CN102956530A - Method and device for separating wafers - Google Patents
Method and device for separating wafers Download PDFInfo
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- CN102956530A CN102956530A CN2011102542947A CN201110254294A CN102956530A CN 102956530 A CN102956530 A CN 102956530A CN 2011102542947 A CN2011102542947 A CN 2011102542947A CN 201110254294 A CN201110254294 A CN 201110254294A CN 102956530 A CN102956530 A CN 102956530A
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Abstract
The invention provides a method and device for separating wafers. The method for separating the wafers is characterized by comprising the following steps of: separating wafers from a stacked wafer group in a multi-wafer stacked state, removing and carrying the separated wafers to the operation of a set position one by one and preventing the separated wafers from being damaged by applying no stress generated due to friction, deformation and the like on the separated wafers as far as possible, thereby further enhancing the qualification rate of the wafers and stably supplying the wafers. The device for separating the wafers comprises a water tank (2), a nozzle (3), a wafer supply machine (4) and a wafer removing machine (5), wherein the nozzle (3) is arranged on a position close to the water surface of the water tank (2); the wafer supply machine (4) keeps the stacked wafer group (7) and enables the stacked wafer group (7) to move to a water intake part of water generated through the nozzle (3) positioned at a water surface side; the wafer removing machine (5) is used for keeping the wafers separated from the stacked wafer group (7) and removing and carrying the wafers to the set position; and the nozzle (3) is configured to enable the sprayed water to obtain air on the water surface and generate an air-liquid mixed flow containing water and multiple bubbles in water.
Description
Technical field
The present invention relates to a kind of separation method and separator of wafer, more specifically, relate to separation method and the separator that a kind of wafer after will separating, will separate from the stacked wafer set of the state that is the multi-disc stack of wafers as the wafer of the material of semiconductor element moves to the wafer at regulation position piecewise.
Background technology
As the material of semiconductor element and the wafer (wafer that uses, be also referred to as wafer) manufacturing in, by will cutting into the lamellar stacked wafer set that forms the state that is the multi-disc stack of wafers by the crystal ingot that silicon etc. forms, wafer is by from this piecewise strip off of stacked wafer set, separation.
The detached job of this wafer is a kind of very difficult operation as known to the public, is used for the device of separating wafer and stable supplying to comprise such as patent documentation 1 described " separate transfer of wafer and separate carrying method ", patent documentation 2 described " the monolithic processing unit of wafer and monolithic processing method " or patent documentation 3 described " from the method and apparatus of stack of wafers separating wafer " etc.
In addition, patent documentation 2 has been put down in writing following invention: " keep separating wafer by the absorption of the first adsorption element; also keep described separating wafer by the second adsorption element in the absorption of the top position of the first adsorption element; the flexible pipe of the second adsorption element is shunk; overturning also, absorption keeps separating wafer; the outer peripheral face top of then pressing adjacent chip with the restriction body; forbid that adjacent chip moves with the movement of separating wafer, and separating wafer be moved upward and separate from stacked wafer set, therefore need not strict gap management and can from stacked wafer set effectively one by one monolithic process wafer ".
In addition, patent documentation 3 has been put down in writing following invention: " from the method for vertical stack of wafers separating wafer, wafer is carried from the top one by one by the mobile unit that acts on from the top.Mobile unit is manufactured with the rotating band on attraction surface of the topmost of contact wafer (12), and wafer (12) accelerates because of the attraction of negative pressure to the contact that attracts the surface.In order to be separately configured in a plurality of wafers on other wafers, mobile unit carries out at least one in the following two steps,
(a) thus the top that water sprays from oblique below the wafer of topmost applies power.
(b) mobile unit (23) leads and makes wafer cross the top of the stripping off device that contact with the surface below of wafer mobile from the below, and both are pressed into the attraction surface with wafer and carry out braking action.
Then, wafer moves and carries to further processing to carrying path.”。
In addition, the water about spraying in (a), also record " owing to contain air or bubble, thereby be not only hydraulic pressure, air bubble also can pass through between each wafer, its result has eliminated adhewsive action ".
Patent documentation 1: Japanese kokai publication hei 9-148278 communique
Patent documentation 2: TOHKEMY 2002-75922 communique
Patent documentation 3: Japanese Unexamined Patent Application Publication 2011-507242 communique
But, as mentioned above, the invention that patent documentation 1 is put down in writing is " make the wafer mechanicalness rotation of topmost and apply starting power with the contact terminal that separates ejector unit, follow by nozzle to the upper surface of the wafer of water surface site, make it to a direction rotation to the position injection water that has departed from its center ".Therefore, wafer at topmost is quite large with the facial mobile frictional resistance of contacting of other wafers, particularly utilizes when separating the ejector unit starting, owing to being subject to larger stress on two wafers, so in fact be difficult to wafer is separated sleekly, may cause wafer damaged.
In addition, as mentioned above, the invention that patent documentation 2 is put down in writing is " keep separating wafer by the first adsorption element absorption; and keep separating wafer by the second adsorption element in the absorption of the top position of the first adsorption element, the flexible pipe that makes the second adsorption element shrinks and upset and absorption keep separating wafer ".Therefore, separating wafer is subject to the larger stress that produces because of distortion, may cause breakage.
In addition, in the invention that patent documentation 3 is put down in writing, because described air bubble can pass through, its result, eliminated adhewsive action between each wafer, therefore, compared wafer with the invention that patent documentation 1 and patent documentation 2 are put down in writing and easily to separate.
