CN102922007B - A kind of micro-brill of PCB and processing method thereof - Google Patents
A kind of micro-brill of PCB and processing method thereof Download PDFInfo
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- CN102922007B CN102922007B CN201210420696.4A CN201210420696A CN102922007B CN 102922007 B CN102922007 B CN 102922007B CN 201210420696 A CN201210420696 A CN 201210420696A CN 102922007 B CN102922007 B CN 102922007B
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Abstract
The open a kind of micro-brill of PCB of the present invention and processing method thereof, the micro-brill of described PCB includes that at least one chip area, described chip area include at least two sections, by apex point to the direction boring tail, by N+1 section chip area, the helical angle of every section of chip area increases successively, described N >=0；And between two sections of adjacent chip areas, the groove width of rear one section of chip area is not less than the groove width of chip area the last period.By above structure, by apex point to the direction boring tail, chip area increases in the arrangement density with boring, in the case of guaranteeing that width of chip space does not diminishes, the fabric width with chip area arrangement density increase, brill can be made to reduce, say, that, overall groove width increases and fabric width reduces, increase the ditch pair ratio of drill bit, improve the bits ability of holding of drill bit and then improve the chip removal ability of drill bit, improve the thick performance in hole of drill bit and reduce the probability of the breaking of rod.
Description
Technical field
The present invention relates to process tool field, in particular, relate to a kind of micro-brill of PCB and processing thereof
Method.
Background technology
Along with printed circuit board (PCB) technology and the development of product, to being used for processing printed circuit board
The requirement of microbit more and more higher.PCB microbit (being called for short the micro-brill of PCB) is one
Plant complex-shaped band spiral fluted capillary processing instrument, traditional fluted drill be derived.PCB
Micro-brill size is small, its apex point structure will by optical microscope just it is observed that.Major part at present
PCB producer uses numerical control drilling machine to carry out processing PCB, and digital control hole drilling is the important step of printed board processing procedure,
Owing to the material of PCB is different from metal, so the processing of PCB is also different from traditional intermetallic composite coating,
PCB is made by the material such as resin and copper-clad plate, being difficult to by boring when High-speed machining of this type of material
The chip area of body is discharged, and therefore chip removal performance and the appearance bits performance of the micro-brill of PCB is directly connected to drill bit
The thick performance in hole and lose performance.
Summary of the invention
It is good that the technical problem to be solved is to provide a kind of bits performance, chip removal performance held, and hole is thick
Performance and lose the probability micro-brill of little PCB and processing method thereof.
It is an object of the invention to be achieved through the following technical solutions: a kind of micro-brill of PCB, including to
A few chip area, described chip area includes at least two sections, by apex point to the direction of brill tail, by N+1
Section chip area starts, and the helical angle of every section of chip area increases successively, described N >=0；And adjacent two sections
Between chip area, the groove width of rear one section of chip area is not less than the groove width of chip area the last period.
Preferably, by apex point to the direction of brill tail, by described N+1 section chip area, each section of row
The groove width of bits groove is identical.So can more preferably ensure its rigidity while improving drill bit ditch amplitude ratio.
Preferably, by apex point to the direction of brill tail, by described N+1 section chip area, each section of row
The groove width of bits groove increases successively.Increase the appearance bits ability of drill bit further.
Preferably, the joining place of two sections of adjacent chip areas is provided with lead-over groove.Enable drilling cuttings smooth
Next section of chip area is entered from chip area the last period.
Preferably, the micro-brill of described PCB only includes three sections of chip areas, respectively leading portion chip area, stage casing
Chip area and back segment chip area, described N=1, described N+1 section chip area is the chip removal of described stage casing
Groove, the helical angle of described back segment chip area is more than the helical angle of stage casing chip area.Micro-according to most PCB
The length bored, is classified as three sections and is easy to processing.
