CN102818237B - Led导热装置制造方法 - Google Patents

Led导热装置制造方法 Download PDF

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CN102818237B
CN102818237B CN201110223083.7A CN201110223083A CN102818237B CN 102818237 B CN102818237 B CN 102818237B CN 201110223083 A CN201110223083 A CN 201110223083A CN 102818237 B CN102818237 B CN 102818237B
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李竹
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PanJit International Inc
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
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    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • F28—HEAT EXCHANGE IN GENERAL
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49865—Assembling or joining with prestressing of part by temperature differential [e.g., shrink fit]

Abstract

本发明涉及一种LED导热装置制造方法，其包含以冷锻压制成型制作略呈锥状装配部的散热载体，以及引伸成型一LED导热板，LED导热板形成导热墙，将LED焊接于LED导热板上，对散热载体加热并将LED导热板紧配于散热载体，使导热墙紧贴于散热载体的装配部，再冷却以提高紧贴度，LED导热装置制造方法中成型的导热墙可以增加导热面积，LED导热板与散热载体的紧密贴合，可有效提升LED导热板的导热效率，使LED导热板上的LED可处于适当的工作温度，并延长使用寿命。

Description

LED导热装置制造方法
技术领域
本发明涉及一种LED导热装置制造方法，尤指一种可提高LED导热板的导热效能的成型方法。
背景技术
目前LED照明灯具内设有一平板状的导热板，该导热板上设有LED，以及该导热板通过螺丝锁设于一散热载体，其中，该导热板的顶面外缘形成一导热面，并以该导热面涂布散热胶或其他导热材料与散热载体接触，LED照明时产生的热能传导于导热板上，经由导热板上的导热胶与散热载体接触的导热面，进一步传导至散热载体，达到LED散热的目的。
然而上述内容中，该导热板仅利用顶面上形成的单一导热面，导热面提供的热能传导接触面积小，以及导热板与散热载体螺接的方式，使导热面与散热载体之间存有大量的空气介质，影响热传导效率，因此LED产生的热能无法有效率地经由导热板传导至散热载体进行散热，故散热效率不佳，导致LED照明灯具的温度升高，让LED无法在适当的工作温度下运行，造成LED的使用寿命与效能下降。
另有利用螺丝锁设的方式将导热板与散热载体组设，导热板与散热载体之间存在大量的空气介质，影响热能传导速率，所以导热性不佳，此外，也有导热板与散热载体卡接的方式，接触面积太小，也会产生导热性不佳的问题。
发明内容
本发明的主要目的在于提供一种LED导热装置制造方法，希望借此设计，改善目前平板状的导热板利用导热胶、锁设或卡接等方式与散热载体接触的方式，产生导热效率不佳的问题。
为达成前述目的，本发明提出了一种LED导热装置制造方法，其包含：
以冷锻压制成型制作一散热载体，并于该散热载体上形成一装配部；
将平板状的导热单元放置于引伸模具内，以配合的液压设备对导热单元引伸成型，将导热单元外围引伸形成导热墙，让导热单元成型为LED导热板；
将LED定位并焊接于LED导热板上；以及
先将散热载体加热，使其因热膨胀，再将散热载体与LED导热板进行组合，让LED导热板的导热墙与散热载体的装配部紧配连接，再冷却使配合更为紧密。
换言之，为达成前述目的，本发明所设计的LED导热装置制造方法，包含有：
