CN102856474A - Light emitting diode-chip on board (LED-COB) intelligent paring and packaging technology - Google Patents
Light emitting diode-chip on board (LED-COB) intelligent paring and packaging technology Download PDFInfo
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- CN102856474A CN102856474A CN 201210307726 CN201210307726A CN102856474A CN 102856474 A CN102856474 A CN 102856474A CN 201210307726 CN201210307726 CN 201210307726 CN 201210307726 A CN201210307726 A CN 201210307726A CN 102856474 A CN102856474 A CN 102856474A
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Abstract
The invention provides a light emitting diode-chip on board (LED-COB) intelligent paring and packaging technology. When a chip is solidified, a wafer point-measurement data mapping file is read, and mutual paring chips are selected from a raw material wafer through intelligent pairing and are respectively solidified on a COB, so that the overall photoelectric characteristic of an LED-COB light source is integrated in the specification. The LED-COB intelligent paring and packaging technology comprises the steps of adjusting a COB solidification position of the chip by adopting a unit area optical parameter averaging method; optimizing pairing combinations during pairing by taking a moving distance and time of a chip solidifier raw material platform as cost functions; and during polishing, automatically selecting repaired chip combinations and solidifying the chips. The technology has the beneficial effects that in a process of searching admissible pairing chip groups, a sorting procedure with extremely high cost is eliminated; and due to intelligent pairing and packaging technical operation, the chip solidification cost is reduced.
Description
[technical field]
The invention belongs to the led chip encapsulation field, be specifically related to the intelligent pairing encapsulation technology of a kind of LED-COB.
[background technology]
That LED has is energy-conservation, high brightness, life-span are long, without advantages such as mercury, environmental protection, wherein in great power LED will replace conventional bulb and electricity-saving lamp becomes main lighting source.Tradition LED technique be sapphire wafer through outside delay and be made into led chip.Because the restriction of MOCVD epitaxy technique, each chip characteristics differs in a slice disk, and luminous dominant wavelength has the span of 20 nanometers; Brightness may have 300% difference; And forward more than the voltage phase difference 0.5V, so that before the LED encapsulation, must obtain through point measurement machine the photoelectric characteristic data of each chip, with separator the chip of characteristic close is selected one by one again the side's of being called sheet to blue film.Become LED lamp pearl take square sheet as raw material through packaging technology.In order to reach the high brightness demand, being connected on PCB and the aluminum base circuit board with a plurality of packaged LED lamp bead welds traditionally becomes light source.In order further to improve cooling effect and to reduce manufacturing cost, on a circuit board, this kind COB (Chip On Board) packaged type is more and more universal with the direct die bond routing of a plurality of chips.
Conventional processes needs the high sorting operation of cost, and the chip that photoelectric characteristic is close is selected the side's of becoming sheet group, selected with a collection of disk after, generally have approximately nearly 150 prescription sheets.On the same group square sheet need to not joined corresponding fluorescent material prescription, just can reach identical white light colour temperature.The multi-chip of dividing into groups stock control is difficult and the fluorescent material allotment is numerous and diverse, and the quality control of LED high expensive is difficult for.
[summary of the invention]
The object of the invention is to propose the intelligent pairing encapsulation technology of a kind of LED-COB, do not need traditional LED sorting operation, read in disk point during die bond and survey the data mapping file, automatically in the raw material disk, choose mutual pairing chip difference die bond on COB through intelligent pairing, the whole photoelectric characteristic of LED-COB light source is concentrated in the specification.
The present invention is achieved through the following technical solutions:
The intelligent pairing encapsulation technology of described LED-COB is as follows: read in disk point and survey the data mapping file when die bond, automatically in the raw material disk, choose mutual pairing chip through intelligent pairing, die bond concentrates in the specification the whole photoelectric characteristic of LED-COB light source on COB respectively.
Further, the intelligent pairing encapsulation technology of described LED-COB comprises in unit are optical parameter homogenizing mode and adjusts chip in the step of COB die bond position.
Further, the intelligent pairing encapsulation technology of described LED-COB comprises the step of optimizing combinations of pairs take die bond machine raw material platform movement distance, time as cost function in the pairing process.
The step with die bond selected of automatically again matching chip portfolio when further, the intelligent pairing encapsulation technology of described LED-COB comprises the die bond material casting.
The LED disk records the photoelectric parameter of each chip itself through the point measurement machine point.And absorption, the emission parameter of encapsulation fluorescent material prescription are known, and one single chip can be learnt through the output spectrum of fluorescent material prescription.The whole output spectrum of LED-COB packaged light source is upper each chip of COB output spectrum summation under this fluorescent material prescription; LED-COB packaged light source global voltage can be learnt according to the parallel connection of COB circuit or series connection by the last chip of COB, so the whole photoelectric characteristic of LED-COB packaged light source can be learnt by the photoelectric parameter of each chip.The intelligent matching module of the present invention is utilized this principle, searches the chip photoelectric parameter combination that can match in disk, makes the whole photoelectric characteristic of LED-COB light source in concentrating on specification.The instruction that the die bond machine is accepted intelligent matching module will be matched chip and will be fixed in one by one on the blank COB substrate.
Beneficial effect of the present invention is: in the process of searching the chipset that can match, removed the high sorting operation of cost from, by intelligence pairing packing technical operation, can unit are optical parameter homogenizing mode adjust chip in COB die bond position; And in the pairing process, optimize combinations of pairs take die bond machine raw material platform and finished product platform movement distance, time as cost function; When die bond is because of a variety of causes material casting again die bond in addition, the combination of selecting of automatically again matching chip.These functions can be used in the disparate modules collocation, further reduce the die bond cost.