Preferably, described leading portion chip area is two being arranged on the micro-brill of PCB and originating in apex point end
Apex point end chip area, the afterbody of described two apex point end chip areas converges in one chip removal of formation with brill
Groove also continues to boring tail extension formation described stage casing chip area and described back segment chip area.Due to two
Groove pools a groove, and it holds bits ability and reduces, can be partially or completely thereby through changing ditch amplitude ratio
Offset the effect that bits ability reduces of holding caused after pooling a groove, and apex point end uses two
The structure of groove can improve the cutting power of apex point end.
Preferably, the micro-brill of described PCB is hog nose, only includes that one is extended to bore tail by apex point end
Chip area.Hog nose is due to only one chip area, and its appearance bits ability is compared has two chip areas
Drill bit poor, thus carry out improving the design of ditch amplitude ratio for hog nose, be conducive to improving hog nose
Hold bits ability, improve the thick performance in hole of hog nose, and reduce hog nose lose probability.
Preferably, the micro-brill of described PCB only includes two chip areas originating in apex point end, described two
Chip area extends respectively to bore tail.The drilling performance of two-groove drill is preferable.
The processing method of a kind of micro-brill of above-mentioned PCB, including the step of processing chip area；Described processing row
Bits groove comprises the following steps:
S1, by apex point to bore tail direction, successively processing first paragraph to N+1 section chip area, described
N >=0, it is ensured that when processing helical angle when processing N+1 section chip area is more than or equal to processing this section
Emery wheel is relative to the established angle boring body；
S2, process N+2 section to latter end chip area, process described N+2 section to latter end
During chip area, increase N+2 section successively to the processing helical angle of latter end chip area.
Preferably, in described step S2, change emery wheel relative to bore body established angle make described the
N+2 section is identical to the groove width of latter end chip area.
The present invention by the chip area of micro-for PCB brill is divided into more than at least two sections, and by apex point to bore tail
Direction process the most respectively, by the course of processing change processing helical angle, the most often process one
After section chip removal, the processing helical angle increasing next section of chip area makes the helical angle of next section increase, separately
Outward, it is ensured that the established angle of emery wheel, less than the helical angle of first paragraph chip area, the most just can ensure that chip area
Width do not diminish；By above processing, by apex point to the direction of brill tail, chip area is with brill
Arrangement density increase, in the case of guaranteeing that width of chip space does not diminishes, can make chip area arrangement close
Fabric width with degree increase, brill reduces, say, that overall groove width increases and fabric width reduction, increase
The ditch pair ratio of drill bit, improves the bits ability of holding of drill bit and then improves the chip removal ability of drill bit, changing
It is apt to the thick performance in hole of drill bit and has reduced the probability of the breaking of rod.
Accompanying drawing explanation
Fig. 1 is PCB micro-brill structure diagram of the embodiment of the present invention one,
Fig. 2 is the machining sketch chart of the micro-brill of PCB of the embodiment of the present invention one,
Fig. 3 is the established angle schematic diagram that the micro-brill of PCB of the embodiment of the present invention one adds emery wheel in man-hour,
Fig. 4 is PCB micro-brill structure diagram of the embodiment of the present invention two.
Wherein: 1, apex point, 100, bore body, the 101, first apex point end chip area, 102, second bore
Most advanced and sophisticated chip area, 103, stage casing chip area, 104, back segment chip area, 7, emery wheel.
Detailed description of the invention
The invention will be further described with preferred embodiment below in conjunction with the accompanying drawings.
