CN105620000A - Composite plate and manufacturing method thereof - Google Patents
Composite plate and manufacturing method thereof Download PDFInfo
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- CN105620000A CN105620000A CN201410583528.6A CN201410583528A CN105620000A CN 105620000 A CN105620000 A CN 105620000A CN 201410583528 A CN201410583528 A CN 201410583528A CN 105620000 A CN105620000 A CN 105620000A
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- resin
- screw extruder
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- firming agent
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Abstract
The invention provides a manufacturing method of a composite plate. The manufacturing method comprises the steps: melting a resin raw material with a screw extruder; injecting epoxy modified polybutadiene resin from a feeding mouth of the screw extruder; casting the resin combination onto a conductor plate; and sizing the conductor plate and the resin combination. Compared with a traditional copper-clad plate processing technology, the manufacturing method does not use any organic solvent, and has the advantages of environmental protection, no pollution, simple process and lower cost. Moreover, the invention also provides the composite plate having low dielectric constant and low dielectric loss.
Description
Technical field
The present invention relates to a kind of composite plate and manufacture method thereof.
Background technology
Development along with microwave technology, various types of communication electronic equipment starts toward high frequency direction development, require jumbo information in the low-loss high-speed transfer of high band and process, but frequency is more high, the signal of telecommunication is more easily decayed, therefore for being operated in all kinds of devices of high frequency band, it is desirable to base material has as far as possible low dielectric constant and loss.
Commercialization high frequency printed circuit boards on market based on the high frequency plate of PTFE base material, this series products excellent electrical property, but cost is very high, and because fluororesin mechanical property is non-normally low, its processing characteristics and dimensional stability are excessively poor. Although non-polar polymeric material dielectric constant is relatively low, but it is poor with the surface combination power of Copper Foil or other anakinetomer. Additionally, in copper-clad plate production process, the mode gluing machine that the thermosetting resin such as epoxy resin is mixed by solution is compounded on glass fabric, obtains copper-clad plate again through being heating and curing. This technique must use substantial amounts of organic solvent dissolution resin, relatively costly.
Summary of the invention
For the problem using a large amount of organic solvent and complex process in composite plate production process in prior art, the invention provides the manufacture method of composite plate and composite plate.
According to an aspect of the invention, it is provided the manufacture method of a kind of composite plate, including:
Use screw extruder that resin raw material is melted;
Epoxy modified polybutadiene resin is injected from the spout of screw extruder;
By on resin combination sialorrhea to conductor plate; And
Conductor plate and resin combination are shaped.
In certain embodiments, from side, the stage casing spout of screw extruder, epoxy modified polybutadiene resin is injected.
In certain embodiments, screw extruder is double screw extruder.
In certain embodiments, resin raw material includes thermoplastic resin.
In certain embodiments, resin raw material farther includes one or more in the group being made up of firming agent, grafting compatilizer and initiator.
In certain embodiments, before using screw extruder step that resin raw material is melted, farther include: thermoplastic resin is mixed with one or more in the group being made up of firming agent, grafting compatilizer and initiator.
In certain embodiments, in high-speed mixer, implement the step that resin is carried out to be mixed with one or more in the group being made up of firming agent, compatilizer and initiator.
In certain embodiments, in the step using screw extruder that resin raw material is melted, the temperature of screw extruder is set as in the scope of 150 DEG C and 320 DEG C.
In certain embodiments, thermoplastic resin includes polyolefin, polyethers, polysulfones, polyether-ether-ketone, polyamide and/or their combination.
In certain embodiments, firming agent is alkene firming agent.
In certain embodiments, alkene firming agent includes styrene, 1,3 butadiene, isoprene, styrene, butadiene and/or their combination.
In certain embodiments, grafting compatilizer includes maleic anhydride, glycidyl methacrylate, acrylic acid and/or their combination.
In certain embodiments, initiator is radical initiator.
In certain embodiments, radical initiator includes azo compound, peroxide compound and/or their combination.
