CN102802394B - A kind of absorbing material - Google Patents
A kind of absorbing material Download PDFInfo
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- CN102802394B CN102802394B CN201210275134.5A CN201210275134A CN102802394B CN 102802394 B CN102802394 B CN 102802394B CN 201210275134 A CN201210275134 A CN 201210275134A CN 102802394 B CN102802394 B CN 102802394B
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Abstract
The present invention relates to a kind of absorbing material, including at least one sheet of material, each described sheet of material includes three laminar substrates, described substrate is from top to bottom respectively first substrate, second substrate and the 3rd substrate, every laminar substrate includes at least one base board unit, the upper surface of each base board unit is attached with metal micro structure, at least one hollow annular structure identical sized by the metal micro structure of the upper surface attachment of the base board unit of described first substrate, two helical structures of formation are curled up respectively inwards at the two ends that metal micro structure is open annular structure and split ring of the upper surface attachment of the base board unit of described second substrate, described helical structure mutually disjoints, described 3rd substrate base board unit upper surface attachment metal micro structure and described second substrate base board unit on the metal micro structure of attachment complementary.The absorbing material with said structure has preferable absorbing property.
Description
Technical field
The present invention relates to a kind of Novel manual electromagnetic material, more particularly, it relates to a kind of absorbing material with preferable absorbing property.
Background technology
Along with the development of modern science and technology, the impact of environment is increased by electromagenetic wave radiation day by day.On airport, airplane flight is overdue because Electromagnetic Interference cannot be taken off；In hospital, mobile phone often can disturb the normal work of various electronic instrument for diagnosing and curing diseases device.Therefore, administer electromagnetic pollution, find a kind of material absorbing material that can keep out and weaken electromagenetic wave radiation, it has also become the big problem of the one of material science.
Absorbing material refers to effectively be absorbed into a class material of the electromagnetic wave energy being mapped to its surface, and incident electromagnetic wave is changed into heat energy or other form of energy by the various different loss mechanisms of material and reaches to inhale the purpose of ripple by it.Absorbing material has structural type and application type, and the former is mainly wedge shape, foam shape, plate shaped etc., and the latter is composited by binding agent, absorbent.
Artificial electromagnetic material, is a kind of novel artificial synthetic material that electromagnetic wave can produce response, is made up of substrate and the man-made microstructure being attached on substrate.The structure with certain geometrical pattern being typically arranged into by conductive material due to man-made microstructure, therefore, it is possible to electromagnetic wave is produced response, so that Meta Materials entirety to embody the electromagnetic property being different from substrate, such as DIELECTRIC CONSTANT ε different with magnetic permeability μ, according to refractive index formulaUnderstanding, refractive index n is the most different.Artificial electromagnetic material becomes the new direction of absorbing material research.By designing special man-made microstructure, can obtain can the material of broadband absorbing, and change the size and dimension of man-made microstructure, just can change its suction ripple frequency range.
Summary of the invention
The technical problem to be solved in the present invention is, a kind of absorbing material of design, this absorbing material is the artificial electromagnetic material with preferable absorbing property.
The technical solution adopted for the present invention to solve the technical problems is: a kind of absorbing material of structure, including at least one sheet of material, each described sheet of material includes three laminar substrates, described substrate is from top to bottom respectively first substrate, second substrate and the 3rd substrate, every laminar substrate includes that at least one base board unit, the upper surface of each base board unit are attached with metal micro structure；At least one hollow annular structure identical sized by the metal micro structure of the upper surface attachment of the base board unit of described first substrate；Curling up two helical structures of formation respectively inwards at the two ends that metal micro structure is open annular structure and split ring of the upper surface attachment of the base board unit of described second substrate, described helical structure mutually disjoints；Complementary (i.e. the place of the upper surface adhesion metal micro structure of second substrate non-cohesive metal micro structure, upper surface of second substrate on the position that the upper surface of the 3rd substrate is corresponding does not has the place of adhesion metal micro structure to enclose metal micro structure in the place that the upper surface of the 3rd substrate is corresponding) with the metal micro structure of attachment on the base board unit of described second substrate at the metal micro structure of the upper surface attachment of the base board unit of described 3rd substrate.
In a preferred embodiment of the invention, the upper surface of the base board unit of described first substrate is attached with multiple hollow annular structure, and multiple hollow annular structure is distributed relative to the central point of described base board unit.
In a preferred embodiment of the invention, five hollow annular structure it are attached with on the upper surface of the base board unit of described first substrate, the center of one of them hollow annular structure and the center superposition of base board unit, remaining four hollow annular structure is evenly distributed on the surrounding of the hollow annular structure being positioned at center.
In a preferred embodiment of the invention, described hollow annular structure is circular rings.
In a preferred embodiment of the invention, described hollow annular structure is polygon ring.
In a preferred embodiment of the invention, the opening direction of the split ring of the metal micro structure on the adjacent base board unit of described second substrate is mutually perpendicular to.