以冷锻压制成型制作一散热载体，并于该散热载体上形成一略呈锥状装配部；
将平板状的导热单元放置于引伸模具内，以配合的液压设备对导热单元引伸成型，将导热单元外围引伸形成略呈锥面的导热墙，让导热单元成型为略呈锥状的LED导热板；
将LED定位并焊接于略呈锥状的LED导热板上；以及
先将散热载体加热，使其因热膨胀，再将散热载体与LED导热板进行组合，让略呈锥状的LED导热板的导热墙与散热载体的略呈锥状装配部紧迫连接，再冷却使配合更为紧密的热传导途径。
据上所述，冷锻压制成型可使材料密度更高，以提升热传导，该LED导热装置制造方法于拉伸步骤中，将导热单元的外围拉伸成型出具有锥面的导热墙，增加LED导热板的导热面积，以及于紧迫组接步骤中，让LED导热板可以紧配于散热载体中，使导热墙的锥面与散热载体的略呈锥状装配部可紧密贴合，利用加热后再冷却的方式，也可提升紧密贴合度，所以LED导热板可将LED产生的热能顺畅的传导出来至散热载体，以提高LED导热板的导热效率，让LED导热板上的LED在适当的工作温度下发光，进一步延长LED的使用寿命，并可省略导热胶与螺丝的使用。
附图说明
图1：为本发明LED导热装置制造方法中拉伸步骤的一个较佳实施例的步骤流程示意图。
图2：为本发明LED导热装置制造方法中LED导热装置的一个较佳实施例的立体分解示意图。
图3：为本发明LED导热装置制造方法中LED导热装置的一个较佳实施例的组合侧视剖面示意图。
图4：为本发明LED导热装置制造方法中LED导热装置组设于LED照明灯具的一个较佳实施例的组合侧视剖面示意图。
【主要元件符号说明】
10 导热单元        20 导热板
21 平面部          22 导热墙
30 散热载体        40 LED
50 灯座            51 控制模块
52 定位件          53 灯杯单元。
具体实施方式
本发明LED导热装置制造方法是利用冷锻压制成型制作一散热载体，并于该散热载体30上形成一略呈锥状或直筒状装配部。
将导热单元10放置于模具内，再以配合的液压设备对导热单元10施加引伸拉力，让导热单元10外围引伸成外侧面略呈锥面或垂直面的导热墙22，使导热单元10成型为略呈锥状或垂直的LED导热板20，如图1所示，该LED导热板20包含有一平面部21，以及该导热墙22是由该平面部21的外周侧向延伸，故该导热墙22环绕于该平面部21，以及该导热墙22端缘处的外径大于该平面部21的外径。
将LED40定位并焊接于该LED导热板20的平面部21上。
接续进行组装步骤，将略呈锥状的LED导热板20，以及散热载体30，放置于对应配合的组装模具中，利用连接于组装模具的液压设备，对组装模具内的LED导热板20与散热载体30进行组装，先将散热载体30加热，使散热载体30受热膨胀，组装后，略呈锥状或垂直的LED导热板20中一部分的平面部21与导热墙22，与散热载体30的装配部紧配(如图2、图3所示)，紧配之后再进行冷却，使散热载体30因冷却收缩，增加紧配度，减少LED导热板20与散热载体30的相邻接处的空气介质量。
请参阅图4所示，组接后的LED导热板20与散热载体30形成LED导热装置，该LED导热装置可设置于一LED照明灯具中，其中，该LED照明灯具包含有一灯座50，该灯座50内可设置控制模块51，该LED导热装置的散热载体30组设于该灯座50上，并通过一定位件52将一灯杯单元53组固于该散热载体30上，且该灯杯单元邻近该LED导热板20，并配合该LED导热板20上的LED40，以及LED40电性连接该控制模块51。
其中，LED40发光所产生的热能，会传导至该LED导热板20的平面部21与导热墙22，进一步将热能传导至该散热载体30以散热。
综上所述，该LED导热装置制造方法中，散热载体30冷锻压制成型可使材料密度更高，可提升热传导，将导热单元10的外围引伸成型出导热墙22，可增加LED导热板20对于散热载体30的导热面积，紧配合方式让LED导热板20可以紧迫散热载体30，使导热墙22的锥面与散热载体30中略呈锥状的装配部紧贴，同时配合热胀冷缩提升紧配度，减少LED导热板20与散热载体30接触之间的空气介质量，让LED导热板20可将LED40产生的热能顺畅的传导至该散热载体30，提升LED导热板20的导热效率，让LED导热板20上的LED40在适当的工作温度下发光，且可延长LED40的使用寿命，以及省略导热胶与螺丝的使用，故利于产业的利用。

Claims (3)

