CN102922400A - Buffing device - Google Patents
Buffing device Download PDFInfo
- Publication number
- CN102922400A CN102922400A CN2012104450501A CN201210445050A CN102922400A CN 102922400 A CN102922400 A CN 102922400A CN 2012104450501 A CN2012104450501 A CN 2012104450501A CN 201210445050 A CN201210445050 A CN 201210445050A CN 102922400 A CN102922400 A CN 102922400A
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- CN
- China
- Prior art keywords
- polishing plate
- disk pedestal
- grinding layer
- burnishing device
- outer ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a buffing device which comprises a circular disc base seat, a plurality of buffing plates, a grinding layer, a center pressing disc and an outer ring pressing disc. The plurality of buffing plates are arranged on the circular disc base seat. The grinding layer is paved between the circular disc base seat and the plurality of buffing plates. A thread through hole is formed in the center position of the circular disc base seat, and the center pressing disc fixes the grinding layer on the upper surface of the circular disc base seat by the fact that a fixed bolt is coupled with a thread inside the thread through hole. A plurality of protrusions which are in a circular ring shape are arranged on the outer ring of the circular disc base seat, each protrusion in a circular ring shape is of a hollow thread structure, and the outer ring pressing disc fixes the circular disc base seat on an outer support by the fact that fixed bolts are respectively coupled with the hollow thread structures. The buffing device can dispose the plurality of buffing plates at one time, and processing speed is improved.
Description
Technical field
The present invention relates to polish milling apparatus, relate in particular to a kind of burnishing device.
Background technology
Burnishing device is a kind of electric tool, and burnishing device is comprised of primary elements such as base, mill, grinding cover and lids.Motor is fixed on the base, and the tapered sleeve that the fixing polishing dish is used links to each other with motor reel by screw.Grind fabric and be fastened on the abrasive disk by lasso, after motor started by the switch connection power supply on the base, just available hand was exerted pressure to sample and is ground at the abrasive disk that rotates.The lapping liquid that adds in the process of lapping can flow in the square plate that places the burnishing device side by the drainpipe that is fixed in the vinyl disc on the base.Grinding cover and lid can prevent that dirt and other foreign material from dropping on and grind on the fabric and affect result of use when machine does not use.
For different application, need the dissimilar burnishing device of exploitation.Particularly, need to be for the special burnishing device of special application and development.Traditional burnishing device only is that monolithic is processed, and perhaps the multi-disc of pipeline system is processed synchronously.The former processing mode treatment effeciency is low, although the latter's processing mode has realized batch process, is difficult to require to provide the Extraordinary multi-disc to process simultaneously for different machined parameters.
Summary of the invention
The present inventor's combination research and development experience has for many years been developed a kind of burnishing device, comprising:
The disk pedestal;
A plurality of polishing plates are arranged on the described disk pedestal;
Grinding layer is layed between described disk pedestal and the described a plurality of polishing plate;
The center platen, the center of wherein said disk pedestal has a tapped through hole, and described center platen is fixed in described grinding layer on the upper surface of described disk pedestal via the screw thread couple of a set bolt and described tapped through hole; And
The outer ring platen, the outer ring of wherein said disk pedestal is provided with a plurality of circular projections, each circular projection is the cannulated threaded structure, and described outer ring platen is fixed in described disk pedestal on one outside support by the screw thread couple of set bolt and described cannulated threaded structure respectively.
Preferably, according to a preferred embodiment of the invention, in above-mentioned burnishing device, described a plurality of polishing plates are all in the form of annular discs, and described a plurality of polishing plate is arranged on the upper surface of described grinding layer symmetrically.
Preferably, according to a preferred embodiment of the invention, in above-mentioned burnishing device, further comprise a plurality of pressing components, the pressure block that described pressing component comprises press rods and is fixed in an end place of described press rods, described pressure block is identical with the section shape of described polishing plate, wherein said pressure block with the contacted surface of described polishing plate be rough surface.
Preferably, according to a preferred embodiment of the invention, in above-mentioned burnishing device, in when work, described pressing component is pressed described polishing plate, with and described polishing plate between drive described polishing plate after forming the friction coupling and rotate around described press rods.
Preferably, according to a preferred embodiment of the invention, in above-mentioned burnishing device, when driving described polishing plate around described press rods rotation, between described polishing plate and described grinding layer, apply grinding agent, to promote the abrasive action between described polishing plate and the described grinding layer.
The present invention can a plurality of polishing plates of disposable processing, have improved process velocity.In addition, can apply to different polishing plates different rotating speeds, a plurality of polishing plates that require to process simultaneously different machining parameters.
Should be appreciated that the above generality of the present invention is described and the following detailed description all is exemplary and explanat, and be intended to the further explanation that the invention provides for as claimed in claim.
Description of drawings
Accompanying drawing mainly is be used to providing the present invention further to be understood.Accompanying drawing shows embodiments of the invention, and plays the effect of explaining the principle of the invention with this specification.In the accompanying drawing:
Fig. 1 schematically shows the basic structure of burnishing device of the present invention.
The specific embodiment
Discuss a plurality of embodiment of the present invention in detail below in conjunction with accompanying drawing.
Fig. 1 schematically shows the basic structure of burnishing device 100 of the present invention.As shown in the figure, burnishing device 100 of the present invention mainly can comprise: disk pedestal 101, polishing plate 102, grinding layer 103, center platen 104, outer ring platen 105.
A plurality of polishing plates 102 are arranged on the described disk pedestal 101.Grinding layer 103 is layed between described disk pedestal 101 and the described a plurality of polishing plate 102.Preferably, according to a preferred embodiment of the invention, described a plurality of polishing plates 102 are all in the form of annular discs, and described a plurality of polishing plate 102 is arranged on the upper surface of described grinding layer 103 symmetrically.
