CN102942878A - Thermoplastic resin adhesive film - Google Patents
Thermoplastic resin adhesive film Download PDFInfo
- Publication number
- CN102942878A CN102942878A CN 201210496075 CN201210496075A CN102942878A CN 102942878 A CN102942878 A CN 102942878A CN 201210496075 CN201210496075 CN 201210496075 CN 201210496075 A CN201210496075 A CN 201210496075A CN 102942878 A CN102942878 A CN 102942878A
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- China
- Prior art keywords
- adhesive film
- circuit board
- printed circuit
- thermoplastic resin
- described adhesive
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Abstract
The invention relates to a thermoplastic resin adhesive film and application thereof. The adhesive film comprises symmetrical polyphenylene ether molecules, is not sticky and has low dielectric constant and dielectric loss, and a high-frequency multilayer printed circuit board prepared by the adhesive film has high glass transition temperature, excellent heat resistance and flame resistance and an environmental protection function. The adhesive film serves as a thermally conductive and insulating layer of the high-frequency printed circuit board, so that the printed circuit board has the advantages of high thermal conductivity, quick signal transmission, low loss and the like.
Description
Technical field
The present invention relates to a kind of thermoplastic resin, be specifically related to a kind of thermoplastic resin adhesive film and application thereof.
Background technology
Along with electronic product to the development of light, thin, little, high-density, multifunction, element packing density and integrated level are more and more higher on the printed circuit board, the transmission of signal frequency is more and more higher, and is also more and more higher to the requirement of the medium layer that plays the transmission of signal effect.
Adhesive film is applied in the pressure programming of multilayer printed circuit board making, in order to bonding different circuit layers, its material affects the transmission of signal, this just requires the specific inductivity of selected adhesive film little, can be than transmission of signal faster, require simultaneously the dielectric loss of adhesive film also lower, can make signal loss in transmission course little, make the next device of being communicated to of signal integrity.Also require simultaneously adhesive film to have fire-retardant, heat-resisting, high adhesion and the easy performance such as processing.
Traditional high-frequency signal is selected polytetrafluoroethylmaterial material with printed circuit board, adhesive film all is to use inclined to one side fluoropolymer, US Patent No. 7687142 adopts poly-fluorine vinylchlorid to suppress multilayer circuit board as adhesive film, its specific inductivity, thermotolerance can meet the demands, but processing difficulties, large especially to the mould loss, product is difficult to obtain, and physical property is subjected to the impact of hydridization composition in the poly-fluorine vinylchlorid, and is unstable.US Patent No. 5571609 disclosed the polyolefins material as adhesive film afterwards, and its specific inductivity is lower, and was heat-resisting also relatively good, and glass transition temperature reaches 280 ℃, but the sticking hand of product is not easy operation, is difficult to be widely used.Polybutadiene and the multipolymer of the vinylbenzene of the maleic anhydride graft of high molecular and divinyl of Chinese patent CN101328277 by introducing low-molecular-weight maleic anhydride addition improves and glues the hand characteristic, but the stripping strength of product is very little, has the circuit reliability problem.Therefore, seek a kind of adhesive film, both had lower specific inductivity and dielectric loss, have again high bonding, workability energy, become the key in the high-frequency signal usefulness printed circuit board preparation process.
Summary of the invention
The purpose of this invention is to provide a kind of thermoplasticity adhesive film, in order to the different circuit layers of bonding high frequency with multilayer printed circuit board.
For achieving the above object, the technical solution used in the present invention is: a kind of thermoplastic resin adhesive film, and its molecule is symmetrical structure, comprises following structural formula:
Wherein, n is natural number; The surface of described adhesive film is without bubble, and inclusion-free.
In the technique scheme, the weight-average molecular weight of described adhesive film is greater than 5000, and this superpolymer is machined into film by film forming it is applied in the printed circuit board.
In the technique scheme, the thickness of described adhesive film is 12.5～150 microns.
In the technique scheme, described adhesive film is by extruding or the blow moiding method preparation.
The present invention protects the application of above-mentioned adhesive film in the multilayer printed wiring board pressure programming simultaneously.
The present invention compared with prior art has following advantage:
(1) adhesive film provided by the present invention is tack-free, except possessing lower specific inductivity, dielectric loss, also has higher cementability, very low water-absorbent, than the higher glass transition temperature of vinylidene, work-ing life and the permanent stability of these characteristics to have improved whole electronic component.
(2) adhesive film provided by the present invention has anti-combustion characteristic, is the intrinsic fire retardant material, need not add the prejudicial halogen of environment is done the requirement that fire retardant just satisfies UL burning, can satisfy whole electronic industry chain to environmental requirement, do not pollute.
When (3) adhesive film provided by the present invention was applied to the multilayer printed wiring board pressure programming, required processing condition were simple, need not existing installation is done improvement, made things convenient for large-scale industrial production.
Embodiment
The present invention will be further described in detail below in conjunction with specific embodiment.
