CN102922007A - PCB (Printed circuit board) micro drill and processing method thereof - Google Patents

PCB (Printed circuit board) micro drill and processing method thereof Download PDF

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Publication number
CN102922007A
CN102922007A CN2012104206964A CN201210420696A CN102922007A CN 102922007 A CN102922007 A CN 102922007A CN 2012104206964 A CN2012104206964 A CN 2012104206964A CN 201210420696 A CN201210420696 A CN 201210420696A CN 102922007 A CN102922007 A CN 102922007A
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chip area
pcb
section
chip
brill
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CN102922007B (en
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厉学广
屈建国
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Shenzhen Jinzhou Precision Technology Corp
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Shenzhen Jinzhou Precision Technology Corp
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Abstract

The invention discloses a PCB (Printed circuit board) micro drill and a processing method of the PCB micro drill. The PCB micro drill comprises at least one chip removing groove, wherein the chip removing groove comprises at least two sections which are arranged in a direction from a drill bit to a drill tail; a spiral angle of each chip removing groove section, starting from the (N+1)th chip removing groove, is gradually increased, wherein N is not less than 0; and the width of the following chip removing groove section is not less than that of the previous chip removing groove section based on two adjacent chip removing groove sections. According to the structure mentioned above, the chip removing grooves are distributed on a drill body with the density increased in the direction from the drill bit to the drill tail; the arrangement density of the chip removing grooves can be increased, and the breadth of the drill body can be reduced while the widths of the chip removing grooves are unchanged, which means that the width of the whole groove is increased and the breadth is reduced, so that the width ratio of the groove of the drill bit is increased, the chip containing capacity of the drill bit is improved, and as a result, the chip removing capacity of the drill bit is improved, the performance of the drill bit large in hole is improved, and the probability that the drill is broken is reduced.

