CN202428308U - Polishing disc and polishing machine table - Google Patents
Polishing disc and polishing machine table Download PDFInfo
- Publication number
- CN202428308U CN202428308U CN2011205107543U CN201120510754U CN202428308U CN 202428308 U CN202428308 U CN 202428308U CN 2011205107543 U CN2011205107543 U CN 2011205107543U CN 201120510754 U CN201120510754 U CN 201120510754U CN 202428308 U CN202428308 U CN 202428308U
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- CN
- China
- Prior art keywords
- abrasive disk
- hole
- cover plate
- polishing disc
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model discloses a polishing disc and a polishing machine table. The polishing machine table comprises the polishing disc and a polishing pad arranged on the polishing disc. The polishing disc comprises a polishing disc body, a through hole covering plate and a transparent laser window covering plate, the polishing disc body is provided with the front and the back, a through hole used for accommodating a polish laser device is arranged on the polishing disc body, the through hole covering plate is arranged on the front of the polishing disc body and covered one end of the through hole, a laser window hole is arranged on the through hole covering plate, and the laser window covering plate is covered on the laser window hole. When the polish laser device is needed to be exchanged, the polish laser device can be exchanged directly by opening the through hole covering plate through the front of the polishing disc body without disassembling the polishing disc, so that the polishing disc is time-saving and Limbourg-saving, cost is saved, and maintenance efficiency is improved.
Description
Technical field
The utility model relates to the semiconductor grinding field, relates in particular to a kind of abrasive disk and grinder station.
Background technology
At present, in field of semiconductor manufacture extensive use chemical mechanical milling tech (Chemical Mechanical Polishing) to having an even surface of wafer.Chemical mechanical milling tech is the technical process of a complicacy; It is that crystal column surface is contacted with the lapped face of grinding pad; Then, with flattening wafer surface, adopt grinder station to carry out chemical mechanical milling tech through the relative motion between crystal column surface and the lapped face usually.Said grinder station comprises a cmp head; When carrying out grinding technics, the wafer that will grind is attached on the grinding head, and this wafer to be ground faces down and contact counterrotating grinding pad; The downforce that grinding head provides is pressed onto this wafer on the grinding pad; Said grinding pad is to be pasted on the abrasive disk (platen), and when rotating under the drive of this abrasive disk at motor, grinding pad also carries out corresponding sports.Simultaneously; Lapping liquid is transported on the grinding pad through the lapping liquid supply line; And be evenly distributed on the grinding pad through centrifugal force, being provided with laser detector (ISRM Polish Laser) in the said abrasive disk, said laser detector is used to detect the thickness that wafer is ground off.
See also Fig. 1 and Fig. 2, shown in Figure 1 is the schematic top plan view of abrasive disk in the existing grinder station; Shown in Figure 2 is the elevational schematic view of abrasive disk in the existing grinder station.Existing abrasive disk comprises the abrasive disk body 100 with front 110 and back side 120; Wafer 140 is positioned on the abrasive disk body 100 with grinding pad; The back side 120 of said abrasive disk body 100 is provided with a groove 130 that is used for ccontaining laser detector (not shown); This groove 130 does not penetrate abrasive disk body 100, and the bottom of said groove 130 is provided with a laser window oral pore 131, and said laser window oral pore 131 is provided with transparent laser window flap (not shown).
Existing grinder station and abrasive disk thereof because laser detector 130 is installed on the back side of said abrasive disk body 100, therefore, in case laser detector 130 failover need to change, must disassemble abrasive disk, could change laser detector.
On the one hand, because abrasive disk itself is very heavy, the work of dismounting abrasive disk is very heavy, and must two people operate, and not only wastes time and energy, and causes injury to personnel easily.
On the other hand, because abrasive disk contacts with chemicals all the time, therefore, it is very careful to need when abrasive disk is installed, and there have carelessness to install slightly to be not in place, causes and leak.After having reinstalled abrasive disk, need do horizontal checkout, cumbersome.
