CN102810534A - LED (light emitting diode) module - Google Patents
LED (light emitting diode) module Download PDFInfo
- Publication number
- CN102810534A CN102810534A CN2011101487783A CN201110148778A CN102810534A CN 102810534 A CN102810534 A CN 102810534A CN 2011101487783 A CN2011101487783 A CN 2011101487783A CN 201110148778 A CN201110148778 A CN 201110148778A CN 102810534 A CN102810534 A CN 102810534A
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- heat radiation
- emitting diode
- copper seat
- light emitting
- circuit board
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Abstract
An LED (light emitting diode) module comprises a cooling copper base, a circuit board and a plurality of LEDs, wherein the cooling copper base comprises a first cooling region and a second cooling region; the first cooling region is provided with a plurality of cooling high platforms and a plurality of first cooling top faces respectively formed on the cooling high platforms; the second cooling region is provided with a second cooling top face lower than the first cooling top faces; the circuit board comprises a cooling part correspondingly contacted with the second cooling region of the cooling copper base, a plurality of troughs formed in the cooling part and corresponding to the cooling high platforms, and at least one welding part which is not in contact with the cooling copper base; the cooling high platforms are arranged in the troughs; and the LEDs are arranged on the first cooling top faces of the cooling copper base.
Description
Technical field
The present invention relates to a kind of photoelectric cell, particularly relate to a kind of light emitting diode module.
Background technology
A kind of light emitting diode module in the past; Like TaiWan, China patent M311119 number and exposures of M311844 number institute, comprise a circuit board, a heat radiation copper seat that is positioned at below this circuit board, reach a plurality of light-emitting diodes; Because this circuit board entire area is covered on this heat radiation copper seat; Take off patent before making when welding power supply electric wire,, and make scolding tin fixed rapidly easily because the heat radiation of this heat radiation copper seat is too quick; Be difficult for when molten condition, scolding tin being adjusted to appropriate position, cause that welding is difficult for, elongate man-hour, caused weldering easily, be difficult for a large amount of disappearances of producing or the like.
Summary of the invention
The object of the present invention is to provide a kind of easy welding to be fit to mass-produced light emitting diode module.
Light emitting diode module of the present invention; Comprise: a heat radiation copper seat, a circuit board; And a plurality of light-emitting diodes, this heat radiation copper seat comprises one first radiating area, and one second radiating area; This first radiating area has the high platform of a plurality of heat radiations and a plurality of first heat radiation end face that is formed at the high platform of said heat radiation respectively; This second radiating area have one be lower than the said first heat radiation end face the second heat radiation end face, this circuit board comprises the radiating part of corresponding this heat radiation copper seat second radiating area of contact, the conduit that the high platform of the said heat radiation of a plurality of correspondence is opened in this radiating part, reaches the weld part that at least one does not touch with this heat radiation copper seated connection; The high platform of said heat radiation lays respectively in the said conduit, and said light-emitting diode is positioned at the first heat radiation end face of this heat radiation copper seat.
Light emitting diode module of the present invention, the welding position of this circuit board is in this heat radiation copper seat outside.
Light emitting diode module of the present invention, this heat radiation copper seat also comprise two to wire hole that should the circuit board weld part.
Light emitting diode module of the present invention, said wire hole is communicated with these heat radiation copper seat outer peripheral edges.
Light emitting diode module of the present invention also comprises the electric wire that most bars are welded in this circuit board weld part.
Light emitting diode module of the present invention, said light-emitting diode comprise a base of processing for aluminium nitride respectively.
Light emitting diode module of the present invention also comprises the eutectic layer between the first heat radiation end face of base end face and this heat radiation copper seat that one deck is positioned at said light-emitting diode.
Light emitting diode module of the present invention, this heat radiation copper seat first heat radiation end face adds that the height of this eutectic layer is higher than this circuit board, and difference in height is less than 0.03mm.
Light emitting diode module of the present invention, this heat radiation copper seat and this circuit board are used the solid welding of high-melting-point scolding tin, and said light-emitting diode and this heat radiation copper seat and circuit board use the solid welding of low melting point scolding tin.
Light emitting diode module of the present invention also comprises a control unit that is installed on this heat radiation copper seat, and this control unit comprises a thermistor.
Light emitting diode module of the present invention, the first heat radiation apical side height of this heat radiation copper seat is not less than this circuit board, and the thickness of this eutectic layer is less than 0.03mm.
Light emitting diode module of the present invention, said eutectic layer are to be processed by the gold-tin alloy layer of light-emitting diode base end face and this heat radiation copper seat first heat radiation end face.
Light emitting diode module of the present invention, coating scolding tin is filled up air gap between said light-emitting diode base end face and this heat radiation copper seat first heat radiation end face.
