CN102909872B - Preparation method of inhomogeneous-media substrate - Google Patents
Preparation method of inhomogeneous-media substrate Download PDFInfo
- Publication number
- CN102909872B CN102909872B CN201110219404.6A CN201110219404A CN102909872B CN 102909872 B CN102909872 B CN 102909872B CN 201110219404 A CN201110219404 A CN 201110219404A CN 102909872 B CN102909872 B CN 102909872B
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- China
- Prior art keywords
- idiosome
- material layer
- groove
- convex tooth
- mould
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
- B29C2045/0063—Joining parts moulded in separate cavities facing before assembling, i.e. bringing the parts opposite to each other before assembling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
- B29C2045/0072—Joining parts moulded in separate cavities the parts to be joined being moulded in a stack mould
Abstract
The invention provides a preparation method of an inhomogeneous-media substrate. The method comprises the steps that: a first high-molecular material is injected into a first mold chamber, such that a first blank is obtained, wherein the first blank is composed of a first high-molecular material layer and protruding teeth and recesses below the first high-molecular material layer; a second high-molecular material is injected into a second mold chamber, such that a second blank is obtained, wherein the second blank is composed of a second high-molecular material layer and protruding teeth and recesses above the second high-molecular material layer; the first blank and the second blank are spliced, such that the protruding teeth and recesses of the first blank are engaged with the protruding teeth and recesses of the second blank, and therefore a third blank is obtained; and the first high-molecular material layer and the second high-molecular material layer on the third blank are removed, such that the inhomogeneous-media substrate is obtained. The method provided by the invention is used for preparing the inhomogeneous-media substrate. The process flow is simple, and the precision is high.
Description
[technical field]
The present invention relates to technical field of composite materials, especially, relate to a kind of preparation method of inhomogeneous dielectric substrate.
[background technology]
In recent years, along with the fast development of the new and high technologies such as radar detection, satellite communication, Aero-Space, and the rise of the research field such as electromagnetism interference, stealth technique, microwave dark room, the research of microwave absorbing material is more and more subject to people's attention.
Meta Materials can reveal very marvellous galvanomagnetic-effect, can be used for the field such as absorbing material and stealth material, becomes the focus of absorbing material area research.
The character of Meta Materials and function mainly come from the structure of its inside, how accurately to prepare the key that the three-dimensional fine structure with periodic arrangement becomes Meta Materials technology of preparing.
PCB substrate with metal micro structure array is mainly laminated on together by the process of Meta Materials, fills other media between each laminar substrate.Traditional PCB substrate is mostly uniform dielectric substrate, and dielectric constant is difficult to regulate.The shortcomings such as although ceramic composite has wider dielectric constant range, ceramic composite exists processing difficulties, needs high temperature, expensive.
[summary of the invention]
Technical problem to be solved by this invention is to provide a kind of preparation method of inhomogeneous dielectric substrate, can obtain inhomogeneous dielectric substrate, thus obtains different dielectric constants according to demand.
For solving the problems of the technologies described above, one embodiment of the invention provides a kind of preparation method of inhomogeneous dielectric substrate, and the method comprises:
At indoor injection first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is made up of the first polymer material layer and the convex tooth be positioned at below this first polymer material layer and groove;
At indoor injection second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is made up of the second polymer material layer and the convex tooth be positioned at above this second polymer material layer and groove;
First idiosome and the second idiosome are spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding, obtain the 3rd idiosome;
Remove the first polymer material layer on the 3rd idiosome and the second polymer material layer, obtain inhomogeneous dielectric substrate.
Compared with prior art, technique scheme has the following advantages: by Implanted Polymer in a mold, formed and there is convex tooth and groove first idiosome and there is the second idiosome of convex tooth and groove, groove and the convex tooth of the convex tooth of the first idiosome and groove and the second idiosome are mutually embedding, obtain the medium substrate that the first macromolecular material and the second macromolecular material replace mutually.Because different region dielectric constants is different, therefore can regulates according to demand, obtain different dielectric constants, technological process is simple, and accuracy is high.