Description

The little brill of a kind of PCB and processing method thereof
Technical field
The present invention relates to the process tool field, in particular, relate to the little brill of a kind of PCB and processing method thereof.
Background technology
Along with the development of printed circuit board (pcb) technology and product, to also more and more higher for the requirement of the microbit of processing printed circuit board.PCB is a kind of complex-shaped band spiral fluted capillary processing instrument with microbit (being called for short the little brill of PCB), and is derivative by traditional fluted drill.The little brill size of PCB is small, and its apex point structure will just can be observed by light microscope.Present most of PCB producer comes processing PCB with numerical control drilling machine, digital control hole drilling is the important step of printed board processing procedure, because the material of PCB is different from metal, so the processing of PCB is also different from traditional metal processing, PCB is made by materials such as resin and copper-clad plates, being difficult for when High-speed machining of materials discharged by the chip area that bores body, so the chip removal performance of the little brill of PCB and hold the bits performance and be directly connected to the thick performance in hole of drill bit and lose performance.
Summary of the invention
Technical problem to be solved by this invention provides a kind of appearance bits performance, the chip removal performance is good, the thick performance in hole and lose the little brill of the little PCB of probability and processing method thereof.
The objective of the invention is to be achieved through the following technical solutions: the little brill of a kind of PCB, comprise at least one chip area, described chip area comprises at least two sections, by the direction of apex point to the brill tail, begun by N+1 section chip area, the helical angle of every section chip area increases successively, described N 〉=0; And between two sections adjacent chip areas, the groove width of rear one section chip area is not less than the groove width of chip area the last period.
Preferably,, begun by described N+1 section chip area to the direction of boring tail by apex point, the groove width of each section chip area is identical.When improving drill bit ditch amplitude ratio, can better guarantee its rigidity like this.
Preferably,, begun by described N+1 section chip area to the direction of boring tail by apex point, the groove width of each section chip area increases successively.Further increase the appearance bits ability of drill bit.
Preferably, the joining place of two sections adjacent chip areas is provided with lead-over groove.Make drilling cuttings can be smoothly from the last period chip area enter next section chip area.
Preferably, the little brill of described PCB only comprises three sections chip areas, is respectively leading portion chip area, stage casing chip area and back segment chip area, described N=1, described N+1 section chip area is described stage casing chip area, and the helical angle of described back segment chip area is greater than the helical angle of stage casing chip area.According to the length of the little brill of most PCB, it is divided into three sections is convenient to processing.
Preferably, described leading portion chip area is to be arranged on two apex point end chip areas that originate in the apex point end on the little brill of PCB, and the afterbody of described two apex point end chip areas converges in brill and forms a chip area with it and continue and extend to form described stage casing chip area and described back segment chip area to boring tail.Because two grooves pool a groove, it holds the bits ability and reduces, thereby can partially or completely offset and pool the effect that the appearance bits ability that causes behind the groove reduces by changing the ditch amplitude ratio, and the apex point end uses the structure of two grooves can improve the cutting power of apex point end.
Preferably, the little brill of described PCB is hog nose, only comprises a chip area that is extended to the brill tail by the apex point end.Hog nose is owing to only having a chip area, it is poor that its appearance bits ability is compared the drill bit with two chip areas, thereby the design that improves the ditch amplitude ratio for hog nose, is conducive to improve the appearance bits ability of hog nose, improve the thick performance in hole of hog nose, and reduce the probability of losing of hog nose.
Preferably, the little brill of described PCB only comprises two chip areas that originate in the apex point end, and described two chip areas extend to respectively the brill tail.The drilling performance of two-groove drill is better.
The processing method of the little brill of a kind of above-mentioned PCB comprises the step of processing chip area; Described processing chip area may further comprise the steps:
S1, by apex point to the direction of boring tail, process successively first paragraph to the N+1 section chip area, described N 〉=0, the processing helical angle when guaranteeing to process N+1 section chip area during more than or equal to this section of processing emery wheel with respect to the established angle that bores body;
S2, the extremely latter end chip area of processing N+2 section when the extremely latter end chip area of the described N+2 section of processing, increase the processing helical angle of the extremely latter end chip area of N+2 section successively.
Preferably, among the described step S2, change emery wheel with respect to bore body established angle make described N+2 section identical to the groove width of latter end chip area.
