CN102825868A - Silicon crystal composite panel - Google Patents
Silicon crystal composite panel Download PDFInfo
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- CN102825868A CN102825868A CN201210296438XA CN201210296438A CN102825868A CN 102825868 A CN102825868 A CN 102825868A CN 201210296438X A CN201210296438X A CN 201210296438XA CN 201210296438 A CN201210296438 A CN 201210296438A CN 102825868 A CN102825868 A CN 102825868A
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Abstract
The invention discloses a silicon crystal composite panel, which comprises a ceramic layer used as a bottom base material, and a quartz layer used as a surface material; the ceramic layer and the quartz layer are bonded by using modified epoxy resin as an adhesive; the quartz layer mainly comprises the following components: a quartz ore material doped with more than 50% of waste recovered materials, quartz powder, unsaturated polyester resin, and an additive; the waste recovered materials comprise cullet and waste scraps cut from natural stone; the seamless bonding of the quartz surface material with ceramic tiles not only overcomes the technical problem of warpping when the quartz surface material is adhered to the floor, but also has the advantages of mature ceramic tile floor adhesion technology; therefore the silicon crystal composite panel of the invention has wide market prospects.
Description
Technical field
The invention belongs to building materials technology field, specifically, relate to a kind of silicon wafer composite panel.
Background technology
The compound plane materiel of silicon wafer is claimed artificial quartz in lump again;, anti scuffing, anticorrosive, anti-aging, impermeable, hard like stone, bright like numerous advantages such as mirrors gorgeous, radiationless, wear-resisting, withstand voltage by means of its rich color; Receive liking of users deeply, and become the new decorative material of traditional stone materials such as replacing natural marble, granite, common artificial marble gradually.According to incompletely statistics, nearly thousand families of national big and small artificial stone manufacturing enterprise in 2008, the gross sales of national artificial stone enterprise has surpassed 9,000,000,000 RMB, exports nearly 1.5 hundred million dollars.Along with product technology and market are constantly ripe, quartz market is activated, and consumption demand constantly increases.Particularly Spain matches beautiful stone the wideling popularize of China, and has introduced new consumption concept and life style to people.The quartz plane materiel has been widely used in fields such as metope, table top, fireplace, fountain and various trade dress at present.Yet the quartz plane materiel exist to paste the floor and opens and stick up defective, and artificial quartz in lump mainly is to be applied in kitchen countertop, the toilet table top, and the bar desk, dinner table, and indoor wall etc., being applied in ground decoration can't break through always, still is to be main with ceramic tile.
The history of ceramic tile should be traced back to B.C. 4000, and at that time, the Egyptian had begun to decorate various types of houses with ceramic tile.Since several centuries, the decorative effect of ceramic tile improves along with the improvement of ceramic tile production method.Up to Islamic period, the trailing of all ceramic tiles has reached the peak.For example floor tile, the glazed tile of Antwerp, the development of Dutch ceramic tile illustration and the ceramic tile of Germany in Spain and Portuguese mosaic, the Italian renaissance period all have landmark meaning.Ceramic tile is almost used the every aspect of building, for example: the exterior wall of wall, ground, ceiling, fireplace, mural painting and building etc.Defectives such as yet ceramic tile is single owing to color, pattern is few become the bottleneck of ceramic tile market development gradually.
Summary of the invention
The present invention has overcome shortcoming of the prior art; Provide a kind of silicon wafer compound plane materiel; With quartz plane materiel and the unique seamless binding of ceramic tile; Both overcome quartz plane materiel subsides floor and opened the technical barrier that sticks up, and had the ripe floor attaching process of ceramic tile simultaneously again concurrently, thereby have vast market prospect.
In order to solve the problems of the technologies described above, the present invention realizes through following technical scheme:
A kind of silicon wafer composite panel comprises the ceramic layer as bottom substrate, and is as the quartz layer of plane materiel, as adhesive that said ceramic layer and said quartz layer is bonding with modified epoxy.
Further, said quartz layer mainly contains following component: mix quartz mine material, silica flour, unsaturated polyester resin and the auxiliary agent of the discarded regenerant more than 50%, said discarded regenerant comprises cullet and lithotome cutting edge horn scraps.
Further, said quartz layer contains following component: quartz 50%, silica flour 40%, cullet 3%, idol connect KH570 0.15%, curing agent methyl ethyl ketone peroxide 0.08%, unsaturated polyester resin 6.77%.
Further, said unsaturated polyester resin mixes the ball-type nanometer grade silica.
Further; Said modified epoxy comprises epoxy resin 50%, Corvic 15%, dioctyl phthalate 10%, xylenes 3%; Iron powder 2%, silica flour 5%, flake asbestos 5%, boron trifluoride glycerine 5%, boron trifluoride aniline 4%, 3-aminopropyltriethoxywerene werene 1%.
Further, the binding face of said ceramic layer and said quartz layer is all played bulk processing.