[accompanying drawing explanation]
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the preparing processes figure of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention provides;
Fig. 2 is preparation method's flow chart of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention one provides;
Fig. 3 is preparation method's flow chart of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention two provides;
Fig. 4 is preparation method's flow chart of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention three provides.
[detailed description of the invention]
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
First, in order to those skilled in the art are easier to understand technical scheme of the present invention, below preparing processes of the present invention is described.
See Fig. 1, be the preparing processes figure of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention provides.
101 for preparing the mould state diagram needed for inhomogeneous dielectric substrate, and this mould comprises upper mold 11, middle level mould 12 and lower mold 13.Wherein, have can the opening of Implanted Polymer and corresponding control valve (not shown in figure 1) for upper mold 11 and lower mold 13.
102 for splicing upper mold 11 and middle level mould 12, and middle level mould 12 and lower mold 13 are spliced shown state diagram.Wherein, upper mold 11 and middle level mould 12 splices and obtain the first mould room 14, and middle level mould 12 and lower mold 13 are spliced and obtained the second mould room 15.
103 obtain the first idiosome 16 and in the second mould room 15, inject the second macromolecular material obtaining the rear shown state diagram of the second idiosome 17 for injecting the first macromolecular material in the first mould room 14.
104 for be separated shown state diagram with upper mold 11 with lower mold 13 respectively by middle level mould 12.
105 obtain the state diagram shown in the 3rd idiosome 18 for upper mold 11 and lower mold 13 being carried out splicing.
106 for be separated shown state diagram with upper mold 11 with lower mold 13 by the 3rd idiosome 18.
107 is the first polymer material layer on removal the 3rd idiosome and the second polymer material layer, obtains the state diagram shown in inhomogeneous dielectric substrate.
Known above, the technological process that the embodiment of the present invention obtains non-homogeneous composite material substrate is simple, adopts Polymer materialspreparation in addition, reasonable price.
Embodiment one,
See Fig. 2, be preparation method's flow chart of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention one provides, this preparation method comprises:
S201: at indoor injection first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is made up of the first polymer material layer and the convex tooth be positioned at below this first polymer material layer and groove.
Wherein, the first macromolecular material is selected according to required concrete electromagnetic parameter, such as, can select any one in polypropylene, acrylonitrile resin or epoxy resin.
S202: at indoor injection second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is made up of the second polymer material layer and the convex tooth be positioned at above this second polymer material layer and groove.
Wherein, the second macromolecular material is the material different from the first macromolecular material, selects according to required concrete electromagnetic parameter, such as, can select any one in polypropylene, acrylonitrile resin or epoxy resin.
S203: the first idiosome and the second idiosome are spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding, obtain the 3rd idiosome.
S204: remove the first polymer material layer on the 3rd idiosome and the second polymer material layer, obtains inhomogeneous dielectric substrate.
In the present embodiment, by Implanted Polymer in a mold, formed and there is convex tooth and groove first idiosome and there is the second idiosome of convex tooth and groove, groove and the convex tooth of the convex tooth of the first idiosome and groove and the second idiosome are mutually embedding, obtain the medium substrate that the first macromolecular material and the second macromolecular material replace mutually.Because different region dielectric constants is different, therefore can regulates according to demand, obtain different dielectric constants, technological process is simple, and accuracy is high.
See Fig. 3, be preparation method's flow chart of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention two provides, the method comprises:
S301: preparation upper mold, middle level mould and lower mold.
Concrete, prepare upper mold 11 as shown in Figure 1, middle level mould 12 and lower mold 13.
S302: upper mold and middle level mould are spliced, obtains the first mould room, and the groove that this first mould room is connected below first passage and with first passage by first passage and being positioned at and convex tooth form.
S303: lower mold and middle level mould are spliced, obtains the second mould room, and the groove that this second mould room is connected above second channel and with second channel by second channel and being positioned at and convex tooth form.
S304: at indoor injection first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is made up of the first polymer material layer and the convex tooth be positioned at below this first polymer material layer and groove.
Wherein, the shape of the first idiosome is corresponding with the cavity shape of the first mould room.
