CN102903830A - 发光装置 - Google Patents
发光装置 Download PDFInfo
- Publication number
- CN102903830A CN102903830A CN2011103268297A CN201110326829A CN102903830A CN 102903830 A CN102903830 A CN 102903830A CN 2011103268297 A CN2011103268297 A CN 2011103268297A CN 201110326829 A CN201110326829 A CN 201110326829A CN 102903830 A CN102903830 A CN 102903830A
- Authority
- CN
- China
- Prior art keywords
- light
- fluorescence coating
- emitting device
- wave band
- emitting component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 claims description 190
- 239000011248 coating agent Substances 0.000 claims description 189
- 230000005855 radiation Effects 0.000 claims description 22
- 210000004276 hyalin Anatomy 0.000 claims description 11
- 238000009877 rendering Methods 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 35
- 239000000758 substrate Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 230000002596 correlated effect Effects 0.000 description 3
- 241001025261 Neoraja caerulea Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/189,933 US20130026514A1 (en) | 2011-07-25 | 2011-07-25 | Light emitting device |
US13/189,933 | 2011-07-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102903830A true CN102903830A (zh) | 2013-01-30 |
Family
ID=47575979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011103268297A Pending CN102903830A (zh) | 2011-07-25 | 2011-10-19 | 发光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130026514A1 (zh) |
CN (1) | CN102903830A (zh) |
TW (1) | TW201306318A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103337584A (zh) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | 一种白光led及其封装方法 |
CN106784260A (zh) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | 一种直下式led背光源的制作方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6154153B2 (ja) * | 2013-02-14 | 2017-06-28 | 大塚電子株式会社 | 標準光源および測定方法 |
JP6094254B2 (ja) * | 2013-02-21 | 2017-03-15 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
JP2014175362A (ja) * | 2013-03-06 | 2014-09-22 | Toshiba Corp | 半導体発光素子及びその製造方法 |
US10535805B2 (en) | 2017-01-13 | 2020-01-14 | Intematix Corporation | Narrow-band red phosphors for LED lamps |
CN113841238A (zh) | 2019-03-18 | 2021-12-24 | 英特曼帝克司公司 | Led灯丝 |
US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
WO2020190960A1 (en) * | 2019-03-18 | 2020-09-24 | Intematix Corporation | Led-filament |
US11342311B2 (en) * | 2019-03-18 | 2022-05-24 | Intematix Corporation | LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005277127A (ja) * | 2004-03-25 | 2005-10-06 | Stanley Electric Co Ltd | 発光デバイス |
US20090058256A1 (en) * | 2007-08-31 | 2009-03-05 | Iwao Mitsuishi | Light-emitting device |
CN101636851A (zh) * | 2007-02-26 | 2010-01-27 | 皇家菲利浦电子有限公司 | 具有透镜中的磷光体片和过模压磷光体的led |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI347687B (en) * | 2007-07-13 | 2011-08-21 | Lite On Technology Corp | Light-emitting device with open-loop control |
-
2011
- 2011-07-25 US US13/189,933 patent/US20130026514A1/en not_active Abandoned
- 2011-10-07 TW TW100136411A patent/TW201306318A/zh unknown
- 2011-10-19 CN CN2011103268297A patent/CN102903830A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005277127A (ja) * | 2004-03-25 | 2005-10-06 | Stanley Electric Co Ltd | 発光デバイス |
CN101636851A (zh) * | 2007-02-26 | 2010-01-27 | 皇家菲利浦电子有限公司 | 具有透镜中的磷光体片和过模压磷光体的led |
US20090058256A1 (en) * | 2007-08-31 | 2009-03-05 | Iwao Mitsuishi | Light-emitting device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103337584A (zh) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | 一种白光led及其封装方法 |
CN106784260A (zh) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | 一种直下式led背光源的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130026514A1 (en) | 2013-01-31 |
TW201306318A (zh) | 2013-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: XUMING PHOTOELECTRICITY INC. Effective date: 20140102 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140102 Address after: Hsinchu City, Taiwan, China Applicant after: Caiyu Science-Technology Co., Ltd. Applicant after: Xuming Photoelectricity Inc. Address before: Hsinchu City, Taiwan, China Applicant before: Caiyu Science-Technology Co., Ltd. |
|
C05 | Deemed withdrawal (patent law before 1993) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130130 |