CN102851716B - 挠性覆铜板电镀装置 - Google Patents
挠性覆铜板电镀装置 Download PDFInfo
- Publication number
- CN102851716B CN102851716B CN201110189379.1A CN201110189379A CN102851716B CN 102851716 B CN102851716 B CN 102851716B CN 201110189379 A CN201110189379 A CN 201110189379A CN 102851716 B CN102851716 B CN 102851716B
- Authority
- CN
- China
- Prior art keywords
- pore
- copper plate
- clad laminate
- flexibility coat
- copper clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 78
- 239000010949 copper Substances 0.000 title claims abstract description 78
- 238000009713 electroplating Methods 0.000 title claims abstract description 31
- 239000011148 porous material Substances 0.000 claims abstract description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims description 14
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110189379.1A CN102851716B (zh) | 2011-06-29 | 2011-06-29 | 挠性覆铜板电镀装置 |
HK13105901.2A HK1178221A1 (zh) | 2011-06-29 | 2013-05-20 | 撓性覆銅板電鍍裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110189379.1A CN102851716B (zh) | 2011-06-29 | 2011-06-29 | 挠性覆铜板电镀装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102851716A CN102851716A (zh) | 2013-01-02 |
CN102851716B true CN102851716B (zh) | 2016-03-09 |
Family
ID=47398677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110189379.1A Expired - Fee Related CN102851716B (zh) | 2011-06-29 | 2011-06-29 | 挠性覆铜板电镀装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102851716B (zh) |
HK (1) | HK1178221A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107472958A (zh) * | 2017-07-20 | 2017-12-15 | 浙江尚越新能源开发有限公司 | 柔性太阳能电池卷对卷丝网印刷回转装置 |
CN107805833A (zh) * | 2017-12-14 | 2018-03-16 | 安徽展鑫电子材料有限公司 | 一种挠性覆铜板电镀装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0416775A1 (en) * | 1989-09-06 | 1991-03-13 | Siegmund Inc. | Apparatus and method for single side spray processing of printed circuit boards |
US7678242B2 (en) * | 2005-08-03 | 2010-03-16 | Korea Institute Of Industrial Technology | System and method for manufacturing flexible copper clad laminate film |
CN201639858U (zh) * | 2010-01-25 | 2010-11-17 | 嘉联益科技股份有限公司 | 软性印刷电路板垂直式卷对卷连续电镀装置 |
CN201857434U (zh) * | 2010-10-28 | 2011-06-08 | 嘉联益科技股份有限公司 | 卷对卷连续垂直式高电流电镀机台 |
CN202139308U (zh) * | 2011-06-29 | 2012-02-08 | 加贺开发科技有限公司 | 挠性覆铜板电镀装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7611584B2 (en) * | 2005-12-13 | 2009-11-03 | Lg Electronics Inc. | Electroless metal film-plating system |
-
2011
- 2011-06-29 CN CN201110189379.1A patent/CN102851716B/zh not_active Expired - Fee Related
-
2013
- 2013-05-20 HK HK13105901.2A patent/HK1178221A1/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0416775A1 (en) * | 1989-09-06 | 1991-03-13 | Siegmund Inc. | Apparatus and method for single side spray processing of printed circuit boards |
US7678242B2 (en) * | 2005-08-03 | 2010-03-16 | Korea Institute Of Industrial Technology | System and method for manufacturing flexible copper clad laminate film |
CN201639858U (zh) * | 2010-01-25 | 2010-11-17 | 嘉联益科技股份有限公司 | 软性印刷电路板垂直式卷对卷连续电镀装置 |
CN201857434U (zh) * | 2010-10-28 | 2011-06-08 | 嘉联益科技股份有限公司 | 卷对卷连续垂直式高电流电镀机台 |
CN202139308U (zh) * | 2011-06-29 | 2012-02-08 | 加贺开发科技有限公司 | 挠性覆铜板电镀装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102851716A (zh) | 2013-01-02 |
HK1178221A1 (zh) | 2013-09-06 |
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