CN102732198A - Pouring sealant for pouring slow-wave system of traveling wave tube and manufacturing method thereof - Google Patents
Pouring sealant for pouring slow-wave system of traveling wave tube and manufacturing method thereof Download PDFInfo
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- CN102732198A CN102732198A CN2012102188872A CN201210218887A CN102732198A CN 102732198 A CN102732198 A CN 102732198A CN 2012102188872 A CN2012102188872 A CN 2012102188872A CN 201210218887 A CN201210218887 A CN 201210218887A CN 102732198 A CN102732198 A CN 102732198A
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- epoxy resin
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- copper powder
- epoxy curing
- epoxy
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Abstract
The invention discloses a pouring sealant for pouring and sealing a slow wave system of a traveling wave tube and a manufacturing method thereof, wherein the pouring sealant is formed by mixing epoxy resin, an epoxy resin curing agent and copper powder, wherein 40-60 parts by weight of the epoxy resin curing agent and 40-60 parts by weight of the copper powder are prepared in every 100 parts by weight of the epoxy resin; the preparation method of the pouring sealant comprises the steps of heating the epoxy resin and the epoxy resin curing agent; vacuum degassing of epoxy resin and epoxy resin curing agent; mixing and proportioning epoxy resin, epoxy resin curing agent and copper powder; the pouring sealant has good heat-conducting property and good stability, is not easy to crack in a slow wave system in the traveling wave tube application process, and can ensure the strength and the quality of the slow wave system of the traveling wave tube; the preparation method of the pouring sealant adopts specific preparation steps, ensures that the epoxy resin, the epoxy resin curing agent and the copper powder are uniformly mixed, and has good thermal conductivity and stability.
Description
Technical field
The invention belongs to microwave vacuum electron device assembling field, be specifically related to a kind of traveling wave tube slow-wave system embedding with joint sealant and preparation method thereof.
Background technology
The special construction of TWT causes traveling wave tube slow-wave system to use permanent magnet focusing system, all is the magnet steel dimidiation is installed on the slow wave of TWT; TWT is usually operated in missile-borne, the rugged environment such as airborne, therefore need to use joint sealant to the whole embedding of slow wave system to strengthen its structural strength, because slow wave system need be dispelled the heat well, so joint sealant also needs good thermal conductivity in addition.The embedding of existing wave duct slow wave system, has influenced the structural strength of slow wave system, and then has influenced the safety of TWT through often occurring little crackle after the temperature shock with joint sealant.
Summary of the invention
The objective of the invention is to overcome the deficiency of prior art, a kind of high thermal conductivity is provided, good stability the embedding of rimose slow wave system do not occur with joint sealant and preparation method thereof.
To achieve these goals, the technical scheme of the present invention's employing is:
Joint sealant is used in said traveling wave tube slow-wave system embedding; Constitute by epoxy resin, epoxy curing agent and copper powder mixing; Be equipped with 40～60 weight part epoxy curing agents and 40～60 weight part copper powders in wherein per 100 weight part epoxy resin, promptly the weight proportion of epoxy resin, epoxy curing agent and copper powder is: 100:40～60:40～60.
The composition of epoxy curing agent is washed amine for gathering, and gathering the purity of washing amine is 99.3-99.8%.
Joint sealant is used in said traveling wave tube slow-wave system embedding, and the weight proportion of preferred epoxy, epoxy curing agent and copper powder is 100:50:50.
Said copper powder is 200 orders, and its purity is 99.7-99.9%.
Said traveling wave tube slow-wave system embedding may further comprise the steps with the making method of joint sealant;
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 1h ± 5min after being heated to 60 ℃ ± 5 ℃, take out then, so that epoxy natural gum has good trickling property with epoxy curing agent;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then, so that eliminate the influence of gas to the thermal conductivity of joint sealant;
(3) take by weighing epoxy resin, epoxy curing agent and copper powder in proportion, earlier with epoxy resin and epoxy curing agent mixing and stirring; Add copper powder then in batches, divide four times and add copper powder, add 1/4th copper powder amount at every turn, after every adding is a collection of, epoxy resin, epoxy curing agent and copper powder are stirred, accomplish making processes with stirring rod.
The invention has the advantages that: said traveling wave tube slow-wave system embedding is with joint sealant and preparation method thereof, and joint sealant is used in this slow wave system embedding, adopts the mode of epoxy resin, epoxy curing agent and copper powder mixing match to make; The adding of copper powder not only makes this joint sealant good heat conductivity, and good stability, and slow wave system is not easy to occur cracking phenomena in the TWT application process, can guarantee the intensity of traveling wave tube slow-wave system, has further guaranteed the TWT quality; This slow wave system embedding makes epoxy natural gum have good trickling property with epoxy curing agent with the making method of joint sealant through heat tracing; Epoxy resin and epoxy resin agent have been eliminated its gas that contains through degas operation in vacuum tank, have improved the thermal conductivity of the joint sealant of processing; Adopt the mode that in batches adds copper powder simultaneously, epoxy resin, epoxy curing agent and copper powder mix more even, good stability.
