Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
It should be noted that, in accompanying drawing or instructions description, similar or identical part is all used identical figure number.The implementation that does not illustrate in accompanying drawing or describe is form known to a person of ordinary skill in the art in affiliated technical field.In addition, although the demonstration of the parameter that comprises particular value can be provided herein, should be appreciated that, parameter is without definitely equaling corresponding value, but can in acceptable error margin or design constraint, be similar to corresponding value.In addition, the direction term of mentioning in following examples, for example " on ", D score, 'fornt', 'back', " left side ", " right side " etc., be only the direction with reference to accompanying drawing.Therefore, the direction term of use is to be not used for limiting the present invention for illustrating.
For Fig. 1, it is the accompanying drawing that prior art is measured solid thermal physical property optical system, and in its figure, the figure number of institute's mark is only for reference, does not include the present invention in and uses.The present invention is understood for convenience of those skilled in the art, first main element involved in the present invention is numbered to explanation, specific as follows shown in:
10-heats laser module; 20-exploring laser light assembly;
30-closes bundle element; 40-beam splitter;
50-heating laser pick-off assembly; 60-sample test assembly;
70-sample retaining element; 80-exploring laser light receiving unit;
11-signal modulator; 12-the first laser instrument;
13-the first wave plate; 14-the first catoptron;
21-second laser; 22-the second wave plate;
23-the second catoptron; 51-the first optical filter;
52-the first photodetector; 61-the 3rd wave plate;
62-object lens; 81-condenser lens;
82-the second optical filter; 83-the second photodetector.
In one exemplary embodiment of the present invention, provide a kind of optical system of measuring solid thermal physical parameter.As shown in Figure 2, this system comprises: add thermal laser generation component 10, exploring laser light generation component 20, close and restraint element 30, beam splitter 40, heating laser pick-off assembly 50, sample test assembly 60, sample retaining element 70, exploring laser light receiving unit 80 and data handling component (not shown).By the thermal laser that adds that adds thermal laser generation component 10 and produce warbled continuous polarization, produced the exploring laser light of continuous polarization by exploring laser light generation component 20; This adds thermal laser and exploring laser light closes bundle for being positioned at the Shu Jiguang that closes of surface level after closing bundle element 30; This closes Shu Jiguang incident beam splitter 40, and polarization direction is transmitted through sample test assembly 60 at the composition of this surface level, and polarization direction reflexes to heating laser pick-off assembly 50 perpendicular to the composition of this surface level; Polarization direction this surface level close bundle light component via sample test assembly 60 after, expose to the tested sample surface on sample retaining element 70, add thermal laser sample heated, the sample after heating produces modulating action to exploring laser light; By the tested sample surface reflection on sample retaining element 70 add thermal laser and modulation after exploring laser light close Shu Jiguang again via reflexing to exploring laser light receiving unit 80 by beam splitter 40 after sample test assembly 60; Exploring laser light receiving unit 80, by the adding after the filtering of thermal laser composition in thermal laser and exploring laser light that add of incident, obtains the signal of exploring laser light; Heating laser pick-off assembly 50 adds after the exploring laser light composition filtering in thermal laser and exploring laser light incident, obtains adding the signal of thermal laser; Data handling component is produced exploring laser light signal and is produced by heating laser pick-off assembly 80 signal that adds thermal laser by the modulating frequency, the exploring laser light receiving unit 50 that add thermal laser, is back-calculated to obtain the thermal physical property parameter of tested sample according to theoretical model.
Below respectively each components/elements is elaborated.
Add thermal laser generation component 10
Add the add thermal laser of thermal laser generation component 10 for generation of the continuous polarization through signal modulation.As shown in Figure 1, this adds thermal laser generation component and comprises: signal modulator 11, it can be digital signal generator, be used for modulating the first laser instrument, its modulating frequency is by outer computer control, modulation frequency range is determined jointly by signal modulator 11 and data handling component, can be that 50kHz is to 20MHz; The first laser instrument 12, is semiconductor laser, under the modulation in signal modulator 11, and the continuous polarization laser that output wavelength is 830nm, its power is 170mW; The first wave plate 13, is 1/2nd wave plates, for the horizontal polarization composition of continuous polarization laser and the ratio of vertical polarization composition that regulate the first laser instrument 12 to export; The first laser mirror 14, its reflectivity is greater than 99%, its reflecting surface with see through the first wave plate 13 add thermal laser angle at 45 °, for by the adding after 90 ° of laser deflections of incident, close bundle element 30 with 45° angle incident.