S305: at indoor injection second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is made up of the second polymer material layer and the convex tooth be positioned at above this second polymer material layer and groove.
Wherein, the shape of the second idiosome is corresponding with the cavity shape of the second mould room.
S306: middle level mould is separated with lower mold with upper mold respectively.
S307: apply the first thick macromolecular material of one deck or the second macromolecular material at the first idiosome edge.
In concrete implementation process, S307 also can substitute by following steps:
The first thick macromolecular material of one deck or the second macromolecular material is applied at the second idiosome edge.
S308: upper mold and lower mold are spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding.
S309: the 3rd idiosome is separated with lower mold with upper mold respectively.
S310: remove the first polymer material layer on the 3rd idiosome and the second polymer material layer, obtains inhomogeneous dielectric substrate.
In concrete implementation process, the mode cuing open light can be adopted to remove the first polymer material layer on the 3rd idiosome and the second polymer material layer.
The present embodiment, relative to embodiment one, first prepares upper mold, middle level mould and lower mold, and then splicing obtains the first mould room and the second mould room.
See Fig. 4, be preparation method's flow chart of a kind of inhomogeneous dielectric substrate that the embodiment of the present invention three provides, the method comprises:
S401: preparation upper mold, middle level mould and lower mold.
Concrete, prepare upper mold 11 as shown in Figure 1, middle level mould 12 and lower mold 13.
S402: upper mold and middle level mould are spliced, obtains the first mould room, and the groove that this first mould room is connected below first passage and with first passage by first passage and being positioned at and convex tooth form.
S403: lower mold and middle level mould are spliced, obtains the second mould room, and the groove that this second mould room is connected above second channel and with second channel by second channel and being positioned at and convex tooth form.
S404: at indoor injection first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is made up of the first polymer material layer and the convex tooth be positioned at below this first polymer material layer and groove.
Wherein, the shape of the first idiosome is corresponding with the cavity shape of the first mould room.
S405: at indoor injection second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is made up of the second polymer material layer and the convex tooth be positioned at above this second polymer material layer and groove.
Wherein, the shape of the second idiosome is corresponding with the cavity shape of the second mould room.
S406: middle level mould is separated with lower mold with upper mold respectively.
S407: upper mold and lower mold are spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding.
S408: heat the first idiosome and the second idiosome, makes the first idiosome and the second idiosome form one.
S409: the 3rd idiosome is separated with lower mold with upper mold respectively.
S410: remove the first polymer material layer on the 3rd idiosome and the second polymer material layer, obtains inhomogeneous dielectric substrate.
In concrete implementation process, the mode cuing open light can be adopted to remove the first polymer material layer on the 3rd idiosome and the second polymer material layer.
The present embodiment, relative to embodiment two, adopts the mode of heating the first idiosome and the second idiosome to be bonded together, and in concrete implementation process, selects the embodiment be applicable to.
Be described in detail the embodiment of the present invention above, apply specific case herein and set forth principle of the present invention and embodiment, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a preparation method for inhomogeneous dielectric substrate, is characterized in that, comprising:
At indoor injection first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is made up of the first polymer material layer and the convex tooth be positioned at below this first polymer material layer and groove;
At indoor injection second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is made up of the second polymer material layer and the convex tooth be positioned at above this second polymer material layer and groove;
First idiosome and the second idiosome are spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding, obtain the 3rd idiosome;
Remove the first polymer material layer on the 3rd idiosome and the second polymer material layer, obtain inhomogeneous dielectric substrate.
2. method according to claim 1, is characterized in that, also comprises before described method:
Upper mold and middle level mould are spliced, obtain the first mould room, the groove that this first mould room is connected below first passage and with first passage by first passage and being positioned at and convex tooth form;
Lower mold and middle level mould are spliced, obtain the second mould room, the groove that this second mould room is connected above second channel and with second channel by second channel and being positioned at and convex tooth form.
3. method according to claim 2, is characterized in that, also comprises before described method:
Preparation upper mold, middle level mould and lower mold.
