CN102832902B - 一种石英晶体谐振器及其加工方法 - Google Patents

一种石英晶体谐振器及其加工方法 Download PDF

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CN102832902B
CN102832902B CN201210353655.8A CN201210353655A CN102832902B CN 102832902 B CN102832902 B CN 102832902B CN 201210353655 A CN201210353655 A CN 201210353655A CN 102832902 B CN102832902 B CN 102832902B
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杨清明
刘青彦
梁羽杉
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CHENGDU KINGBRI FREQUENCY TECHNOLOGY CO LTD
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Abstract

本发明公开一种石英晶体谐振器,包括外壳、基座、引脚、弹簧片、导电胶、镀膜电极、晶片;镀膜电极包括基本电极和与其连接的微调电极;镀膜电极附着在晶片表面,包括由内到外依次排列的下镀铬层、镀银层、上镀铬层;本发明还公开了该石英晶体谐振器的加工方法。本发明能改善石英晶体谐振器的寄生响应特性。

Description

一种石英晶体谐振器及其加工方法
技术领域
本发明涉及电子元器件领域,尤其涉及一种石英晶体谐振器及其加工方法。
背景技术
石英晶体谐振器是用压电石英(即水晶)制成的压电器件,它不仅具有高度稳定的物理化学性能,而且弹性振动损耗极小。与其它电子元器件相比,压电石英晶体还有着很高的频率稳定度和高Q值,使其成为稳定频率和选择频率的重要元器件。AT切石英晶体目前使用的为其厚度切变的振动模式,其振动频率主要由厚度确定,但在实际加工的产品中,还会有石英材料具有的面切边振动、伸缩振动、弯曲振动几种振动模式会产生除标称频率以外的寄生振动频率,称之为寄生响应,对于广泛运用的无线键盘、鼠标应用到的石英晶体谐振器,其寄生响应特性好坏起到非常重要的作用。现有技术是:采用4×1.6mm的银电极,3.0×1.0mm的微调电极尺寸进行频率加工,寄生响应特性只能满足<-6dB要求。
发明内容
本发明旨在提供一种石英晶体谐振器及其加工方法,用于改善石英晶体谐振器的寄生响应特性。
为达到上述目的,本发明是采用以下技术方案实现的:
本发明公开的石英晶体谐振器,包括外壳、基座、引脚、弹簧片、导电胶、镀膜电极、晶片;所述镀膜电极包括基本电极和与其连接的微调电极;其特征在于:所述镀膜电极附着在晶片面,包括由内到外依次排列的下镀铬层、镀银层、上镀铬层;下镀铬层可以增加镀膜电极和晶片之间的附着力,上镀铬层可防止镀膜电极在后续加工过程中被空气氧化。
优选的,所述基本电极为矩形,其尺寸为3.0×1.4mm;所述微调电极为矩形,其尺寸为2.4×1.0mm;此种基本电极和微调电极组合方式能有效避开标称频率附近的寄生耦合振动模式。
优选的,所述下镀铬层的厚度为2至3nm。
优选的,所述上镀铬层的厚度为1至2nm。
本发明公开的石英晶体谐振器的加工方法,包括以下步骤:
步骤1、晶片切割:根据性能指标要求将石英晶棒按AT切型切成方片;
步骤2、晶片研磨:将石英晶体方片在研磨机上进行晶片研磨加工,磨到与所要求频率相符合的厚度;
步骤3、晶片边缘处理:使用滚边机进行晶片边缘滚边加工;
步骤4、化学腐蚀:将机械加工合格的晶片进行化学腐蚀;