Exploring laser light generation component 20
Exploring laser light generation component 20 is for generation of the exploring laser light of continuous polarization, and the wavelength of this exploring laser light is different from the wavelength that adds thermal laser, and power is much smaller than heating laser power.As shown in Figure 1, this adds thermal laser generation component 20 and comprises: second laser 21 is semiconductor laser, the exploring laser light that is 635nm for output wavelength, its power 6mW; The second wave plate 22, is 1/2nd wave plates, for the horizontal polarization composition of continuous polarization laser and the ratio of vertical polarization composition that regulate second laser 21 to export; The second laser mirror 23, its reflectivity is greater than 99%, and its reflecting surface and the exploring laser light angle at 45 ° that sees through the second wave plate 22, for by after 90 ° of the exploring laser light deflections of incident, close bundle element 30 with 45° angle incident.
Close bundle element 30
Closing bundle element 30 is cold mirror, for the 830nm wavelength of its place plane angle at 45 ° incident add thermal laser total transmissivity; For with the exploring laser light total reflection of the 635nm wavelength of its place plane angle at 45 ° incident, thereby make to add thermal laser and exploring laser light closes bundle, realize conllinear and add hot-probing.
Beam splitter 40
Beam splitter 40 is Amici prism.By this Amici prism, close adding in thermal laser and exploring laser light after bundle, polarization direction is transmitted through sample test assembly at the composition of this surface level, and polarization direction reflexes to heating laser pick-off assembly perpendicular to the composition of this surface level; Reflected by sample surfaces add thermal laser and exploring laser light reflexes to exploring laser light receiving unit.
Heating laser pick-off assembly 50
Heating laser pick-off assembly 50, for by after the exploring laser light composition filtering that adds thermal laser and exploring laser light of incident, obtains adding the signal of thermal laser.This heating laser pick-off assembly 50 comprises: the first optical filter 51 and the first photodetector 52.Wherein:
The first optical filter 51, closes the exploring laser light composition of Shu Jiguang for filtering incident, its transmitance for the exploring laser light of 635nm wavelength is 10
-7to 10
-9.
The first photodetector 52, for detection of closing the signal that adds thermal laser in Shu Jiguang, it can be high speed PIN diode, avalanche diode, photomultiplier, or charge-coupled image sensor, the response time is less than 10ns.Wherein, in this signal, can comprise: the information such as power (amplitude), phase place.
Sample test assembly 60
Through beam splitter 40 transmissions add thermal laser and exploring laser light close Shu Jiguang after sample test assembly 60 with sample retaining element on tested sample surface action, reflected by sample surfaces add thermal laser and exploring laser light via sample test assembly 60 back into being incident upon beam splitter 40.
This sample test assembly 60 comprises: quarter-wave plate 61 and object lens 62.Wherein object lens 62 adopt achromatic objective, 100 times of enlargement factors, and focal length is 2mm.Incident close twice of Shu Jiguang after quarter-wave plate 61,90 ° of its change of polarized direction.
Sample retaining element 70
Sample retaining element 70 is fixed adjustment frame, for adjusting and fix the orientation of tested sample, guarantees to close the bundle tested sample of laser vertical incident surface, and the former road of Shu Jiguang of closing of reflection is returned, and is incident to sample test assembly 60.
Add thermal laser sample is heated, the sample after heating produces modulating action to exploring laser light; By the tested sample surface reflection on sample retaining element 70 add thermal laser and modulation after exploring laser light close Shu Jiguang again via reflexing to exploring laser light receiving unit 80 by beam splitter 40 after sample test assembly 60.
Exploring laser light receiving unit 80
Exploring laser light receiving unit 80, for by incident add the adding after the filtering of thermal laser composition of thermal laser and exploring laser light, obtain the signal of exploring laser light.This exploring laser light receiving unit 80 comprises: condenser lens 81, the second optical filter 82 and the second photodetector 83.Wherein:
Condenser lens 81, for focusing on the Shu Jiguang that closes of incident.Difference as requested, the focal length of this condenser lens 81 can be for 10mm be to 300mm.
The second optical filter 82, after focusing on for filtering close Shu Jiguang add thermal laser composition, its transmitance that adds thermal laser for 830nm wavelength is 10
-7to 10
-9.
The second photodetector 83, for detection of the signal that closes exploring laser light in Shu Jiguang, it can be high speed PIN diode, avalanche diode, photomultiplier, or charge-coupled image sensor, the response time is less than 10ns.Wherein, in this signal, can comprise: the information such as power (amplitude), phase place.
The signal that utilizes above-mentioned heating laser pick-off assembly and exploring laser light receiving unit to obtain, can calculate and obtain solid thermal physical parameter.Compare with the time domain approach such as super short pulse laser pumping probe method, the optical system that the present invention measures solid thermal physical parameter does not have mechanical moving element, and measuring system is relatively simple, optical path adjusting is more convenient.
