CN102891058A - Encapsulating structure of electronic element - Google Patents
Encapsulating structure of electronic element Download PDFInfo
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- CN102891058A CN102891058A CN2012103974707A CN201210397470A CN102891058A CN 102891058 A CN102891058 A CN 102891058A CN 2012103974707 A CN2012103974707 A CN 2012103974707A CN 201210397470 A CN201210397470 A CN 201210397470A CN 102891058 A CN102891058 A CN 102891058A
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Abstract
The invention discloses the encapsulating field of electronic elements, and specifically relates to an encapsulating structure of a high-power electronic element. The electronic element comprises a heat producing component and a shell. A composite thermal conductive material is encapsulated between the heat producing component and the shell, and the composite thermal conductive material is aluminum particles coated with resin. Compared with the existing heat-dissipating mode, the encapsulating structure of the electronic element disclosed by the invention has the characteristics of high heat conductivity, low encapsulating temperature, easy molding and the like.
Description
Technical field
The present invention relates to a kind of embedding field of electronic devices and components, be specifically related to the embedding structure of high-power electronic component.
Background technology
Electronic devices and components can be divided into electronic component and electronic device two large classes, and wherein electronic component generally refers to not change the finished product of minute subconstiuent when production and processing, comprises resistor, capacitor and inductor etc.; And electronic device has changed the finished product of molecular structure when generally referring to production and processing, comprises transistor, electron tube and integrated circuit etc.Travelling wave tube belongs to a kind of of electron tube, and it is the microwave tube of realizing enlarging function by the speed of continuous modulation electron beam.
Have now in order to allow electronic devices and components keep good working order, generally can adopt at its heat producing components place and be provided with heat sink, the heat that heat producing components produces when by the high thermal conductivity of heat sink electronic devices and components being worked is passed to the external world.Heat sink can be by metal clamp, ceramic member, macromolecular material spare and composite material element preparation.
The existing heat sink that is used for electronic devices and components generally is metal clamp, and metal clamp itself has the good thermal conductivity of metal, and its radiating effect should be best in theory; But because the restriction of some heat producing components self shape and structure, thus its with heat sink between can not contact preferably, usually can gappedly exist, cause the real contact area between metal clamp and the heat producing components less, radiating effect reduces.
In addition; for the gap between the heat producing components that reduces metal clamp and electronic devices and components; usually can adopt first surface with heat producing components to be coated with and spread casting glue; and then carrying out clamping heat radiation with metal clamp, the heat producing components that is particularly useful for electronic devices and components is not in the situation of flat surface.Can improve to a certain extent radiating effect by the mode that between metal clamp and heat producing components, increases casting glue.
Existing casting glue is generally resin material, epoxide resin material especially, and such material is more yielding, has stronger plasticity, but its thermal conductivity can not show a candle to the thermal conductivity of metal clamp, causes radiating effect to can not get significant lifting.
In addition, except above-mentioned metal clamp for electronic devices and components as the heat sink, the heat radiation of existing electronic devices and components also can realize by other some Heat Conduction Materials of embedding, and is for example following several:
Cermet material: cermet material is a kind of electronic devices and components Heat Conduction Material that the most generally uses now, wherein, and again take aluminium nitride AlN as main.Aluminium nitride has long service life, good insulating, anticorrosive, cheap and thermal conductivity high as the Heat Conduction Material of electronic devices and components, and its thermal conductivity can reach 200W/mK.Although the thermal conductivity of aluminium nitride is higher, itself material is frangible, so its impact resistance is relatively poor; In addition because the fusing point of aluminium nitride is higher, greater than 1800, so its easy-formation not, poor in processability.
Macromolecular material: macromolecular material is emerging in recent years a kind of electronic devices and components Heat Conduction Material.Macromolecular material generally is take high polymer as main, and with regard to its material itself, macromolecular material elasticity is higher than ceramic material far away, so its impact resistance is stronger; In addition, the macromolecular material fusing point is generally lower, so it is than easy-formation, and processability is good; But Polymer Thermal Conductivity is on the low side, generally only has about 0.2W/mK, will cause like this thermal diffusivity of electronic devices and components relatively poor; Simultaneously, macromolecular material itself is easily aging, easily discharges toxic gas, especially under hot conditions.