步骤5、镀膜电极形成:在晶片表面依次蒸镀下镀铬层、镀银层、上镀铬层,从而形成镀膜电极;然后将晶片翻面,对晶片的另一面按照上述相同方法形成镀膜电极。
步骤6、在镀上镀膜电极的晶片上水平装入弹簧片,再点导电胶固定后用隧道炉固化;
步骤7、频率微调:用微调机进行频率微调达到所要求的频率范围;
步骤8、封装成型:连接外壳和基座,并进行气密性检查。
步骤9、高温老化。
步骤10、成品参数特性检查及印字;
步骤11、引脚处理:切脚及引脚成形、引脚浸锡;
步骤12、套绝缘垫片,编带。
优选的,所述步骤5中,蒸镀时控制下镀铬层的厚度为2至3nm,上镀铬层的厚度为1至2nm。
优选的,所述步骤5中,蒸镀时控制基本电极的尺寸为3.0×1.4mm,微调电极的尺寸为2.4×1.0mm。
优选的,所述步骤8中外壳和基座的连接采用电阻焊连接。
本发明提供的石英晶体谐振器及其加工方法,采用新的镀膜电极结构,可增强镀膜电极和晶片之间的附着力,防止镀膜电极在后续加工过程中被空气氧化,还能有效避开在标称频率附近的寄生耦合振动模式;在保持改产品原有特性的基础上,极大的提高了产品寄生响应特性,采用本发明生产的石英晶体谐振器的寄生振荡特性满足<-15dB的要求,寄生特性<-15dB的CPK达到2.0以上,极大的提高了产品的性能和质量。
附图说明
图1是本发明的结构示意图;
图2是本发明镀膜电极的结构示意图;
图3是本发明镀膜电极的剖视图;
图中1-外壳、2-基座、3-引脚、4-弹簧片、5-导电胶、6-镀膜电极、7晶片、61-基本电极、62-微调电极、601-下镀铬层、602-镀银层、603-上镀铬层。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图,对本发明进行进一步详细说明。
如图1,本发明公开的石英晶体谐振器,包括外壳1、基座2、引脚3、弹簧片4、导电胶5、镀膜电极6、晶片7;镀膜电极6包括基本电极61和与其连接的微调电极62;镀膜电极6附着在晶片7表面,包括由内到外依次排列的下镀铬层601、镀银层602、上镀铬层603。
优选的,基本电极61为矩形,其尺寸为3.0×1.4mm;微调电极62为矩形,其尺寸为2.4×1.0mm。
优选的,下镀铬层601的厚度为2至3nm。
优选的,上镀铬层603的厚度为1至2nm。
本发明公开的石英晶体谐振器的加工方法,包括以下步骤:
步骤1、晶片切割:根据性能指标要求将石英晶棒按AT切型切成方片;
步骤2、晶片研磨:将石英晶体方片在研磨机上进行晶片研磨加工,磨到与所要求频率相符合的厚度;
步骤3、晶片边缘处理:使用滚边机进行晶片边缘滚边加工;
步骤4、化学腐蚀:将机械加工合格的晶片7进行化学腐蚀;
步骤5、镀膜电极6形成:在晶片7表面依次蒸镀下镀铬层601、镀银层602、上镀铬层603,从而形成镀膜电极6;然后将晶片翻面,对晶片的另一面按照上述相同方法形成镀膜电极6。
步骤6、在镀上镀膜电极6的晶片7上水平装入弹簧片4,再点导电胶5固定后用隧道炉固化;
步骤7、频率微调:用微调机进行频率微调达到所要求的频率范围;
步骤8、封装成型:连接外壳1和基座2,并进行气密性检查。
步骤9、高温老化。
步骤10、成品参数特性检查及印字;
步骤11、引脚3处理:切脚及引脚3成形、引脚3浸锡;
步骤12、套绝缘垫片,编带。
优选的,所述步骤5中,蒸镀时控制下镀铬层的厚度为2至3nm,上镀铬层的厚度为1至2nm。
优选的,所述步骤5中,蒸镀时控制基本电极(61)的尺寸为3.0×1.4mm,微调电极(62)的尺寸为2.4×1.0mm。
优选的,所述步骤8中外壳1和基座2的连接采用电阻焊连接。
当然,本发明还可有其它多种实施例,在不脱离本发明的精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明做出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。

Claims (6)