But, spray about the water that contains air or gas, because by air or gas inject are sprayed or the nozzle that is used for injection water generates to water, thereby need the auxiliary devices such as compressor, air interchanger.Therefore, produce the problem of the operating costs such as the rising of the manufacturing cost that causes because of auxiliary device and maintenance.
The present inventor is devoted to can special auxiliary device be set and the research that produces the fluid-mixing of water and air, until finish the present invention.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of wafer-separate method and separator, it moves to the operation at position of regulation one by one at the wafer from the stacked wafer set separating wafer of the state that is the multi-disc stack of wafers, after will separating, the stress that as far as possible the wafer that separates is not applied because of generations such as friction, distortion prevents breakage, thereby can further improve the qualification rate stable supplying wafer of wafer.
In order to address the above problem, the mode that the present invention seeks is as follows.
(1) the present invention is a kind of wafer-separate method, the method is by touching the gas-liquid mixed stream that contains liquid and bubble and the lamination surface of stacked wafer set in liquid, described stacked wafer set separating wafer from the state that is the multi-disc stack of wafers, the bubble that described gas-liquid mixed stream contains is the bubble of the γ-ray emission that is obtained at gas-liquid interface by colliding to the liquid of liquid level ejection and liquid level.
(2) according to technical scheme 1 described wafer-separate method, described gas-liquid mixed stream is for containing alveolate jet flow, form with the jet flow interflow that is ejected in the liquid, the bubble of this bubble for colliding the γ-ray emission that is obtained at gas-liquid interface by liquid and liquid level to the liquid level ejection.
(3) according to technical scheme 1 or 2 described wafer-separate methods, described gas-liquid mixed stream is for being the jet flow of required downtilt angles with respect to liquid level, thereby this gas-liquid mixed stream touches from liquid level side and the stacked wafer set liquid.
(4) according to technical scheme 3 described wafer-separate methods, described stacked wafer set is set to tilt and to touch a side of gas-liquid mixed stream higher, the downward angle of inclination of described gas-liquid mixed stream is identical with the angle of inclination of described stacked wafer set or roughly the same with respect to liquid level.
(5) according to technical scheme 4 described wafer-separate methods, the wafer that make from the wafer that described stacked wafer set is separated, is positioned at topmost moves to the position of regulation.
(6) according to technical scheme 5 described wafer-separate methods, the moving through absorbing unit absorption and carry out of wafer.
(7) according to technical scheme 5 or 6 described wafer-separate methods, the wafer that separates from the described stacked wafer set liquid moves to liquid level in liquid on the incline direction identical with the angle of inclination that arranges, and is fetched in the gas from liquid.
(8) the present invention is a kind of wafer-separate device, touch by making the gas-liquid mixed stream that contains liquid and bubble and the lamination surface of stacked wafer set in liquid, described stacked wafer set separating wafer from the state that is the multi-disc stack of wafers, this device has the ejection unit, liquid and liquid level that this ejection unit makes from the gas that liquid is sprayed to liquid level ejiction opening be sprayed onto liquid level collide, thereby obtain gas at gas-liquid interface, make in the ejection liquid and contain bubble.
(9) according to technical scheme 8 described wafer-separate devices, described ejection unit also has ejiction opening in the liquid that sprays liquid in liquid the ejiction opening in gas, the formation gas-liquid mixed flows with the jet flow interflow of the ejection of ejiction opening from described liquid to make the jet flow that ejiction opening sprays to liquid level from described gas.
(10) according to technical scheme 9 described wafer-separate devices, described ejection unit is nozzle, in the described gas in ejiction opening and the described liquid ejiction opening belong to identical nozzle or belong to respectively different nozzles.
(11) according to technical scheme 10 described wafer-separate devices, described nozzle has ejiction opening, this ejiction opening makes described gas-liquid mixed stream form the jet flow that is required downward angle of inclination with respect to liquid level, and this gas-liquid mixed stream is touched with the stacked wafer set in liquid.
(12) according to technical scheme 10 or 11 described wafer-separate devices, described nozzle has: the first nozzle that produces described gas-liquid mixed stream, second nozzle and the 4th nozzle of ejection liquid in liquid, and the 3rd nozzle that in gas, sprays liquid, the first nozzle, second nozzle, and the 3rd nozzle is positioned at from the throughput direction side of the wafer of described stacked wafer set separation, and clip the both sides that landline is configured in described stacked wafer set, the 4th nozzle is positioned at the opposition side of the throughput direction of described wafer, and the reverse extending line that clips described landline is configured in the both sides of described stacked wafer set.
(13) according to technical scheme 11 or 12 described wafer-separate devices, described stacked wafer set is set to tilt and to touch a side of described gas-liquid mixed stream higher, the downward angle of inclination of described gas-liquid mixed stream is identical with the angle of inclination of described stacked wafer set or roughly the same with respect to liquid level.
(14) according to technical scheme 13 described wafer-separate devices, has retrieval unit, this retrieval unit makes such wafer, i.e. isolated, the wafer that is positioned at topmost of described stacked wafer set from liquid, with the direction identical with the angle of inclination that described stacked wafer set is set, in liquid, move to liquid level, thereby this wafer is fetched in the gas from liquid.
(15) according to technical scheme 14 described wafer-separate devices, have the restriction body that prevents from departing from from the wafer that described stacked wafer set is separated extracting position, this restriction body utilization advance and retreat unit advances, retreats with respect to described stacked wafer set.
