CN102929108A - Method for aligning by combining lenses with multiple magnifications in direct-writing photoetching machine - Google Patents
Method for aligning by combining lenses with multiple magnifications in direct-writing photoetching machine Download PDFInfo
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- CN102929108A CN102929108A CN2012105087430A CN201210508743A CN102929108A CN 102929108 A CN102929108 A CN 102929108A CN 2012105087430 A CN2012105087430 A CN 2012105087430A CN 201210508743 A CN201210508743 A CN 201210508743A CN 102929108 A CN102929108 A CN 102929108A
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Abstract
The invention discloses a method for aligning by combining lenses with multiple magnifications in a direct-writing photoetching machine, and the method comprises the following steps of: (1) additionally arranging at least one lens converter between the objective lens and optical path of the direct-writing photoetching machine; (2) sequentially installing 5-magnification, 10-magnification and 20-magnification lens on the lens converter; (3) finding an alignment mark through the 5-magnification lens, moving the alignment mark to a view field center, and then sequentially finding alignment marks through the 10-magnification and the 20-magnification lens and moving the alignment marks to the view field center; (4) finding the alignment mark through a 50-magnification lens, moving the alignment mark to the view field center, and then extracting the center coordinates of the alignment marks. The method disclosed by the invention has the advantages of enhancing the accuracy of the relation of interlaminar relative positions of an exposure pattern by enhancing the alignment accuracy, solving the problem of difficult finding of the alignment marks when using a low-magnification single objective lens and increasing the exposure production efficiency of photoetching machines.
Description
Technical field
The present invention is specifically related to the method that multiple multiplying power camera lens combines and aims in a kind of direct-write type lithography machine, belongs to litho machine and aims at control field.
Background technology
The track control system of direct-write type lithography machine, by spatial light modulator (SLM), lighting source is reflexed on to be processed, then use the reflected light of graphical sensory device (CCD) on gathering to be processed to obtain alignment patterns information, then calculate the centre of figure coordinate by the graphical information of obtaining.Calculate to be processed with respect to the side-play amount of photoetching machine motion platform according to a plurality of alignment patterns centre coordinates on to be processed, and in exposure system, recompense.
Direct-write type lithography machine is the essential equipment of exposure process in the semiconductor production process, and has comprised the multiple tracks exposure process in semiconductor production process, and the corresponding one deck exposure figure of per pass exposure process, namely semiconductor production process has comprised the multilayer exposure figure.The semiconductor product whether qualified and quality of properties of product and the interlayer relative position relation of exposure figure has direct relation, and this position relationship precision is determined by the aligning control accuracy of litho machine.
But prior art only adopts lower object lens of multiplying power to obtain the alignment mark centre coordinate, and the searching that not only is not easy to alignment mark affects the photo-etching machine exposal production capacity, and can not guarantee the figure coordinate precision obtained.
Summary of the invention
The object of the present invention is to provide the method that multiple multiplying power camera lens combines and aims in a kind of direct-write type lithography machine, to solve alignment mark searching difficulty in the prior art, the problem that alignment precision is low.
In order to achieve the above object, the technical solution adopted in the present invention is:
The method that multiple multiplying power camera lens combines and aims in a kind of direct-write type lithography machine may further comprise the steps:
(1) between the object lens of direct-write type lithography machine and light path, sets up at least one lens converter;
(2) 5 times, 10 times, 20 times and 50 times of camera lenses are installed successively on described lens converter;
(3) seek alignment mark with 5 times of camera lenses, and alignment mark is moved on to field of view center, find alignment mark and alignment mark is moved on to field of view center with 10 times of camera lenses, 20 times of camera lenses successively thereafter;
(4) under 50 times of camera lenses, find alignment mark and alignment mark is moved on to field of view center, then extract the alignment mark centre coordinate.
Further, be provided with at least 5 times, 10 times, 20 times and 50 times of camera lens installation positions on the described lens converter, and described lens converter can rotate under manual or automatically controlled driving.
Comparatively preferred, described lens converter and electric control driving device are in transmission connection.
Refer to the actual enlargement ratio of direct-write type lithography machine object lens at the multiple of camera lens described in the step (2).