Based on above-mentioned optical system, the present invention also provides a kind of method of measuring solid thermal physical parameter, the method is according under different signal modulator angular frequencies, produce exploring laser light signal and produced the phase differential of the signal that adds thermal laser by heating laser pick-off assembly by exploring laser light receiving unit, matching obtains the thermal physical property parameter of tested sample, comprises the interface thermal conductance of thermal conductivity, storeroom etc.
In one exemplary embodiment of the present invention, as shown in Figure 3, the method comprises:
Steps A, utilize above-mentioned optical system, obtain under different heating Laser Modulation frequencies and produce exploring laser light signal and produce by heating laser pick-off assembly the signal that adds thermal laser by exploring laser light receiving unit, in this exploring laser light signal and heating laser signal, all comprise power information and phase information;
Step B, under different heating Laser Modulation frequencies, carries out phase differential processing to exploring laser light signal and heating laser signal, obtains phase differential experiment value;
Step C, gives thermal conductivity, the interface thermal conductance tax initial value for the treatment of matching;
Step D, under different heating Laser Modulation frequencies, according to theoretical model formula, the phase differential theoretical value under calculating and phase differential experiment value respective frequencies;
Wherein, Q
0, Q
1be respectively the power that adds thermal laser and exploring laser light, γ is the luminous reflectivity on tested sample surface, and l is integration variable, R
0, R
1be respectively the waist radius while adding thermal laser and exploring laser light generation, the angular frequency that ω is modulation signal; φ be the exploring laser light that receives of exploring laser light receiving unit and heating laser pick-off assembly receive add the phase differential theoretical value between thermal laser.C, D are 2 × 2 material thermal physical property parameter matrix
Corresponding parameter:
If certain layer,
If interface,
Wherein,
ρ, c, k, d are respectively density, quality thermal capacitance, thermal conductivity, the thickness of certain layer, and G is interface thermal conductance, and i is imaginary unit, and j is the number of plies of counting from swashing light incident side.
In addition,, about the concrete meaning of above-mentioned material thermal physical property parameter, refer to list of references 1[J.Zhuet al.J.Appl.Phys.108,094315 (2010))].
Step e, carries out least-squares calculation to the phase differential experiment value under whole heating Laser Modulation frequencies and corresponding phase differential theoretical value, and its least-squares calculation numerical value is as working as time iteration result;
Step F, records heat conductivity value corresponding to current iteration result, interface thermal conductance value, is and works as suboptimal data;
Step G, judges whether the result of this iteration is less than the result of previous iteration, if so, and execution step H, otherwise, execution step I;
Step H, detects output data, execution step J using heat conductivity value corresponding this iteration result, interface thermal conductance value as changing;
Step I, detects output data, execution step J using heat conductivity value corresponding previous iteration result, interface thermal conductance value as changing;
Step J, judges whether that the iteration result of continuous 3 times is less than control accuracy (as 10
-6), if so, execution step K, otherwise, execution step L;
Step K, stops iteration, and the heat conductivity value, the interface thermal conductance value that are obtained by step H or step I are exported, and flow process finishes;
Step L, increases the heat conductivity value being obtained by step H or step I, interface thermal conductance value or reduce according to default step-length, determines that its numerical value changes path, execution step D by the majorized function of presetting.
In this step, default step-length can be the 0.5-5% of current heat conductivity value, interface thermal conductance value; Majorized function can be lsqcurvefit function, fminsearch function or other functions well known in the art.
It should be noted that, the method for the two-parameter matching of above employing has obtained heat conductivity value and interface thermal conductance value simultaneously, certainly, also can determine under above-mentioned one of them prerequisite that is definite value, is obtained another concrete numerical value by the mode of one-parameter matching.According to description above, those skilled in the art are easy to expect relevant computing method, no longer repeat herein.
It should be noted that, the above-mentioned definition to each element is not limited in various concrete structures or the shape in embodiment, mentioned, and those of ordinary skill in the art can know simply and replace it, for example:
(1) add all right other angle incident laser catoptrons of thermal laser or exploring laser light;
(2) light path of system can be at surface level, and in embodiment, selection level face is just for the ease of regulating;
(3) condenser lens just plays convection light and is incident to the effect of photodetector photosensitive region, and in heating laser pick-off assembly, increasing or removing condenser lens does not affect measurement result;
(4) first and second photodetectors can be high speed PIN diode, avalanche diode, photomultiplier, or charge-coupled image sensor.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.