(16) according to technical scheme 14 or 15 described wafer-separate devices, have the wafer feed unit, this wafer feed unit keeps described stacked wafer set, makes described stacked wafer set move to described gas-liquid mixed and flows the position of touching with lamination surface.
The implication of said term " lamination surface " is the side of stacked wafer set, namely represents the face of the thickness of each wafer that multi-disc is stacked in this specification and claims book.
In addition, the meaning of " ejiction opening in the gas " refers to be arranged in the gas ejiction opening of (specifically, in air), and the meaning of " ejiction opening in the liquid " refers to the ejiction opening of in liquid (specifically, in the water).
Effect:
Effect to wafer-separate device of the present invention describes.
At first, make and utilize ejection unit (nozzle etc.) to collide to liquid and the liquid level of liquid level ejection, thus, produce gas-liquid mixed stream in liquid, this gas-liquid mixed stream contains a plurality of bubbles that produced by the gas of obtaining at gas-liquid interface.In addition, the moment of ejection can be after moving to the desired position with stacked wafer set.
Then, utilize wafer feed unit (wafer supplying machine etc.) to keep stacked wafer set, make stacked wafer set move to described gas-liquid mixed and flow the position of touching with lamination surface.
Thus, liquid and bubble enter between the wafer that consists of stacked wafer set, for example the multi-disc wafer of the liquid level side of close stacked wafer set separates gradually, between each wafer, open the gap, liquid and bubble are further entered, for the wafer that separates, the larger stress that can not apply because of generations such as friction, distortion can successfully make its separation.
In addition, enter a plurality of bubbles between each wafer by making, these bubbles perform to so-called liner (buffer unit) effect, so that each self-separation and each wafer of being floating state in water are difficult for coming in contact or colliding each other, thus, can prevent that wafer from damaging.In addition, utilize a plurality of bubbles that the wafer that separates is applied larger buoyancy, wafer was separated with the shorter time.
Then, with wafer mobile unit (wafer moving machine etc.) in each wafer that separates, the wafer that is positioned at topmost keeps, and moves to the position of regulation.Then, move the position from this and take out wafer, be sent to the operation of back.
According to the present invention, move to one by one the operation at position of regulation at the wafer from the stacked wafer set separating wafer of the state that is multiple stack of wafers, after will separating, making the current that contain a plurality of bubbles is that gas-liquid mixed stream touches and separating wafer with the lamination surface of stacked wafer set, thus, for the wafer that separates, the larger stress that can not apply because of generations such as friction, distortion prevents breakage.
Thus, can further improve the qualification rate of wafer, stably supply with wafer.
In addition, because gas-liquid mixed flows contained bubble by γ-ray emission, this gas is obtained because colliding at gas-liquid interface to the liquid of liquid level ejection and liquid level, so do not need the auxiliary devices such as compressor, air interchanger, can not cause the operating costs such as the rising of manufacturing cost and maintenance because of auxiliary device.
Description of drawings
Fig. 1 represents the first execution mode of wafer-separate device of the present invention, is the perspective illustration of seeing from front side.
Fig. 2 is the perspective illustration of seeing the wafer-separate device shown in Fig. 1 from rear side.
Fig. 3 be expression wafer-separate device structure face key diagram.
Fig. 4 is the X-X direction of arrow cross-sectional illustration figure of Fig. 3.
Fig. 5 is the Y-Y direction of arrow cross-sectional illustration figure of Fig. 3.
Fig. 6 is the key diagram that expression utilizes the operation till the wafer-separate of wafer-separate device.
Fig. 7 is the key diagram that expression utilizes the operation till the movement after the wafer-separate of wafer-separate device.
Fig. 8 represents the A-stage of lifting base, (a) is that key diagram is looked in the left side, is to overlook key diagram (b).
Fig. 9 is illustrated in the state of the stacked wafer set of mounting on the lifting base shown in Figure 8, (a) is that key diagram is looked in the left side, is to overlook key diagram (b).
Figure 10 represents to make stacked wafer set rise to the state of detached job position by lifting base, is that key diagram is looked in the left side (a), is to overlook key diagram (b).
Figure 11 represents to make gas-liquid mixed stream to touch with stacked wafer set and separates the state of a plurality of wafers, is that key diagram is looked in the left side (a), is to overlook key diagram (b).
Figure 12 represents the major part of the second execution mode of wafer-separate device of the present invention, is the explanation view of the A direction of arrow of Figure 13.
Figure 13 is the cross-sectional illustration figure of the X-X direction of arrow of Figure 12.
The reference numeral explanation:
A... wafer-separate device; 1... framework; 2... tank; 3,3a... nozzle (the first nozzle); 3b, 3c... second nozzle; 3d, 3e... the 3rd nozzle; 3f, 3g... the 4th nozzle; 30... ejiction opening; 4... wafer supplying machine; 40... supporting bracket; 41... guide finger; 42... restriction body; 43... lifting base; 44... drive unit; 45... lifting body; 46... base frame; 5... wafer moving machine; 50... guide way; 51... moving body; 52... actuator; 52... drive unit; 53... lifting arm; 54... vacuum suction section; 6... mobile receiver; 60... actuator; 61... lifting body; 62... carrying platen; 63... mounting recess; 7... stacked wafer set; 70... wafer; B... bubble; S... limiting mechanism.