In certain embodiments, azo compound includes azobisisobutyronitrile, azo two eyeball in different heptan and/or their combination.
In certain embodiments, peroxide compound includes benzoyl peroxide, isopropyl benzene hydroperoxide, tert-butyl hydroperoxide, cumyl peroxide and/or their combination.
In certain embodiments, the thermoplastic resin of 47-95 weight portion is mixed with one or more in the group being made up of the firming agent of 1-20 weight portion, the grafting compatilizer of 0.2-3 weight portion and the initiator of 0.05-1 weight portion; And from the spout of screw extruder, inject the epoxide modified polybutadiene of 2-30 weight portion. In invention, dielectric constant and the dielectric loss of finished product composite plate can be reduced by injecting the epoxide modified polybutadiene of 2-30 weight portion.
In certain embodiments, conductor plate is metallic plate.
In certain embodiments, metallic plate is Copper Foil, aluminium foil, native gold or native silver.
In certain embodiments, after sialorrhea and before sizing, the thickness of the resin combination on conductor plate is in the scope of 0.2mm to 8mm.
In certain embodiments, use calender that conductor plate and resin combination are shaped.
In certain embodiments, after using calender sizing, the thickness of composite plate is in the scope of 0.1mm to 4mm.
According to a further aspect in the invention, additionally providing a kind of composite plate, composite plate includes: two conductor plates and be clipped in the resin bed between two conductor plates, and this resin bed is made up of resin combination, and this resin combination includes:
The resin of 47-95 weight portion; And
The epoxide modified polybutadiene of 2-30 weight portion.
In certain embodiments, resin combination farther includes:
The firming agent of 1-20 weight portion;
The grafting compatilizer of 0.2-3 weight portion; And
The initiator of 0.05-1 weight portion.
In certain embodiments, resin is thermoplastic resin.
In certain embodiments, thermoplastic resin includes polyolefin, polyethers, polysulfones, polyether-ether-ketone, polyamide and/or their combination.
In certain embodiments, firming agent is alkene firming agent.
In certain embodiments, alkene firming agent includes styrene, 1,3 butadiene, isoprene, styrene, butadiene and/or their combination.
In certain embodiments, grafting compatilizer includes maleic anhydride, glycidyl methacrylate, acrylic acid and/or their combination.
In certain embodiments, initiator is radical initiator.
In certain embodiments, radical initiator includes azo compound, peroxide compound and/or their combination.
In certain embodiments, azo compound includes azobisisobutyronitrile, azo two eyeball in different heptan and/or their combination.
In certain embodiments, peroxide compound includes benzoyl peroxide, isopropyl benzene hydroperoxide, tert-butyl hydroperoxide, cumyl peroxide and/or their combination.
In certain embodiments, conductor plate is metallic plate.
In certain embodiments, metallic plate is Copper Foil, aluminium foil, native gold or native silver.
In certain embodiments, the thickness of composite plate is in the scope of 0.1mm to 4mm.
Owing to the present invention is by adding grafting compatilizer at screw extruder leading portion, resin is adjusted by one or more in firming agent and initiator, improve the cohesive force of resin and conductor plate (such as Copper Foil), again through adding liquid epoxy modified polybutadiene resin in screw extruder stage casing, leading portion grafting compatilizer residual free radical is utilized to cause epoxide modified polybutadiene radical polymerization in screw extruder stage casing, cause the crosslinking of resin system, improve the thermostability of resin, solvent resistance, from screw extruder mouth die direct extrusion molding and cover conductor plate and obtain low-k composite plate. compared with traditional composite plate processing technique, the present invention does not use any organic solvent completely, environment friendly and pollution-free, and technique is simple, less costly. and the composite plate prepared by the method has low-k and low-dielectric loss.
Accompanying drawing explanation
Fig. 1 is the flow chart of the method for manufacturing the composite plate with low-k and low-dielectric loss according to embodiments of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments. Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain, broadly fall into the scope of protection of the invention.