1.一种LED导热装置制造方法，其包含：
以冷锻压制成型制作一散热载体，并于该散热载体上形成一装配部；
将平板状的导热单元放置于引伸模具内，以配合的液压设备对导热单元引伸成型，将导热单元外围引伸形成导热墙，让导热单元成型为LED导热板，该LED导热板包含有一平面部，该导热墙环绕于该平面部，以及该导热墙端缘处的外径大于该平面部的外径；
将LED定位并焊接于LED导热板上；以及
先将散热载体加热，使其因热膨胀，再将散热载体与LED导热板进行组合，让LED导热板的导热墙与散热载体的装配部紧配连接，再冷却使配合更为紧密。
2.根据权利要求1所述的LED导热装置制造方法，其中，该装配部略呈锥状，导热单元外围引伸形成略呈锥面的导热墙，让导热单元成型为略呈锥状的LED导热板，略呈锥状的LED导热板的导热墙与散热载体的略呈锥状装配部紧配连接。
3.根据权利要求1所述的LED导热装置制造方法，其中，该装配部呈直筒状，导热单元外围引伸形成垂直面的导热墙，让导热单元成型为呈垂直的LED导热板，呈垂直的LED导热板的导热墙与散热载体的直筒状的装配部紧配连接。
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2959209B1 (en) * 2013-02-19 2018-09-12 Philips Lighting Holding B.V. Lighting device with improved thermal properties
JP6286791B2 (ja) * 2013-12-10 2018-03-07 パナソニックＩｐマネジメント株式会社 光源ユニット及びそれを用いた照明器具
DE102014203192B4 (de) * 2014-02-21 2022-03-03 Ledvance Gmbh Halbleiterlampe mit Wärmesenke
US10914962B2 (en) * 2015-08-21 2021-02-09 Everready Precision Ind. Corp Structured light module with fastening element
CN108458264A (zh) * 2017-02-21 2018-08-28 漳州立达信光电子科技有限公司 灯泡中安装发光二极管灯条的方法、灯泡装置与照明装置
CN112427880A (zh) * 2020-11-20 2021-03-02 株洲时代新材料科技股份有限公司 一种套装在扭转臂臂套内的抗侧滚扭杆的脱出方法及装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2682586Y (zh) * 2003-11-20 2005-03-02 东莞莫仕连接器有限公司 散热装置
CN201066109Y (zh) * 2007-03-13 2008-05-28 宁翔科技股份有限公司 光源散热结构
CN201331033Y (zh) * 2008-12-26 2009-10-21 苏州力创科技有限公司 Led灯具散热模块结构
TW201020461A (en) * 2008-11-28 2010-06-01 Univ Nat Taiwan Science Tech A thermal module for light source

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7646544B2 (en) * 2005-05-14 2010-01-12 Batchko Robert G Fluidic optical devices
JP4454973B2 (ja) 2003-07-04 2010-04-21 株式会社ウシオスペックス スポットライトの放熱構造
US7816698B2 (en) * 2007-04-13 2010-10-19 Industrial Technology Research Institute Heat dissipation package for heat generation element
KR100872140B1 (ko) 2007-12-28 2008-12-10 (주)블루글라스코리아 발광다이오드 램프 모듈
TW200940881A (en) * 2008-03-18 2009-10-01 Pan Jit Internat Inc LED lamp with thermal convection and thermal conduction heat dissipating effect, and heat dissipation module thereof
US7677767B2 (en) 2008-04-01 2010-03-16 Wen-Long Chyn LED lamp having higher efficiency
US8476812B2 (en) * 2009-07-07 2013-07-02 Cree, Inc. Solid state lighting device with improved heatsink
US7932532B2 (en) * 2009-08-04 2011-04-26 Cree, Inc. Solid state lighting device with improved heatsink
KR101742970B1 (ko) * 2009-10-09 2017-06-02 에이피에스 재팬 가부시키가이샤 조명장치
CN102640581B (zh) * 2009-10-22 2015-02-04 瑟莫尔解决方案资源有限责任公司 包覆模制的led照明组件及其制造方法
US8608341B2 (en) * 2011-03-07 2013-12-17 Lighting Science Group Corporation LED luminaire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2682586Y (zh) * 2003-11-20 2005-03-02 东莞莫仕连接器有限公司 散热装置
CN201066109Y (zh) * 2007-03-13 2008-05-28 宁翔科技股份有限公司 光源散热结构
TW201020461A (en) * 2008-11-28 2010-06-01 Univ Nat Taiwan Science Tech A thermal module for light source
CN201331033Y (zh) * 2008-12-26 2009-10-21 苏州力创科技有限公司 Led灯具散热模块结构

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