Embodiment
Below, the execution mode shown in reference to the accompanying drawings is described in detail the present invention.In addition, in the following description, having illustrated gas is that air, liquid are the situation of water, but should not only limit to the sky G﹠W.Also can use and in water, add the liquid of interfacial agent and can implement other gases of the present invention, liquid.
The first execution mode:
Referring to figs. 1 through Fig. 5, and Fig. 8 to Figure 11.
In addition, in Fig. 1 to Fig. 5, for convenience of explanation, the stacked wafer set that will be the state of multi-disc stack of wafers is expressed as symbol 7, will be expressed as symbol 70 from the independent wafer that stacked wafer set 7 is separated.
Wafer-separate device A separates wafer 70 and move to from stacked wafer set 7 position (in the present embodiment, being mobile receiver 6 described later) of regulation.
Wafer-separate device A has the framework 1 with the square tube assembling.Be assembled with on the framework 1: tank 2; Be equipped on nozzle 3, the 3a of the water surface site (cross on underwater and the water surface both) of tank 2; Keep stacked wafer set 7, make stacked wafer set 7 can enter the wafer supplying machine 4 of the position movement between the wafer to the gas-liquid mixed stream that is produced by nozzle 3,3a; Maintenance is also moved from the wafer moving machine 5 of the wafer 70 of stacked wafer set 7 separation; And the mobile receiver 6 of accepting wafer 70 from wafer moving machine 5.
In addition, nozzle 3,3a are configured to (with reference to Figure 11 (b)) in the present embodiment: such as described later, when stacked wafer set 7 rises near the water surface, gas-liquid mixed stream from its both sides (left and right sides Fig. 3) flow to stacked wafer set 7 about two bights, gas-liquid mixed stream contacts with the front with the two sides of lamination surface effectively.
In addition, the position of nozzle 3,3a (highly) and angle of inclination are not subjected to the restriction of foregoing, but, its position and angle of inclination should be set as at least: collide from water and the water surface of nozzle 3,3a ejection, obtain air at gas-liquid interface, in water, produce the gas-liquid mixed stream that contains water and a plurality of bubbles.
As shown in Figure 4, wafer supplying machine 4 has the base frame 46 of the bottom that for example is fixed on tank 2.Central authorities at base frame 46 are fixed with tetragonal supporting bracket 40.Supporting bracket 40 is 15～40 ° (in the present embodiment as 25 °) take the bottom surface (or water surface) with tank 2 angle tilts, and its front side (right side among Fig. 4) is uprised.In the present embodiment, the angle initialization of supporting bracket 40 must be identical to the angle of water surface ejection from described nozzle 3,3a with water, but be not so limited.At the upper surface of other three avris except one side of toe lateral of supporting bracket 40, with the rectangular direction of supporting bracket 40 on each limit, be fixed with guide finger 41 (with reference to Fig. 8 (a), (b)) according to two two ground, required interval.
The position that each guide finger 41 is set is for the lamination surface with the tripartite sidepiece of the stacked wafer set 7 of prism-shaped maintains some inboards that with gap stacked wafer set 7 are accommodated in, and the avris (conveying of wafer or take out side) that guide finger 41 can also never be set is put into and taken in stacked wafer set 7.In addition, supporting bracket 40 and the guide finger 41 of present embodiment are corresponding with tetragonal wafer, yet, also can constitute on three limits of the same position of for example supporting bracket 40 guide finger is set respectively, thus can be corresponding with the wafer of circle.
In each guide finger 41, on the top of each guide finger 41 on relative both sides of being of supporting bracket 40 (left and right sides among Fig. 3), the parallel each other highly identical tabular restriction body 42 that is fixed with respectively.Each limit body 42 be a kind of when wafer 70 separates from stacked wafer set 7, the wafer 70 that prevents from the separating parts that break away from the position of wafer moving machines 5 absorption, it is fixed as parallel with supporting bracket 40.
In addition, wafer supplying machine 4 has the lifting base 43 of the stacked wafer set 7 of mounting.Lifting base 43 is positioned at the upper surface side of supporting bracket 40, is fixed on the downside top of the lifting body 45 of drive unit 44 with cantilevered construction, and described drive unit 44 is fixed on a side (right side among Fig. 3) of framework 1.The mounting portion of lifting base 43 is parallel with supporting bracket 40, and lifting base 43 constitutes the lifting on the direction parallel with described guide finger 41 of the drive unit 44 that utilizes ball screw type.
As shown in Figure 5, wafer moving machine 5 has the guide way 50 of the Len req of the opposite side (left side among Fig. 3) that is fixed in framework 1.Guide way 50 is 15～40 ° angle inclination with the bottom surface with tank 2, its front side is uprised.In the present embodiment, be set as identical with the angle of supporting bracket 40, but be not so limited.On guide way 50, moving body 51 is installed as and can utilizes ball screw type drive unit 55 to move along guide way 50.
Moving body 51 has actuator 52 and utilizes the lifting arm 53 of actuator 52 liftings.Downside top at lifting arm 53 is provided with vacuum suction section 54 with cantilevered construction.Moving body 51 can make vacuum suction section 54 be positioned at the top of short transverse of the guide finger 41 of stacked wafer set 7, and stacked wafer set 7 is positioned on the lifting base 43, the wafer 70 that vacuum suction section 54 can adsorbing separation.The lifting direction of lifting arm 53 is with respect to the direction of guide way 50 rectangular direction also up and down.
In addition, in the present embodiment, wafer moving machine 5 is one, but in order to improve mobile efficient, can also arrange many.