Embodiment one
It is illustrated in figure 1 the specific embodiment of the micro-brill of a kind of PCB that the present invention provides, the micro-brill of this PCB
Including apex point 1 and brill body 100, apex point 1 is provided with two symmetrical main cutting edges, for convenience
Describe, brill body 1 is divided into: first paragraph bores body, second segment brill body, the 3rd section of brill body and the 4th section
Bore body；Wherein being provided with leading portion chip area with first paragraph brill, described leading portion chip area is two and initiates
In the apex point end chip area that apex point end is corresponding with main cutting edge, it is respectively as follows: the first apex point end chip area 101
And the second apex point end chip area 102, the first apex point end chip area 101 and the second apex point end chip area
The helical angle of 102 is different, and both afterbodys converge with first paragraph brill and form a chip area and continue
Continue the direction to boring tail to extend, the chip area of this convergence second segment bore body, the 3rd section bore body and the
Stage casing chip area 103 and back segment chip area 104, stage casing chip area 103 is formed respectively with four sections of brills
And the joining place between back segment chip area 104 is provided with a lead-over groove (not shown), this transition
Groove is arranged on the 3rd section of brill.In the present embodiment, stage casing chip area 103 and back segment chip area
The groove width of 104 is identical, but the pitch angle gamma 1 of stage casing chip area 103 is less than the spiral shell of back segment chip area 104
Swing angle γ 2, thus, the density at the 4th section of back segment chip area 104 formed with boring is more than second
The density of the stage casing chip area 103 formed with section brill；In the case of groove width is constant, i.e. second segment
With brill groove width W1 of stage casing chip area 103 bore equal to the 4th section with the groove width of back segment chip area 104
W2, i.e. W1=W3, and now, with second segment brill, the fabric width W2 of stage casing chip area 103 is more than the 4th
Section bore with fabric width W4, the i.e. W2 ＞ W4 of back segment chip area 104, such second segment bore with ditch
Amplitude ratio W1/W2 is less than ditch amplitude ratio W3/W4 with the 4th section of brill, it follows that the ditch amplitude ratio of drill bit
Increase, improve the appearance bits ability of drill bit, and then improve the chip removal ability of drill bit, be so conducive to
Improve the thick performance in hole of drill bit and reduce the damage rate of drill bit.
Owing to the helical angle of stage casing chip area 103 and back segment chip area 104 is different, in order to ensure in
Drilling cuttings in section chip area 103 can enter back segment chip area 104 smoothly, thus at stage casing chip area
103 and back segment chip removal just 104 joining place that is the 3rd section brill be in lead-over groove be set, its be one section by
The end of stage casing chip area 103 is smoothly transitted into the lead-over groove of back segment chip area 104.
In order to avoid causing brill stiffness of the body degree to reduce owing to increasing the helical angle of back segment chip area 104, with
And avoid excessive helical angle to cause drilling cuttings to be difficult to by stage casing chip area 103 entering back segment chip area 104,
Leading portion chip area is 2～25 ° with the spiral angle difference of back segment chip area 104.
The present embodiment provides the described PCB processing method of micro-brill, the processing of its apex point to bore with conventional simultaneously
The processing of head is identical, no longer describes in detail.As in figure 2 it is shown, the processing of described PCB micro-brill chip area is logical
Cross emery wheel 7 and carry out grinding formation on brill body 100.As it is shown on figure 3, for the groove making chip area
Width reaches a certain requirements, and the revolution section of emery wheel 7 needs the center with bar 100 (i.e. boring body)
Axis forms certain angle, and this angle is by being adjusted the setting angle of emery wheel 7 on cutter sharpener
Realize, therefore, the established angle α that angle is emery wheel that the central axis of emery wheel 7 and bar 100 is formed,
Additionally, the groove width of chip area is also relevant in the size of the processing helical angle adding man-hour with this chip area, if
Processing helical angle changes with in established angle α, then groove width also changes.
The processing of PCB micro-brill chip area comprises the following steps:
P1: use wheel grinding to go out two the first different apex point end chip removals of helical angle on body 100 boring
Groove 101 and the second apex point end chip area 102, make described first apex point end chip area 101 and
Two apex point end chip areas 102 converge.
P2: set the processing pitch angle gamma 1 of stage casing chip area 103, at the first apex point boring body 100
Use emery wheel by adding of setting at the convergence of end chip area 101 and the second apex point end chip area 102
Work helical angle grinding goes out stage casing chip area 103, it is ensured that the processing pitch angle gamma 1 of stage casing chip area 103
More than or equal to emery wheel when processing this stage casing chip area 103 relative to the established angle α boring body 100.
P3: the afterbody wheel grinding at stage casing chip area 103 goes out a lead-over groove, and lead-over groove can be regarded as
It is that the size of the shorter helical angle in one end is in the chip area between leading portion chip removal and back segment chip area,
Certainly, it can be the multistage groove with the helical angle that multistage helical angle is gradient to back segment chip area.