Embodiment 1
Be that 40000 polyphenylene oxide particles join in the forcing machine with weight-average molecular weight, under 270 ℃, extrude thickness and be 100 microns film; Film put between two printed circuit boards of making figure and processing through melanism or brown form compoboard, compoboard is put in the vacuum press, at 30Kg/cm
2Suppress under the pressure, be warmed up to 220 ℃ with the temperature rise rate of 5 ℃/min from 50 ℃, under 220 ℃, kept 30 minutes; With the routinely making process of circuit board continuation making of the above compoboard that suppresses, finally carry out production board, and carry out performance test.
Embodiment 2
Be that 5000 polyphenylene oxide particles join in the blow moulding machine with weight-average molecular weight, under 250 ℃, blow out thickness and be 50 microns film; Film put between two printed circuit boards of making figure and processing through melanism or brown form compoboard, compoboard is put in the vacuum press, at 20Kg/cm
2Suppress under the pressure, be warmed up to 210 ℃ with the temperature rise rate of 5 ℃/min from 50 ℃, under 210 ℃, kept 30 minutes; With the routinely making process of circuit board continuation making of the above compoboard that suppresses, finally carry out production board, and carry out performance test.
Embodiment 3
Be that 10000 polyphenylene oxide particles join in the forcing machine with weight-average molecular weight, under 280 ℃, extrude thickness and be 80 microns film; Film put between two printed circuit boards of making figure and processing through melanism or brown form compoboard, compoboard is put in the vacuum press, at 24Kg/cm
2Suppress under the pressure, be warmed up to 220 ℃ with the temperature rise rate of 5 ℃/min from 50 ℃, under 220 ℃, kept 30 minutes; With the routinely making process of circuit board continuation making of the above compoboard that suppresses, finally carry out production board, and carry out performance test.
Embodiment 4
Be that 18000 polyphenylene oxide particles join in the blow moulding machine with weight-average molecular weight, under 260 ℃, blow out thickness and be 150 microns film; Film put between two printed circuit boards of making figure and processing through melanism or brown form compoboard, compoboard is put in the vacuum press, at 30Kg/cm
2Suppress under the pressure, be warmed up to 220 ℃ with the temperature rise rate of 5 ℃/min from 50 ℃, under 220 ℃, kept 30 minutes; With the routinely making process of circuit board continuation making of the above compoboard that suppresses, finally carry out production board, and carry out performance test.
Comparative Examples 1
Adopt prepreg that common Resins, epoxy and 2116 glass types cloth make as adhesive film, put between two printed circuit boards of making figure and processing through melanism or brown and form compoboard, compoboard is put in the vacuum press, at 25Kg/cm
2Suppress under the pressure, be warmed up to 220 ℃ with the temperature rise rate of 5 ℃/min from 50 ℃, under 220 ℃, kept 30 minutes; With the routinely making process of circuit board continuation making of the above compoboard that suppresses, finally carry out production board, and carry out performance test.
According to the testing method of IPC-TM650 the production board of embodiment 1 to 4 and Comparative Examples 1 is carried out performance test, the results are shown in Table 1.
The performance data of the production board of table 1 embodiment 1 to 4 and Comparative Examples 1
As seen from Table 1, the multilayer printed circuit board of making according to adhesive film provided by the present invention has higher thermal conductivity, excellent thermotolerance, anti-water absorbability and shock-resistance, is fit to be applied to high frequency with the making of multilayer printed circuit board.
Claims (5)
1. thermoplastic resin adhesive film, it is characterized in that: the molecule of described adhesive film is symmetrical structure, comprises following structural formula:
Wherein, n is natural number; The surface of described adhesive film is without bubble, and inclusion-free.
2. adhesive film according to claim 1, it is characterized in that: the weight-average molecular weight of described adhesive film (Mw) is greater than 5000.
3. adhesive film according to claim 1, it is characterized in that: the thickness of described adhesive film is 12.5～150 microns.
4. described adhesive film according to claim 1～3 is characterized in that: described adhesive film is by extruding or the blow moiding method preparation.
5. the application of adhesive film claimed in claim 1 in the multilayer printed wiring board pressure programming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210496075 CN102942878A (en) | 2012-11-29 | 2012-11-29 | Thermoplastic resin adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210496075 CN102942878A (en) | 2012-11-29 | 2012-11-29 | Thermoplastic resin adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102942878A true CN102942878A (en) | 2013-02-27 |
Family
ID=47725876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210496075 Pending CN102942878A (en) | 2012-11-29 | 2012-11-29 | Thermoplastic resin adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102942878A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105620000A (en) * | 2014-10-27 | 2016-06-01 | 深圳光启高等理工研究院 | Composite plate and manufacturing method thereof |
| CN106585008A (en) * | 2015-10-19 | 2017-04-26 | 昆山雅森电子材料科技有限公司 | Low-dielectric rubber film and manufacturing method thereof |
-
2012
- 2012-11-29 CN CN 201210496075 patent/CN102942878A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105620000A (en) * | 2014-10-27 | 2016-06-01 | 深圳光启高等理工研究院 | Composite plate and manufacturing method thereof |
| CN106585008A (en) * | 2015-10-19 | 2017-04-26 | 昆山雅森电子材料科技有限公司 | Low-dielectric rubber film and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130227 |