As shown in Figure 1, 2, mobile receiver 6 is fixed in a side (right side in Fig. 3) of framework 1 front side, and the rising stop position that its setting height(from bottom) is set as carrying platen 62 described later is near the height of upper edge edge of tank 2.
The mounting recess 63 that is provided with embedding at the upper surface that carries platen 62 drops to prevent mobile wafer 70.Mounting recess 63 forms rear side and has end difference, the front side does not have end difference (with reference to Fig. 5), about mobile wafer 70, can make its obliquely upward (the place ahead) slide and take out.
In addition, carrying platen 62 constitute by actuator 60 with the rectangular direction of surface direction of carrying platen 62 on lifting.The rising stop position of carrying platen 62 is set in after the lifting arm 53 of described wafer moving machine 5 descends, and can enter the height of mounting recess 63 by the wafer 70 of vacuum suction section 54 absorption.
In addition, be provided with in the present embodiment mobile receiver 6, yet, this also can be set move receiver 6, and constitute: from the device that wafer moving machine 5 directly moves to wafer 70 conveyer such as known construction, the wafer 70 that is used for separating such as conveyer belt etc. is carried to subsequent handling.
In addition, recommend attached setting, monitor all the time the pollution (dirt) of water trough inner water, the device of when pollution reaches certain rank, warning or change water.This device can example such as the transducer that detects the pollution of water by light, detect the known transducers such as conductivity sensor of the variation of conduction situation.
Effect:
With reference to Fig. 1～Figure 11, for the effect of wafer-separate device A, and utilize wafer-separate device A, describe from the stacked wafer set separating wafer of the state that is the multi-disc stack of wafers, operation that the wafer that separates is moved to the regulation position one by one.
(1) state shown in Fig. 6 (a) and Fig. 8 (a), (b) is A-stage, the lifting base 43 of wafer supplying machine 4 drops to foot, the moving body with lifting arm 53 51 of wafer moving machine 5 is positioned at the position of front, lifting arm 53 and vacuum suction section 54 superposed positions.
(2) lifting base 43 of wafer supplying machine 4 is uploaded and is equipped with stacked wafer set 7, is accommodated in the inboard (with reference to Fig. 6 (b), Fig. 9 (a), (b)) of each guide finger 41.
(3) drive unit 44 moves, and stacked wafer set 7 is with lifting base 43 risings (with reference to Figure 10 (a), (b)).Then, to the water surface and water, spray water from nozzle 3,3a according to required pressure.Water to water surface ejection is obtained air when the water surface enters the water, produce the gas-liquid mixed stream (with reference to Fig. 6 (c), Figure 11 (a)) that contains a plurality of bubble B with being sprayed onto the hydration stream in the water.
(4) lifting base 43 stops in the detached job position, this detached job position is the position that the lamination surface on the top of described gas-liquid mixed stream and stacked wafer set 7 is touched, gas-liquid mixed stream from the left and right sides of stacked wafer set 7 to stacked wafer set 7 about two bights flow, gas-liquid mixed stream touches with two sides and the front of lamination surface.In addition, if gas-liquid mixed stream does not hinder the separation of wafer 70, also can touch with other positions of lamination surface.
Thus, a plurality of wafers 70 utilize gas-liquid mixed stream to separate and float from stacked wafer set 7 in the inboard of each guide finger 41, and the wafer 70 that is positioned at topmost is stopped at the downside (with reference to Figure 11 (a)) of restriction body 42.Then, the moving body 51 rearward wafer absorption position movements (with reference to Fig. 6 (d)) of wafer moving machine 5.
In addition, when wafer 70 separated, water and bubble B entered between each wafer 70, can not apply the larger stress that produces because of friction, distortion etc. to the wafer 70 that separates, and can make its smooth separation.In addition, the bubble B that enters between each wafer 70 can play so-called liner effect, and therefore each self-separation and be that each wafer 70 of floating state is difficult for contact or collision each other in water can prevent that wafer from damaging thus.In addition, by a plurality of bubble B each wafer 70 that separates is applied larger buoyancy, wafer 70 was separated with the shorter time.
(5) lifting arm 53 of wafer moving machine 5 descends, by 54 absorption of vacuum suction section from stacked wafer set 7 separate and be positioned at restriction body 42 the below, be in the wafer 70 (with reference to Fig. 7 (e)) of topmost.The position of the wafer 70 of absorption topmost for the lower surface of restriction body 42 slightly in the water of downside (in Figure 11 (a), the part of the front side of wafer 70 is exposed from the water surface, yet also can integral body all in water), do not prevent from damaging thereby when moving to mobile receiver 6, can contact with restriction body 42.
(6) under the state of the wafer 70 that has adsorbed topmost with the vacuum suction section 54 of lifting arm 53, drive unit 55 moves, and moving body 51 advances and stops (with reference to Fig. 7 (f)) at assigned position.
Stacked wafer set 7 is set to have with respect to the water surface the downward angle of inclination of 15～40 ° (being in the present embodiment 25 °) as mentioned above.Therefore, the wafer 70 that separates from stacked wafer set 7 is the angle that makes progress of above-mentioned angle by the wafer moving machine 5 relative waters surface, and keeps this angle on one side, with the end face of wafer as the top, on one side in water to water surface movable, by (the water) takes out to the water surface from the underwater.Therefore, can avoid the resistance of the water that wafer 70 is subject to and be fetched on the water surface from the underwater, so can to the wafer stress application, can not prevent the breakage of wafer.
In addition, above-mentioned gas-liquid mixed stream continues to touch with stacked wafer set 7 and each wafer 70 of separating, and after the wafer 70 that is positioned at topmost moved, wafer 70 thereafter was stopped at the downside at restriction body 42.In addition, stacked wafer set 7 constitutes by lifting base 43 and rises gradually, thereby whole stacked wafer set 7 is separated into wafer 70.
(7) actuator 60 of mobile receiver 6 (with reference to Fig. 1, Fig. 2) moves, and carrying platen 62 rises and stops at assigned position.Releasing moves to wafer 70 the mounting recess 63 (with reference to Fig. 7 (g), Fig. 4, Fig. 5) of carrying platen 62 by the adsorbed state of the wafer of vacuum suction section 54 generations.
(8) carrying platen 62 descends, and gets back to original position.In addition, lifting arm 53 risings (with reference to Fig. 7 (h)).
Thus, turn back to the state that finish described (3), repeat (4)～operation of (8), carry out the detached job of wafer 70, until do not consist of the wafer 70 of stacked wafer set 7.In addition, the wafer that moves to mobile receiver 6 is carried to subsequent handling successively.
In addition, validity and superiority for the wafer-separate device A that confirms present embodiment compare checking (with reference to table 1) by following embodiment: (1) sprays the situation (present embodiment) of the gas-liquid mixed stream of water and air, (2) only spray water in water situation, (3) only spray air in water situation in water.
Specifically, the lamination surface of the stacked wafer set in the water in tank sprays each fluid, disengaging time when measurement makes the wafer-separate that is positioned at topmost, checking is until move NG probability (fraction defective) till the wafer with lifting arm after being positioned at the wafer-separate of topmost.
Table 1
Investigate:
At first, about the wafer-separate time, the situation (1) of the gas-liquid mixed of the ejection water and air of present embodiment stream is that only the situation of water (2) is compared with jet method, can be when shorter the chien shih wafer-separate.This is because water and a plurality of bubble enter between the stacked wafer, by applying the separation that larger buoyancy promotes wafer to the wafer that is positioned at topmost.
In addition, NG probability when moving about wafer, be in the situation (2) of only water at jet method, the wafer breakage that generation causes because of the wafer-separate state labile, move mistake and obtain two wafer because adsorbing the bad wafer that causes, the NG probability is 14%, relative therewith, NG does not occur in the situation (1) of the gas-liquid mixed stream of the ejection water and air (bubble) of present embodiment, and as seen obvious superiority is arranged.
In addition, about the situation (3) that only sprays air, the breakage of wafer occurs in the flowing instability of the air in the water (bubble).In addition, when air mass flow was reduced to the degree that can not make the wafer breakage, underfed was so that wafer-separate, and its result is difficult to verify.
Like this, can confirm: in above-mentioned three embodiment, the method separating wafer of the gas-liquid mixed of the ejection water and air (bubble) of usefulness (1) stream is the most effective.
The second execution mode:
With reference to Figure 12 and Figure 13.In the second execution mode, the structure etc. of restriction body of floating that mainly is the wafer that separates from stacked wafer set of the installation constitution of the quantity of nozzle and the guide finger of configuration, wafer supplying machine and preventing is different from the first execution mode, and other are identical substantially with the first execution mode.In addition, the position identical symbol of mark identical with the first execution mode or that be equal to is represented.
About nozzle:
Nozzle clips roughly four jiaos or the four sides that is disposed at stacked wafer set 7 from the landline L of the wafer 70 of stacked wafer set 7 separation.
About nozzle, except with the first execution mode in suitable the first nozzle 3 of the nozzle that illustrates, 3a, dispose second nozzle 3b, 3c and the 3rd nozzle 3d, 3e in the same side of the first nozzle 3,3a.In addition, dispose the 4th nozzle 3f, 3g at the throughput direction opposition side with wafer.
The global shape of the first nozzle 3,3a is substantially the cuboid of lengthwise, has ejiction opening 30, the 30a of the slit-shaped of lengthwise.On ejiction opening 30,30a are set to from the underwater to the water surface (from water in air), be positioned on the water surface and the underwater.Thus, Xiang Shuizhong and the water surface two aspects ejection water.The emission direction of water is parallel with wafer surface, yet as long as can also some crossing angles can be set by removed wafer.
Make in water jet flow that income has a near air the water surface and produce the water that contains a plurality of bubbles and the gas-liquid mixed stream of bubble to the jet flow interflow of the water of underwater ejection, near the air the described water surface is by entering into water from ejiction opening 30,30a to the collision of the water of water surface ejection.By this gas-liquid mixed stream is touched with the lamination surface of stacked wafer set 7, wafer 70 is separated from stacked wafer set 7.
The 3rd nozzle 3d, 3e and the first nozzle homonymy have and make current be emitted into fan-shaped ejiction opening 30d, 30e.Being emitted into fan-shaped water touches with the angle of slightly intersecting for the stack of wafers face. Ejiction opening 30d, 30e all are positioned at the top of the water surface, make jet flow touch stacked wafer set the liquid from the water surface.Produce bubble this moment.The 3rd nozzle makes the gap between the wafer of stacked wafer set 7 open more effectively by fan-shaped current, auxiliary or support, promote from stacked wafer set 7 separating wafers 70.