Composite material: composite material generally refers to the material that metal material or nonmetallic materials and macromolecular material combine, and wherein, the composite material that the composite material of being combined with macromolecular material take aluminium powder and boron nitride powder are combined with macromolecular material is as main.The composite material that forms increases in shock resistance although aluminium powder combines with macromolecular material, and its thermal conductivity only reaches 4.6W/mK; And in boron nitride and the composite material that macromolecular material combines, its thermal conductivity can reach 18.3W/mK, but because the boron nitride fancy price has restricted its application in high-power electronic component.
If the heat producing components surface irregularity, then the metal heat sink difficulty of processing is large, and is difficult to accomplish to mate fully with heat producing components; Ceramic heat-dissipating spare processing temperature high (aluminium nitride fusing point 〉=1800 ℃), and frangible, and impact resistance is relatively poor; Macromolecular material heat sink thermal conductance rate variance.And the development of hyundai electronics components and parts proposes easy-formation, package temperature is low, thermal conductivity is high requirement to heat sink.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of embedding structure of electronic devices and components, it is compared with the radiating mode of existing metal clamp, has obviously better radiating effect.
For solving above technical problem, technical scheme of the present invention is to adopt a kind of electronic devices and components embedding structure, and described electronic devices and components include heat producing components, shell; Embedding has composite heat conducting material between described heat producing components and the shell, and described composite heat conducting material is the alumina particles of resin-coating.
Preferably, described electronic devices and components are radio tubes.
Preferably, described radio tube is travelling wave tube, and described heat producing components is the slow wave parts.
Preferably, described alumina particles is dispersed in the resin.
Preferably, the particle diameter of described alumina particles is 0.01-10mm.
Preferably, described alumina particles surface from inside to outside is coated with zinc coating and copper coating successively.
Preferably, described resin is the epoxy resin prepolymer through curing agent and diluent curing.
Preferably, described surface from inside to outside is coated with the alumina particles of zinc coating and copper coating and the mass ratio of epoxy resin prepolymer is 100:1-30 successively.
Preferably, the mass ratio of described epoxy resin and curing agent and diluent is 1:0.1-2:0.1-2.
Preferably, described composite heat conducting material also includes 0.1-2 weight portion promoter or 0.1-2 weight portion flexibilizer.
Electronic devices and components embedding structure of the present invention includes heat producing components and shell, and it does not adopt existingly smears the casting glues such as upper resin with the heat producing components periphery first, and then the mode of metal clamp is set between heat producing components and shell; The mode that the present invention adopts is that embedding between described heat producing components and the shell is had composite heat conducting material, and described composite heat conducting material is the alumina particles of resin-coating.
The described composite heat conducting material of electronic devices and components embedding structure of the present invention is the alumina particles of resin-coating; The thermal conductivity of above-mentioned composite heat conducting material is less than metal clamping holder, and greater than resin, this puts different but it has fixing shape from metal clamp; Composite heat conducting material of the present invention in embedding after between heat producing components and the shell, composite heat conducting material is the alumina particles of resin-coating, resin has stronger plasticity, therefore its with the surface of heat producing components between can contact preferably, thereby reduce the gap, improve the real contact area on Heat Conduction Material and heat producing components surface, thereby improve significantly radiating effect.
Electronic devices and components embedding structure of the present invention is compared than the existing radiating mode of metal clamp and casting glue that utilizes, even between existing metal clamp and the heat producing components the lower resin filling of thermal conductivity is arranged, but its essence heat-conducting effect is relatively poor; Although and in the electronic devices and components embedding structure of the present invention the thermal conductivity of employed composite heat conducting material less than metal clamp, but the metallic particles aluminium that is scattered here and there a large amount of in the resin, and heat producing components and shell carried out the mode of embedding owing to having increased the essence contact area of heat production position and heat-conducting metal, make on the contrary it have better heat-conducting effect.
Further, preferably to adopt described electronic devices and components be radio tube in the present invention; Radio tube of the present invention includes: magnetron, straight advancing klystron, reflex klystron, travelling wave tube, O type backward wave tube etc.; The above-mentioned execution mode of preferred employing is because radio tube is more with respect to other electronic devices and components heat production among the present invention, so it more needs to have preferably heat dispersion and damping performance.
Further, it is travelling wave tube that the present invention preferably adopts described radio tube, and described heat producing components is the slow wave parts.
