CN102892253B - 一种导电、绝缘油墨线路板加工方法 - Google Patents
一种导电、绝缘油墨线路板加工方法 Download PDFInfo
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- CN102892253B CN102892253B CN201210375686.3A CN201210375686A CN102892253B CN 102892253 B CN102892253 B CN 102892253B CN 201210375686 A CN201210375686 A CN 201210375686A CN 102892253 B CN102892253 B CN 102892253B
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- Prior art keywords
- printing
- ink
- electrically conductive
- wiring board
- conductive ink
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- 238000009413 insulation Methods 0.000 title claims abstract description 15
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 238000007639 printing Methods 0.000 claims abstract description 63
- 238000012360 testing method Methods 0.000 claims abstract description 58
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 25
- 239000010959 steel Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000013461 design Methods 0.000 claims abstract description 13
- 238000001994 activation Methods 0.000 claims abstract description 8
- 238000002360 preparation method Methods 0.000 claims abstract description 4
- 239000000976 ink Substances 0.000 claims description 105
- 230000008569 process Effects 0.000 claims description 12
- 238000011161 development Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 7
- 241000272165 Charadriidae Species 0.000 claims description 6
- 238000007603 infrared drying Methods 0.000 claims description 6
- 238000007788 roughening Methods 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 239000008262 pumice Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims description 3
- 238000005299 abrasion Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 abstract 1
- 239000010408 film Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000003801 milling Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
控制项目 | 工艺参数控制范围 |
钢丝网版目数 | 250目 |
绷网角度 | 22.5° |
网版厚度 | 15-25um |
钢丝网张力 | 20-28N/cm |
控制项目 | 工艺参数控制范围 |
架空距离(网距) | 1.0-2.0mm |
离板距离 | 0.3-0.7mm |
刮板硬度 | 肖氏硬度为75° |
刮板角度 | 15-25° |
覆墨刀角度 | 0° |
印刷速度(覆墨) | 60-100mm/sec |
印刷速度(刮板) | 20-70mm/sec |
绝缘油墨宽度(MIN) | 8-10mil |
导电年轮(MIN) | 5-8mil |
绝缘与导电间距(MIN) | 8-12mil |
控制项目 | 工艺参数控制范围 |
架空距离(网距) | 1.0-2.0mm |
离板距离 | 0.3-0.7mm |
刮板硬度 | 肖氏硬度为75° |
刮板角度 | 15-25° |
覆墨刀角度 | 0° |
印刷速度(覆墨) | 60-100mm/sec |
印刷速度(刮板) | 20-70mm/sec |
绝缘油墨宽度(MIN) | 8-10mil |
导电年轮(MIN) | 5-8mil |
绝缘与导电间距(MIN) | 8-12mil |
控制项目 | 工艺参数控制范围 |
钢丝网版目数 | 250目 |
绷网角度 | 22.5° |
网版厚度 | 15-25um |
钢丝网张力 | 20-28N/cm |
控制项目 | 工艺参数控制范围 |
架空距离(网距) | 1.0-2.0mm |
离板距离 | 0.3-0.7mm |
刮板硬度 | 肖氏硬度为75° |
刮板角度 | 15-25° |
覆墨刀角度 | 0° |
印刷速度(覆墨) | 60-100mm/sec |
印刷速度(刮板) | 20-70mm/sec |
绝缘油墨宽度(MIN) | 8-10mil |
导电年轮(MIN) | 5-8mil |
绝缘与导电间距(MIN) | 8-12mil |
控制项目 | 工艺参数控制范围 |
架空距离(网距) | 1.0-2.0mm |
离板距离 | 0.3-0.7mm |
刮板硬度 | 肖氏硬度为75° |
刮板角度 | 15-25° |
覆墨刀角度 | 0° |
印刷速度(覆墨) | 60-100mm/sec |
印刷速度(刮板) | 20-70mm/sec |
绝缘油墨宽度(MIN) | 8-10mil |
导电年轮(MIN) | 5-8mil |
绝缘与导电间距(MIN) | 8-12mil |
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210375686.3A CN102892253B (zh) | 2012-09-27 | 2012-09-27 | 一种导电、绝缘油墨线路板加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210375686.3A CN102892253B (zh) | 2012-09-27 | 2012-09-27 | 一种导电、绝缘油墨线路板加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102892253A CN102892253A (zh) | 2013-01-23 |
CN102892253B true CN102892253B (zh) | 2015-12-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210375686.3A Active CN102892253B (zh) | 2012-09-27 | 2012-09-27 | 一种导电、绝缘油墨线路板加工方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102892253B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105163508B (zh) * | 2015-08-13 | 2018-08-10 | 恩达电路(深圳)有限公司 | 长寿命耐摩擦碳油电路板生产方法 |
