CN102938982A - Processing method of printed wiring board with ultra-small solder mask intervals - Google Patents
Processing method of printed wiring board with ultra-small solder mask intervals Download PDFInfo
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- CN102938982A CN102938982A CN2012104486378A CN201210448637A CN102938982A CN 102938982 A CN102938982 A CN 102938982A CN 2012104486378 A CN2012104486378 A CN 2012104486378A CN 201210448637 A CN201210448637 A CN 201210448637A CN 102938982 A CN102938982 A CN 102938982A
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Abstract
The invention relates to a processing method of a printed wiring board and relates to a processing method of a printed wiring board with ultra-small solder mask intervals. The method includes the following steps of firstly, subjecting the printed wiring board to surface activating treatment, and then subjecting solder resist ink separation lines of the printed wiring board to screen printing in four hours after treatment; subjecting the printed wiring board to exposing, developing and solidifying at the temperature of 150 DEG C for 30 minutes after the screen printing of the solder resist ink separation lines; subjecting the solidified printed wiring board to surface activating treatment and then subjecting the solder resist ink separation lines of of the whole printed wiring board to electrostatic spraying in four hours after treatment; subjecting the printed wiring board to preliminary drying at the temperature of 80 DEG C for 40-50 minutes; and subjecting the preliminarily dried printed wiring board to exposing, developing and solidifying at the temperature of 150 DEG C for 60 minutes. By means of the processing method, the problem of poor binding forces between separation line ink and a printed wiring board base material is solved, and dropping of the solder resist ink separation lines is prevented in the process of subsequent processing.
Description
Technical field
The present invention relates to the processing method of printed wiring board, more particularly, relate to a kind of processing method of extra small anti-welding spacing printed wiring board.
Background technology
Development along with electronic information technology, electronic product is towards lightweight, microminiaturization, high speed future development, printed board is had higher requirement, and high density connects the epoch of (HDI) technology, and live width and line-spacing etc. are with the inevasible past little close trend development of healing of healing.In order to adapt to this development trend, printed wiring board Design and manufacture persons are also in the continuous manufacture method of Renewal Design theory and technique.Along with the increase of printed wiring board design density, for the also day by day raising of required precision of welding resistance ink lay.For the printed wiring board that requires extra small anti-welding spacing, traditional screen printing technique can not solve the problem that comes off every line.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the object of the invention provides a kind of processing method of extra small anti-welding spacing printed wiring board, solved that traditional screen printing technique cann't be solved every the line problem that comes off.
In order to solve existing problem in the prior art, the technical scheme that the present invention takes is: a kind of processing method of extra small anti-welding spacing printed wiring board may further comprise the steps:
1), first printed wiring board is carried out surface activation process, and in processing it is carried out welding resistance printing ink every the silk screen printing of line in rear 4 hours;
2), welding resistance printing ink is after the silk screen printing of line, to its expose → develop → solidify processing, in the film that described exposure is used, only design is every the exposure area at line place, other zones are the black area, do not expose, and be designed to 1mil every the SMD at line place pad dead zone annual ring, curing temperature was controlled at 150 ℃, curing time control at 30 minutes;
3), the printed wiring board after solidifying is carried out surface activation process, and in processing it is carried out the whole plate electrostatic spraying of welding resistance printing ink in rear 4 hours;
4) printed wiring board is carried out preliminary drying, temperature is controlled at 80 ℃, time and is controlled at 40-50 minute;
5) to pre-baked printed wiring board to explosure → development → curing, curing temperature was controlled at 150 ℃, curing time control at 60 minutes.
Described welding resistance ink thickness is according to half ink thickness of customer requirement.
Described printing length two ends every line all exceed SMD pad dead zone annual ring 1-1.5mil.
In the film that described step 5) exposure is used, every the year size of wheel windowing of the SMD of line place welding disking area by the customer requirement design, the SMD welding disking area on the described film is the black area, does not expose.