Beneficial effect of the present invention is: because this circuit board weld part does not touch with this heat radiation copper seated connection; Therefore; When welding power supply electric wire, not influenced by this heat radiation copper seat; Just this heat radiation copper seat is not positioned at the below of power supply electric wire weld, and scolding tin can not make welding quality descend because heat radiation is too fast, and this characteristic helps a large amount of production light emitting diode module.
Description of drawings
Fig. 1 is the three-dimensional exploded view of first preferred embodiment of a kind of light emitting diode module of the present invention;
Fig. 2 is the stereogram of the assembly graph of a relation of this first preferred embodiment;
Fig. 3 is the end view of the size of an originally circuit board of first preferred embodiment greater than the size of a heat radiation copper seat;
Fig. 4 is the partial enlarged drawing that one of them light-emitting diode of this first preferred embodiment is welded in this circuit board and this heat radiation copper seat;
Fig. 5 is the three-dimensional exploded view of second preferred embodiment of a kind of light emitting diode module of the present invention;
Fig. 6 is the stereogram of the assembly graph of a relation of this second preferred embodiment;
Fig. 7 is the assembling signal three-dimensional exploded view of this second preferred embodiment and a lampshade and a heat radiation rack.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is elaborated:
Consult Fig. 1 to Fig. 4, first preferred embodiment of light emitting diode module of the present invention comprises a heat radiation copper seat 2, circuit board 1, a plurality of light-emitting diode 3, a control unit 4, and two electric wires 5.
This heat radiation copper seat 2 comprises one first radiating area 23; And one second radiating area 24; This first radiating area 23 does not overlap each other with this second radiating area 24; This first radiating area 23 has the high platform 21 of a plurality of heat radiations and a plurality of first heat radiation end face 22 that is formed at the high platform 21 of said heat radiation respectively, and this second radiating area 24 has second a heat radiation end face 241 that is lower than the said first heat radiation end face 22.
This circuit board 1 comprises that the high platform 21 of radiating part 13, the said heat radiation of a plurality of correspondence of corresponding these heat radiation copper seat 2 second radiating areas 24 of contact is opened in the conduit 11 of this radiating part 13, the weld part 12 that at least one does not contact with this heat radiation copper seat 2; And a plurality of electrical connection sections 14, the high platform 21 of said heat radiation is arranged in the said conduit 11.
In this first preferred embodiment, this circuit board 1 weld part 12 is positioned at this heat radiation copper seat 2 outsides, and just the area of this circuit board 1 is greater than this heat radiation copper seat 2.
Said light-emitting diode 3 is positioned on the first heat radiation end face 22 of this heat radiation copper seat 2, and said light-emitting diode 3 is welded in the said electrical connection section 14 of this circuit board 11, and said light-emitting diode 3 comprises a base 31 of processing for aluminium nitride respectively.
These base 31 tolerable maximum voltages are 20kY, and thermal conductivity coefficient is 200W/mk, and the fusing point of said light-emitting diode 3 tolerables use scolding tin is 150 ℃, and electric current is 4 amperes.
This control unit 4 is installed on this heat radiation copper seat 2; This control unit 4 is used to respond to the temperature of said light-emitting diode 3; And comprise a thermistor 41; The resistance value of this thermistor 41 changes with temperature, destroys said light-emitting diode 3 to avoid super-high-current to feed said light-emitting diode 3, and temperature opens circuit to protect said light-emitting diode 3 when too high.
In this first preferred embodiment; This thermistor 41 is connected with said light-emitting diode 3; This circuit board 1 comprises one to perforate 15 that should thermistor 41, and this heat radiation copper seat 2 also comprises one to projection 25 that should thermistor 41, and this projection 25 is arranged in this perforate 15; This thermistor 41 is arranged at this perforate 15 and contacts this projection 25 in order to the temperature of experiencing this heat radiation copper seat 2; The temperature of wherein being somebody's turn to do heat radiation copper seat 2 is synchronous with the temperature of said light-emitting diode 3 again, so this control unit 4 is used to respond to the temperature of said light-emitting diode 3, reaches the effect of the said light-emitting diode 3 of protection.
The welding end points 51 of said electric wire 5 is welded on this weld part 12 of this circuit board 1; Because this circuit board 1 size is greater than these heat radiation copper seat 2 sizes; Therefore, when welding power supply electric wire 5, not influenced by this heat radiation copper seat 2, just this heat radiation copper seat 2 is not positioned at the below of power supply electric wire 5 welds; The welding end points 51 of said electric wire 5 welderings is connected to this weld part 12; Scolding tin can not produce the disappearance that welding quality descends because heat radiation in the welding process is too fast, avoid really that welding is difficult for, elongate man-hour, caused weldering or the like phenomenon easily, and this characteristic helps a large amount of production light emitting diode module.