The preparation method of composite plate:
With reference to the flow chart that Fig. 1, Fig. 1 are the methods preparing composite plate, shown in the S101 in Fig. 1, using screw extruder that resin raw material is melted, the temperature of screw extruder is set as in the scope of 150 DEG C and 320 DEG C; In this step, resin raw material includes thermoplastic resin, it is preferable that resin raw material farther includes one or more in the group being made up of firming agent, grafting compatilizer and initiator. Wherein, thermoplastic resin includes polyolefin, polyethers, polysulfones, polyether-ether-ketone, polyamide and/or their combination; Firming agent is alkene firming agent, and alkene firming agent includes styrene, 1,3 butadiene, isoprene, styrene, butadiene and/or their combination; Grafting compatilizer includes maleic anhydride, glycidyl methacrylate, acrylic acid and/or their combination; Initiator is radical initiator, radical initiator includes azo compound, peroxide compound and/or their combination, azo compound includes azobisisobutyronitrile, azo two eyeball in different heptan and/or their combination, and peroxide compound includes benzoyl peroxide, isopropyl benzene hydroperoxide, tert-butyl hydroperoxide, cumyl peroxide and/or their combination. The preferred double screw extruder of screw extruder.
In S101 step, the resin raw material carrying out melting can also include antioxidant, nucleator, releasing agent, lubricant, pigment, antistatic additive etc., owing to they are well known to those of ordinary skill in the art, for purposes of simplicity, it is not described in detail in this article.
Before S101 step, farther include: carry out mixing to obtain resin raw material at high-speed mixer with one or more in the group being made up of the firming agent of 1-20 weight portion, the grafting compatilizer of 0.2-3 weight portion and the initiator of 0.05-1 weight portion by the thermoplastic resin of 47-95 weight portion.
Shown in S103 in Fig. 1, from the spout of screw extruder, inject the liquid epoxy modified polybutadiene resin of 2-30 weight portion, it is preferable that inject from side, the stage casing spout of screw extruder.
Shown in S105 in Fig. 1, by resin combination sialorrhea to conductor plate, wherein conductor plate is metallic plate, including Copper Foil, aluminium foil, native gold or native silver. After sialorrhea has operated, the thickness of the resin combination on conductor plate is in the scope of 0.2mm to 8mm.
Shown in S107 in Fig. 1, using calender that conductor plate and resin combination are shaped, after using calender sizing, the thickness of composite plate is in the scope of 0.1mm to 4mm.
1 to embodiment 4 describes in further detail the present invention by the following examples.
Embodiment 1
1. resin formula
A kind of polyphenylene oxide (PPO) composite base plate, its resin formula is as follows:
2. the preparation technology of composite plate
Step a: weigh each component by above-mentioned percentage by weight;
Step b: the polyphenylene oxide resin weighed, maleic anhydride, DCP, styrene, antioxidant 1098 and irgasfos 168 are joined in high-speed mixer and mix;
Step c: above-mentioned each component of mix homogeneously is placed in the hopper of double screw extruder, each temperature of double screw extruder is set in 250-320 degree Celsius; Liquid epoxy modified butadiene resin is measured from the spout of side, stage casing injection; By resin combination from mouth die curtain coating to upper and lower two continuous copper foils, after sialorrhea completes, the thickness of the resin combination on Copper Foil is 4mm; Then through calender, Copper Foil and resin combination are shaped, obtain the copper-clad plate that thickness is 2mm.
Embodiment 2
1. resin formula
A kind of polypropylene composite materials substrate, its resin formula is as follows:
2. the preparation technology of composite plate
Step a: weigh each component by above-mentioned percentage by weight;
Step b: the acrylic resin weighed, maleic anhydride, azobisisobutyronitrile, 1,3 butadiene, antioxidant 1010 and irgasfos 168 are added mixing in high-speed mixer;
Step c: above-mentioned each component of mix homogeneously is placed in the hopper of double screw extruder, each section of temperature of double screw extruder is set in 150-250 degree Celsius; Liquid epoxy modified butadiene resin is measured from the spout of side, stage casing injection; By resin combination from mouth die curtain coating to upper and lower two continuous aluminium foils, after sialorrhea completes, the thickness of the resin combination on aluminium foil is 6mm; Then through calender, aluminium foil and resin combination are shaped, obtain the metallic plate that thickness is 3mm.