Refer to the center of object lens observation scope at field of view center described in the step (3).
In step (3) and step (4), the searching of alignment mark is auxiliary lower realization of CCD.
Alignment mark centre coordinate described in the step (4) is the coordinate of centre of figure in direct-write type lithography machine article carrying platform coordinate system of alignment mark.
The multiple multiplying power camera lens method of aiming at that combines also comprises in the described direct-write type lithography machine: utilize step (4) gained alignment mark centre coordinate to carry out the aligning computing of direct-write type lithography machine.
Compared with prior art, advantage of the present invention is at least: by improving alignment precision, thereby improved the interlayer relative position relation precision of exposure figure, and solved when adopting the single object lens of low range, alignment mark is sought difficult problem, has improved photo-etching machine exposal production efficiency.
Description of drawings
Fig. 1 is the illustraton of model of an optical alignment system related to the present invention.
Fig. 2 is the procedure chart of seeking alignment mark in the alignment procedures
Fig. 3 is the design sketch of respectively aiming at identical alignment mark under the camera lens
Embodiment
The present invention is intended to provide the method that multiple multiplying power camera lens combines and aims in a kind of direct-write type lithography machine for the deficiencies in the prior art.As one of comparatively preferred embodiment, technical scheme of the present invention can comprise:
(1) at first between the object lens of direct-write type lithography machine and light path, increases a lens converter;
(2) then 5 times, 10 times, 20 times and 50 times of camera lenses are installed on the lens converter successively, as aiming at camera lens;
(3) seek alignment mark with 5 times of camera lenses, and alignment mark is moved on to field of view center, find alignment mark and alignment mark is moved on to field of view center with 10 times of camera lenses, 20 times of camera lenses successively thereafter;
(4) under 50 times of camera lenses, find alignment mark and alignment mark is moved on to field of view center, then extract the alignment mark centre coordinate.
Particularly, the lens converter in the described step (1), it is that a plurality of camera lenses can be installed, and can be by the device of manual or automatically controlled rotation.
In the described step (2), the camera lens multiple refers to the actual enlargement ratio of direct-write type lithography machine object lens.
In the described step (3), field of view center refers to the center of object lens observation scope.The lower visual field of the multiplying power of object lens is larger.Graphical sensory device (CCD) has been used in the searching of alignment mark.
In the described step (4), the alignment mark centre coordinate is the coordinate of centre of figure in direct-write type lithography machine article carrying platform coordinate system of alignment mark; And the centre coordinate under 50 times of camera lenses participates in the aligning computing of direct-write type lithography machine.
Below in conjunction with a preferred embodiment technical scheme of the present invention is described further.
Consulting shown in Figure 1 is the model of an optical alignment system in the present embodiment, the light beam 2 that light source 1 sends arrives pattern generator (SLM) 3 through light path, to be processed 6 (5 is lens converter and the combination of aiming at camera lens shown in the figure through aiming at camera lens arrival by the first folded light beam 4 after the pattern generator reflection, the selection of wherein aiming at camera lens can realize by lens converter, lens converter can rotate by the sense of rotation of selecting among Fig. 1), the second folded light beam 7 that is reflected back for to be processed 6 arrives imageing sensor 8 through aiming at camera lens again, graphical sensory device 8 is depicted to be processed graphical information by gathering the second folded light beam 7.
Consulting shown in Figure 2 is the process of seeking alignment mark in the alignment procedures, wherein, A aims at camera lens, B is the visual field of aiming at camera lens, C is to be processed, and (face to be processed is placed on the article carrying platform of lithographic equipment, can carry out by platform the motion of level and vertical direction), D is the alignment mark on to be processed, E is to be processed tangential movement direction of relatively aiming at camera lens, F is to be processed vertical movement direction of relatively aiming at camera lens, G is to be processed folded light beam, and H is the graphical sensory device.After entering the visual field B that aims at camera lens as the alignment mark D on to be processed, alignment system gets access to graphical information by graphical sensory device H, and the article carrying platform by direct-write type lithography machine is with the center of the alignment mark D on to be processed to the visual field B that aims at camera lens
Consult the different effects of aiming at identical alignment mark under the camera lens that tie up to shown in Figure 3, wherein image 10～40 is respectively under 5 times, 10 times, 20 times and the 50 times of camera lenses alignment mark at the design sketch of field of view center, obviously, wherein the visual field of image 10 is maximum, be mainly used in seeking alignment mark, the visual field of image 40 is minimum, but enlargement ratio is maximum, can accurately extract the centre coordinate of alignment mark in image 40.
