CN102950831B - Ceramic, aluminum and porous copper composite material - Google Patents
Ceramic, aluminum and porous copper composite material Download PDFInfo
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- CN102950831B CN102950831B CN201110242571.2A CN201110242571A CN102950831B CN 102950831 B CN102950831 B CN 102950831B CN 201110242571 A CN201110242571 A CN 201110242571A CN 102950831 B CN102950831 B CN 102950831B
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- porous copper
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Abstract
The invention discloses a ceramic, aluminum and porous copper composite material. The composite material is composed of ceramic, aluminum and porous copper, and the ceramic, the aluminum and the porous copper are pretreated. The pretreatment of a ceramic substrate comprises the following steps: coating a photosensitive adhesive, exposing, washing through water, printing a silver paste, sintering the ceramic to make the ceramic have a silver foil 15-20mum higher than the ceramic substrate, and sintering again to make the right side of the ceramic substrate be an electronic circuit required by printing and the wrong side be the sintered silver foil; the aluminum plate pretreatment is that two surfaces of an aluminum (aluminum alloy) plate are electroplated by tin. The ceramic, aluminum and porous copper composite material is prepared through mutually superposing the porous copper, the aluminum and the ceramic, coating a tin paste on the contact surfaces, and tightly welding and fixing the porous copper, the aluminum and the ceramic in a reflow soldering furnace. The composite material can bear electronic elements; and compared with an aluminum substrate, the composite material has the advantages of fast heat radiation, firmness, good insulation performance, and no combustion. The composite material is of great practical significance to electronic device heat radiation, especially LED heat radiation.
Description
Technical field
The present invention relates to a kind of material, particularly relate to the composite of a kind of pottery of heat radiation, aluminium, Porous Cu.
Background technology
Along with the development of science and technology, network universal, electronic equipment application is more and more extensive, requires also more and more higher to circuit board material, requirement be should thermal conductivity high, corrosion-resistant, wear-resistant, but to insulate again, can machining.And pottery, aluminium or copper can only meet wherein means suitable.Only have at present and use metal material just can reach requirement with the tight material welded of nonmetallic materials.Current electronic device is by this composite of aluminium base in a large number, but this material is that printed panel and aluminium are combined by adhering with epoxy resin, not only tight ness rating, firmness is inadequate but also radiating effect is poor, insulating properties are poor.The printed panel of this material is organic material, will burn after temperature height, is easy to cause fire.And material of the present invention is pottery, aluminium, copper, there is no the basis of burning, and be tight welding, because welding is the material by two parts homogeneity or non-homogeneous, utilize the diffusion of interatomic contact and particle, form permanent connection by the method heating, pressurize or heat, so just can guarantee the requirement of its several functions.The one pottery that the present invention makes, the complex material of aluminium (aluminium-containing alloy), Porous Cu can carry electronic component on ceramic wafer, can utilize again pottery insulating properties, corrosion-resistant, with wear-resistant, can utilize again that aluminium and Porous Cu conduct heat soon, the feature of good heat dissipation simultaneously, the heat of components and parts or LED is distributed in time.Through test, aluminium base is resistance to is pressed in about 2KV, and the 1.5KV of difference just punctures heating, and pcb board burns.And the present invention withstand voltage be more than 5KV.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, the composite of a kind of pottery, aluminium, Porous Cu is provided.
The technical scheme that the present invention solves its technical problem is: the composite of a kind of pottery, aluminium, Porous Cu, and it superposes successively primarily of Porous Cu, aluminium sheet and ceramic substrate and is welded to form.
Further, the upper and lower surface of described aluminium sheet is coated with the first tin coating and the second tin coating respectively; The upper and lower surface of ceramic substrate sinters upper strata silver foil and lower floor's silver foil respectively, and the thickness of upper strata silver foil and lower floor's silver foil is 15-20 micron; Porous Cu is welded together by the second tin coating of the second tin paste layer and aluminium sheet, and the first tin coating of aluminium sheet is welded together by the upper strata silver foil of the first tin paste layer and ceramic substrate.