Embodiment
Through the description to optimum embodiment, specific embodiments of the invention is done further detailed explanation below.
Embodiment 1
Joint sealant is used in the traveling wave tube slow-wave system embedding; Constitute according to outfit 40 weight part epoxy curing agents and 40 weight part copper powder proportionings in per 100 weight part epoxy resin by epoxy resin, epoxy curing agent, copper powder; Copper powder is 200 orders, and its purity is 99.7%; The composition of epoxy curing agent is washed amine for gathering, and gathering the purity of washing amine is 99.3.
This traveling wave tube slow-wave system embedding uses the making method of joint sealant to be:
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 1hmin after being heated to 60 ℃, take out then, so that epoxy natural gum has good trickling property with epoxy curing agent;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then, so that eliminate the influence of gas to the joint sealant thermal conductivity;
(3) take by weighing 100 weight part epoxy resin, take by weighing 40 weight part epoxy curing agents and 40 weight part copper powders; Earlier epoxy resin and epoxy curing agent are mixed; Add copper powder then in batches; Every batch adds 1/4th, with stirring rod epoxy resin, epoxy curing agent and copper powder is stirred, and promptly accomplishes the making of joint sealant.
Through verification experimental verification; Use traveling wave tube slow-wave system embedding that this method processes by this composition proportion TWT with the joint sealant embedding, the slow wave system outward appearance is good after TWT uses for some time, finds cracking; And the traveling wave tube slow-wave system heat conductivility is good, the TWT stable performance.
Embodiment 2
Joint sealant is used in the traveling wave tube slow-wave system embedding; Constitute according to outfit 50 weight part epoxy curing agents and 50 weight part copper powder proportionings in per 100 weight part epoxy resin by epoxy resin, epoxy curing agent, copper powder; Copper powder is 200 orders, and its purity is 99.8%; The composition of epoxy curing agent is washed amine for gathering, and gathering the purity of washing amine is 99.8%.
This traveling wave tube slow-wave system embedding uses the making method of joint sealant to be:
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 55min after being heated to 65 ℃, take out then, so that epoxy natural gum has good trickling property with epoxy curing agent;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then, so that eliminate the influence of gas to the joint sealant thermal conductivity;
(3) take by weighing 100 weight part epoxy resin, 50 weight part epoxy curing agents and 50 weight part copper powders; Earlier with epoxy resin and epoxy curing agent uniform mixing; Add copper powder then in batches; Every batch adds 1/4th copper powder, with stirring rod epoxy resin, epoxy curing agent and copper powder is stirred, and promptly accomplishes the making of joint sealant.
Through verification experimental verification; Use traveling wave tube slow-wave system embedding that this method processes by this composition proportion TWT with the joint sealant embedding, the slow wave system outward appearance is good after TWT uses for some time, finds cracking; And the traveling wave tube slow-wave system heat conductivility is excellent, the TWT stable performance.
Embodiment 3
Joint sealant is used in the traveling wave tube slow-wave system embedding; Constitute according to outfit 60 weight part epoxy curing agents and 60 weight part copper powder proportionings in per 100 weight part epoxy resin by epoxy resin, epoxy curing agent, copper powder; Copper powder is 200 orders, and its purity is 99.9%; The composition of epoxy curing agent is washed amine for gathering, and gathering the purity of washing amine is 99.5%.
This traveling wave tube slow-wave system embedding uses the making method of joint sealant to be:
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 65min after being heated to 55 ℃, take out then, so that epoxy natural gum has good trickling property with epoxy curing agent;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then, so that eliminate the influence of gas to the joint sealant thermal conductivity;
(3) take by weighing 100 weight part epoxy resin, 60 weight part epoxy curing agents and 60 weight part copper powders, earlier with epoxy resin and epoxy curing agent uniform mixing, add copper powder then in batches, every batch adds 1/4th copper powder; With stirring rod epoxy resin, epoxy curing agent and copper powder are stirred, promptly accomplish the making of joint sealant.
Through verification experimental verification; Use traveling wave tube slow-wave system embedding that this method processes by this composition proportion TWT with the joint sealant embedding, the slow wave system outward appearance is good after TWT uses for some time, finds cracking; And the traveling wave tube slow-wave system heat conductivility is good, the TWT stable performance.