The present invention utilizes lens converter with the combination of the camera lens of multiple multiplying power, and obtains alignment mark information on to be processed with the graphical sensory device.Under 5 times of large camera lenses of visual field, seek alignment mark, solved the problem of seeking the alignment mark difficulty.Progressively be transitioned into 50 times of camera lenses in conjunction with 10 times with 20 times of camera lenses, to guarantee that alignment mark can remain on field of view center always.Use 50 times of camera lenses to increase the figure enlargement ratio, can obtain more accurately the alignment mark centre coordinate, thereby improve alignment precision, improved the interlayer relative position relation precision of exposure figure.
Although embodiment of the present invention are open as above, but it is not restricted to listed utilization in instructions and the embodiment, it can be applied to various suitable the field of the invention fully, for those skilled in the art, can easily realize other modification, therefore do not deviating under the universal that claim and equivalency range limit, the present invention is not limited to specific details and illustrates here and the legend of describing.
Claims (8)
1. the method that multiple multiplying power camera lens combines and aims in the direct-write type lithography machine is characterized in that, may further comprise the steps:
(1) between the object lens of direct-write type lithography machine and light path, sets up at least one lens converter;
(2) 5 times, 10 times, 20 times and 50 times of camera lenses are installed successively on described lens converter;
(3) seek alignment mark with 5 times of camera lenses, and alignment mark is moved on to field of view center, find alignment mark and alignment mark is moved on to field of view center with 10 times of camera lenses, 20 times of camera lenses successively thereafter;
(4) under 50 times of camera lenses, find alignment mark and alignment mark is moved on to field of view center, then extract the alignment mark centre coordinate.
2. the method that multiple multiplying power camera lens combines and aims in the direct-write type lithography machine according to claim 1, it is characterized in that, at least be provided with 5 times, 10 times, 20 times and 50 times of camera lens installation positions on the described lens converter, and described lens converter can rotate under manual or automatically controlled driving.
3. the method that multiple multiplying power camera lens combines and aims in the direct-write type lithography machine according to claim 1 and 2 is characterized in that described lens converter and electric control driving device are in transmission connection.
4. the method that multiple multiplying power camera lens combines and aims in the direct-write type lithography machine according to claim 1 is characterized in that, refers to the actual enlargement ratio of direct-write type lithography machine object lens at the multiple of camera lens described in the step (2).
5. the method that multiple multiplying power camera lens combines and aims in the direct-write type lithography machine according to claim 1 is characterized in that, refers to the center of object lens observation scope at field of view center described in the step (3).
6. the method that multiple multiplying power camera lens combines and aims in the direct-write type lithography machine according to claim 1 is characterized in that, in step (3) and step (4), the searching of alignment mark is auxiliary lower realization of CCD.
7. the method that multiple multiplying power camera lens combines and aims in the direct-write type lithography machine according to claim 1, it is characterized in that, alignment mark centre coordinate described in the step (4) is the coordinate of centre of figure in direct-write type lithography machine article carrying platform coordinate system of alignment mark.
8. according to claim 1 or the method that multiple multiplying power camera lens combines and aims in the 7 described direct-write type lithography machines, it is characterized in that, it also comprises: utilize step (4) gained alignment mark centre coordinate to carry out the aligning computing of direct-write type lithography machine.