4. method according to claim 2, is characterized in that, the first idiosome and the second idiosome is spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding, comprising:
Middle level mould is separated with lower mold with upper mold respectively;
Upper mold and lower mold are spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding.
5. method according to claim 4, is characterized in that, before upper mold and lower mold being spliced, also comprises:
The first thick macromolecular material of one deck or the second macromolecular material is applied at the first idiosome edge.
6. method according to claim 4, is characterized in that, before upper mold and lower mold being spliced, also comprises:
The first thick macromolecular material of one deck or the second macromolecular material is applied at the second idiosome edge.
7. method according to claim 4, is characterized in that, the first idiosome and the second idiosome is spliced, make the groove of the convex tooth of the first idiosome and groove and the second idiosome and convex tooth mutually embedding after also comprise:
First idiosome and the second idiosome are heated, makes the first idiosome and the second idiosome form one.
8. method according to claim 1, is characterized in that, before removing the first polymer material layer on the 3rd idiosome and the second polymer material layer, also comprises:
3rd idiosome is separated with lower mold with upper mold respectively.
9. method according to claim 1, is characterized in that, described first polymer material layer is polypropylene, acrylonitrile resin or epoxy resin.
10. method according to claim 9, is characterized in that, described second polymer material layer is any one different from the first macromolecular material in polypropylene, acrylonitrile resin and epoxy resin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219404.6A CN102909872B (en) | 2011-08-02 | 2011-08-02 | Preparation method of inhomogeneous-media substrate |
| PCT/CN2011/084540 WO2013016933A1 (en) | 2011-08-02 | 2011-12-23 | Method for preparing inhomogeneous dielectric substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219404.6A CN102909872B (en) | 2011-08-02 | 2011-08-02 | Preparation method of inhomogeneous-media substrate |
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| Publication Number | Publication Date |
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| CN102909872A CN102909872A (en) | 2013-02-06 |
| CN102909872B true CN102909872B (en) | 2015-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110219404.6A Active CN102909872B (en) | 2011-08-02 | 2011-08-02 | Preparation method of inhomogeneous-media substrate |
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| WO (1) | WO2013016933A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171933A (en) * | 1987-12-28 | 1989-07-06 | Honda Motor Co Ltd | Manufacture of cogged belt |
| JP3684249B2 (en) * | 1995-02-22 | 2005-08-17 | 新日鐵化学株式会社 | Spacer for entrainment and method for manufacturing substrate for flexible printed wiring board |
| JP2010192586A (en) * | 2009-02-17 | 2010-09-02 | Nitto Denko Corp | Optical semiconductor sealing sheet |
| KR20100129374A (en) * | 2009-05-31 | 2010-12-09 | 공석태 | Frp pannel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004001424A (en) * | 2002-04-04 | 2004-01-08 | Canon Inc | Injection molding method, injection mold, resin molded product and insert resin part |
| US7303626B2 (en) * | 2003-06-05 | 2007-12-04 | Murata Manufacturing Co., Ltd. | Three-dimensional periodic structure and method for producing the same |
| CN101081538A (en) * | 2006-06-02 | 2007-12-05 | 陈法胜 | Method for constructing high molecule matter by crossing moulding tools having different raw materials and the die thereof |
-
2011
- 2011-08-02 CN CN201110219404.6A patent/CN102909872B/en active Active
- 2011-12-23 WO PCT/CN2011/084540 patent/WO2013016933A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171933A (en) * | 1987-12-28 | 1989-07-06 | Honda Motor Co Ltd | Manufacture of cogged belt |
| JP3684249B2 (en) * | 1995-02-22 | 2005-08-17 | 新日鐵化学株式会社 | Spacer for entrainment and method for manufacturing substrate for flexible printed wiring board |
| JP2010192586A (en) * | 2009-02-17 | 2010-09-02 | Nitto Denko Corp | Optical semiconductor sealing sheet |
| KR20100129374A (en) * | 2009-05-31 | 2010-12-09 | 공석태 | Frp pannel |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013016933A1 (en) | 2013-02-07 |
| CN102909872A (en) | 2013-02-06 |
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