Again on the one hand, when abrasive disk is installed, need to change the correlated parts of abrasive disk, for example O-ring seals (O-ring), packing ring (washer), bolt (bullet screw) or the like cause the waste of material thus.
Therefore, how to provide a kind of can be so that to change the abrasive disk of laser detector be the technical problem that this area needs to be resolved hurrily.
The utility model content
The purpose of the utility model is to provide a kind of abrasive disk, need not to dismantle the replacing that abrasive disk promptly can be realized abrasive disk inner laser checkout gear, and is time saving and energy saving.
In order to reach above-mentioned purpose, the utility model adopts following technical scheme:
A kind of abrasive disk; Comprise abrasive disk body with front and back; Said abrasive disk also comprises through hole cover plate and transparent laser window cover plate, and said abrasive disk body is provided with the through hole that is used for ccontaining laser detector, and said through hole cover plate is arranged at the positive of said abrasive disk body and covers at said through hole one end; Also be provided with the laser window oral pore on the said through hole cover plate, said laser window cover plate covers on said laser window oral pore.
Said through hole cover plate is transparent.
Said through hole cover plate is opaque.
" O " shape sealing ring is set between said through hole cover plate and the said through hole.
The invention also discloses a kind of grinder station, comprise grinding pad and abrasive disk, said grinding pad is arranged on the said abrasive disk, and said abrasive disk adopts aforesaid abrasive disk.
Abrasive disk that the utility model provides and grinder station; Owing on said abrasive disk body, offer through hole, through hole cover plate and a transparent laser window cover plate that is used for ccontaining laser detector, said through hole cover plate is arranged at the positive of said abrasive disk body and covers at said through hole one end, also is provided with the laser window oral pore on the said through hole cover plate; Said laser window cover plate covers on said laser window oral pore; Therefore, when needs are changed laser detector, need not abrasive disk is disassembled; Can directly promptly can carry out more changing jobs of laser detector through open the through hole cover plate in the front of abrasive disk body; Time saving and energy saving, not only practice thrift cost, and improved maintenance efficiency.
Description of drawings
Abrasive disk of the utility model and grinder station are provided by following embodiment and accompanying drawing.
Fig. 1 is the schematic top plan view of abrasive disk in the existing grinder station;
Fig. 2 is the elevational schematic view of abrasive disk in the existing grinder station;
Fig. 3 is the schematic top plan view of abrasive disk in the grinder station of the utility model one embodiment;
Fig. 4 is the elevational schematic view of abrasive disk in the grinder station of the utility model one embodiment;
The specific embodiment
Below will do further to describe in detail to the abrasive disk and the grinder station of the utility model.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented the preferred embodiment of the utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize the advantageous effects of the utility model.Therefore, following description is appreciated that extensively knowing to those skilled in the art, and not as the restriction to the utility model.
For clear, whole characteristics of practical embodiments are not described.In following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development possibly be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose, the characteristic that make the utility model is more obviously understandable, be further described below in conjunction with the specific embodiment of accompanying drawing to the utility model.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 3 and Fig. 4, wherein, shown in Figure 3 is the schematic top plan view of abrasive disk in the grinder station of the utility model one embodiment, and shown in Figure 4 is the elevational schematic view of abrasive disk in the grinder station of the utility model one embodiment.