Beneficial effect of the present invention is: a kind of processing method of extra small anti-welding spacing printed wiring board may further comprise the steps: 1), first printed wiring board is carried out surface activation process, and it is carried out welding resistance printing ink every the silk screen printing of line in processing in rear 4 hours; 2), welding resistance printing ink is after the silk screen printing of line, to its expose → develop → solidify processing, in the film that described exposure is used, only design is every the exposure area at line place, other zones are the black area, do not expose, and be designed to 1mil every the SMD at line place pad dead zone annual ring, curing temperature was controlled at 150 ℃, curing time control at 30 minutes; 3), the printed wiring board after solidifying is carried out surface activation process, and in processing it is carried out the whole plate electrostatic spraying of welding resistance printing ink in rear 4 hours; 4) printed wiring board is carried out preliminary drying, temperature is controlled at 80 ℃, time and is controlled at 40-50 minute; 5) to pre-baked printed wiring board to explosure → development → curing, curing temperature was controlled at 150 ℃, curing time control at 60 minutes.Compared with the prior art, processing method of the present invention because welding resistance printing ink prints separately, exposes, solidifies every line, thoroughly solves the adhesion problem between line printing ink and printed wiring plate substrate, thereby guarantee in the following process process, stop welding resistance printing ink and occur every the line thing that comes off.In addition, use independently that film exposes separately every line to welding resistance printing ink, can not consider the aligning accuracy problem of other figures on the printed wiring board, so more easily control the aligning accuracy every line, avoid having improved product quality every line off normal platen.
Description of drawings
Fig. 1 is welding resistance printing ink structural representation between silk screen printing SMD pad of the present invention;
Fig. 2 is that the present invention is every the line structure schematic diagram;
Fig. 3 is electrostatic spraying ink structural representation of the present invention;
Fig. 4 is that printed wiring board of the present invention is every the line schematic appearance.
Among the figure: 1, SMD pad, 2, screen printing ink, 2-1, every line, 3, SMD pad dead zone annual ring, 4, electrostatic spraying ink
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
First printed wiring board is carried out surface activation process, and it is carried out welding resistance printing ink every the silk screen printing of line in processing in rear 4 hours; Welding resistance printing ink after the silk screen printing of line, to its expose → develop → solidify processing.
As shown in Figure 1, between the described SMD pad 1 by the above screen printing ink 2 of silk screen printing, the welding resistance ink thickness of described silk screen printing is that described printing length two ends every line 2-1 all exceed SMD pad dead zone annual ring 1-1.5mil according to half ink thickness of customer requirement.During exposure, the film of use only designs every the exposure area at line 2-1 place, and other zones are the black area, do not expose, and the dead zone annual ring of described SMD pad 1 every line 2-1 place is designed to 1mil, and curing temperature was controlled at 150 ℃, curing time control at 30 minutes.
As shown in Figure 2, printed wiring board after solidifying is carried out surface activation process, be that the ground pumice brush board is processed, and it is carried out the whole plate electrostatic spraying of welding resistance printing ink in processing in rear 4 hours, then printed wiring board is carried out preliminary drying, the preliminary drying temperature is controlled at 80 ℃, preliminary drying time and is controlled at 40-50 minute; Then to pre-baked printed wiring board to explosure → development → curing, in the film that exposure is used, described every the line 2-1 SMD of place pad 1 regional year size of wheel windowing by the customer requirement design, SMD pad 1 zone on the described film is the black area, does not expose.Curing temperature was controlled at 150 ℃, curing time control at 60 minutes, and after the curing, electrostatic spraying ink 4 and combine every line 2-1 forms complete welding resistance ink lay, shown in Fig. 3,4.