Further, described aluminium sheet 5 also can be substituted by aluminium alloy plate.
The invention has the beneficial effects as follows: the complex material good insulation preformance of the present invention's pottery, aluminium, Porous Cu, perfect heat-dissipating, working ability is strong.As the working material of electronic component, completely avoid common pcb board, shortcoming that aluminium base will burn when high temperature, solve the hidden danger of fire, this has extremely important meaning in a lot of fields.In addition the withstand voltage height of material of the present invention is withstand voltage several times of aluminium base, corrosion-resistant, can work in the presence of a harsh environment, so this can play great role in many industries such as electronics, electric power, military affairs.
Accompanying drawing explanation
Fig. 1 is welding schematic diagram of the present invention;
In figure: ceramic substrate 1, upper strata silver foil 2, first tin paste layer 3, first tin coating 4, aluminium sheet 5, second tin paste layer 6, Porous Cu 7, lower floor's silver foil 8, second tin coating 9.
Detailed description of the invention
The invention discloses the composite of a kind of pottery of substitution of Al substrate, aluminium, Porous Cu, its upper strata is Porous Cu 7, and centre is aluminium sheet 5(also can be aluminium alloy plate), lower floor is ceramic substrate 1.The upper and lower surface of aluminium sheet 5 is coated with the first tin coating 4 and the second tin coating 9; The upper and lower surface of ceramic substrate sinters upper strata silver foil 2 and lower floor's silver foil 8 respectively, and the thickness of upper strata silver foil 2 and lower floor's silver foil 8 is 15-20 micron.Porous Cu 7 is welded together with the second tin coating 9 of aluminium sheet 5 by the second tin paste layer 6, and the first tin coating 4 of aluminium sheet 5 is welded together with the upper strata silver foil 2 of ceramic substrate 1 by the first tin paste layer 3.
Later electronic component is welded on lower floor's silver foil 8 of ceramic substrate 1.
The present invention is in preparation process, and pretreatment wanted by aluminium sheet, and make it two-sided zinc-plated, ceramic substrate also wants pretreatment, makes its two-sided sintering silver foil, is then made the composite of pottery, aluminium, Porous Cu by Reflow Soldering.Its step is as follows;
1, aluminium sheet is zinc-plated: the application organic solvent such as kerosene, gasoline slightly except the grease on aluminium sheet or aluminium alloy plate, then is placed in mixed liquor and carries out alkali cleaning, and carry out electrochemical deoiling, mixed liquor is by NaOH (NaOH), sodium carbonate (Na
2c0
3) and water be mixed to get according to mass ratio 2:1:7; Its objective is except ensureing the quality that aluminium sheet (or aluminium alloy plate) is electroplated after degrease, finally put into electroplating bath and carry out two-sided zinc-plated 10 minutes, thus be coated with the first tin coating 4 and the second tin coating 9 in the upper and lower surface of aluminium sheet 5, during plating, the available adhesive tape in place electroplated is not needed to stick, in electroplating bath, containing 10-40 gram of stannous sulfate SnS0 in often liter of electroplate liquid
4, 73.6 grams of concentrated sulfuric acid H
2s0
4, 2.5 grams of naphthols and 5 grams of gelatin, temperature of electroplating solution is 30 DEG C, and DC voltage is 18V, and current density is 2A/dm
2.
2, ceramic silver ink firing: comprise serigraphy and ceramic post sintering two steps.