P4: set the processing pitch angle gamma 2 of back segment chip area 104, during this processing pitch angle gamma 2 is more than
The pitch angle gamma 1 of section chip area 103, meanwhile, according to the processing spiral shell of the back segment chip area 104 set
Swing angle γ 2 and the difference of the pitch angle gamma 1 of leading portion chip area, readjust the established angle α holding peace of emery wheel
Dress angle α is constant with the difference of processing helical angle, to guarantee groove width and the leading portion chip area of back segment chip area
Groove width is identical；After the most ready, at lead-over groove afterbody emery wheel by the processing helical angle grinding set
Go out the back segment chip area of chip area.In this step, man-hour is being added due to the established angle α of emery wheel
Fixing, thus can be by changing the relative angle boring body 100 with emery wheel, i.e. adjustable established angle α
Size.
Embodiment two
The present embodiment is with embodiment one difference, and in step S4, emery wheel is relative to boring body 100
Established angle α constant, so, the established angle α of emery wheel and the pitch angle gamma 2 of back segment chip area 104
Difference more than the difference with the pitch angle gamma 1 of stage casing chip area 103, say, that in the course of processing,
Helical angle change makes greatly the difference of remaining established angle α become big, and such result will cause groove width to become greatly.As
Shown in Fig. 4, the groove width of stage casing chip area 103 is W2, and back segment chip area 104 is due to the peace of emery wheel
Dress angle α is not changed in but pitch angle gamma 2 becomes big, and the groove width that result in back segment chip area 104 becomes big,
Simultaneously as pitch angle gamma 2 becomes big, the 4th section of chip area density boring body is also increased, i.e. groove
Wide and groove density increases and fabric width reduces, and W1/W2 is less than W3/W4, and ditch amplitude ratio increases, and thus increases
The appearance bits ability of drill bit.
Both examples above all illustrates having the micro-brill of the PCB of a chip area, it is impossible to assert
Being embodied as of the present invention is confined to these explanations.Certainly, for having two chip areas (i.e. two
The chip area that bar is corresponding with main cutting edge extend to bore tail) the micro-brill of PCB for, too may be used
To increase ditch amplitude ratio by increase helical angle, to improve the appearance bits performance of drill bit.It addition, for only
For there is the hog nose of a chip area, also it is relatively specific for the solution of the present invention, because of hog nose originally
Body also only has a main cutting edge, and it is limited in one's ability that it holds bits, can be improved by the present invention program
Improve and hold bits ability, improve bit performance.
Further, since different bit sizes and accuracy requirement, also micro-for PCB brill can be processed into and have more
Multistage has the chip area of difformity or structure, has 5,6 sections or more multistage as being processed into
Chip area, and helical angle increase can also be from the beginning of N+1 section, N >=0；And process accordingly
Method is also to carry out according to above-mentioned steps, first from apex point to the direction boring tail, processes first paragraph successively
To N+1 section chip area, certainly, adding when guaranteeing to process N+1 section chip area in the course of processing
When work helical angle is more than or equal to process this section, emery wheel is relative to the established angle boring body；Then is processed
N+2 section, to latter end chip area, when processing described N+2 section to latter end chip area, increases successively
Big N+2 section is to the processing helical angle of latter end chip area.In embodiment one and embodiment two, therefrom
Section chip area 103 starts helical angle and increases change, i.e. N=1, N+1 section be the 2nd section i.e. the most described in
Section chip area 103.
For general technical staff of the technical field of the invention, without departing from present inventive concept
On the premise of, it is also possible to make some simple deduction or replace, all should be considered as belonging to the guarantor of the present invention
Protect scope.
Claims (6)
1. the micro-brill of PCB, including at least one chip area, it is characterised in that described chip area bag
Including leading portion chip area, stage casing chip area and back segment chip area, described leading portion chip area is two and initiates
Corresponding with main cutting edge in apex point end, described leading portion chip area converges with brill and continues to boring tail
Direction extends and forms described stage casing chip area and described back segment chip area respectively, by apex point to the side boring tail
To, by N+1 section chip area, the helical angle of every section of chip area increases successively, described N >=0；
And between two sections of adjacent chip areas, the groove width of rear one section of chip area is not less than the groove of chip area the last period
Width, described leading portion chip area is 2～25 ° with the spiral angle difference of back segment chip area.
