, and this first and second side 111,112 has a capillary structure layer 114, described supporter 113 two ends connect respectively aforementioned first and second side 111,112, described body 1 outside relatively this chamber 11 arranges described supporter 113 places and is arranged with a plurality of connecting portions 115, and described capillary structure layer 114 is the complete aforementioned cavity 11 that is attached to.
This retaining element 2 has a hole 21, and an end connects the connecting portion 115 of aforementioned body 1; Described hole 21 interior setting tools have internal thread 22.
Described retaining element 2 be by welding processing and point discharge processing and machining and ultrasonic waves welding wherein arbitrary and aforementioned body be combined, wherein machining can be punching press and bore a hole and Drilling operation wherein arbitrary but do not regard it as and be limited.
See also Fig. 4, it is the stereogram of the second embodiment of fixed structure of the present invention's heat abstractor, as shown in the figure, the present embodiment part-structure system is identical with aforementioned the first embodiment, therefore will repeat no more at this, only the present embodiment and not existing together of aforementioned the first embodiment are that described body 1 outside is convexly equipped with at least one heat affected zone 116, described heat affected zone 116 adjacent described connecting portions 115.
See also Fig. 5, Fig. 6, be stereo decomposing and the constitutional diagram of the 3rd embodiment of fixed structure of the present invention's heat abstractor, as shown in the figure, the present embodiment part-structure system is identical with aforementioned the first embodiment, therefore will repeat no more at this, only the present embodiment and not existing together of aforementioned the first embodiment are that the corresponding and substrate 4 of described body 1 is sticked, this body 1 is convexly equipped with at least one heat affected zone 116 and contacts with at least one thermal source 41 on this substrate 4, described thermal source 41 all sides are provided with a plurality of holes 42, described hole 42 is corresponding with aforementioned retaining element 2, and wears aforementioned hole 42 and aforementioned retaining element 2 is fixing with described body 1 and substrate 4 by at least one lock member 5.
One of aforementioned body 1 opposite this heat affected zone 116 side-line connects a radiator 6.
See also Fig. 7, Fig. 8, be stereo decomposing and the assembled sectional view of the 4th embodiment of fixed structure of the present invention's heat abstractor, as shown in the figure, the present embodiment part-structure system is identical with aforementioned the first embodiment, therefore will repeat no more at this, only the present embodiment and not existing together of aforementioned the first embodiment are that described body 1 has also that one first plate body 1a and one second plate body 1b are corresponding to cover and jointly define aforementioned cavity 11.
Claims (11)
1. the fixed structure of a heat abstractor is characterized in that, comprises:
One body, has a chamber, this chamber has one first side and one second side and a plurality of supporter and working fluid, and this first and second side has a capillary structure layer, described supporter connects aforementioned first and second side, and relative this chamber of described body exterior arranges described supporter place and is arranged with a plurality of connecting portions;
A plurality of retaining elements, described retaining element has a hole, and an end connects the connecting portion of aforementioned body.
2. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, has internal thread in the hole of described retaining element.
3. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, the complete aforementioned cavity that is attached to of described capillary structure layer.
4. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, described retaining element is combined with aforementioned body by welding processing.
5. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, described retaining element is combined with aforementioned body by point discharge processing.
6. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, described retaining element is combined with aforementioned body by the ultrasonic waves welding.
7. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, described retaining element is combined with aforementioned body by machining.
8. the fixed structure of heat abstractor as claimed in claim 1, it is characterized in that, described body is corresponding to be sticked with a substrate, this body is convexly equipped with at least one heat affected zone and contacts with at least one thermal source on this substrate, the all sides of described thermal source are provided with a plurality of holes, described hole is corresponding with aforementioned retaining element, and opposite this heat affected zone one side of described body connects a radiator.
9. the fixed structure of heat abstractor as claimed in claim 8 is characterized in that, has also that a lock member wears aforementioned hole and aforementioned retaining element is fixed described body and substrate.
10. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, described body exterior is convexly equipped with at least one heat affected zone, the adjacent described connecting portion in described heat affected zone.
11. the fixed structure of heat abstractor as claimed in claim 1 is characterized in that, described body also has one first plate body and one second plate body correspondence covers and jointly define aforementioned cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110236701.1A CN102956579B (en) | 2011-08-17 | 2011-08-17 | The fixed structure of heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110236701.1A CN102956579B (en) | 2011-08-17 | 2011-08-17 | The fixed structure of heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102956579A true CN102956579A (en) | 2013-03-06 |
| CN102956579B CN102956579B (en) | 2015-08-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110236701.1A Active CN102956579B (en) | 2011-08-17 | 2011-08-17 | The fixed structure of heat abstractor |
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| Country | Link |
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| CN (1) | CN102956579B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764311A (en) * | 2016-05-05 | 2016-07-13 | 重庆大学 | Heat dissipation device for chip |
| CN110769654A (en) * | 2019-10-30 | 2020-02-07 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method thereof and electronic equipment |
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| CN101072490A (en) * | 2006-05-10 | 2007-11-14 | 英业达股份有限公司 | Support column with porous structure |
| CN201787842U (en) * | 2010-07-14 | 2011-04-06 | 夏邦杰 | Soaking plate |
| CN201839581U (en) * | 2010-10-28 | 2011-05-18 | 游明郎 | Equalizing thermal module |
| JP2011142142A (en) * | 2010-01-05 | 2011-07-21 | Onkyo Corp | Heat sink mounting structure and heat sink mounting method |
| CN201926356U (en) * | 2010-12-21 | 2011-08-10 | 深圳市万景华科技有限公司 | Uniform-temperature plate |
| CN202217658U (en) * | 2011-08-17 | 2012-05-09 | 奇鋐科技股份有限公司 | Fixing structure of radiation device |
-
2011
- 2011-08-17 CN CN201110236701.1A patent/CN102956579B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101072490A (en) * | 2006-05-10 | 2007-11-14 | 英业达股份有限公司 | Support column with porous structure |
| JP2011142142A (en) * | 2010-01-05 | 2011-07-21 | Onkyo Corp | Heat sink mounting structure and heat sink mounting method |
| CN201787842U (en) * | 2010-07-14 | 2011-04-06 | 夏邦杰 | Soaking plate |
| CN201839581U (en) * | 2010-10-28 | 2011-05-18 | 游明郎 | Equalizing thermal module |
| CN201926356U (en) * | 2010-12-21 | 2011-08-10 | 深圳市万景华科技有限公司 | Uniform-temperature plate |
| CN202217658U (en) * | 2011-08-17 | 2012-05-09 | 奇鋐科技股份有限公司 | Fixing structure of radiation device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764311A (en) * | 2016-05-05 | 2016-07-13 | 重庆大学 | Heat dissipation device for chip |
| CN110769654A (en) * | 2019-10-30 | 2020-02-07 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method thereof and electronic equipment |
| CN110769654B (en) * | 2019-10-30 | 2020-09-22 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method thereof and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102956579B (en) | 2015-08-19 |
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