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| CN2012105087430A CN102929108A (en) | 2012-12-04 | 2012-12-04 | Method for aligning by combining lenses with multiple magnifications in direct-writing photoetching machine |
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| CN2012105087430A CN102929108A (en) | 2012-12-04 | 2012-12-04 | Method for aligning by combining lenses with multiple magnifications in direct-writing photoetching machine |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104076611A (en) * | 2013-03-27 | 2014-10-01 | 上海微电子装备有限公司 | Imaging calibration method for spliced objectives of photoetching equipment |
| CN108303858A (en) * | 2018-03-09 | 2018-07-20 | 中山新诺科技股份有限公司 | A kind of maskless lithography system and its exposure method |
| CN110299318A (en) * | 2019-07-01 | 2019-10-01 | 武汉新芯集成电路制造有限公司 | Wafer alignment method |
| CN111142343A (en) * | 2020-01-02 | 2020-05-12 | 长江存储科技有限责任公司 | Method for generating center coordinates of alignment mark |
| CN113168087A (en) * | 2018-11-15 | 2021-07-23 | 应用材料公司 | Self-alignment system and method for photoetching system |
| CN115113495A (en) * | 2022-08-29 | 2022-09-27 | 赫智科技(苏州)有限公司 | Photoetching light splitting system and photoetching equipment |
| CN115628685A (en) * | 2022-08-15 | 2023-01-20 | 魅杰光电科技(上海)有限公司 | Method and equipment for measuring critical dimension and method for positioning critical dimension in grading manner |
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| JP2000147795A (en) * | 1998-11-11 | 2000-05-26 | Ushio Inc | Alignment microscope |
| CN201083960Y (en) * | 2007-05-23 | 2008-07-09 | 芯硕半导体（合肥）有限公司 | Direct-writing lithographic equipment |
| CN201138424Y (en) * | 2007-09-30 | 2008-10-22 | 芯硕半导体（合肥）有限公司 | Aligning mark mechanism for wafer aligning of projecting lens conversion |
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| CN1156327A (en) * | 1995-11-15 | 1997-08-06 | 日本电气株式会社 | Electronic beam unit projection stamp mark system |
| JP2000147795A (en) * | 1998-11-11 | 2000-05-26 | Ushio Inc | Alignment microscope |
| CN201083960Y (en) * | 2007-05-23 | 2008-07-09 | 芯硕半导体（合肥）有限公司 | Direct-writing lithographic equipment |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104076611A (en) * | 2013-03-27 | 2014-10-01 | 上海微电子装备有限公司 | Imaging calibration method for spliced objectives of photoetching equipment |
| CN104076611B (en) * | 2013-03-27 | 2016-07-06 | 上海微电子装备有限公司 | Calibration method is surveyed in splicing object lens imaging for lithographic equipment |
| CN108303858A (en) * | 2018-03-09 | 2018-07-20 | 中山新诺科技股份有限公司 | A kind of maskless lithography system and its exposure method |
| CN113168087A (en) * | 2018-11-15 | 2021-07-23 | 应用材料公司 | Self-alignment system and method for photoetching system |
| CN113168087B (en) * | 2018-11-15 | 2024-05-14 | 应用材料公司 | Self-aligned system and method for a lithography system |
| CN110299318A (en) * | 2019-07-01 | 2019-10-01 | 武汉新芯集成电路制造有限公司 | Wafer alignment method |
| CN111142343A (en) * | 2020-01-02 | 2020-05-12 | 长江存储科技有限责任公司 | Method for generating center coordinates of alignment mark |
| CN111142343B (en) * | 2020-01-02 | 2022-11-18 | 长江存储科技有限责任公司 | Method for generating center coordinates of alignment mark |
| CN115628685A (en) * | 2022-08-15 | 2023-01-20 | 魅杰光电科技(上海)有限公司 | Method and equipment for measuring critical dimension and method for positioning critical dimension in grading manner |
| CN115628685B (en) * | 2022-08-15 | 2024-03-26 | 魅杰光电科技(上海)有限公司 | Method and equipment for measuring critical dimension and method for classifying and positioning critical dimension |
| CN115113495A (en) * | 2022-08-29 | 2022-09-27 | 赫智科技(苏州)有限公司 | Photoetching light splitting system and photoetching equipment |
| CN115113495B (en) * | 2022-08-29 | 2022-11-29 | 赫智科技(苏州)有限公司 | Photoetching light splitting system and photoetching equipment |
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Application publication date: 20130213 |