As effect comparison, increase embodiment 4, embodiment 5 and embodiment 6.
Embodiment 4
Joint sealant is used in the traveling wave tube slow-wave system embedding; Constitute according to outfit 35 weight part epoxy curing agents and 35 weight part copper powder proportionings in per 100 weight part epoxy resin by epoxy resin, epoxy curing agent, copper powder; Copper powder is 200 orders, and its purity is 99.7%; The composition of epoxy curing agent is washed amine for gathering, and gathering the purity of washing amine is 99.5%.
This traveling wave tube slow-wave system embedding uses the making method of joint sealant to be:
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 1hmin after being heated to 60 ℃, take out then, so that epoxy natural gum has good trickling property with epoxy curing agent;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then, so that eliminate the influence of gas to the thermal conductivity of joint sealant;
(3) take by weighing 100 weight part epoxy resin, 35 weight part epoxy curing agents and 35 weight part copper powders, earlier with epoxy resin and epoxy curing agent uniform mixing, add copper powder then in batches, every batch adds 1/4th copper powder; With stirring rod epoxy resin, epoxy curing agent and copper powder are stirred, promptly accomplish the making of joint sealant.
Through verification experimental verification, the traveling wave tube slow-wave system embedding of processing by this composition proportion is with the TWT of joint sealant embedding, and cracking appears in the slow wave system surface after TWT uses for some time, and wave duct slow wave system heat conductivility is poor.
Embodiment 5
Joint sealant is used in the traveling wave tube slow-wave system embedding; Constitute according to outfit 65 weight part epoxy curing agents and 65 weight part copper powder proportionings in per 100 weight part epoxy resin by epoxy resin, epoxy curing agent, copper powder; Copper powder is 200 orders, and its purity is 99.9%; The composition of epoxy curing agent is washed amine for gathering, and gathering the purity of washing amine is 99.5%.
This traveling wave tube slow-wave system embedding uses the making method of joint sealant to be:
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 1hmin after being heated to 60 ℃, take out then, so that epoxy natural gum has good trickling property with epoxy curing agent;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then, so that eliminate the influence of gas to the thermal conductivity of joint sealant;
(3) take by weighing 100 weight part epoxy resin, 65 weight part epoxy curing agents and 65 weight part copper powders, earlier with epoxy resin and epoxy curing agent uniform mixing, add copper powder then in batches, every batch adds 1/4th copper powder; With stirring rod epoxy resin, epoxy curing agent and copper powder are stirred, promptly accomplish the making of joint sealant.
Through verification experimental verification, the traveling wave tube slow-wave system embedding of processing by this composition proportion is with the TWT of joint sealant embedding, and cracking appears in the slow wave system surface after TWT uses for some time, and wave duct slow wave system heat conductivility is poor.
Embodiment 6
Joint sealant is used in this traveling wave tube slow-wave system embedding, is made up of according to being equipped with 50 weight part epoxy curing agent proportionings in per 100 weight part epoxy resin epoxy resin, epoxy curing agent; The composition of epoxy curing agent is washed amine for gathering, and gathering the purity of washing amine is 99.5%.
This traveling wave tube slow-wave system embedding uses the making method of joint sealant to be:
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 1hmin after being heated to 60 ℃, take out then, so that epoxy natural gum has good trickling property with epoxy curing agent;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then, so that eliminate the influence of gas to the thermal conductivity of joint sealant;
(3) take by weighing 50 weight part epoxy curing agents and 100 weight part epoxy resin mix, accomplish the making of joint sealant.
Through verification experimental verification, the traveling wave tube slow-wave system embedding that this composition proportion is processed is with the TWT of joint sealant embedding, and the slow wave system appearance is good after TWT uses for some time, cracking do not occur, but wave duct slow wave system heat conductivility is poor.
The comparative example 1 to embodiment 6, and epoxy resin, epoxy curing agent and copper powder need adopt specific proportioning mode, just can make joint sealant have good heat conductivity, and have the characteristics of good stability; Slow wave system just is not easy to occur cracking phenomena in the TWT application process, can guarantee the intensity of traveling wave tube slow-wave system, guarantees the TWT quality; This slow wave system embedding makes epoxy natural gum have good trickling property with epoxy curing agent with the making method of joint sealant through heat tracing; Epoxy resin and epoxy resin agent have been eliminated the influence of gas to the joint sealant thermal conductivity through degas operation in vacuum tank; Adopt the mode that in batches adds copper powder simultaneously, epoxy resin, epoxy curing agent and copper powder mix more even, good stability.