This eutectic layer 32 is 22 of first heat radiation end faces that are positioned at base end face and this heat radiation copper seat 2 of said light-emitting diode 3, and this eutectic layer 32 processes for gold-tin alloy, and this eutectic layer 32 can promote radiating effect.
In this first preferred embodiment; This heat radiation copper seat 2 uses 61 solid weldings of high-melting-point scolding tin with this circuit board 1; Said light-emitting diode 3 uses 62 solid weldings of low melting point scolding tin with this heat radiation copper seat 2 with circuit board 1, and high-melting-point scolding tin 61 fusing points are 260 ℃, and low melting point scolding tin 62 fusing points are 150 ℃.
The order of welding does; Earlier with after this circuit board 1 and 61 solid weldings of this heat radiation copper seat 2 use high-melting-point scolding tin; Again said light-emitting diode 3 and this heat radiation copper seat 2 are used 62 solid weldings of low melting point scolding tin with circuit board 1, and because low melting point scolding tin 62 fusing point higher melt scolding tin 61 are low, therefore; At the said light-emitting diode of later welded 3 with this heat radiation copper seat 2 during with circuit board 1, can be with the dispel the heat high-melting-point scolding tin 61 scolding tin meltings of 2 of copper seats of this circuit board 1 and this.
What illustrate further is, these heat radiation copper seat 2 first heat radiation end faces 22 highly are not less than this circuit board 1, when welding, uses predetermined pressure to exert pressure to make said eutectic layer 32 thin thickness and evenly, these eutectic layer 32 preferable thickness are less than 0.03mm.
In addition; What be worth explanation is before welding, on the first heat radiation end face 22 of said light-emitting diode 3 bases, 31 bottom surfaces and this heat radiation copper seat 2, all to be formed with the gold-tin alloy layer; Then form eutectic layer 32 after the welding; And utilize low melting point scolding tin 62 can let said light-emitting diode 3 tightr with the binding of this heat radiation copper seat 2, and welding after accomplishing left low melting point scolding tin 62 very thin, fill up air gap through low melting point scolding tin 62 and avoid air reduction radiating effect; Can effectively improve the contact area of said light-emitting diode 3 and this heat radiation copper seat 2, and then promote radiating effect.
In addition, before welding, copper seat 2 oxidations of can the inertia of utilization own avoiding dispelling the heat of the metal ingredient gold of gold-tin alloy layer then utilize the metal ingredient tin of gold-tin alloy layer to reduce fusing point during welding, avoid the 61 scolding tin meltings of high-melting-point scolding tin.
These heat radiation copper seat 2 first heat radiation end faces 22 add that the height of this eutectic layer 32 is higher than this circuit board 1, and difference in height is less than 0.03mm, to avoid said light-emitting diode 3 because of crossing the phenomenon that far causes loose contacts such as empty weldering apart from this circuit board 1 electrical connection section 14.
Consult Fig. 5 to Fig. 7; Second preferred embodiment of light emitting diode module of the present invention and this first preferred embodiment member and assembling mode are roughly the same; Difference is in this second preferred embodiment; This heat radiation copper seat 2 also comprises two to wire hole 242 that should circuit board 1 weld part 12, and said wire hole 242 is communicated with these heat radiation copper seat 2 outer peripheral edges.
What deserves to be mentioned is; Said wire hole 242 can not be communicated with these heat radiation copper seat 2 outer peripheral edges yet; Be the pattern of wearing perforation; 1 correspondence of this circuit board comprises a plurality of weld parts 12, only intercommunicating pore with wear perforation these be changed to be familiar with this skill the personage according to bright content of preceding exposure and graphic spreading to, so description of drawings no longer.
Consult Fig. 7, be the assembling sketch map of this second preferred embodiment and a lampshade 7 and a heat radiation rack 8.
In sum, the advantage of this preferred embodiment is:
One, because these heat radiation copper seat 2 first heat radiation end faces 22 highly is not less than this circuit board 1; Use predetermined pressure to exert pressure to make eutectic layer 32 thin thickness of said light-emitting diode 3 and this heat radiation copper seat 2 and even in when welding; These eutectic layer 32 preferable thickness are less than 0.03mm, to strengthen the radiating effect of this light emitting diode module.
Two, the weld part 12 through this circuit board 1 does not contact this heat radiation copper seat 2; Therefore; When welding electric wire 5, not influenced by this heat radiation copper seat 2, just this heat radiation copper seat 2 is not positioned at the below of power supply electric wire 5 welds, and scolding tin can not make welding quality descend because heat radiation is too fast; This characteristic helps a large amount of production light emitting diode module, so can reach the object of the invention really.