Further, said quartz layer adds in raw material again and accounts for gross weight 5%, particle diameter 30-70 purpose luminescent powder.
Further, the solidification temperature of said quartz layer is 40-50 ℃.
Further, said cullet size is 0.5-20mm, and lithotome cutting edge horn scraps size is 0.5-20mm.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention integrates the advantage of quartz and ceramic tile, makes this product will become the new lover in market rapidly.Its advantage is following: the one, and in light weight: the silicon wafer composite panel is because sheet metal thickness generally has only about 12 millimeters thick, and quartz aspect material thickness has only 3mm, and many costs have just been saved in only transportation aspect, the building had it is optimal selection under the situation of load limit; The 2nd, intensity is high: after quartz and ceramic tile were compound, its bending resistance, anti-folding, shear-stable intensity were significantly improved, and greatly reduce the breakage rate in transportation, installation, the use; The 3rd, contamination resistance improves: common ceramic tile (being the entire body ceramic tile) is in installation process or in the use later on; As with after very possible half a year of cement wet combining or 1 year; Its surface various variable color occurs and spot is very difficult to remove; The compound plane materiel of quartz-ceramic tile is the quartz plane materiel because of its surface, the quartz plane materiel be under vacuum condition, make think and act in one and the same way the composite of dense non-porous; Its quartz surfaces has fabulous resistance to corrosion to the soda acid in kitchen etc., has avoided the generation of this situation.
The price of present ceramic tile is about 0.6 times of quartz, and the quartz-ceramic tile composite panel that 12mm is thick, ceramic tile is about 9mm, calculates by this, and the cost of a composite panel can save 46.85%, well below the quartz plane materiel cost of an equal quality,
The specific embodiment
A kind of silicon wafer composite panel of the present invention comprises the ceramic layer as bottom substrate, and is as the quartz layer of plane materiel, as adhesive that said ceramic layer and said quartz layer is bonding with modified epoxy.
Wherein the bottom ceramic layer mainly is to adopt the waste old ceramics material to pulverize the back to add resin, auxiliary agent, and compression molding need not to carry out high temperature glazing and high temperature sintering, helps promoting the development of comprehensive utilization of resources and recycling economy.
Quartz layer mainly contains following component: the quartz mine material, silica flour, unsaturated polyester resin and the auxiliary agent that mix the discarded regenerant more than 50%; Discarded regenerant comprises cullet and lithotome cutting edge horn scraps; The cullet size is 0.5-20mm, and lithotome cutting edge horn scraps size is 0.5-20mm.
In the present embodiment; Quartz layer contains following component: quartz 50%, silica flour 40%, cullet 3%, idol connect KH5700.15%, curing agent methyl ethyl ketone peroxide 0.08%, unsaturated polyester resin 6.77%, and its anti-fracture strength, compression strength and bending strength all are greatly improved.
Unsaturated polyester resin mixes the ball-type nanometer grade silica; Through adopting the ball-type nanometer grade silica that the unsaturated ester resin of getting is carried out modification; Nano material and macromolecular material is compound, strengthen and improved the quartz wearability, multinomial physical properties such as moulding cracking and morphotropism; On toughness and intensity, be significantly improved after making quartz layer panel and ceramic bottom board moulding, also improved the yield rate of product greatly.
Modified epoxy comprises epoxy resin 50%, Corvic 15%, dioctyl phthalate 10%, xylenes 3%; Iron powder 2%, silica flour 5%, flake asbestos 5%, boron trifluoride glycerine 5%, boron trifluoride aniline 4%, 3-aminopropyltriethoxywerene werene 1% are through the adjustment of factory formula; The use of auxiliary chemicals, adhesive make that in quartz panel and the ceramic bottom board molding process, the intensity of sheet material is improved; And has certain pliability; When guaranteeing that sheet material has higher stretching and bending strength, after machine-shaping, be unlikely to cracking, the anti-wear performance that improves the quartz panel with contract the mould morphotropism.
Solidification temperature in the quartz layer production process is merely the 40-70 degree, thereby need not consume a large amount of fuel, does not have toxic emission, does not have dust emission, and industrial water recycles, and without sewage discharge has the advantage of environmental protection and energy saving, cleaner production.
The binding face of ceramic layer and quartz layer is all played bulk processing, and plane materiel and base plate bond degree are improved, and has certain pliability, and shock resistance reaches desirable effect.
Quartz layer adds in raw material again and accounts for gross weight 5%, particle diameter 30-70 purpose luminescent powder.