Above the present invention has been carried out exemplary description; Obviously the concrete realization of the present invention does not receive the restriction of aforesaid way; As long as adopted the improvement of the various unsubstantialities that method of the present invention design and technical scheme carry out; Or design of the present invention and technical scheme are directly applied to other occasion without improving, all within protection scope of the present invention.
Claims (5)
1. joint sealant is used in a traveling wave tube slow-wave system embedding; It is characterized in that: constitute by epoxy resin, epoxy curing agent and copper powder mixing, be equipped with 40～60 weight part epoxy curing agents and 40～60 weight part copper powders in wherein per 100 weight part epoxy resin.
2. use joint sealant according to the described traveling wave tube slow-wave system embedding of claim 1, it is characterized in that:
Said epoxy curing agent composition is washed amine for gathering, and gathering the purity of washing amine is 99.3-99.8%.
3. use joint sealant according to claim 1 or 2 described traveling wave tube slow-wave system embeddings, it is characterized in that: be equipped with 50 weight part epoxy curing agents and 50 weight part copper powders in per 100 weight part epoxy resin.
4. use joint sealant according to the described traveling wave tube slow-wave system embedding of claim 3, it is characterized in that: said copper powder is 200 orders, and its purity is 99.7-99.9%.
5. each described traveling wave tube slow-wave system embedding of claim 1 to 4 is characterized in that: may further comprise the steps with the making method of joint sealant;
(1) epoxy resin, epoxy curing agent are heated in baking oven, in baking oven, be incubated 1h ± 5min after being heated to 60 ℃ ± 5 ℃, take out then;
(2) will put into the vacuum tank degasification through epoxy resin and epoxy curing agent after step (1) is handled then;
(3) take by weighing epoxy resin, epoxy curing agent and copper powder in proportion, earlier with epoxy resin and epoxy curing agent mixing and stirring; Add copper powder then in batches, divide four times and add copper powder, add 1/4th copper powder amount at every turn, after every adding is a collection of, epoxy resin, epoxy curing agent and copper powder are stirred, accomplish making processes with stirring rod.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210218887.2A CN102732198B (en) | 2012-06-29 | 2012-06-29 | Pouring sealant for pouring slow-wave system of traveling wave tube and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210218887.2A CN102732198B (en) | 2012-06-29 | 2012-06-29 | Pouring sealant for pouring slow-wave system of traveling wave tube and manufacturing method thereof |
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| CN102732198A true CN102732198A (en) | 2012-10-17 |
| CN102732198B CN102732198B (en) | 2014-06-04 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891058A (en) * | 2012-10-18 | 2013-01-23 | 成都国光电气股份有限公司 | Encapsulating structure of electronic element |
| CN103400733A (en) * | 2013-07-31 | 2013-11-20 | 成都国光电气股份有限公司 | Technology for filling and sealing composite heat conduction material in traveling wave tube |
| CN104465270A (en) * | 2014-11-17 | 2015-03-25 | 安徽华东光电技术研究所 | Method for packaging traveling wave tube shell |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101967361A (en) * | 2009-07-27 | 2011-02-09 | 日邦树脂(无锡)有限公司 | Composition of epoxy resin heat-conducting adhesive |
| CN101974302A (en) * | 2010-10-19 | 2011-02-16 | 烟台德邦电子材料有限公司 | Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive |
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2012
- 2012-06-29 CN CN201210218887.2A patent/CN102732198B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101967361A (en) * | 2009-07-27 | 2011-02-09 | 日邦树脂(无锡)有限公司 | Composition of epoxy resin heat-conducting adhesive |
| CN101974302A (en) * | 2010-10-19 | 2011-02-16 | 烟台德邦电子材料有限公司 | Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891058A (en) * | 2012-10-18 | 2013-01-23 | 成都国光电气股份有限公司 | Encapsulating structure of electronic element |
| CN103400733A (en) * | 2013-07-31 | 2013-11-20 | 成都国光电气股份有限公司 | Technology for filling and sealing composite heat conduction material in traveling wave tube |
| CN103400733B (en) * | 2013-07-31 | 2016-07-06 | 成都国光电气股份有限公司 | A kind of technique of embedding composite heat conducting material in travelling-wave tube |
| CN104465270A (en) * | 2014-11-17 | 2015-03-25 | 安徽华东光电技术研究所 | Method for packaging traveling wave tube shell |
| CN104465270B (en) * | 2014-11-17 | 2016-11-09 | 安徽华东光电技术研究所 | Method for packaging traveling wave tube shell |
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| CN102732198B (en) | 2014-06-04 |
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Address after: 241000 No.01 Eshan Road, high tech Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241000 Anhui Province, Wuhu city Yijiang District South high tech Development Zone Technology Park mansion Patentee before: Anhui Huadong Polytechnic Institute |
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