Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
Need to prove that in accompanying drawing or instructions description, similar or identical part is all used identical figure number.The implementation that does not illustrate in the accompanying drawing or describe is form known to a person of ordinary skill in the art in the affiliated technical field.In addition, although this paper can provide the demonstration of the parameter that comprises particular value, should be appreciated that parameter need not definitely to equal corresponding value, but can in acceptable error margin or design constraint, be similar to corresponding value.In addition, the direction term of mentioning in following examples, such as " on ", D score, 'fornt', 'back', " left side ", " right side " etc., only be direction with reference to the accompanying drawings.Therefore, the direction term of use is to illustrate not to be to limit the present invention.
For Fig. 1, it is the accompanying drawing that prior art is measured solid thermal physical property optical system, and the figure number of institute's mark is only for reference among its figure, does not include the present invention in and uses.For making things convenient for those skilled in the art that the present invention is understood, at first main element involved in the present invention is numbered explanation, specific as follows shown in:
10-heats laser module; 20-exploring laser light assembly;
30-closes the bundle element; The 40-beam splitter;
50-heating laser pick-off assembly; 60-sample test assembly;
70-sample retaining element; 80-exploring laser light receiving unit;
The 11-signal modulator; 12-the first laser instrument;
13-the first wave plate; 14-the first catoptron;
The 21-second laser; 22-the second wave plate;
23-the second catoptron; 51-the first optical filter;
52-the first photodetector; 61-the 3rd wave plate;
The 62-object lens; The 81-condenser lens;
82-the second optical filter; 83-the second photodetector.
In one exemplary embodiment of the present invention, provide a kind of optical system of measuring the solid thermal physical parameter.As shown in Figure 2, this system comprises: add thermal laser generation component 10, exploring laser light generation component 20, close and restraint element 30, beam splitter 40, heating laser pick-off assembly 50, sample test assembly 60, sample retaining element 70, exploring laser light receiving unit 80 and data handling component (not shown).By the thermal laser that adds that adds the warbled continuous polarization of thermal laser generation component 10 generations, produced the exploring laser light of continuous polarization by exploring laser light generation component 20; This adds thermal laser and exploring laser light closes bundle for being positioned at the Shu Jiguang that closes of surface level after closing bundle element 30; This closes Shu Jiguang incident beam splitter 40, and the polarization direction is transmitted through sample test assembly 60 at the composition of this surface level, and the polarization direction reflexes to heating laser pick-off assembly 50 perpendicular to the composition of this surface level; The polarization direction this surface level close the bundle light component via sample test assembly 60 after, expose to the tested sample surface on the sample retaining element 70, add thermal laser sample heated, the sample after the heating produces modulating action to exploring laser light; The Shu Jiguang that closes that adds the exploring laser light after thermal laser and the modulation by the tested sample surface reflection on the sample retaining element 70 reflexes to exploring laser light receiving unit 80 via behind the sample test assembly 60 by beam splitter 40 again; Exploring laser light receiving unit 80 with incident add in thermal laser and the exploring laser light add the filtering of thermal laser composition after, obtain the signal of exploring laser light; Heating laser pick-off assembly 50 with incident add exploring laser light composition filtering in thermal laser and the exploring laser light after, obtain adding the signal of thermal laser; Data handling component is produced the exploring laser light signal and is produced the signal that adds thermal laser by heating laser pick-off assembly 80 by the modulating frequency that adds thermal laser, exploring laser light receiving unit 50, is back-calculated to obtain the thermal physical property parameter of tested sample according to theoretical model.
Below respectively each components/elements is elaborated.
Add thermal laser generation component 10
Add thermal laser generation component 10 for generation of the thermal laser that adds of the continuous polarization of modulating through signal.As shown in Figure 1, this adds the thermal laser generation component and comprises: signal modulator 11, it can be digital signal generator, be used for modulation the first laser instrument, its modulating frequency is controlled by outer computer, modulation frequency range is determined jointly by signal modulator 11 and data handling component, can be that 50kHz is to 20MHz; The first laser instrument 12 is semiconductor laser, is used under the modulation of signal modulator 11, and output wavelength is the continuous polarization laser of 830nm, and its power is 170mW; The first wave plate 13 is 1/2nd wave plates, for the horizontal polarization composition of the continuous polarization laser of regulating 12 outputs of the first laser instrument and the ratio of vertical polarization composition; The first laser mirror 14, its reflectivity be greater than 99%, its reflecting surface with see through the first wave plate 13 add thermal laser angle at 45 °, be used for closing bundle element 30 with after 90 ° of the adding laser deflections of incident with 45° angle incident.