The present invention is divided into more than two sections by the chip area with the little brill of PCB at least, and by the direction successively respectively processing of apex point to the brill tail, by in process, changing the processing helical angle, after namely whenever processing one section chip removal, increase the processing helical angle of next section chip area so that the helical angle increase of next section, in addition, guarantee the established angle of emery wheel less than the helical angle of first paragraph chip area, can guarantee that so just the width of chip area does not diminish; By above processing, by the direction of apex point to the brill tail, chip area increases in the density of arranging of boring with it, do not diminish in the situation that guarantee width of chip space, chip area is arranged, and density increases, brill fabric width with it reduces, and that is to say, whole groove width increases and fabric width reduces, increase the secondary ratio of ditch of drill bit, improved the appearance bits ability of drill bit and then improved the chip removal ability of drill bit, improved the thick performance in hole of drill bit and the probability that reduces the breaking of rod.
Description of drawings
Fig. 1 is the little brill structure diagram of the PCB of the embodiment of the invention one,
Fig. 2 is the machining sketch chart of the little brill of PCB of the embodiment of the invention one,
Fig. 3 is the established angle schematic diagram that the little brill of the PCB of the embodiment of the invention one adds the emery wheel in man-hour,
Fig. 4 is the little brill structure diagram of the PCB of the embodiment of the invention two.
Wherein: 1, apex point, 100, bore body, the 101, first apex point end chip area, the 102, second apex point end chip area, 103, the stage casing chip area, 104, the back segment chip area, 7, emery wheel.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing and preferred embodiment.
Embodiment one
Be illustrated in figure 1 as the specific embodiment of the little brill of a kind of PCB provided by the invention, the little brill of this PCB comprises apex point 1 and bores body 100, be provided with the main cutting edge of two symmetries on the apex point 1, be conveniently to describe, will bore body 1 and be divided into: first paragraph bores body, second segment bores body, the 3rd section brill body and the 4th section brill body; Wherein first paragraph bores and is provided with the leading portion chip area with it, described leading portion chip area is two and originates in the apex point end apex point end chip area corresponding with main cutting edge, be respectively: the first apex point end chip area 101 and the second apex point end chip area 102, the helical angle of the first apex point end chip area 101 and the second apex point end chip area 102 is different, both afterbodys bore to converge with it to form a chip area and continue at first paragraph and extend to the direction of boring tail, this chip area that converges bores body at second segment, the 3rd section brill body and the 4th section brill form respectively stage casing chip area 103 and back segment chip area 104 with it, joining place between stage casing chip area 103 and the back segment chip area 104 is provided with a lead-over groove (not shown), and this lead-over groove is arranged on it the 3rd section brill.In the present embodiment, the groove width of stage casing chip area 103 and back segment chip area 104 is identical, but the pitch angle gamma 1 of stage casing chip area 103 is less than the pitch angle gamma 2 of back segment chip area 104, thereby the density of the back segment chip area 104 that forms with it at the 4th section brill is greater than the density of boring the stage casing chip area 103 that forms at second segment with it; In the situation that groove width is constant, be that second segment bores with it the groove width W1 of stage casing chip area 103 and equals the 4th section and bore the groove width W2 of back segment chip area 104 with it, be W1=W3, and this moment, second segment bores the fabric width W2 of stage casing chip area 103 with it greater than the fabric width W4 of the 4th section brill back segment chip area 104 with it, be W2>W4, second segment brill ditch amplitude ratio W1/W2 with it is less than the 4th section brill ditch amplitude ratio W3/W4 with it like this, hence one can see that, the ditch amplitude ratio of drill bit increases, improve the appearance bits ability of drill bit, and then improved the chip removal ability of drill bit, be conducive to like this improve the thick performance in hole of drill bit and the damage rate that reduces drill bit.
Because the helical angle of stage casing chip area 103 and back segment chip area 104 is different, can enter smoothly back segment chip area 104 in order to ensure the drilling cuttings in the stage casing chip area 103, thereby stage casing chip area 103 and back segment chip removal just 104 joining place namely the 3rd section brill be in lead-over groove be set, it is the lead-over groove that one section end by stage casing chip area 103 is smoothly transitted into back segment chip area 104.
For fear of cause brill body intensity to reduce owing to the helical angle that increases back segment chip area 104, and avoid excessive helical angle to cause drilling cuttings to be difficult for entering back segment chip area 104 by stage casing chip area 103, the spiral angle of leading portion chip area and back segment chip area 104 is poor to be 2 ~ 25 °.
The present embodiment provides the described PCB processing method of little brill simultaneously, and the processing of its apex point is identical with the processing of conventional bit, no longer describes in detail.As shown in Figure 2, the processing of the little brill chip area of described PCB is carried out grinding formation by emery wheel 7 at brill body 100.As shown in Figure 3, for the groove width that makes chip area reaches a certain requirements, the revolution section of emery wheel 7 need to namely bore body with bar 100() central axis form certain angle, this angle realizes by the setting angle of adjusting emery wheel 7 at cutter sharpener, therefore, emery wheel 7 is the established angle α of emery wheel with the angle of the central axis formation of bar 100, in addition, the groove width of chip area is also relevant in the size of the processing helical angle that adds man-hour with this chip area, if one among processing helical angle and the established angle α changes, then groove width also changes.