Especially travelling wave tube in the electronic devices and components, its heat producing components is the slow wave parts; Because the slow wave parts surface of travelling wave tube is originally as the concavo-convex attached structure of periodicity platform, cause the contact-making surface of metal clamp and slow wave parts only to be the part of slow wave parts projection, its contact area is less, the gap is larger, therefore, the embedding structure of electronic devices and components of the present invention is more applicable for the electronic devices and components of this class heat producing components surface irregularity of travelling wave tube; In addition, because the more position of essence heat production is its surperficial recess on the slow wave parts, therefore the embedding structure of electronic devices and components of the present invention further is applicable to travelling wave tube.
Further, the present invention preferably adopts described alumina particles to be dispersed in the resin.The present invention preferably adopts the above-mentioned execution mode can be so that heat producing components radiating effect everywhere is comparatively even in the electronic devices and components embedding structure of the present invention.
Further, preferably to adopt the particle diameter of described alumina particles be 0.01-10mm in the present invention.Alumina particles particle diameter in the composite heat conducting material of the present invention is less, and the essence contact area of the composite heat conducting material that it prepares and heat producing components is larger, and heat-conducting effect is better; But the particle diameter of alumina particles is less, and the cost of production and processing is also just larger, and therefore, it is 0.01-10mm that the present invention preferably adopts the particle diameter of described alumina particles.
In addition, when the particle diameter of alumina particles surpassed 10mm, its particle diameter was larger, can reduce like this alumina particles plating zinc on surface and copper-plated effect; When the particle diameter of alumina particles during less than 0.1mm, its particle diameter is less, will increase like this total surface area of alumina particles under the equal in quality, thereby greatly increases the use amount of electrogalvanizing and copper electroplating solution, causes cost to increase.
Further, the present invention preferably adopts described alumina particles surface from inside to outside to be coated with successively zinc coating and copper coating.The existing method that composite heat conducting material of the present invention adheres to resin in the alumina particles periphery can be divided into carries out mechanical mixture under normal temperature or the heating condition; Carrying out zinc-plated and copper plating treatment on the alumina particles surface, like this can be so that can form the electroplated metal layer of densification through the alumina particles surface of electroplating or chemical plating was processed, thus avoid alumina particles oxidized and so that thermal conductivity decline.
The used alumina particles of the present invention is the alumina particles that the surface is crossed through zinc-plated and copper plating treatment; Pure aluminum metal is a kind of metal that very easily is subjected to air oxidation to become alundum (Al2O3); fine aluminium or a kind of light weight; soft good heat conductive metal, but since its surface often can oxidizedly produce matter firmly, the alundum (Al2O3) of poorly conductive, will seriously reduce like this heat conductivility of aluminum metal.
In view of the foregoing, adopt among the present invention with alumina particles through zinc-plated and copper plating treatment after, gained alumina particles surface just can not contact with air to some extent, its heat conductivility can be not therefore and variation; The heat conductivility of composite heat conducting material will be improved preferably among the present invention like this.
The copper coating of alumina particles described in the present invention and zinc-plated method can be the conventional methods in existing plating or the chemical plating.
Further, the present invention preferably adopts described resin to be the epoxy resin prepolymer through curing agent and diluent curing.The used epoxy resin of the present invention is that the primary structure unit is epoxy ethyl (CH
2-(O)-CH
2-) or the macromolecular compound of substituted epoxy ethyl; The general molecular weight of epoxy resin is not high, generally between 300-500; Since epoxy resin the adhesive strength of metal surface a little less than, it is difficult for being attached to fully metal surface.In view of the foregoing, the preferred employing is cured processing with hardener for epoxy resin and diluent among the present invention.
Curing agent described in the present invention can be any existing amine resins curing agent, includes fatty amines, aromatic amine, polyether monoamine, amide-type curing agent.Curing agent is preferably aromatic amine curing agent described in the present invention.
Diluent described in the present invention can be the diluent resin of any existing glycidol ethers, include lauryl diglycidyl ether, n-butyl glycidyl ether, allyl glycidyl ether, phenyl glycidyl ether, BDDE etc.
Epoxy resin prepolymer through curing agent and diluent curing among the present invention has preferably adhesive strength, and it can brute force be attached to the metal surface, makes composite heat conducting material of the present invention have more excellent heat conductivility.
Further, the present invention preferably adopts described surface from inside to outside to be coated with successively the alumina particles of zinc coating and copper coating and the mass ratio of epoxy resin prepolymer is 100:1-30.When epoxy resin prepolymer was too much, when namely the mass ratio of described alumina particles and epoxy resin prepolymer was less than 100:30, the heat conductivility of obtained composite heat conducting material will reduce among the present invention; When epoxy resin prepolymer was very few, when namely the mass ratio of described alumina particles and epoxy resin prepolymer was greater than 100:1, the alumina particles in the obtained composite heat conducting material just can not obtain fully adhering to of epoxy resin prepolymer.