Claims (13)
1. light emitting diode module; Comprise: a heat radiation copper seat, a circuit board; And a plurality of light-emitting diodes, it is characterized in that: this heat radiation copper seat comprises one first radiating area, and one second radiating area; This first radiating area has the high platform of a plurality of heat radiations and a plurality of first heat radiation end face that is formed at the high platform of said heat radiation respectively; This second radiating area have one be lower than the said first heat radiation end face the second heat radiation end face, this circuit board comprises the radiating part of corresponding this heat radiation copper seat second radiating area of contact, the conduit that the high platform of the said heat radiation of a plurality of correspondence is opened in this radiating part, reaches the weld part that at least one does not touch with this heat radiation copper seated connection; The high platform of said heat radiation lays respectively in the said conduit, and said light-emitting diode is positioned at the first heat radiation end face of this heat radiation copper seat.
2. light emitting diode module according to claim 1 is characterized in that: the welding position of this circuit board is in this heat radiation copper seat outside.
3. light emitting diode module according to claim 1 is characterized in that: this heat radiation copper seat also comprises two to wire hole that should the circuit board weld part.
4. light emitting diode module according to claim 3 is characterized in that: said wire hole is communicated with these heat radiation copper seat outer peripheral edges.
5. light emitting diode module according to claim 1 is characterized in that: also comprise the electric wire that most bars are welded in this circuit board weld part.
6. light emitting diode module according to claim 1 is characterized in that: said light-emitting diode comprises a base of processing for aluminium nitride respectively.
7. light emitting diode module according to claim 6 is characterized in that: also comprise the eutectic layer between the first heat radiation end face of base end face and this heat radiation copper seat that one deck is positioned at said light-emitting diode.
8. light emitting diode module according to claim 7 is characterized in that: this heat radiation copper seat first heat radiation end face adds that the height of this eutectic layer is higher than this circuit board, and difference in height is less than 0.03mm.
9. light emitting diode module according to claim 1 is characterized in that: this heat radiation copper seat and this circuit board use the solid welding of high-melting-point scolding tin, and said light-emitting diode and this heat radiation copper seat and circuit board use the solid welding of low melting point scolding tin.
10. light emitting diode module according to claim 1 is characterized in that: also comprise a control unit that is installed on this heat radiation copper seat, this control unit comprises a thermistor.
11. light emitting diode module according to claim 7 is characterized in that: the first heat radiation apical side height of this heat radiation copper seat is not less than this circuit board, and the thickness of this eutectic layer is less than 0.03mm.
12. light emitting diode module according to claim 6 is characterized in that: said eutectic layer is to be processed by the gold-tin alloy layer of light-emitting diode base end face and this heat radiation copper seat first heat radiation end face.
13. light emitting diode module according to claim 7 is characterized in that: coating scolding tin is filled up air gap between said light-emitting diode base end face and this heat radiation copper seat first heat radiation end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101487783A CN102810534A (en) | 2011-06-03 | 2011-06-03 | LED (light emitting diode) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101487783A CN102810534A (en) | 2011-06-03 | 2011-06-03 | LED (light emitting diode) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102810534A true CN102810534A (en) | 2012-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101487783A Pending CN102810534A (en) | 2011-06-03 | 2011-06-03 | LED (light emitting diode) module |
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| CN (1) | CN102810534A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104953007A (en) * | 2014-03-26 | 2015-09-30 | 贺喜能源股份有限公司 | Light-emitting diode with silicon base and light-emitting diode lamp |
| CN110429079A (en) * | 2019-08-05 | 2019-11-08 | 东莞市良友五金制品有限公司 | A kind of double array packaged light source structure and packaging method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200620720A (en) * | 2006-03-01 | 2006-06-16 | Mutual Tek Ind Co Ltd | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
| CN201170534Y (en) * | 2008-03-06 | 2008-12-24 | 李西林 | High-power LED heat radiator |
| CN201636635U (en) * | 2010-04-27 | 2010-11-17 | 林万炯 | Large-power LED lamp |
| CN201796948U (en) * | 2010-07-26 | 2011-04-13 | 张荣民 | High-power LED packaging base plate |
-
2011
- 2011-06-03 CN CN2011101487783A patent/CN102810534A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200620720A (en) * | 2006-03-01 | 2006-06-16 | Mutual Tek Ind Co Ltd | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
| CN201170534Y (en) * | 2008-03-06 | 2008-12-24 | 李西林 | High-power LED heat radiator |
| CN201636635U (en) * | 2010-04-27 | 2010-11-17 | 林万炯 | Large-power LED lamp |
| CN201796948U (en) * | 2010-07-26 | 2011-04-13 | 张荣民 | High-power LED packaging base plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104953007A (en) * | 2014-03-26 | 2015-09-30 | 贺喜能源股份有限公司 | Light-emitting diode with silicon base and light-emitting diode lamp |
| CN110429079A (en) * | 2019-08-05 | 2019-11-08 | 东莞市良友五金制品有限公司 | A kind of double array packaged light source structure and packaging method |
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Application publication date: 20121205 |