Embodiment 3
1. resin formula
A kind of polystyrene composite base plate, its resin formula is as follows:
2. the preparation technology of composite plate
Step a: weigh each component by above-mentioned percentage by weight;
Step b: the polystyrene resin weighed, glycidyl methacrylate, benzoyl peroxide, styrene, antioxidant 1010 and irgasfos 168 are added mixing in high-speed mixer;
Step c: above-mentioned each component of mix homogeneously is placed in the hopper of double screw extruder, each section of temperature of double screw extruder is set in 150-250 degree Celsius; Liquid epoxy modified butadiene resin is measured from the spout of side, stage casing injection; By resin combination from mouth die curtain coating to upper and lower two continuous copper foils, after sialorrhea completes, the thickness of the resin combination on Copper Foil is 3mm; Then through calender, Copper Foil and resin combination are shaped, obtain the copper-clad plate that thickness is 1.6mm.
Embodiment 4
1. resin formula
A kind of polystyrene composite base plate, its resin formula is as follows:
2. the preparation technology of composite plate
Step a: weigh each component by above-mentioned percentage by weight;
Step b: the polystyrene resin weighed, GMA, MAH, BPO, styrene, antioxidant 1010 and irgasfos 168 are joined in high-speed mixer and mix;
Step c: above-mentioned each component of mix homogeneously is placed in the hopper of double screw extruder, each section of temperature of double screw extruder is set in 150-250 degree Celsius; Liquid epoxy modified butadiene resin is measured from the spout of side, stage casing injection; By resin combination from mouth die curtain coating to upper and lower two continuous copper foils, after sialorrhea completes, on Copper Foil the thickness of resin combination be 7mm; Then through calender, Copper Foil and resin combination are shaped, obtain the copper-clad plate that thickness is 3.6mm.
Dielectric constant test and dielectric loss test
Use AET high frequency (microwave) dielectric constant analyser that composite plate made in embodiment 1 to embodiment 4 carries out dielectric constant test and dielectric loss test respectively. Test result is as follows:
| Dielectric constant | Dielectric loss | |
| Embodiment 1 | 2.7 | 0.005 |
| Embodiment 2 | 2.6 | 0.007 |
| Embodiment 3 | 2.9 | 0.009 |
| Embodiment 4 | 2.6 | 0.005 |
Table 1 dielectric constant and dielectric loss test result
As shown in table 1, the composite plate of the present invention is respectively provided with relatively low dielectric constant and low-dielectric loss, use the dielectric constant of the composite plate of the method manufacture described in embodiment 1 to embodiment 4 be respectively less than 2.9 and its dielectric loss be respectively less than 0.009. Therefore, by the method for preparation composite plate provided by the invention, when not using any organic solvent, the final prepared composite plate with relatively low dielectric constant and low-dielectric loss, the method technique is simple and less costly.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (15)
1. the manufacture method of a composite plate, it is characterised in that including:
Use screw extruder that resin raw material is melted;
Epoxy modified polybutadiene resin is injected from the spout of described screw extruder;
By on resin combination sialorrhea to conductor plate; And
Described conductor plate and described resin combination are shaped.
2. method according to claim 1, it is characterised in that inject described epoxide modified polybutadiene from side, the stage casing spout of described screw extruder.
3. method according to claim 1, it is characterised in that described screw extruder is double screw extruder.
4. method according to claim 1, it is characterised in that described resin raw material includes thermoplastic resin.
5. method according to claim 4, it is characterised in that described resin raw material farther includes one or more in the group being made up of firming agent, grafting compatilizer and initiator.