Further, preferably to adopt the mass ratio of described epoxy resin and curing agent and diluent be 1:0.1-2:0.1-2 in the present invention.The mass ratio of epoxy resin and curing agent and diluent is preferably 1:0.1-2:0.1-2 among the present invention; When the amount of curing agent and diluent was too high, the heat conductivility of prepared composite heat conducting material will decrease; When the amount of curing agent and diluent was very few, the adhesive force of prepared composite heat conducting material was just less.
Further, the present invention preferably adopts described composite heat conducting material also to include 0.1-2 weight portion promoter or 0.1-2 weight portion flexibilizer.The promoter of using among the present invention can be existing any epoxy resin promoter, and its effect mainly is the solidification that further increases curing agent, plays a driving role.Promoter is preferably polyether-ketone described in the present invention, and polyether-ketone is that the primary structure unit is the high molecular polymer that ehter bond and ketonic bond alternately form.The amount of promoter is preferably the 0.1-2 weight portion among the present invention.
The flexibilizer that uses among the present invention can be existing any epoxy resin toughener, and its effect mainly is the toughness that further increases the gained composite heat conducting material.Flexibilizer is preferably polyether sulfone described in the present invention, and polyether sulfone is that the primary structure unit is the high molecular polymer that ehter bond and sulfonyl alternately form.The amount of diluent is preferably the 0.1-2 weight portion among the present invention.
The curing of epoxy resin described in the present invention can be the curing of existing curing agent, namely can be to be cured under normal temperature or the heating condition.
In addition, described in the present invention in the composite heat conducting material resin material on alumina particles surface have extraordinary elastic deformation ability, under effect of stress, elastic deformation very easily occurs, thereby the elasticity of composite heat conducting material described in increase the present invention, so that its applied electronic devices and components embedding structure has preferably damping performance.
Description of drawings
Fig. 1 is the cutaway view of prior art travelling wave tube mounting structure;
Fig. 2 is the cutaway view of the first execution mode travelling wave tube embedding structure of the present invention;
Fig. 3 is the cutaway view of prior art transformer mounting structure;
Fig. 4 is the cutaway view of the second execution mode transformer embedding structure of the present invention.
Embodiment
In order to make those skilled in the art understand better technical scheme of the present invention, the present invention is described in further detail below in conjunction with specific embodiment.
Comparative example 1
As shown in Figure 1, prior art travelling wave tube mounting structure includes slow wave parts 14 and shell 11, is provided with metal grip block 12 between described slow wave parts 14 and the shell 11, and described metal is aluminium; Gap location between described metal grip block 12 and the slow wave parts 14 is filled with casting glue 13, and described casting glue is existing epoxide resin material.
Comparative example 2
As shown in Figure 3, prior art transformer mounting structure includes iron core 31 and heat producing components coil 32; Iron core 31 is metal material, is heat sink; Because iron core 31 is solid shape, has more gap 33 between coil 32 and the iron core 31, when coil 32 work, can produce more heat, its heat dissipation path only is iron core 31.
Comparative example 3
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention includes slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is the combined composite material of 100 weight portion alumina particles and 10 weight portion epoxy resin.
Comparative example 4
As shown in Figure 4, the second execution mode transformer embedding structure of the present invention includes iron core 41, heat producing components coil 41; Gap 43 places embedding between described iron core 41 and the coil 42 has composite heat conducting material 44, the alumina particles that described composite heat conducting material 44 coats for epoxy resin; Described composite heat conducting material 44 is the combined composite material of 100 weight portion alumina particles and 10 weight portion epoxy resin.
Comparative example 5
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
The alumina particles of A, 100 weight portion copper coatings, the particle diameter of described alumina particles are 1mm.
B, 10 weight portion epoxy resin.
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Comparative example 6
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion conventional aluminium particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through aromatic amine; The mass ratio of described epoxy resin and curing agent is 1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Comparative example 7
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through aromatic amine; The mass ratio of described epoxy resin and curing agent is 1:0.1;
C, 1 weight portion polyether-ketone promoter.