2. the micro-brill of PCB as claimed in claim 1, it is characterised in that by apex point to the direction of brill tail,
By described N+1 section chip area, the groove width of each section of chip area is identical.
3. the micro-brill of PCB as claimed in claim 1, it is characterised in that by apex point to the direction of brill tail,
By described N+1 section chip area, the groove width of each section of chip area increases successively.
4. the micro-brill of PCB as described in claim 1-3 is arbitrary, it is characterised in that two sections of adjacent rows
The joining place of bits groove is provided with lead-over groove.
5. the micro-brill of PCB as claimed in claim 1, it is characterised in that the micro-brill of described PCB is single
Cutting drill, only includes a chip area being extended to bore tail by apex point end.
6. the micro-brill of PCB as claimed in claim 1, it is characterised in that the micro-brill of described PCB only wraps
Including two chip areas originating in apex point end, described two chip areas extend respectively to bore tail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210420696.4A CN102922007B (en) | 2012-10-29 | 2012-10-29 | A kind of micro-brill of PCB and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210420696.4A CN102922007B (en) | 2012-10-29 | 2012-10-29 | A kind of micro-brill of PCB and processing method thereof |
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| Publication Number | Publication Date |
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| CN102922007A CN102922007A (en) | 2013-02-13 |
| CN102922007B true CN102922007B (en) | 2016-08-24 |
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| CN201210420696.4A Active CN102922007B (en) | 2012-10-29 | 2012-10-29 | A kind of micro-brill of PCB and processing method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433535B (en) * | 2013-08-26 | 2015-11-04 | 深圳市金洲精工科技股份有限公司 | A kind of microbit |
| CN114393454B (en) * | 2022-01-25 | 2023-04-14 | 厦门厦芝科技工具有限公司 | Groove micro-diameter drill bit processing method and groove micro-diameter drill bit |
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| CN1618557A (en) * | 2002-09-03 | 2005-05-25 | 三菱综合材料株式会社 | Drill and production method thereof |
| CN101422826A (en) * | 2008-08-12 | 2009-05-06 | 深圳市金洲精工科技股份有限公司 | Micro drill bit for circuit boring |
| CN102205436A (en) * | 2010-03-31 | 2011-10-05 | 佑能工具株式会社 | Perforating tool |
| CN202180239U (en) * | 2011-05-10 | 2012-04-04 | 尖点科技股份有限公司 | Chip groove structure of drill bit |
| CN102476209A (en) * | 2010-11-22 | 2012-05-30 | 佑能工具株式会社 | Drilling tool |
| CN202861477U (en) * | 2012-10-29 | 2013-04-10 | 深圳市金洲精工科技股份有限公司 | Printed circuit board (PCB) micro drill |
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2012
- 2012-10-29 CN CN201210420696.4A patent/CN102922007B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1618557A (en) * | 2002-09-03 | 2005-05-25 | 三菱综合材料株式会社 | Drill and production method thereof |
| CN101422826A (en) * | 2008-08-12 | 2009-05-06 | 深圳市金洲精工科技股份有限公司 | Micro drill bit for circuit boring |
| CN102205436A (en) * | 2010-03-31 | 2011-10-05 | 佑能工具株式会社 | Perforating tool |
| CN102476209A (en) * | 2010-11-22 | 2012-05-30 | 佑能工具株式会社 | Drilling tool |
| CN202180239U (en) * | 2011-05-10 | 2012-04-04 | 尖点科技股份有限公司 | Chip groove structure of drill bit |
| CN202861477U (en) * | 2012-10-29 | 2013-04-10 | 深圳市金洲精工科技股份有限公司 | Printed circuit board (PCB) micro drill |
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| CN102922007A (en) | 2013-02-13 |
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