[description of drawings]
Fig. 1 is preferred flow charts of the present invention.
[embodiment]
Below in conjunction with the drawings and the specific embodiments the present invention is described further:
Preferably, the intelligent pairing encapsulation technology of described LED-COB is as follows: read in disk point and survey the data mapping file when die bond, automatically choose mutual pairing chip through intelligent pairing in the raw material disk, die bond concentrates in the specification the whole photoelectric characteristic of LED-COB light source on COB respectively.Specifically, the LED disk records the parameter of every chips light and electricity through point measurement machine with one one of all chips on the disk, comprising the ranks position, and light energy, voltage forward, absolute spectrum, dominant wavelength, chromaticity coordinate etc.Through a disk of surveying, must directly not deliver to the die bond machine through separator, this time point is surveyed data file through intelligent pairing, and the die bond machine will match chip and be fixed in one by one on the substrate of blank according to intelligent matched order.Intelligent pairing is searched the chipset that can match in disk point is surveyed data file, looked-up sequence can be according to present die bond crawl position last time, by near to choosing far successively chip portfolio.The population parameter of chip portfolio calculates: forward voltage in parallel or series connection calculating according to the COB circuit chip; The absolute spectrum of one single chip calculates output spectrum through the absorption/emission parameter of fluorescent material prescription, all chip output spectrums is added up obtain the whole output spectrum of LED-COB light source and colour temperature.Chip portfolio is chosen in intelligent pairing, guarantees that the whole photoelectric characteristic of LED-COB light source is in specification.
Preferably, the intelligent pairing encapsulation technology of described LED-COB comprises in unit are optical parameter homogenizing mode and adjusts chip in the step of COB die bond position.Be about to choose chipset die bond all arrangement modes on COB and calculate respectively its unit are optical parameter uniformity, choose best uniformity chipset arrangement mode.
Preferably, the intelligent pairing encapsulation technology of described LED-COB comprises the step of optimizing combinations of pairs take die bond machine raw material platform movement distance, time as cost function in the pairing process.Specifically, be exactly search can the pairing process in, can satisfy the chipset of the whole photoelectric characteristic of LED-COB light source in specification numerous, calculate die bond cost of each group take die bond machine raw material platform and finished product platform movement distance, time as cost function, choose the incompatible die bond of chipset of cost minimization.
The step with die bond selected of automatically again matching chip portfolio when preferably, the intelligent pairing encapsulation technology of described LED-COB comprises the die bond material casting.Specifically, be exactly in the intelligent pairing die bond of COB process, during because of a variety of causes material casting again die bond, receive the material casting information that the die bond machine comes, the chip of die bond is considered in the pairing of automated intelligent type simultaneously, seeks new replacement scheme.
The according to the above description announcement of book and instruction, those skilled in the art in the invention can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the present invention is not limited to also should fall in the protection range of claim of the present invention modifications and changes more of the present invention.In addition, although used some specific terms in this specification, these terms do not consist of any restriction to the present invention just for convenience of description.
Claims (4)
1. intelligent pairing encapsulation technology of LED-COB, read in disk point when it is characterized in that die bond and survey the data mapping file, automatically choose mutual pairing chip through intelligent pairing in the raw material disk, die bond concentrates in the specification the whole photoelectric characteristic of LED-COB light source on COB respectively.
2. the intelligent pairing encapsulation technology of LED-COB as claimed in claim 1 is characterized in that comprising in unit are optical parameter homogenizing mode and adjusts chip in the step of COB die bond position.
3. the intelligent pairing encapsulation technology of LED-COB as claimed in claim 1 is characterized in that comprising the step of optimizing combinations of pairs take die bond machine raw material platform movement distance, time as cost function in the pairing process.
4. the intelligent pairing encapsulation technology of LED-COB as claimed in claim 1, the step with die bond selected of automatically again matching chip portfolio when it is characterized in that comprising the die bond material casting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210307726 CN102856474A (en) | 2012-08-27 | 2012-08-27 | Light emitting diode-chip on board (LED-COB) intelligent paring and packaging technology |
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| CN 201210307726 CN102856474A (en) | 2012-08-27 | 2012-08-27 | Light emitting diode-chip on board (LED-COB) intelligent paring and packaging technology |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107665939A (en) * | 2016-07-27 | 2018-02-06 | 江西省晶瑞光电有限公司 | A kind of preparation method of White-light LED chip |
| WO2020155162A1 (en) * | 2019-02-02 | 2020-08-06 | 厦门三安光电有限公司 | Led flip-chip display screen and manufacturing method therefor |
| CN111540280A (en) * | 2020-05-06 | 2020-08-14 | 惠州雷曼光电科技有限公司 | LED display screen wafer mixing and fixing method and LED display screen |
| CN113782558A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | Method for transferring Mini or Micro LED chip to PCB |
-
2012
- 2012-08-27 CN CN 201210307726 patent/CN102856474A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107665939A (en) * | 2016-07-27 | 2018-02-06 | 江西省晶瑞光电有限公司 | A kind of preparation method of White-light LED chip |
| CN107665939B (en) * | 2016-07-27 | 2020-02-14 | 江西省晶能半导体有限公司 | Preparation method of white light LED chip |
| WO2020155162A1 (en) * | 2019-02-02 | 2020-08-06 | 厦门三安光电有限公司 | Led flip-chip display screen and manufacturing method therefor |
| CN111540280A (en) * | 2020-05-06 | 2020-08-14 | 惠州雷曼光电科技有限公司 | LED display screen wafer mixing and fixing method and LED display screen |
| CN113782558A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | Method for transferring Mini or Micro LED chip to PCB |
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Application publication date: 20130102 |