Comparative example 8
As shown in Figure 4, the second execution mode transformer embedding structure of the present invention includes iron core 41, heat producing components coil 42; Gap 43 places embedding between described iron core 41 and the coil 42 has composite heat conducting material 44, the alumina particles that described composite heat conducting material 44 coats for epoxy resin; Described composite heat conducting material 44 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through amide-type and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:0.1:0.1;
D, 1 weight portion polyether sulfone flexibilizer.
Comparative example 9
As shown in Figure 4, the second execution mode transformer embedding structure of the present invention includes iron core 41, heat producing components coil 42; Gap 43 places embedding between described iron core 41 and the coil 42 has composite heat conducting material 44, the alumina particles that described composite heat conducting material 44 coats for epoxy resin; Described composite heat conducting material 44 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through amide-type and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:0.1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Comparative example 1-9
Make Heat Conduction Material in the predetermined composition of composite material described in the comparative example 3-9 and each component mechanical agitation mixing under 80 ℃ of conditions of ratio, its embedding is entered in travelling wave tube or the transformer, detect respectively the radiating effect of comparative example 1-9 gained travelling wave tube or transformer embedding structure; Travelling wave tube or transformer that comparative example 1-9 embedding is good are worked a period of time respectively, then measure the temperature on its heat producing components surface, and the gained measurement result is listed in the table one:
Table one
| Comparative example | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 |
| Temperature (℃) | 160 | 150 | 140 | 130 | 120 | 110 | 100 | 90 | 80 |
Embodiment 1
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 0.1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through amide-type curing agent and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:0.1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Embodiment 2
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 10mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through amide-type curing agent and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:0.1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Embodiment 3
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 0.1 weight portion solidify through aromatic amine curing agent and n-butyl glycidyl ether; The mass ratio of described epoxy resin and curing agent and n-butyl glycidyl ether is 1:0.1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Embodiment 4
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 30 weight portions solidify through aromatic amine curing agent and n-butyl glycidyl ether; The mass ratio of described epoxy resin and curing agent and n-butyl glycidyl ether is 1:0.1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Embodiment 5
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through aromatic amine curing agent and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:0.1:0.1;
C, 0.1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Embodiment 6
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through aromatic amine curing agent and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:0.1:0.1;
C, 2 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Embodiment 7
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through polyether monoamine curing agent and phenyl glycidyl ether; The mass ratio of described epoxy resin and curing agent and phenyl glycidyl ether is 1:0.1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 0.1 weight portion polyether sulfone flexibilizer.
Embodiment 8
As shown in Figure 2, the first execution mode travelling wave tube embedding structure of the present invention comprises slow wave parts 24 and shell 21, and embedding has composite heat conducting material 23 between described slow wave parts 24 and the shell 21, the alumina particles that described composite heat conducting material 23 coats for epoxy resin; Described composite heat conducting material 23 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through polyether monoamine curing agent and phenyl glycidyl ether; The mass ratio of described epoxy resin and curing agent and phenyl glycidyl ether is 1:0.1:0.1;
C, 1 weight portion polyether-ketone promoter;
D, 2 weight portion polyether sulfone flexibilizer.
Embodiment 9
As shown in Figure 4, the second execution mode transformer embedding structure of the present invention includes iron core 41, heat producing components coil 42; Gap 43 places embedding between described iron core 41 and the coil 42 has composite heat conducting material 44, the alumina particles that described composite heat conducting material 44 coats for epoxy resin; Described composite heat conducting material 44 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through polyether monoamine curing agent and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:1:1;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Embodiment 10
As shown in Figure 4, the second execution mode transformer embedding structure of the present invention includes iron core 41, heat producing components coil 42; Gap 43 places embedding between described iron core 41 and the coil 42 has composite heat conducting material 44, the alumina particles that described composite heat conducting material 44 coats for epoxy resin; Described composite heat conducting material 44 is composed of the following components:
A, 100 weight portion plating zinc on surface and copper-plated alumina particles, the particle diameter of described alumina particles is 0.1mm;
The epoxy resin prepolymer that B, 10 weight portions solidify through polyether monoamine curing agent and lauryl diglycidyl ether; The mass ratio of described epoxy resin and curing agent and lauryl diglycidyl ether is 1:2:2;
C, 1 weight portion polyether-ketone promoter;
D, 1 weight portion polyether sulfone flexibilizer.
Only be preferred implementation of the present invention below, should be pointed out that above-mentioned preferred implementation should not be considered as limitation of the present invention, protection scope of the present invention should be as the criterion with the claim limited range.For those skilled in the art, without departing from the spirit and scope of the present invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. electronic devices and components embedding structure, described electronic devices and components include heat producing components, shell; Embedding has composite heat conducting material between described heat producing components and the shell, and described composite heat conducting material is the alumina particles of resin-coating.