As described in Figure 1, the center of described disk pedestal 101 has a tapped through hole, and described center platen 104 is fixed in described grinding layer on the upper surface of described disk pedestal 101 via the screw thread couple of a set bolt and described tapped through hole.
In addition, the outer ring of described disk pedestal 101 is provided with a plurality of circular projections, each circular projection is the cannulated threaded structure, and described outer ring platen 105 is fixed in described disk pedestal 101 on the outside support by the screw thread couple of set bolt and described cannulated threaded structure respectively.
Preferably, according to a preferred embodiment of the invention, in above-mentioned burnishing device 100, further comprise a plurality of pressing components, the pressure block 107 that described pressing component comprises press rods 106 and is fixed in an end place of described press rods 106.Can see from accompanying drawing, described pressure block 106 is identical with the section shape of described polishing plate 102, wherein said pressure block 106 with described polishing plate 102 contacted surfaces be rough surface.
In when work, described pressing component is pressed described polishing plate 102, with and described polishing plate 102 between drive described polishing plate 102 around described press rods 106 rotations after forming the friction coupling.
Preferably, when driving described polishing plate 102 around described press rods 106 rotation, between described polishing plate 102 and described grinding layer 103, apply grinding agent, to promote the abrasive action between described polishing plate 102 and the described grinding layer 103.
Like this, the present invention can a plurality of polishing plates of disposable processing, have improved process velocity.
In addition, can apply for different polishing plates different rotating speeds, in order to process simultaneously a plurality of polishing plates that different machining parameters requires.
Above-described embodiment provides to those of ordinary skills and realizes or use of the present invention; those of ordinary skills can be in the situation that do not break away from invention thought of the present invention; above-described embodiment is made various modifications or variation; thereby protection scope of the present invention do not limit by above-described embodiment, and should be the maximum magnitude that meets the inventive features that claims mention.
Claims (5)
1. burnishing device comprises:
The disk pedestal;
A plurality of polishing plates are arranged on the described disk pedestal;
Grinding layer is layed between described disk pedestal and the described a plurality of polishing plate;
The center platen, the center of wherein said disk pedestal has a tapped through hole, and described center platen is fixed in described grinding layer on the upper surface of described disk pedestal via the screw thread couple of a set bolt and described tapped through hole; And
The outer ring platen, the outer ring of wherein said disk pedestal is provided with a plurality of circular projections, each circular projection is the cannulated threaded structure, and described outer ring platen is fixed in described disk pedestal on one outside support by the screw thread couple of set bolt and described cannulated threaded structure respectively.
2. burnishing device as claimed in claim 1 is characterized in that, described a plurality of polishing plates are all in the form of annular discs, and described a plurality of polishing plate is arranged on the upper surface of described grinding layer symmetrically.
3. burnishing device as claimed in claim 1, it is characterized in that, further comprise a plurality of pressing components, the pressure block that described pressing component comprises press rods and is fixed in an end place of described press rods, described pressure block is identical with the section shape of described polishing plate, wherein said pressure block with the contacted surface of described polishing plate be rough surface.
4. burnishing device as claimed in claim 3 is characterized in that, in when work, described pressing component is pressed described polishing plate, with and described polishing plate between drive described polishing plate after forming the friction coupling and rotate around described press rods.
5. burnishing device as claimed in claim 4 is characterized in that, when driving described polishing plate around described press rods rotation, applies grinding agent between described polishing plate and described grinding layer, to promote the abrasive action between described polishing plate and the described grinding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104450501A CN102922400A (en) | 2012-11-09 | 2012-11-09 | Buffing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104450501A CN102922400A (en) | 2012-11-09 | 2012-11-09 | Buffing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102922400A true CN102922400A (en) | 2013-02-13 |
Family
ID=47637400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104450501A Pending CN102922400A (en) | 2012-11-09 | 2012-11-09 | Buffing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102922400A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020197745A1 (en) * | 2001-06-19 | 2002-12-26 | Shanmugasundram Arulkumar P. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| CN1505110A (en) * | 2002-12-04 | 2004-06-16 | ���µ�����ҵ��ʽ���� | Chemical mechanical polishing method and apparatus |
| CN1661780A (en) * | 2004-02-27 | 2005-08-31 | 台湾积体电路制造股份有限公司 | CMP apparatus and polishing method |
| CN101073878A (en) * | 2006-05-17 | 2007-11-21 | 联华电子股份有限公司 | Method for polishing chemical machinery |
| CN101159230A (en) * | 2006-10-03 | 2008-04-09 | 松下电器产业株式会社 | Substrate processing apparatus and substrate processing method |
-
2012
- 2012-11-09 CN CN2012104450501A patent/CN102922400A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020197745A1 (en) * | 2001-06-19 | 2002-12-26 | Shanmugasundram Arulkumar P. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| CN1505110A (en) * | 2002-12-04 | 2004-06-16 | ���µ�����ҵ��ʽ���� | Chemical mechanical polishing method and apparatus |
| CN1661780A (en) * | 2004-02-27 | 2005-08-31 | 台湾积体电路制造股份有限公司 | CMP apparatus and polishing method |
| CN101073878A (en) * | 2006-05-17 | 2007-11-21 | 联华电子股份有限公司 | Method for polishing chemical machinery |
| CN101159230A (en) * | 2006-10-03 | 2008-04-09 | 松下电器产业株式会社 | Substrate processing apparatus and substrate processing method |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
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Application publication date: 20130213 |