This grinder station comprises grinding pad (not shown) and abrasive disk, and said grinding pad is arranged on the said abrasive disk.Said abrasive disk comprises abrasive disk body 200, through hole cover plate 240 and the transparent laser window cover plate 250 with front 210 and back side 220; Said abrasive disk body 200 is provided with the through hole 230 that is used for ccontaining laser detector (not shown); Said through hole cover plate 240 is arranged at the front 210 of said abrasive disk body 200 and covers at said through hole 230 1 ends; Also be provided with laser window oral pore 241 on the said through hole cover plate 240, said laser window cover plate 250 covers on said laser window oral pore 241.When needs are changed laser detector; Need not abrasive disk is disassembled, can directly promptly can carry out more changing jobs of laser detector through opening through hole cover plate 240 in the front 210 of abrasive disk body 200, time saving and energy saving; Not only practice thrift cost, and improved maintenance efficiency
Said through hole cover plate 240 can be transparent, also can be opaque.Whether in the present embodiment, said through hole cover plate 240 is transparent, break down to maintain easily personnel's preliminary observation checkout gear.
Preferably, in this enforcement, " O " shape sealing ring (not shown) is set between said through hole cover plate 240 and the said through hole 230.Through " O " shape sealing ring is set, can avoid lapping liquid contact laser detector, can protect laser detector thus.
In sum, abrasive disk that the utility model provides and grinder station are owing to offer through hole, through hole cover plate and a transparent laser window cover plate that is used for ccontaining laser detector on said abrasive disk body; Said through hole cover plate is arranged at the positive of said abrasive disk body and covers at said through hole one end; Also be provided with the laser window oral pore on the said through hole cover plate, said laser window cover plate covers on said laser window oral pore, therefore; When needs are changed laser detector; Need not abrasive disk is disassembled, can directly promptly can carry out more changing jobs of laser detector through open the through hole cover plate in the front of abrasive disk body, time saving and energy saving; Not only practice thrift cost, and improved maintenance efficiency.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.
Claims (5)
1. abrasive disk; Comprise abrasive disk body, it is characterized in that said abrasive disk also comprises through hole cover plate and transparent laser window cover plate with front and back; Said abrasive disk body is provided with the through hole that is used for ccontaining laser detector; Said through hole cover plate is arranged at the positive of said abrasive disk body and covers at said through hole one end, also is provided with the laser window oral pore on the said through hole cover plate, and said laser window cover plate covers on said laser window oral pore.
2. abrasive disk according to claim 1 is characterized in that, said through hole cover plate is transparent.
3. abrasive disk according to claim 1 is characterized in that, said through hole cover plate is opaque.
4. abrasive disk according to claim 1 is characterized in that, is provided with " O " shape sealing ring between said through hole cover plate and the said through hole.
5. a grinder station comprises grinding pad and abrasive disk, and said grinding pad is arranged on the said abrasive disk, it is characterized in that, said abrasive disk adopts like any described abrasive disk in the claim 1～4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205107543U CN202428308U (en) | 2011-12-08 | 2011-12-08 | Polishing disc and polishing machine table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205107543U CN202428308U (en) | 2011-12-08 | 2011-12-08 | Polishing disc and polishing machine table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202428308U true CN202428308U (en) | 2012-09-12 |
Family
ID=46777781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205107543U Expired - Fee Related CN202428308U (en) | 2011-12-08 | 2011-12-08 | Polishing disc and polishing machine table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202428308U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818299A (en) * | 2018-06-06 | 2018-11-16 | 太仓鉴崧实业有限公司 | A kind of mill structure and its working method for intersecting operating |
| CN113319736A (en) * | 2021-07-12 | 2021-08-31 | 北京烁科精微电子装备有限公司 | Grinding disk window cover, grinding disk and grinding machine |
-
2011
- 2011-12-08 CN CN2011205107543U patent/CN202428308U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818299A (en) * | 2018-06-06 | 2018-11-16 | 太仓鉴崧实业有限公司 | A kind of mill structure and its working method for intersecting operating |
| CN108818299B (en) * | 2018-06-06 | 2023-08-18 | 太仓鉴崧实业有限公司 | Cross-running millstone structure and working method thereof |
| CN113319736A (en) * | 2021-07-12 | 2021-08-31 | 北京烁科精微电子装备有限公司 | Grinding disk window cover, grinding disk and grinding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130427 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130427 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120912 Termination date: 20181208 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |