CN102909872A - Preparation method of inhomogeneous-media substrate - Google Patents
Preparation method of inhomogeneous-media substrate Download PDFInfo
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- CN102909872A CN102909872A CN2011102194046A CN201110219404A CN102909872A CN 102909872 A CN102909872 A CN 102909872A CN 2011102194046 A CN2011102194046 A CN 2011102194046A CN 201110219404 A CN201110219404 A CN 201110219404A CN 102909872 A CN102909872 A CN 102909872A
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- idiosome
- material layer
- groove
- protruding tooth
- mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
- B29C2045/0063—Joining parts moulded in separate cavities facing before assembling, i.e. bringing the parts opposite to each other before assembling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
- B29C2045/0072—Joining parts moulded in separate cavities the parts to be joined being moulded in a stack mould
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides a preparation method of an inhomogeneous-media substrate. The method comprises the steps that: a first high-molecular material is injected into a first mold chamber, such that a first blank is obtained, wherein the first blank is composed of a first high-molecular material layer and protruding teeth and recesses below the first high-molecular material layer; a second high-molecular material is injected into a second mold chamber, such that a second blank is obtained, wherein the second blank is composed of a second high-molecular material layer and protruding teeth and recesses above the second high-molecular material layer; the first blank and the second blank are spliced, such that the protruding teeth and recesses of the first blank are engaged with the protruding teeth and recesses of the second blank, and therefore a third blank is obtained; and the first high-molecular material layer and the second high-molecular material layer on the third blank are removed, such that the inhomogeneous-media substrate is obtained. The method provided by the invention is used for preparing the inhomogeneous-media substrate. The process flow is simple, and the precision is high.
Description
[technical field]
The present invention relates to technical field of composite materials, especially, relate to a kind of preparation method of inhomogeneous dielectric substrate.
[background technology]
In recent years, along with the fast development of the new and high technologies such as radar detection, satellite communication, Aero-Space, and the rise of the research field such as anti-electromagnetic interference, stealth technique, microwave dark room, the research of microwave absorbing material more and more is subject to people's attention.
Super material can reveal very marvellous galvanomagnetic-effect, can be used for the fields such as absorbing material and stealth material, becomes the focus of absorbing material area research.
Super material character and function mainly come from its inner structure, how accurately to prepare the key that the three-dimensional fine structure with periodic arrangement becomes super material preparation technology.
The process of super material mainly is with the PCB substrate joining of metal micro structure array together, fills other media between each laminar substrate.Traditional PCB substrate mostly is greatly the uniform dielectric substrate, and dielectric constant is difficult to regulate.The shortcomings such as although ceramic composite has wider dielectric constant range, there is processing difficulties in ceramic composite, needs high temperature, and is expensive.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of preparation method of inhomogeneous dielectric substrate, can access inhomogeneous dielectric substrate, thereby obtains according to demand different dielectric constants.
For solving the problems of the technologies described above, one embodiment of the invention provides a kind of preparation method of inhomogeneous dielectric substrate, and the method comprises:
At indoor injection the first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is comprised of the first polymer material layer and the protruding tooth and the groove that are positioned at this first polymer material layer below;
At indoor injection the second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is comprised of the second polymer material layer and the protruding tooth and the groove that are positioned at this second polymer material layer top;
The first idiosome and the second idiosome are spliced, make the protruding tooth and groove and the protruding tooth mutually embedding of groove with the second idiosome of the first idiosome, obtain the 3rd idiosome;
Remove the first polymer material layer and the second polymer material layer on the 3rd idiosome, obtain inhomogeneous dielectric substrate.
Compared with prior art, technique scheme has the following advantages: by Implanted Polymer in mould, the second idiosome that formation has protruding tooth and groove the first idiosome and has protruding tooth and groove, the protruding tooth of the first idiosome and groove and the protruding tooth mutually embedding of groove with the second idiosome obtain the medium substrate that the first macromolecular material and the second macromolecular material replace mutually.Because different regional dielectric constants is different, therefore can regulate according to demand, obtains different dielectric constants, technological process is simple, and accuracy is high.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention, the accompanying drawing of required use was done to introduce simply during the below will describe embodiment, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the preparation state diagram of a kind of inhomogeneous dielectric substrate of providing of the embodiment of the invention;
Fig. 2 is preparation method's flow chart of a kind of inhomogeneous dielectric substrate of providing of the embodiment of the invention one;
Fig. 3 is preparation method's flow chart of a kind of inhomogeneous dielectric substrate of providing of the embodiment of the invention two;
Fig. 4 is preparation method's flow chart of a kind of inhomogeneous dielectric substrate of providing of the embodiment of the invention three.
[specific embodiment]
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other embodiment that obtain under the creative work prerequisite.
At first, for those skilled in the art are more readily understood technical scheme of the present invention, the below is described preparation state of the present invention.
Referring to Fig. 1, the preparation state diagram of a kind of inhomogeneous dielectric substrate that provides for the embodiment of the invention.
101 are the required mould state diagram of preparation inhomogeneous dielectric substrate, and this mould comprises upper mold 11, middle level mould 12 and lower mold 13.Wherein, but upper mold 11 and lower mold 13 have opening and the corresponding control valve (not shown in figure 1) of Implanted Polymer.
102 is with upper mold 11 and 12 splicings of middle level mould, and with middle level mould 12 and the state diagram shown in lower mold 13 splicings.Wherein, upper mold 11 obtains the first mould chamber 14 with 12 splicings of middle level mould, and middle level mould 12 obtains the second mould chamber 15 with lower mold 13 splicings.
103 for inject in the first mould chamber 14 that the first macromolecular material obtains the first idiosome 16 and after the second mould chamber 15 interior injection the second macromolecular materials obtain the second idiosome 17 shown in state diagram.
104 for middle level mould 12 respectively with upper mold 11 and the state diagram shown in lower mold 13 is separated.
105 is upper mold 11 and lower mold 13 to be spliced obtain the state diagram shown in the 3rd idiosome 18.
106 for the 3rd idiosome 18 and upper mold 11 and the state diagram shown in lower mold 13 is separated.
107 for removing the first polymer material layer and the second polymer material layer on the 3rd idiosome, obtains the state diagram shown in the inhomogeneous dielectric substrate.
Below as can be known, the technological process of embodiment of the invention acquisition non-homogeneous composite material substrate is simple, adopts in addition Polymer materialspreparation, reasonable price.
Embodiment one,
Referring to Fig. 2, preparation method's flow chart of a kind of inhomogeneous dielectric substrate that provides for the embodiment of the invention one, this preparation method comprises:
S201: at indoor injection the first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is comprised of the first polymer material layer and the protruding tooth and the groove that are positioned at this first polymer material layer below.
Wherein, the first macromolecular material is selected according to required concrete electromagnetic parameter, for example can select in polypropylene, acrylonitrile resin or the epoxy resin any one.
S202: at indoor injection the second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is comprised of the second polymer material layer and the protruding tooth and the groove that are positioned at this second polymer material layer top.
Wherein, the second macromolecular material is the material different from the first macromolecular material, selects according to required concrete electromagnetic parameter, for example can select in polypropylene, acrylonitrile resin or the epoxy resin any one.
S203: the first idiosome and the second idiosome are spliced, make the protruding tooth and groove and the protruding tooth mutually embedding of groove with the second idiosome of the first idiosome, obtain the 3rd idiosome.
S204: remove the first polymer material layer and the second polymer material layer on the 3rd idiosome, obtain inhomogeneous dielectric substrate.
In the present embodiment, by Implanted Polymer in mould, the second idiosome that formation has protruding tooth and groove the first idiosome and has protruding tooth and groove, the protruding tooth of the first idiosome and groove and the protruding tooth mutually embedding of groove with the second idiosome obtain the medium substrate that the first macromolecular material and the second macromolecular material replace mutually.Because different regional dielectric constants is different, therefore can regulate according to demand, obtains different dielectric constants, technological process is simple, and accuracy is high.
Referring to Fig. 3, preparation method's flow chart of a kind of inhomogeneous dielectric substrate that provides for the embodiment of the invention two, the method comprises:
S301: preparation upper mold, middle level mould and lower mold.
Concrete, preparation upper mold 11, middle level mould 12 and lower mold 13 as shown in fig. 1.
S302: upper mold and middle level mould are spliced, obtain the first mould chamber, this first mould chamber is by first passage and be positioned at first passage below and the groove and the protruding tooth that link to each other with first passage form.
S303: lower mold and middle level mould are spliced, obtain the second mould chamber, this second mould chamber is by second channel and be positioned at second channel top and the groove and the protruding tooth that link to each other with second channel form.
S304: at indoor injection the first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is comprised of the first polymer material layer and the protruding tooth and the groove that are positioned at this first polymer material layer below.
Wherein, the shape of the first idiosome is corresponding with the cavity shape of the first mould chamber.