Exploring laser light generation component 20
Exploring laser light generation component 20 is for generation of the exploring laser light of continuous polarization, and the wavelength of this exploring laser light is different from the wavelength that adds thermal laser, and power is much smaller than the heating laser power.As shown in Figure 1, this adds thermal laser generation component 20 and comprises: second laser 21, be semiconductor laser, and being used for output wavelength is the exploring laser light of 635nm, its power 6mW; The second wave plate 22 is 1/2nd wave plates, for the horizontal polarization composition of the continuous polarization laser of regulating second laser 21 outputs and the ratio of vertical polarization composition; The second laser mirror 23, its reflectivity be greater than 99%, and its reflecting surface and the exploring laser light angle at 45 ° that sees through the second wave plate 22 are used for closing bundle element 30 with after 90 ° of the exploring laser light deflections of incident with 45° angle incident.
Close bundle element 30
Close bundle element 30 and be cold mirror, for the 830nm wavelength of its plane, place angle at 45 ° incident add the thermal laser total transmissivity; For with the exploring laser light total reflection of the 635nm wavelength of its plane, place angle at 45 ° incident, add thermal laser and exploring laser light closes bundle thereby make, realize that conllinear adds hot-probing.
Beam splitter 40
Beam splitter 40 is Amici prism.By this Amici prism, close adding in thermal laser and the exploring laser light behind the bundle, the polarization direction is transmitted through the sample test assembly at the composition of this surface level, and the polarization direction reflexes to heating laser pick-off assembly perpendicular to the composition of this surface level; By sample surfaces reflection add thermal laser and exploring laser light reflexes to the exploring laser light receiving unit.
Heating laser pick-off assembly 50
Heating laser pick-off assembly 50 for after the exploring laser light composition filtering that adds thermal laser and exploring laser light with incident, obtains adding the signal of thermal laser.This heating laser pick-off assembly 50 comprises: the first optical filter 51 and the first photodetector 52.Wherein:
The first optical filter 51 is used for the exploring laser light composition that Shu Jiguang is closed in filtering incident, and its transmitance for the exploring laser light of 635nm wavelength is 10
-7To 10
-9
The first photodetector 52, for detection of closing the signal that adds thermal laser among the Shu Jiguang, it can be high speed PIN diode, avalanche diode, photomultiplier, or charge-coupled image sensor, the response time is less than 10ns.Wherein, can comprise in this signal: the information such as power (amplitude), phase place.
Sample test assembly 60
Through beam splitter 40 transmissions add thermal laser and exploring laser light close Shu Jiguang through sample test assembly 60 after with the sample retaining element on tested sample surface action, by the sample surfaces reflection add thermal laser and exploring laser light is incident to beam splitter 40 again via sample test assembly 60.
This sample test assembly 60 comprises: quarter-wave plate 61 and object lens 62.Wherein object lens 62 adopt achromatic objective, 100 times of enlargement factors, and focal length is 2mm.Incident close twice of Shu Jiguang through behind the quarter-wave plate 61,90 ° of its change of polarized direction.
Sample retaining element 70
Sample retaining element 70 is the fixed adjustment frame, is used for adjusting and fixing the orientation of tested sample, guarantees to close the tested sample of bundle laser vertical incident surface, and the former road of Shu Jiguang of closing of reflection is returned, and is incident to sample test assembly 60.
Add thermal laser sample is heated, the sample after the heating produces modulating action to exploring laser light; The Shu Jiguang that closes that adds the exploring laser light after thermal laser and the modulation by the tested sample surface reflection on the sample retaining element 70 reflexes to exploring laser light receiving unit 80 via behind the sample test assembly 60 by beam splitter 40 again.
Exploring laser light receiving unit 80
Exploring laser light receiving unit 80, be used for incident add thermal laser and exploring laser light add the filtering of thermal laser composition after, obtain the signal of exploring laser light.This exploring laser light receiving unit 80 comprises: condenser lens 81, the second optical filter 82 and the second photodetector 83.Wherein:
Condenser lens 81 is used for the Shu Jiguang that closes of incident is focused on.Difference as requested, the focal length of this condenser lens 81 can arrive 300mm for 10mm.
The second optical filter 82, after being used for filtering and focusing on close Shu Jiguang add the thermal laser composition, its transmitance that adds thermal laser for the 830nm wavelength is 10
-7To 10
-9
The second photodetector 83, for detection of the signal that closes exploring laser light among the Shu Jiguang, it can be high speed PIN diode, avalanche diode, photomultiplier, or charge-coupled image sensor, the response time is less than 10ns.Wherein, can comprise in this signal: the information such as power (amplitude), phase place.