Each item index of the present invention:
(1) shearing strength (25 ℃/72h, quartz/ceramic tile): >=8MPa
(2) hardening time (25 ℃, quartz/ceramic tile): 0.5h
(4) impact strength (25 ℃/72h, quartz/ceramic tile): qualified
(5) after the immersion, shearing strength (25 ℃/72h, quartz/ceramic tile): >=7MPa
(6) high-low temperature resistant, shearing strength (25 ℃/72h, quartz/ceramic tile): >=7MPa
(7) water absorption rate (25 ℃/10d) :≤0.15%
(8) shrinkage factor (25 ℃/72h) :≤3%
What should explain at last is: more than be merely the preferred embodiments of the present invention; Be not limited to the present invention; Although with reference to embodiment the present invention has been carried out detailed explanation, for a person skilled in the art, it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing; Perhaps part technical characterictic wherein is equal to replacement; But all within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. silicon wafer composite panel is characterized in that: comprise ceramic layer as bottom substrate, and as the quartz layer of plane materiel, as adhesive that said ceramic layer and said quartz layer is bonding with modified epoxy.
2. a kind of silicon wafer composite panel according to claim 1; It is characterized in that: said quartz layer mainly contains following component: mix quartz mine material, silica flour, unsaturated polyester resin and the auxiliary agent of the discarded regenerant more than 50%, said discarded regenerant comprises cullet and lithotome cutting edge horn scraps.
3. a kind of silicon wafer composite panel according to claim 1 and 2, it is characterized in that: said quartz layer contains following component: quartz 50%, silica flour 40%, cullet 3%, idol connect KH5700.15%, curing agent methyl ethyl ketone peroxide 0.08%, unsaturated polyester resin 6.77%.
4. a kind of silicon wafer composite panel according to claim 3, it is characterized in that: said unsaturated polyester resin mixes the ball-type nanometer grade silica.
5. a kind of silicon wafer composite panel according to claim 3; It is characterized in that: said modified epoxy comprises epoxy resin 50%, Corvic 15%; Dioctyl phthalate 10%; Xylenes 3%, iron powder 2%, silica flour 5%, flake asbestos 5%, boron trifluoride glycerine 5%, boron trifluoride aniline 4%, 3-aminopropyltriethoxywerene werene 1%.
6. a kind of silicon wafer composite panel according to claim 5, it is characterized in that: the binding face of said ceramic layer and said quartz layer is all played bulk processing.
7. a kind of silicon wafer composite panel according to claim 5 is characterized in that: said quartz layer adds in raw material again and accounts for gross weight 5%, particle diameter 30-70 purpose luminescent powder.
8. a kind of silicon wafer composite panel according to claim 5 is characterized in that: the solidification temperature of said quartz layer is 40-50 ℃.
9. a kind of silicon wafer composite panel according to claim 6 is characterized in that: said cullet size is 0.5-20mm, and lithotome cutting edge horn scraps size is 0.5-20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210296438.XA CN102825868B (en) | 2012-08-20 | 2012-08-20 | Silicon crystal composite panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210296438.XA CN102825868B (en) | 2012-08-20 | 2012-08-20 | Silicon crystal composite panel |
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| Publication Number | Publication Date |
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| CN102825868A true CN102825868A (en) | 2012-12-19 |
| CN102825868B CN102825868B (en) | 2014-08-27 |
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| CN201210296438.XA Active CN102825868B (en) | 2012-08-20 | 2012-08-20 | Silicon crystal composite panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105950094A (en) * | 2016-06-30 | 2016-09-21 | 禹州市远大塑料电器有限责任公司 | Unsaturated polyester resin used for quartzite bonding and preparation method thereof |
| CN106032326A (en) * | 2015-03-20 | 2016-10-19 | 深圳光启高等理工研究院 | Multilayer composite ceramic plate and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1210831A (en) * | 1997-09-11 | 1999-03-17 | 石家庄松厦新型建材有限公司 | Light wall plate and its making method |
| CN101181799A (en) * | 2006-11-13 | 2008-05-21 | 天津市世纪东方建筑景观雕塑技术开发中心 | Method for making composite glass agate jade brick |
-
2012
- 2012-08-20 CN CN201210296438.XA patent/CN102825868B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1210831A (en) * | 1997-09-11 | 1999-03-17 | 石家庄松厦新型建材有限公司 | Light wall plate and its making method |
| CN101181799A (en) * | 2006-11-13 | 2008-05-21 | 天津市世纪东方建筑景观雕塑技术开发中心 | Method for making composite glass agate jade brick |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106032326A (en) * | 2015-03-20 | 2016-10-19 | 深圳光启高等理工研究院 | Multilayer composite ceramic plate and preparation method thereof |
| CN105950094A (en) * | 2016-06-30 | 2016-09-21 | 禹州市远大塑料电器有限责任公司 | Unsaturated polyester resin used for quartzite bonding and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102825868B (en) | 2014-08-27 |
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Address after: 528518 No. 112 Mingcheng Second Road, Gaoming District, Foshan City, Guangdong Province Patentee after: Guangdong Zhongqi New Materials Co., Ltd. Address before: 528518 No. 112 Mingcheng Second Road, Gaoming District, Foshan City, Guangdong Province Patentee before: Guangdong Banner New Material Technology Co., Ltd. |
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