1.一种石英晶体谐振器,包括外壳(1)、基座(2)、引脚(3)、弹簧片(4)、导电胶(5)、镀膜电极(6)、晶片(7);所述镀膜电极(6)包括基本电极(61)和与其连接的微调电极(62);其特征在于:所述镀膜电极(6)附着在晶片(7)表面,包括由内到外依次排列的下镀铬层(601)、镀银层(602)、上镀铬层(603),所述下镀铬层(601)的厚度为2至3nm,上镀铬层(603)的厚度为1至2nm。
2.根据权利要求1所述的石英晶体谐振器,其特征在于:所述基本电极(61)为矩形,其尺寸为3.0×1.4mm;所述微调电极(62)为矩形,其尺寸为2.4×1.0mm。
3.一种制造权利要求1-2任意一项所述的石英晶体谐振器的加工方法,包括以下步骤:
步骤1、晶片切割:根据性能指标要求将石英晶棒按AT切型切成方片;
步骤2、晶片研磨:将石英晶体方片在研磨机上进行晶片研磨加工,磨到与所要求频率相符合的厚度;
步骤3、晶片边缘处理:使用滚边机进行晶片边缘滚边加工;
步骤4、化学腐蚀:将机械加工合格的晶片(7)进行化学腐蚀;
步骤5、镀膜电极(6)形成:在晶片(7)表面依次蒸镀下镀铬层(601)、镀银层(602)、上镀铬层(603),从而形成镀膜电极(6);然后将晶片(7)翻面,对晶片(7)的另一面按照上述相同方法形成镀膜电极(6);
步骤6、在镀上镀膜电极(6)的晶片(7)上水平装入弹簧片(4),再点导电胶(5)固定后用隧道炉固化;
步骤7、频率微调:用微调机进行频率微调达到所要求的频率范围;
步骤8、封装成型:连接外壳(1)和基座(2),并进行气密性检查;
步骤9、高温老化;
步骤10、成品参数特性检查及印字;
步骤11、引脚(3)处理:切脚及引脚(3)成形、引脚(3)浸锡;
步骤12、套绝缘垫片,编带。
4.根据权利要求3所述的石英晶体谐振器的加工方法,其特征在于:所述步骤5中,蒸镀时控制下镀铬层的厚度为2至3nm,上镀铬层的厚度为1至2nm。
5.根据权利要求3所述的石英晶体谐振器的加工方法,其特征在于:所述步骤5中,蒸镀时控制基本电极(61)的尺寸为3.0×1.4mm,微调电极(62)的尺寸为2.4×1.0mm。
6.根据权利要求3所述的石英晶体谐振器的加工方法,其特征在于:所述步骤8中外壳(1)和基座(2)的连接采用电阻焊连接。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4638536A (en) * 1986-01-17 1987-01-27 The United States Of America As Represented By The Secretary Of The Army Method of making a resonator having a desired frequency from a quartz crystal resonator plate
CN201122937Y (zh) * 2007-12-04 2008-09-24 成都奔月科技有限公司 一种微型石英晶体谐振器
CN201490982U (zh) * 2009-09-09 2010-05-26 安徽铜峰电子股份有限公司 SMD5032-12MHz型晶体谐振器用晶片
CN101841314A (zh) * 2010-05-21 2010-09-22 金华市创捷电子有限公司 石英晶体谐振器及其制作方法
CN202872745U (zh) * 2012-09-21 2013-04-10 成都晶宝时频技术股份有限公司 一种石英晶体谐振器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4638536A (en) * 1986-01-17 1987-01-27 The United States Of America As Represented By The Secretary Of The Army Method of making a resonator having a desired frequency from a quartz crystal resonator plate
CN201122937Y (zh) * 2007-12-04 2008-09-24 成都奔月科技有限公司 一种微型石英晶体谐振器
CN201490982U (zh) * 2009-09-09 2010-05-26 安徽铜峰电子股份有限公司 SMD5032-12MHz型晶体谐振器用晶片
CN101841314A (zh) * 2010-05-21 2010-09-22 金华市创捷电子有限公司 石英晶体谐振器及其制作方法
CN202872745U (zh) * 2012-09-21 2013-04-10 成都晶宝时频技术股份有限公司 一种石英晶体谐振器

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