2. electronic devices and components embedding structure according to claim 1, it is characterized in that: described electronic devices and components are radio tubes.
3. electronic devices and components embedding structure according to claim 2, it is characterized in that: described radio tube is travelling wave tube, described heat producing components is the slow wave parts.
4. the described electronic devices and components embedding of arbitrary claim structure according to claim 1-3, it is characterized in that: described alumina particles is dispersed in the resin.
5. electronic devices and components embedding structure according to claim 4, it is characterized in that: the particle diameter of described alumina particles is 0.01-10mm.
6. electronic devices and components embedding structure according to claim 4, it is characterized in that: described alumina particles surface from inside to outside is coated with zinc coating and copper coating successively.
7. it is characterized in that according to claim 3 or 6 described electronic devices and components embedding structures: the epoxy resin prepolymer of described resin for solidifying through curing agent and diluent.
8. electronic devices and components embedding structure according to claim 7, it is characterized in that: described surface from inside to outside is coated with the alumina particles of zinc coating and copper coating successively and the mass ratio of epoxy resin prepolymer is 100:1-30.
9. electronic devices and components embedding structure according to claim 7, it is characterized in that: the mass ratio of described epoxy resin and curing agent and diluent is 1:0.1-2:0.1-2.
10. electronic devices and components embedding structure according to claim 1, it is characterized in that: described composite heat conducting material also includes 0.1-2 weight portion promoter and/or 0.1-2 weight portion flexibilizer.
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| CN2012103974707A CN102891058A (en) | 2012-10-18 | 2012-10-18 | Encapsulating structure of electronic element |
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| CN2012103974707A CN102891058A (en) | 2012-10-18 | 2012-10-18 | Encapsulating structure of electronic element |
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| CN102891058A true CN102891058A (en) | 2013-01-23 |
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| CN103400733A (en) * | 2013-07-31 | 2013-11-20 | 成都国光电气股份有限公司 | Technology for filling and sealing composite heat conduction material in traveling wave tube |
| CN103985621A (en) * | 2014-05-09 | 2014-08-13 | 成都国光电气股份有限公司 | Travelling-wave tube slow wave heat dissipation structure |
| CN105419301A (en) * | 2014-09-11 | 2016-03-23 | 北京廊桥材料技术有限公司 | Composite heat conduction filler and manufacturing method thereof |
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| US20080274349A1 (en) * | 2006-08-10 | 2008-11-06 | International Business Machines Corporation | Multipath Soldered Thermal Interface Between a Chip and its Heat Sink |
| CN102212273A (en) * | 2011-04-29 | 2011-10-12 | 上海安美特铝业有限公司 | Heat-conducting material used for solar photoelectricity-heat conversion equipment and preparation method thereof |
| CN102732198A (en) * | 2012-06-29 | 2012-10-17 | 安徽华东光电技术研究所 | Pouring sealant for pouring slow-wave system of traveling wave tube and manufacturing method thereof |
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| US20080274349A1 (en) * | 2006-08-10 | 2008-11-06 | International Business Machines Corporation | Multipath Soldered Thermal Interface Between a Chip and its Heat Sink |
| CN102212273A (en) * | 2011-04-29 | 2011-10-12 | 上海安美特铝业有限公司 | Heat-conducting material used for solar photoelectricity-heat conversion equipment and preparation method thereof |
| CN102732198A (en) * | 2012-06-29 | 2012-10-17 | 安徽华东光电技术研究所 | Pouring sealant for pouring slow-wave system of traveling wave tube and manufacturing method thereof |
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| CN103400733A (en) * | 2013-07-31 | 2013-11-20 | 成都国光电气股份有限公司 | Technology for filling and sealing composite heat conduction material in traveling wave tube |
| CN103400733B (en) * | 2013-07-31 | 2016-07-06 | 成都国光电气股份有限公司 | A kind of technique of embedding composite heat conducting material in travelling-wave tube |
| CN103985621A (en) * | 2014-05-09 | 2014-08-13 | 成都国光电气股份有限公司 | Travelling-wave tube slow wave heat dissipation structure |
| CN105419301A (en) * | 2014-09-11 | 2016-03-23 | 北京廊桥材料技术有限公司 | Composite heat conduction filler and manufacturing method thereof |
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