S305: at indoor injection the second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is comprised of the second polymer material layer and the protruding tooth and the groove that are positioned at this second polymer material layer top.
Wherein, the shape of the second idiosome is corresponding with the cavity shape of the second mould chamber.
S306: the middle level mould is separated with lower mold with upper mold respectively.
S307: at thick the first macromolecular material or the second macromolecular material of the first idiosome edge coating one deck.
In concrete implementation process, S37 also can substitute with following steps:
At thick the first macromolecular material or the second macromolecular material of the second idiosome edge coating one deck.
S308: upper mold and lower mold are spliced, so that the protruding tooth of the first idiosome and groove and the protruding tooth mutually embedding of groove with the second idiosome.
S309: the 3rd idiosome is separated with lower mold with upper mold respectively.
S310: remove the first polymer material layer and the second polymer material layer on the 3rd idiosome, obtain inhomogeneous dielectric substrate.
In concrete implementation process, can adopt the mode of cuing open light to remove the first polymer material layer and the second polymer material layer on the 3rd idiosome.
The present embodiment at first prepares upper mold, middle level mould and lower mold with respect to embodiment one, and then splicing obtains the first mould chamber and the second mould chamber.
Referring to Fig. 4, preparation method's flow chart of a kind of inhomogeneous dielectric substrate that provides for the embodiment of the invention three, the method comprises:
S401: preparation upper mold, middle level mould and lower mold.
Concrete, preparation upper mold 11, middle level mould 12 and lower mold 13 as shown in fig. 1.
S402: upper mold and middle level mould are spliced, obtain the first mould chamber, this first mould chamber is by first passage and be positioned at first passage below and the groove and the protruding tooth that link to each other with first passage form.
S403: lower mold and middle level mould are spliced, obtain the second mould chamber, this second mould chamber is by second channel and be positioned at second channel top and the groove and the protruding tooth that link to each other with second channel form.
S404: at indoor injection the first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is comprised of the first polymer material layer and the protruding tooth and the groove that are positioned at this first polymer material layer below.
Wherein, the shape of the first idiosome is corresponding with the cavity shape of the first mould chamber.
S405: at indoor injection the second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is comprised of the second polymer material layer and the protruding tooth and the groove that are positioned at this second polymer material layer top.
Wherein, the shape of the second idiosome is corresponding with the cavity shape of the second mould chamber.
S406: the middle level mould is separated with lower mold with upper mold respectively.
S407: upper mold and lower mold are spliced, so that the protruding tooth of the first idiosome and groove and the protruding tooth mutually embedding of groove with the second idiosome.
S408: the first idiosome and the second idiosome are heated, make the first idiosome and the second idiosome form one.
S409: the 3rd idiosome is separated with lower mold with upper mold respectively.
S410: remove the first polymer material layer and the second polymer material layer on the 3rd idiosome, obtain inhomogeneous dielectric substrate.
In concrete implementation process, can adopt the mode of cuing open light to remove the first polymer material layer and the second polymer material layer on the 3rd idiosome.
The present embodiment adopts the mode of heating that the first idiosome and the second idiosome are bonded together with respect to embodiment two, in concrete implementation process, selects the embodiment that is fit to.
Above the embodiment of the invention is described in detail, has used specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. the preparation method of an inhomogeneous dielectric substrate is characterized in that, comprising:
At indoor injection the first macromolecular material of the first mould, obtain the first idiosome, this first idiosome is comprised of the first polymer material layer and the protruding tooth and the groove that are positioned at this first polymer material layer below;
At indoor injection the second macromolecular material of the second mould, obtain the second idiosome, this second idiosome is comprised of the second polymer material layer and the protruding tooth and the groove that are positioned at this second polymer material layer top;
The first idiosome and the second idiosome are spliced, make the protruding tooth and groove and the protruding tooth mutually embedding of groove with the second idiosome of the first idiosome, obtain the 3rd idiosome;
Remove the first polymer material layer and the second polymer material layer on the 3rd idiosome, obtain inhomogeneous dielectric substrate.
2. method according to claim 1 is characterized in that, also comprises before the described method:
Upper mold and middle level mould are spliced, obtain the first mould chamber, this first mould chamber is by first passage and be positioned at first passage below and the groove and the protruding tooth that link to each other with first passage form;
Lower mold and middle level mould are spliced, obtain the second mould chamber, this second mould chamber is by second channel and be positioned at second channel top and the groove and the protruding tooth that link to each other with second channel form.