The signal that utilizes above-mentioned heating laser pick-off assembly and exploring laser light receiving unit to obtain can calculate and obtain the solid thermal physical parameter.Compare with the time domain approach such as super short pulse laser pumping probe method, the optical system that the present invention measures the solid thermal physical parameter does not have mechanical moving element, and measuring system is relatively simple, optical path adjusting is more convenient.
Based on above-mentioned optical system, the present invention also provides a kind of method of measuring the solid thermal physical parameter, the method is according under different signal modulator angular frequencies, produce the exploring laser light signal and produced the phase differential of the signal that adds thermal laser by heating laser pick-off assembly by the exploring laser light receiving unit, match obtains the thermal physical property parameter of tested sample, comprises the interface thermal conductance of thermal conductivity, storeroom etc.
In one exemplary embodiment of the present invention, as shown in Figure 3, the method comprises:
Steps A, utilize above-mentioned optical system, obtain under different heating Laser Modulation frequencies and produce the signal that adds thermal laser by exploring laser light receiving unit generation exploring laser light signal with by heating laser pick-off assembly, all comprise power information and phase information in this exploring laser light signal and the heating laser signal;
Step B under different heating Laser Modulation frequencies, carries out the phase differential processing to exploring laser light signal and heating laser signal, obtains the phase differential experiment value;
Step C composes initial value for thermal conductivity, the interface thermal conductance for the treatment of match;
Step D, under different heating Laser Modulation frequencies, according to the theoretical model formula, the phase differential theoretical value under calculating and the phase differential experiment value respective frequencies;
Wherein, Q
0, Q
1Be respectively the power that adds thermal laser and exploring laser light, γ is the luminous reflectivity on tested sample surface, and l is integration variable, R
0, R
1Be respectively the waist radius when adding thermal laser and exploring laser light generation, ω is the angular frequency of modulation signal; φ be the exploring laser light that receives of exploring laser light receiving unit and heating laser pick-off assembly receive add phase differential theoretical value between the thermal laser.C, D are 2 * 2 material thermal physical property parameter matrix
Corresponding parameter:
If certain layer,
If the interface,
Wherein,
ρ, c, k, d are respectively certain layer density, quality thermal capacitance, thermal conductivity, thickness, and G is the interface thermal conductance, and i is imaginary unit, the number of plies of j for counting from swashing light incident side.
In addition, about the concrete meaning of above-mentioned material thermal physical property parameter, see list of references 1[J.Zhuet al.J.Appl.Phys.108 for details, 094315 (2010))].
Step e is carried out least-squares calculation to the phase differential experiment value under whole heating Laser Modulation frequencies and corresponding phase differential theoretical value, and its least-squares calculation numerical value is as working as time iteration result;
Step F, corresponding heat conductivity value, the interface thermal conductance value of record current iteration result is and works as suboptimal data;
Whether step G, the result who judges this iteration less than the result of previous iteration, if so, and execution in step H, otherwise, execution in step I;
Step H, the heat conductivity value that this iteration result is corresponding, interface thermal conductance value detect output data, execution in step J as changing;
Step I, the heat conductivity value that the previous iteration result is corresponding, interface thermal conductance value detect output data, execution in step J as changing;
Step J, judge whether continuous 3 times iteration result less than control accuracy (such as 10
-6), if so, execution in step K, otherwise, execution in step L;
Step K stops iteration, will be exported by heat conductivity value, interface thermal conductance value that step H or step I obtain, and flow process finishes;
Step L will be increased according to default step-length by heat conductivity value, the interface thermal conductance value that step H or step I obtain or reduce, and determines that by default majorized function its numerical value changes path, execution in step D.
In this step, default step-length can be the 0.5-5% of current heat conductivity value, interface thermal conductance value; Majorized function can be lsqcurvefit function, fminsearch function or other functions well known in the art.
Need to prove, more than adopt the method for two-parameter match to obtain simultaneously heat conductivity value and interface thermal conductance value, certainly, also can determine above-mentioned one of them be under the prerequisite of definite value, obtained another concrete numerical value by the mode of one-parameter match.According to description above, those skilled in the art are easy to expect the computing method of being correlated with no longer repeat herein.
Need to prove that above-mentioned definition to each element is not limited in various concrete structures or the shape of mentioning in the embodiment, those of ordinary skill in the art can replace simply to it with knowing, for example:
(1) adds all right other angle incident laser catoptrons of thermal laser or exploring laser light;
(2) light path of system can be at surface level, and the selection level face is just for the ease of regulating among the embodiment;
(3) condenser lens just plays convection light and is incident to the effect of photodetector photosensitive region, and in heating laser pick-off assembly, increasing or removing condenser lens does not affect measurement result;
(4) first and second photodetectors can be high speed PIN diode, avalanche diode, photomultiplier, or charge-coupled image sensor.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.