The processing of the little brill chip area of PCB may further comprise the steps:
P1: use wheel grindings to go out two the first apex point end chip area 101 and the second apex point end chip areas 102 that helical angle is different at brill body 100, described the first apex point end chip area 101 and the second apex point end chip area 102 are converged.
P2: the processing pitch angle gamma 1 of setting stage casing chip area 103, use emery wheel to go out stage casing chip area 103 by the processing helical angle grinding that sets at the place of converging of the first apex point end chip area 101 that bores body 100 and the second apex point end chip area 102, the processing pitch angle gamma 1 of guaranteeing stage casing chip area 103 during more than or equal to this stage casing of processing chip area 103 emery wheel with respect to the established angle α of brill body 100.
P3: the afterbody at stage casing chip area 103 goes out a lead-over groove with wheel grinding, lead-over groove can regard that the size of the helical angle that an end is shorter is in the chip area between leading portion chip removal and the back segment chip area as, certainly, it can be to have the multistage groove that the multistage helical angle is gradient to the helical angle of back segment chip area.
P4: the processing pitch angle gamma 2 of setting back segment chip area 104, this processing pitch angle gamma 2 is greater than the pitch angle gamma 1 of stage casing chip area 103, simultaneously, poor according to the pitch angle gamma 1 of the processing pitch angle gamma 2 of the back segment chip area 104 that sets and leading portion chip area, the established angle α that readjusts emery wheel keeps established angle α constant with the difference of processing helical angle, and is identical with the groove width of leading portion chip area with the groove width of guaranteeing the back segment chip area; Above ready after, go out the back segment chip area of chip area by the processing helical angle grinding that sets with emery wheel at the lead-over groove afterbody.In this step, because the established angle α of emery wheel is to add man-hour fixing, thereby can be by changing the relative angle that bores body 100 and emery wheel, the i.e. size of capable of regulating established angle α.
Embodiment two
The present embodiment and embodiment one difference are, among the step S4, emery wheel with respect to bore body 100 established angle α constant, like this, poor greater than with the pitch angle gamma 1 of stage casing chip area 103 of the difference of the established angle α of emery wheel and the pitch angle gamma 2 of back segment chip area 104 that is to say, in process, helical angle becomes large so that the poor of all the other established angle α becomes large, and such result will cause groove width to become large.As shown in Figure 4, the groove width of stage casing chip area 103 is W2, pitch angle gamma 2 becomes large and back segment chip area 104 is not because the established angle α of emery wheel changes, and has caused the groove width of back segment chip area 104 to become large, simultaneously, because pitch angle gamma 2 becomes large, the 4th section chip area density of boring body is also increased, and namely groove width and groove density increase and fabric width reduces, and W1/W2 is less than W3/W4, the ditch amplitude ratio increases, and has so just increased the appearance bits ability of drill bit.
Above two embodiment all creep into row explanation so that the PCB with a chip area is little, can not assert that implementation of the present invention is confined to these explanations.Certainly, for the little brill of PCB with two chip areas (namely two chip areas corresponding with main cutting edge extend to always and bore tail), can increase the ditch amplitude ratio by increasing helical angle too, to improve the appearance bits performance of drill bit.In addition, for the hog nose that only has a chip area, also relatively be applicable to the solution of the present invention, because hog nose itself also only has a main cutting edge, it is limited in one's ability that it holds bits, can improve to improve by the present invention program and hold the bits ability, improves bit performance.
In addition, because different bit sizes and accuracy requirement, also the little brill of PCB can be processed into and have the chip area that multistage more has difformity or structure, have 5,6 sections or the chip area of multistage more as being processed into, and the helical angle increase also can be since the N+1 section, N 〉=0; And corresponding processing method also is to carry out according to above-mentioned steps, at first from apex point to the direction of boring tail, process successively first paragraph to the N+1 section chip area, processing helical angle when certainly, guaranteeing in the process to process N+1 section chip area more than or equal to processing during this section emery wheel with respect to the established angle that bores body; Then process the extremely latter end chip area of N+2 section, when the extremely latter end chip area of the described N+2 section of processing, increase successively the processing helical angle of the extremely latter end chip area of N+2 section.Among embodiment one and the embodiment two, increase from stage casing chip area 103 beginning helical angles and to change, i.e. N=1, it is described stage casing chip area 103 that the N+1 section is the 2nd section.
For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.