2.1, serigraphy: consider heat radiation and expansion factor, the present invention adopts thickness to be the aluminium oxide ceramic substrate of 0.5mm.Its process is as follows: first manufacture masterplate, and silk screen is coated with photoresists, then masterplate is placed on photoresists, exposed by exposure machine, expose beyond silk screen cope match-plate pattern part, photoresists solidify, and masterplate part is light tight, the photoresists that template part covers are due to light tight and do not solidify.Rinse with water, wash away unexposed portion, adopt silver slurry as ink again, silk screen is placed on ceramic substrate and prints, silver paste is imprinted on ceramic substrate, is transmission because silk screen cope match-plate pattern covers part, so silver slurry is just imprinted on relevant position on ceramic substrate, and remainder is because there is rubber seal to live, silver slurry does not just stamp.
2.2, ceramic post sintering: sintered in ceramic sintering furnace by the ceramic substrate printed, makes to form good fusion between silver slurry and ceramic substrate, forms the sintering aspect of silver after sintering, be upper strata silver foil 2.During the printing of silver slurry, its shape should be consistent with aluminium sheet tin coating 2 shape, and the silver foil after sintering should exceed ceramic substrate 15 microns-20 microns.The silver slurry adopted during enforcement, its main component is the mixture of silver and glass, the main component of silver slurry is silver, by mass percentage, account for 65%, its slurry can be made after mixing 2% binding agent to have suitable viscosity, binding agent is dimethylbenzene etc., for the Metal Palladium powder preventing silver oxidation from adding 3%, all the other 30% are glass powder.
Repeat step 2.2, at the another side sintering lower floor silver foil 8 of ceramic substrate 1, difference is, masterplate needs to form printed circuit according to the electronic component shape for connecting.
In order to prevent aluminium sheet 5 and ceramic substrate 1 due to the coefficient of expansion different and cause cracking, silver foil 4 shape made at ceramic substrate should be consistent with tin coating 2 shape of aluminium sheet 1, silver foil 4 exceeds ceramic plane 15 microns-20 microns, makes the aluminium after welding influence each other minimum in each self-expanding with pottery.In sintering process, the maximum temperature of ceramic sintering furnace 800 degree, programming rate should be slow, makes organic bond decompose completely and volatilize, solid powder melting, decomposes and chemical combination, forms fine and close firm thick film.For preventing thick film from ftractureing, also cooling rate should be controlled.The ceramic cracking phenomena that described aluminium is different due to the coefficient of expansion from pottery and cause is that several Common materials linear expansion coefficient is as follows due to various metal and nonmetal linear expansion coefficient difference; The coefficient of expansion (10-6/ ° of C): aluminium 23.2, zinc-plated 22, scolding tin 23.0, silver 19.5, aluminium oxide ceramics 7.85.Its structural arrangement major part of the welding method that we adopt the pottery of the addition method and aluminium to be welded to each other is consistent with the coefficient of expansion of this several material, causes effect also less so expand.As for silver and ceramic substrate, although coefficient of expansion difference is comparatively large, silver foil is that graininess sinters in ceramic wafer, so cause expansion reason also very little.The aluminium sheet shape that the present invention should weld with it at the silver-colored contact surface of ceramic post sintering is similar, and suitably should exceed ceramic substrate 15 micron of-20 microns.And more than superpose the coefficient of expansion from top to bottom to increase successively, and the cubic expansion coefficient of its material is relevant with its length and shape, and the tin coating shape of silver foil and aluminium is similar when firing, the reason that expansion is caused reduces to minimum, effectively avoids aluminium different due to the coefficient of expansion from pottery and the ceramic cracking phenomena that causes.
3, superposing type Reflow Soldering: as shown in Figure 1, tin cream is adopted during Reflow Soldering, by mass percentage, its composition is the tin of 95% and the silver of 5%, tin cream is evenly coated in the upper strata silver foil 2 of ceramic substrate 1, on first tin coating 4 of aluminium sheet 5 upper and lower surface and the second tin coating 9, the first tin coating 4 of relative for the upper strata silver foil 2 of ceramic substrate 1 aluminium sheet 5, second tin coating 9 of the relative aluminium sheet 5 of Porous Cu 7, after their superpositions, put into reflow soldering together, control in-furnace temperature at about 260 degree, Reflow Soldering is after 10 minutes, Porous Cu 7, ceramic substrate 5 has just closely welded together with aluminium sheet 1.