The 4th nozzle 3f, 3g are positioned at the opposition side of the first to the 3rd nozzle, and global shape is substantially the cuboid of lengthwise, have ejiction opening 30f, the 30g of the slit-shaped of lengthwise.Ejiction opening 30f, 30g all are in water.The emission direction of water is parallel with wafer surface.The 4th nozzle is assisted or is supported, promotes from stacked wafer set 7 separating wafers 70, and makes the wafer 70 of floating parallel with the vacuum suction section 54 of wafer moving machine 5, realizes the stability of wafer absorption.
The landline L that the first to the 3rd nozzle clips wafer is disposed at the both sides of stacked wafer set 7, can not hinder the conveying of the wafer of separation.In addition, by making first to fourth nozzle towards the center of stacked wafer set 7, jet flow is touched and separating wafer effectively with stacked wafer set 7.
About the wafer supplying machine and the restriction body:
Wafer supplying machine 4a loads stacked wafer set 7, has the lifting base 43 that stacked wafer set 7 is risen along with the separation of the wafer 70 of topmost.Lifting base 43 is roughly quadrangle in the present embodiment.In lifting base 43, except the conveying of wafer 70 or take out the inside a little place of ora terminalis on other three limits the limit of side, erect according to two two ground on each limit, required interval and be provided with guide finger 41.
In addition, also have a pair of restriction body mechanism S, this restriction body mechanism S prevents from departing from extracting position from the wafer 70 that stacked wafer set 7 is separated.Restriction body mechanism S is configured in the both sides that the landline L with wafer 70 intersects vertically.
Each limits body mechanism S and comprises: restriction body 420, and from stacked wafer set 7 separating wafer 70 time, the position that this restriction body 420 stops the wafer 70 of separation to break away from by moving machine 5 absorption; Cylinder 422 makes restriction body 420 advance, retreat; Top, opposite side that support 421, one sides are installed on the bar of cylinder 422 are equipped with described restriction body 420.
In addition, restriction body mechanism S can also adopt the relative structure that an end is fixed, the other end is movable.
Effect:
Effect to the restriction body mechanism S of described structure describes.
When loading stacked wafer set 7 on the lifting base 43, make cylinder 422 actions and restriction body 420 is moved to the direction away from lifting base 43, in the stacked wafer set 7 of lifting base 43 mountings of wafer supplying machine 4, be received into the inboard of each guide finger 41.
Then, make cylinder 422 actions, restriction body 420 is advanced with respect to the stacked wafer set 7 that is positioned in lifting base 43, make each introduction part 420a make the top edge that respectively limits body 42 cover the upper of stacked wafer set near guide finger 41.Thus, can when wafer 70 separates from stacked wafer set 7, stop the wafer 70 that separates to break away from from the position by 5 absorption of wafer moving machine.
Other effects that the second execution mode relates to are roughly the same with the effect of the first execution mode, quote the effect of the first execution mode and description thereof is omitted.
In addition, the term that uses in this specification and expression are not construed as limiting just in order to illustrate, should not get rid of feature and part term, the expression of equal value thereof put down in writing with this specification.In addition, in the scope of technological thought of the present invention, it is self-evident can carrying out various modes of texturing.
In addition, first, second grade is used for the not meaning of grade, importance degree, just is used for a key element of difference and other key elements.
Claims (17)
1. a wafer-separate method is characterized in that, the method is by touching the gas-liquid mixed stream that contains liquid and bubble and the lamination surface of stacked wafer set in liquid, from the described stacked wafer set separating wafer of the state that is the multi-disc stack of wafers,
The bubble that described gas-liquid mixed stream contains is the bubble of the γ-ray emission that is obtained at gas-liquid interface by colliding to the liquid of liquid level ejection and liquid level.
2. wafer-separate method according to claim 1, it is characterized in that, described gas-liquid mixed stream is for containing alveolate jet flow, form with the jet flow interflow that is ejected in the liquid, the bubble of this bubble for colliding the γ-ray emission that is obtained at gas-liquid interface by liquid and liquid level to the liquid level ejection.
3. wafer-separate method according to claim 1 and 2 is characterized in that, described gas-liquid mixed stream is for being the jet flow of required downtilt angles with respect to liquid level, thereby this gas-liquid mixed stream touches from liquid level side and the stacked wafer set liquid.
4. wafer-separate method according to claim 3, it is characterized in that, described stacked wafer set is set to tilt and to touch a side of gas-liquid mixed stream higher, the downward angle of inclination of described gas-liquid mixed stream is identical with the angle of inclination of described stacked wafer set with respect to liquid level.
5. wafer-separate method according to claim 4 is characterized in that, the wafer that make from the wafer that described stacked wafer set is separated, is positioned at topmost moves to the position of regulation.
6. wafer-separate method according to claim 5 is characterized in that, the moving through absorbing unit absorption and carry out of wafer.
7. according to claim 5 or 6 described wafer-separate methods, it is characterized in that, the wafer that separates from the described stacked wafer set liquid moves to liquid level in liquid on the incline direction identical with the angle of inclination that arranges, and is fetched in the gas from liquid.
8. a wafer-separate device is characterized in that, touch by making the gas-liquid mixed stream that contains liquid and bubble and the lamination surface of stacked wafer set in liquid, and from the described stacked wafer set separating wafer of the state that is the multi-disc stack of wafers,
This device has the ejection unit, and liquid and liquid level that this ejection unit makes from the gas that liquid is sprayed to liquid level ejiction opening be sprayed onto liquid level collide, thereby obtain gas at gas-liquid interface, makes in the ejection liquid to contain bubble.