CN105263258A (zh) * | 2015-11-06 | 2016-01-20 | 广东欧珀移动通信有限公司 | 柔性电路板及其定位标示的设置方法 |
CN108337799B (zh) * | 2017-12-26 | 2019-09-13 | 东莞市科佳电路有限公司 | 一种防披锋的线路板 |
CN108668455A (zh) * | 2018-05-02 | 2018-10-16 | 西安工程大学 | 一种用于铝基板led增材电路的制备方法 |
EP3871476A4 (en) * | 2018-10-25 | 2022-08-24 | Jabil Inc. | PRINTING MULTILAYER CIRCUITS ONTO GRAPHICS |
CN111432506B (zh) * | 2020-04-02 | 2022-04-19 | 浙江安扬新能源科技有限公司 | 一种加热芯片的制作工艺 |
CN112218421B (zh) * | 2020-09-23 | 2024-08-16 | 惠州中京电子科技有限公司 | 一种基于自动化视觉的线路检查的对位方法 |
CN114245601A (zh) * | 2021-12-01 | 2022-03-25 | 惠州市金百泽电路科技有限公司 | 一种电路板的高精度碳油阻值制作方法 |
CN117677061B (zh) * | 2024-01-29 | 2024-04-09 | 深圳特新界面科技有限公司 | 一种环保水性导电浆料印刷电子标签的制备方法及系统 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63280490A (ja) * | 1987-05-12 | 1988-11-17 | Cmk Corp | スクリ−ン印刷機 |
CN1974683A (zh) * | 2005-11-28 | 2007-06-06 | 东洋油墨制造株式会社 | 油墨组合物 |
CN102088822A (zh) * | 2009-12-08 | 2011-06-08 | 三星半导体(中国)研究开发有限公司 | 具有焊点自保护功能的pcb基板及其焊盘制作工艺 |
CN102244981A (zh) * | 2010-08-05 | 2011-11-16 | 北京天亿润达科技发展有限公司 | 一种pcb电路板制作新工艺 |
CN102548219A (zh) * | 2010-12-28 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
-
2012
- 2012-09-27 CN CN201210375686.3A patent/CN102892253B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63280490A (ja) * | 1987-05-12 | 1988-11-17 | Cmk Corp | スクリ−ン印刷機 |
CN1974683A (zh) * | 2005-11-28 | 2007-06-06 | 东洋油墨制造株式会社 | 油墨组合物 |
CN102088822A (zh) * | 2009-12-08 | 2011-06-08 | 三星半导体(中国)研究开发有限公司 | 具有焊点自保护功能的pcb基板及其焊盘制作工艺 |
CN102244981A (zh) * | 2010-08-05 | 2011-11-16 | 北京天亿润达科技发展有限公司 | 一种pcb电路板制作新工艺 |
CN102548219A (zh) * | 2010-12-28 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
Non-Patent Citations (1)
Title |
---|
浅谈电子丝网印刷中PCB的印制技术;齐成;《印制电路信息》;20070910(第09期);第60页第2栏第35-40行,第61页第2栏第11-13行、第2栏第27-28行,第62页第1栏第15-16行、第2栏第40-41行 * |
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Publication number | Publication date |
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CN102892253A (zh) | 2013-01-23 |
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Effective date of registration: 20160203 Address after: 9-6, West Tieshan Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian new loop Electronics Co.,Ltd. Address before: 116600 No. 127 West Liaohe Road, Jinzhou New District, Liaoning, Dalian Patentee before: DALIAN PACIFIC ELECTRONICS Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170329 Address after: Thirty, Liaoning, Hong Kong Industrial Zone in the vicinity of the port of Dalian Pu Wan New District, Hong Kong Street, No. 19 Patentee after: DALIAN ASIA PACIFIC ELECTRONICS CO.,LTD. Address before: 9-6, West Tieshan Road, Dalian Development Zone, Liaoning, China Patentee before: Dalian New Loop Electronics Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A kind of conductive and insulating ink circuit board processing method Effective date of registration: 20220830 Granted publication date: 20151202 Pledgee: Bohai Bank Co.,Ltd. Dalian Branch Pledgor: DALIAN ASIA PACIFIC ELECTRONICS CO.,LTD. Registration number: Y2022980014042 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230908 Granted publication date: 20151202 Pledgee: Bohai Bank Co.,Ltd. Dalian Branch Pledgor: DALIAN ASIA PACIFIC ELECTRONICS CO.,LTD. Registration number: Y2022980014042 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A processing method for conductive and insulating ink circuit boards Effective date of registration: 20230914 Granted publication date: 20151202 Pledgee: Bohai Bank Co.,Ltd. Dalian Branch Pledgor: DALIAN ASIA PACIFIC ELECTRONICS CO.,LTD. Registration number: Y2023980056968 |