Claims (10)

1. the little brill of PCB comprises at least one chip area, it is characterized in that, described chip area comprises at least two sections,, is begun by N+1 section chip area to the direction of boring tail by apex point, and the helical angle of every section chip area increases successively, described N 〉=0; And between two sections adjacent chip areas, the groove width of rear one section chip area is not less than the groove width of chip area the last period.
2. the little brill of PCB as claimed in claim 1 is characterized in that,, is begun by described N+1 section chip area to the direction of boring tail by apex point, and the groove width of each section chip area is identical.
3. the little brill of PCB as claimed in claim 1 is characterized in that,, is begun by described N+1 section chip area to the direction of boring tail by apex point, and the groove width of each section chip area increases successively.
4. such as the little brill of the arbitrary described PCB of claim 1-3, it is characterized in that, the joining place of two sections adjacent chip areas is provided with lead-over groove.
5. the little brill of PCB as claimed in claim 4, it is characterized in that, the little brill of described PCB only comprises three sections chip areas, be respectively leading portion chip area, stage casing chip area and back segment chip area, described N=1, described N+1 section chip area is described stage casing chip area, and the helical angle of described back segment chip area is greater than the helical angle of stage casing chip area.
6. the little brill of PCB as claimed in claim 5, it is characterized in that, described leading portion chip area is to be arranged on two apex point end chip areas that originate in the apex point end on the little brill of PCB, and the afterbody of described two apex point end chip areas converges in brill and forms a chip area with it and continue and extend to form described stage casing chip area and described back segment chip area to boring tail.
7. the little brill of PCB as claimed in claim 1 is characterized in that, the little brill of described PCB is hog nose, only comprises a chip area that is extended to the brill tail by the apex point end.
8. the little brill of PCB as claimed in claim 1 is characterized in that, the little brill of described PCB only comprises two chip areas that originate in the apex point end, and described two chip areas extend to respectively the brill tail.
9. the processing method of the little brill of PCB as claimed in claim 1 comprises the step of processing chip area; It is characterized in that, described processing chip area may further comprise the steps:
S1, by apex point to the direction of boring tail, process successively first paragraph to the N+1 section chip area, described N 〉=0, the processing helical angle when guaranteeing to process N+1 section chip area during more than or equal to this section of processing emery wheel with respect to the established angle that bores body;
S2, the extremely latter end chip area of processing N+2 section when the extremely latter end chip area of the described N+2 section of processing, increase the processing helical angle of the extremely latter end chip area of N+2 section successively.
10. the processing method of the little brill of PCB as claimed in claim 9 is characterized in that, among the described step S2, change emery wheel with respect to bore body established angle make described N+2 section identical to the groove width of latter end chip area.
CN201210420696.4A 2012-10-29 2012-10-29 A kind of micro-brill of PCB and processing method thereof Active CN102922007B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103433535A (en) * 2013-08-26 2013-12-11 深圳市金洲精工科技股份有限公司 Minitype drill bit
CN114393454A (en) * 2022-01-25 2022-04-26 厦门厦芝科技工具有限公司 Groove micro-diameter drill bit processing method and groove micro-diameter drill bit

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CN1618557A (en) * 2002-09-03 2005-05-25 三菱综合材料株式会社 Drill and production method thereof
CN101422826A (en) * 2008-08-12 2009-05-06 深圳市金洲精工科技股份有限公司 Micro drill bit for circuit boring
CN102205436A (en) * 2010-03-31 2011-10-05 佑能工具株式会社 Perforating tool
CN202180239U (en) * 2011-05-10 2012-04-04 尖点科技股份有限公司 Chip groove structure of drill bit
CN102476209A (en) * 2010-11-22 2012-05-30 佑能工具株式会社 Drilling tool
CN202861477U (en) * 2012-10-29 2013-04-10 深圳市金洲精工科技股份有限公司 Printed circuit board (PCB) micro drill

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Publication number Priority date Publication date Assignee Title
CN1618557A (en) * 2002-09-03 2005-05-25 三菱综合材料株式会社 Drill and production method thereof
CN101422826A (en) * 2008-08-12 2009-05-06 深圳市金洲精工科技股份有限公司 Micro drill bit for circuit boring
CN102205436A (en) * 2010-03-31 2011-10-05 佑能工具株式会社 Perforating tool
CN102476209A (en) * 2010-11-22 2012-05-30 佑能工具株式会社 Drilling tool
CN202180239U (en) * 2011-05-10 2012-04-04 尖点科技股份有限公司 Chip groove structure of drill bit
CN202861477U (en) * 2012-10-29 2013-04-10 深圳市金洲精工科技股份有限公司 Printed circuit board (PCB) micro drill

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103433535A (en) * 2013-08-26 2013-12-11 深圳市金洲精工科技股份有限公司 Minitype drill bit
CN103433535B (en) * 2013-08-26 2015-11-04 深圳市金洲精工科技股份有限公司 A kind of microbit
JP2016534889A (en) * 2013-08-26 2016-11-10 深▲せん▼市金洲精工科技股▲ふん▼有限公司 Micro drill
CN114393454A (en) * 2022-01-25 2022-04-26 厦门厦芝科技工具有限公司 Groove micro-diameter drill bit processing method and groove micro-diameter drill bit

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