9. wafer-separate device according to claim 8, it is characterized in that, described ejection unit also has ejiction opening in the liquid that sprays liquid in liquid the ejiction opening in gas, the formation gas-liquid mixed flows with the jet flow interflow of the ejection of ejiction opening from described liquid to make the jet flow that ejiction opening sprays to liquid level from described gas.
10. wafer-separate device according to claim 9 is characterized in that, described ejection unit is nozzle, in the described gas in ejiction opening and the described liquid ejiction opening belong to identical nozzle or belong to respectively different nozzles.
11. wafer-separate device according to claim 10, it is characterized in that, described nozzle has ejiction opening, and this ejiction opening makes described gas-liquid mixed stream form the jet flow that is required downtilt angles with respect to liquid level, and this gas-liquid mixed stream is touched with the stacked wafer set in liquid.
12. wafer-separate device according to claim 10, it is characterized in that, described nozzle has: produce the first nozzle of described gas-liquid mixed stream, in liquid the second nozzle of ejection liquid and the 4th nozzle and in gas the 3rd nozzle of ejection liquid
The first nozzle, second nozzle, and the 3rd nozzle be positioned at the throughput direction side of the wafer that separates from described stacked wafer set, and clip the both sides that landline is configured in described stacked wafer set,
The 4th nozzle is positioned at the opposition side of the throughput direction of described wafer, and the reverse extending line that clips described landline is configured in the both sides of described stacked wafer set.
13. wafer-separate device according to claim 11, it is characterized in that, described nozzle has: produce the first nozzle of described gas-liquid mixed stream, in liquid the second nozzle of ejection liquid and the 4th nozzle and in gas the 3rd nozzle of ejection liquid
The first nozzle, second nozzle, and the 3rd nozzle be positioned at the throughput direction side of the wafer that separates from described stacked wafer set, and clip the both sides that landline is configured in described stacked wafer set,
The 4th nozzle is positioned at the opposition side of the throughput direction of described wafer, and the reverse extending line that clips described landline is configured in the both sides of described stacked wafer set.
14. according to claim 11, each described wafer-separate device in 12 or 13, it is characterized in that, described stacked wafer set is set to tilt and to touch a side of described gas-liquid mixed stream higher, the downward angle of inclination of described gas-liquid mixed stream is identical with the angle of inclination of described stacked wafer set with respect to liquid level.
15. wafer-separate device according to claim 14, it is characterized in that, has retrieval unit, this retrieval unit makes such wafer, i.e. isolated, the wafer that is positioned at topmost of described stacked wafer set from liquid, direction with identical with the angle of inclination that described stacked wafer set is set moves to liquid level in liquid, thereby this wafer is fetched in the gas from liquid.
16. wafer-separate device according to claim 15 is characterized in that, has the restriction body that prevents from departing from from the wafer that described stacked wafer set is separated extracting position, this restriction body utilization advance and retreat unit advances, retreats with respect to described stacked wafer set.
17. according to claim 15 or 16 described wafer-separate devices, it is characterized in that having the wafer feed unit, this wafer feed unit keeps described stacked wafer set, makes described stacked wafer set move to the position that described gas-liquid mixed stream and lamination surface are touched.
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| CN2011102542947A CN102956530A (en) | 2011-08-31 | 2011-08-31 | Method and device for separating wafers |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011102542947A CN102956530A (en) | 2011-08-31 | 2011-08-31 | Method and device for separating wafers |
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| CN102956530A true CN102956530A (en) | 2013-03-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104193151A (en) * | 2014-08-22 | 2014-12-10 | 济源石晶光电频率技术有限公司 | Wafer and edge guard glass separation device |
| CN109834858A (en) * | 2017-11-29 | 2019-06-04 | 株式会社迪思科 | Stripping off device |
| CN112193872A (en) * | 2020-09-16 | 2021-01-08 | 钜讯通电子（深圳）有限公司 | Automatic film supply device |
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| CN101356047A (en) * | 2006-07-06 | 2009-01-28 | 里纳特种机械有限责任公司 | Apparatus and method for separating and transporting substrates |
| JP2011129652A (en) * | 2009-12-16 | 2011-06-30 | Takatori Corp | Device and method for separation and housing of wafer |
| JP2011151167A (en) * | 2010-01-21 | 2011-08-04 | Sumitomo Metal Fine Technology Co Ltd | Wafer carrying device and wafer carrying method |
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| JPH08250570A (en) * | 1995-03-10 | 1996-09-27 | Nippei Toyama Corp | Apparatus and method for separating and conveying wafer |
| CN101356047A (en) * | 2006-07-06 | 2009-01-28 | 里纳特种机械有限责任公司 | Apparatus and method for separating and transporting substrates |
| JP2011129652A (en) * | 2009-12-16 | 2011-06-30 | Takatori Corp | Device and method for separation and housing of wafer |
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| CN104193151A (en) * | 2014-08-22 | 2014-12-10 | 济源石晶光电频率技术有限公司 | Wafer and edge guard glass separation device |
| CN109834858A (en) * | 2017-11-29 | 2019-06-04 | 株式会社迪思科 | Stripping off device |
| CN112193872A (en) * | 2020-09-16 | 2021-01-08 | 钜讯通电子（深圳）有限公司 | Automatic film supply device |
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Application publication date: 20130306 |