Claims (4)
1. the processing method of an extra small anti-welding spacing printed wiring board is characterized in that may further comprise the steps:
1), first printed wiring board is carried out surface activation process, and in processing it is carried out welding resistance printing ink every the silk screen printing of line in rear 4 hours;
2), welding resistance printing ink is after the silk screen printing of line, to its expose → develop → solidify processing, in the film that described exposure is used, only design is every the exposure area at line place, other zones are the black area, do not expose, and be designed to 1mil every the SMD at line place pad dead zone annual ring, curing temperature was controlled at 150 ℃, curing time control at 30 minutes;
3), the printed wiring board after solidifying is carried out surface activation process, and in processing it is carried out the whole plate electrostatic spraying of welding resistance printing ink in rear 4 hours;
4) printed wiring board is carried out preliminary drying, temperature is controlled at 80 ℃, time and is controlled at 40-50 minute;
5) to pre-baked printed wiring board to explosure → development → curing, curing temperature was controlled at 150 ℃, curing time control at 60 minutes.
2. the processing method of described a kind of extra small anti-welding spacing printed wiring board according to claim 1 is characterized in that: described welding resistance ink thickness is according to half ink thickness of customer requirement.
3. the processing method of described a kind of extra small anti-welding spacing printed wiring board according to claim 1, it is characterized in that: described printing length two ends every line all exceed SMD pad dead zone annual ring 1-1.5mil.
4. the processing method of a kind of extra small anti-welding spacing printed wiring board according to claim 1, it is characterized in that: in the film that described step 5) exposure is used, every the year size of wheel windowing of the SMD of line place welding disking area by the customer requirement design, SMD welding disking area on the described film is the black area, does not expose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104486378A CN102938982A (en) | 2012-11-10 | 2012-11-10 | Processing method of printed wiring board with ultra-small solder mask intervals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104486378A CN102938982A (en) | 2012-11-10 | 2012-11-10 | Processing method of printed wiring board with ultra-small solder mask intervals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102938982A true CN102938982A (en) | 2013-02-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104486378A Pending CN102938982A (en) | 2012-11-10 | 2012-11-10 | Processing method of printed wiring board with ultra-small solder mask intervals |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555039A (en) * | 2016-02-03 | 2016-05-04 | 江门崇达电路技术有限公司 | Method for fabricating line between two bonding pads of PCB |
| CN108990306A (en) * | 2018-08-15 | 2018-12-11 | 恩达电路(深圳)有限公司 | The processing method of extra small anti-welding spacing wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101795537A (en) * | 2010-03-09 | 2010-08-04 | 施吉连 | Solder mask printing technology of microwave high-frequency circuit board |
| CN102164458A (en) * | 2010-02-24 | 2011-08-24 | 苏州群策科技有限公司 | Drought-proof coating method for dense circuit boards |
| US20120103664A1 (en) * | 2009-06-30 | 2012-05-03 | Ronald Frosch | Multilayered printed circuit board, more particularly flame-resistant and/or smoke-suppressing multilayered printed circuit board |
-
2012
- 2012-11-10 CN CN2012104486378A patent/CN102938982A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120103664A1 (en) * | 2009-06-30 | 2012-05-03 | Ronald Frosch | Multilayered printed circuit board, more particularly flame-resistant and/or smoke-suppressing multilayered printed circuit board |
| CN102164458A (en) * | 2010-02-24 | 2011-08-24 | 苏州群策科技有限公司 | Drought-proof coating method for dense circuit boards |
| CN101795537A (en) * | 2010-03-09 | 2010-08-04 | 施吉连 | Solder mask printing technology of microwave high-frequency circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555039A (en) * | 2016-02-03 | 2016-05-04 | 江门崇达电路技术有限公司 | Method for fabricating line between two bonding pads of PCB |
| CN105555039B (en) * | 2016-02-03 | 2018-10-02 | 江门崇达电路技术有限公司 | A method of making lines between two pads of PCB |
| CN108990306A (en) * | 2018-08-15 | 2018-12-11 | 恩达电路(深圳)有限公司 | The processing method of extra small anti-welding spacing wiring board |
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Effective date of abandoning: 20160217 |
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