Claims (2)
1. a composite for pottery, aluminium, Porous Cu, is characterized in that, it superposes successively primarily of Porous Cu (7), aluminium sheet (5) and ceramic substrate (1) and is welded to form; The upper and lower surface of described aluminium sheet (5) is coated with the first tin coating (4) and the second tin coating (9) respectively; The upper and lower surface of ceramic substrate sinters upper strata silver foil (2) and lower floor's silver foil (8) respectively, and the thickness of upper strata silver foil (2) and lower floor's silver foil (8) is 15-20 micron; Porous Cu (7) is welded together by second tin coating (9) of the second tin paste layer (6) with aluminium sheet (5), and first tin coating (4) of aluminium sheet (5) is welded together by the upper strata silver foil (2) of the first tin paste layer (3) with ceramic substrate (1).
2. the composite of pottery, aluminium, Porous Cu according to claim 1, it is characterized in that, described aluminium sheet (5) is substituted by aluminium alloy plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110242571.2A CN102950831B (en) | 2011-08-23 | 2011-08-23 | Ceramic, aluminum and porous copper composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110242571.2A CN102950831B (en) | 2011-08-23 | 2011-08-23 | Ceramic, aluminum and porous copper composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102950831A CN102950831A (en) | 2013-03-06 |
| CN102950831B true CN102950831B (en) | 2015-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110242571.2A Expired - Fee Related CN102950831B (en) | 2011-08-23 | 2011-08-23 | Ceramic, aluminum and porous copper composite material |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219448A (en) * | 2013-04-12 | 2013-07-24 | 杭州普朗克光电科技有限公司 | Method for welding light emitting diode (LED) on glass |
| CN106211608A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of manufacture method of accurate printed substrate |
| CN107809884A (en) * | 2017-10-11 | 2018-03-16 | 四川珩必鑫电子科技有限公司 | A kind of high thermal conductivity aluminum matrix plate and its manufacturing process |
| CN109094289A (en) * | 2018-08-11 | 2018-12-28 | 上海语翀金属制品有限公司 | 4D wood grain board machining process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85107155A (en) * | 1985-09-19 | 1987-04-08 | 王新魂 | The solid-state pressure diffusion welding (DW) of no silver alloy solder sealing-in pottery and Ke watt, pottery and copper |
| JPH0948677A (en) * | 1995-08-04 | 1997-02-18 | Dowa Mining Co Ltd | Metal-ceramic composite substrate and its production |
| CN101521986A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Metal base printed circuit board |
| CN201681922U (en) * | 2010-05-21 | 2010-12-22 | 中国电子科技集团公司第十三研究所 | Nitrided aluminium-copper metallized ceramic substrate |
| CN202200603U (en) * | 2011-08-23 | 2012-04-25 | 甄海威 | Composite material of ceramic, aluminium and porous copper |
-
2011
- 2011-08-23 CN CN201110242571.2A patent/CN102950831B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85107155A (en) * | 1985-09-19 | 1987-04-08 | 王新魂 | The solid-state pressure diffusion welding (DW) of no silver alloy solder sealing-in pottery and Ke watt, pottery and copper |
| JPH0948677A (en) * | 1995-08-04 | 1997-02-18 | Dowa Mining Co Ltd | Metal-ceramic composite substrate and its production |
| CN101521986A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Metal base printed circuit board |
| CN201681922U (en) * | 2010-05-21 | 2010-12-22 | 中国电子科技集团公司第十三研究所 | Nitrided aluminium-copper metallized ceramic substrate |
| CN202200603U (en) * | 2011-08-23 | 2012-04-25 | 甄海威 | Composite material of ceramic, aluminium and porous copper |
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| CN102950831A (en) | 2013-03-06 |
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