6. method according to claim 5, it is characterized in that, before the step that resin raw material is melted by described use screw extruder, farther include: described thermoplastic resin is mixed with one or more in the described group being made up of firming agent, grafting compatilizer and initiator.
7. method according to claim 1, it is characterised in that in the step that resin raw material is melted by described use screw extruder, is set as the temperature of described screw extruder in the scope of 150 DEG C and 320 DEG C.
8. method according to claim 5, it is characterised in that described firming agent is alkene firming agent.
9. method according to claim 5, it is characterised in that described initiator is radical initiator.
10. method according to claim 6, it is characterized in that, the thermoplastic resin of 47-95 weight portion is mixed with one or more in the group being made up of the firming agent of 1-20 weight portion, the grafting compatilizer of 0.2-3 weight portion and the initiator of 0.05-1 weight portion, and from the spout of described screw extruder, injects the described epoxide modified polybutadiene of 2-30 weight portion.
11. a composite plate, it is characterised in that described composite plate includes: two conductor plates and be clipped in the resin bed between described two conductor plates, described resin bed is made up of resin combination, and described resin combination includes:
The resin of 47-95 weight portion; And
The epoxide modified polybutadiene of 2-30 weight portion.
12. composite plate according to claim 11, it is characterised in that described resin combination farther includes:
The firming agent of 1-20 weight portion;
The grafting compatilizer of 0.2-3 weight portion; And
The initiator of 0.05-1 weight portion.
13. composite plate according to claim 11, it is characterised in that described resin is thermoplastic resin.
14. composite plate according to claim 12, it is characterised in that described firming agent is alkene firming agent.
15. composite plate according to claim 12, it is characterised in that described initiator is radical initiator.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410583528.6A CN105620000B (en) | 2014-10-27 | 2014-10-27 | A kind of composite plate and its manufacturing method |
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| CN201410583528.6A CN105620000B (en) | 2014-10-27 | 2014-10-27 | A kind of composite plate and its manufacturing method |
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| CN105620000A true CN105620000A (en) | 2016-06-01 |
| CN105620000B CN105620000B (en) | 2019-10-25 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61286130A (en) * | 1985-06-13 | 1986-12-16 | 松下電工株式会社 | Laminated board and manufacture thereof |
| JPS62104825A (en) * | 1985-08-23 | 1987-05-15 | Matsushita Electric Works Ltd | Production of polyphenylene oxide cured product |
| CN1745142A (en) * | 2003-01-28 | 2006-03-08 | 松下电工株式会社 | Poly(phenylene ether) resin composition, prepreg, and laminated sheet |
| US20080113187A1 (en) * | 2005-02-03 | 2008-05-15 | Kaoru Toyouchi | Resin Composition For High-Frequency Electronic And Electric Parts And Shaped Article Thereof |
| CN102942878A (en) * | 2012-11-29 | 2013-02-27 | 彭代信 | Thermoplastic resin adhesive film |
-
2014
- 2014-10-27 CN CN201410583528.6A patent/CN105620000B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61286130A (en) * | 1985-06-13 | 1986-12-16 | 松下電工株式会社 | Laminated board and manufacture thereof |
| JPS62104825A (en) * | 1985-08-23 | 1987-05-15 | Matsushita Electric Works Ltd | Production of polyphenylene oxide cured product |
| CN1745142A (en) * | 2003-01-28 | 2006-03-08 | 松下电工株式会社 | Poly(phenylene ether) resin composition, prepreg, and laminated sheet |
| US20080113187A1 (en) * | 2005-02-03 | 2008-05-15 | Kaoru Toyouchi | Resin Composition For High-Frequency Electronic And Electric Parts And Shaped Article Thereof |
| CN102942878A (en) * | 2012-11-29 | 2013-02-27 | 彭代信 | Thermoplastic resin adhesive film |
Non-Patent Citations (1)
| Title |
|---|
| 赵敏等: "《改性聚丙烯新材料》", 30 September 2002, 化学工业出版社 * |
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| CN105620000B (en) | 2019-10-25 |
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