3. method according to claim 2 is characterized in that, also comprises before the described method:
Preparation upper mold, middle level mould and lower mold.
4. method according to claim 2 is characterized in that, the first idiosome and the second idiosome are spliced, and makes the protruding tooth and groove and the protruding tooth mutually embedding of groove with the second idiosome of the first idiosome, comprising:
The middle level mould is separated with lower mold with upper mold respectively;
Upper mold and lower mold are spliced, so that the protruding tooth of the first idiosome and groove and the protruding tooth mutually embedding of groove with the second idiosome.
5. method according to claim 4 is characterized in that, before upper mold and lower mold are spliced, also comprises:
At thick the first macromolecular material or the second macromolecular material of the first idiosome edge coating one deck.
6. method according to claim 4 is characterized in that, before upper mold and lower mold are spliced, also comprises:
At thick the first macromolecular material or the second macromolecular material of the second idiosome edge coating one deck.
7. method according to claim 4 is characterized in that, the first idiosome and the second idiosome are spliced, and the protruding tooth of the first idiosome is also comprised after the embedding mutually with groove and the protruding tooth of groove with the second idiosome:
The first idiosome and the second idiosome are heated, make the first idiosome and the second idiosome form one.
8. method according to claim 1 is characterized in that, removes before the first polymer material layer and the second polymer material layer on the 3rd idiosome, also comprises:
The 3rd idiosome is separated with lower mold with upper mold respectively.
9. want its 1 described method according to right, it is characterized in that, described the first polymer material layer is polypropylene, acrylonitrile resin or epoxy resin.
10. method according to claim 9 is characterized in that, described the second polymer material layer is any one different from the first macromolecular material in polypropylene, acrylonitrile resin and the epoxy resin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219404.6A CN102909872B (en) | 2011-08-02 | 2011-08-02 | Preparation method of inhomogeneous-media substrate |
| PCT/CN2011/084540 WO2013016933A1 (en) | 2011-08-02 | 2011-12-23 | Method for preparing inhomogeneous dielectric substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219404.6A CN102909872B (en) | 2011-08-02 | 2011-08-02 | Preparation method of inhomogeneous-media substrate |
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| Publication Number | Publication Date |
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| CN102909872A true CN102909872A (en) | 2013-02-06 |
| CN102909872B CN102909872B (en) | 2015-02-04 |
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| CN201110219404.6A Active CN102909872B (en) | 2011-08-02 | 2011-08-02 | Preparation method of inhomogeneous-media substrate |
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| WO (1) | WO2013016933A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171933A (en) * | 1987-12-28 | 1989-07-06 | Honda Motor Co Ltd | Manufacture of cogged belt |
| JP3684249B2 (en) * | 1995-02-22 | 2005-08-17 | 新日鐵化学株式会社 | Spacer for entrainment and method for manufacturing substrate for flexible printed wiring board |
| JP2010192586A (en) * | 2009-02-17 | 2010-09-02 | Nitto Denko Corp | Optical semiconductor sealing sheet |
| KR20100129374A (en) * | 2009-05-31 | 2010-12-09 | 공석태 | Frp pannel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004001424A (en) * | 2002-04-04 | 2004-01-08 | Canon Inc | Injection molding method, injection mold, resin molded product and insert resin part |
| CN100351652C (en) * | 2003-06-05 | 2007-11-28 | 株式会社村田制作所 | Three-dimensional periodic structure and process for producing the same |
| CN101081538A (en) * | 2006-06-02 | 2007-12-05 | 陈法胜 | Method for constructing high molecule matter by crossing moulding tools having different raw materials and the die thereof |
-
2011
- 2011-08-02 CN CN201110219404.6A patent/CN102909872B/en active Active
- 2011-12-23 WO PCT/CN2011/084540 patent/WO2013016933A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171933A (en) * | 1987-12-28 | 1989-07-06 | Honda Motor Co Ltd | Manufacture of cogged belt |
| JP3684249B2 (en) * | 1995-02-22 | 2005-08-17 | 新日鐵化学株式会社 | Spacer for entrainment and method for manufacturing substrate for flexible printed wiring board |
| JP2010192586A (en) * | 2009-02-17 | 2010-09-02 | Nitto Denko Corp | Optical semiconductor sealing sheet |
| KR20100129374A (en) * | 2009-05-31 | 2010-12-09 | 공석태 | Frp pannel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102909872B (en) | 2015-02-04 |
| WO2013016933A1 (en) | 2013-02-07 |
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