In a preferred embodiment of the invention, described split ring is rectangular aperture ring, the helical structure that the inward at both ends helically wound of described split ring becomes bending angle to be right angle.
In a preferred embodiment of the invention, described split ring is circular open ring, and the inward at both ends of described split ring curls up rounded helical structure；Or described split ring is elliptical openings ring, the inward at both ends of described split ring curls up ovalize helical structure.
In a preferred embodiment of the invention, described man-made microstructure is made of an electrically conducting material；Described substrate is ceramic material, FR-4 (glass-epoxy), F4B(polytetrafluoroethylglass glass cloth), polymer matrix composites, ferroelectric material, ferrite material, ferromagnetic material or epoxy glass cloth laminated board.
In a preferred embodiment of the invention, described man-made microstructure is by silver, copper, ITO(IndiumTinOxide, indium tin oxide), graphite or CNT make；Described man-made microstructure is carved be attached on described substrate by being etched, electroplate, bore quarter, photoetching, electronics quarter or ion.
Implement the present invention, have the advantages that the absorbing material with said structure has preferable microwave absorbing property.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the front view of the absorbing material in embodiment；
Fig. 2 is the schematic diagram of the upper surface attachment man-made microstructure of first substrate in Fig. 1；
Fig. 3 is the schematic diagram of the upper surface attachment man-made microstructure of second substrate in Fig. 1；
Fig. 4 is the schematic diagram of the upper surface attachment man-made microstructure of the 3rd substrate in Fig. 1；
Fig. 5 is its S of the absorbing material in Fig. 111Characteristic Simulation schematic diagram.
Detailed description of the invention
The present embodiment provides a kind of absorbing material, as shown in Figure 1, including an artificial electromagnetic material lamella, multiple artificial electromagnetic material lamella can certainly be included, when having multiple artificial electromagnetic material lamella, the modes such as both bondings can be assembled integrally by the material being mechanically connected, welding or filling can connect the two between adjacent artificial electromagnetic material lamella by adjacent artificial electromagnetic material lamella along the direction being perpendicular to its upper and lower surface.Artificial electromagnetic material lamella shown in Fig. 1 includes three laminar substrates, three laminar substrates are respectively first substrate 1, second substrate 2 and the 3rd substrate 3 from top to bottom, it is attached with man-made microstructure on every laminar substrate, adjacent substrate is integrated by adhesive bond, naturally it is also possible to be assembled integrally by modes such as mechanical connection or welding.Every laminar substrate is virtually divided at least one base board unit, and the upper surface of each base board unit is attached with metal micro structure.The sheet metal 7 of the 3rd substrate 3 lower surface is equivalent to metal surface accompanying during the actual application of absorbing material, such as the airplane skin surface of absorbing material attachment, tub surface etc.；If the apparatus surface of absorbing material application is non-metal shell surface certainly, then directly can adhere to layer of metal layer at absorbing material the 3rd substrate 3 lower surface.
As shown in Figure 2, first substrate 1 is virtually divided into four base board units, the upper surface of each base board unit adheres to five identical hollow circular beckets 4 of size, certainly the quantity of becket is not limited to five, can also be other different quantity, cavity ring is not limited to hollow circular rings simultaneously, it is also possible to for hollow polygon ring.Five hollow circular beckets in Fig. 2, the center of one of them hollow circular becket and the center superposition of base board unit, remaining four hollow circular beckets are evenly distributed on the surrounding of the hollow circular becket being positioned at center.
Including four base board units on second substrate 2 shown in Fig. 3, each base board unit adheres to a man-made microstructure 5, this micro structure is rectangular aperture ring, and the helical structure that the inward at both ends helically wound of rectangular aperture ring becomes bending angle to be right angle；The opening direction of the split ring of the micro structure on adjacent substrate unit is mutually perpendicular to；Certainly split ring can also be circular open ring, and the inward at both ends of split ring curls up rounded helical structure；Split ring can also be elliptical openings ring, and the inward at both ends of split ring curls up ovalize helical structure.
The shape of the metal micro structure 6 of attachment and the metal micro structure shape complementarity of attachment on second substrate 2 on the 3rd substrate 3 as shown in Figure 4, i.e. the place of the upper surface adhesion metal micro structure of second substrate 2 non-cohesive metal micro structure, upper surface of second substrate 2 on the position that the upper surface of the 3rd substrate 3 is corresponding does not has the place of adhesion metal micro structure to enclose metal micro structure in the place that the upper surface of the 3rd substrate 3 is corresponding
Metal micro structure is made up of copper cash, naturally it is also possible to for other conductive material such as silver, ITO, graphite or CNT etc..Man-made microstructure is led to overetched mode and is attached on the substrate of correspondence, naturally it is also possible to use plating, the modes such as quarters, photoetching, ion quarter of boring to be attached on corresponding substrate,
The material selection epoxy glass cloth laminated board of substrate, naturally it is also possible to for ceramic material, FR-4, F4B, polymer matrix composites, ferroelectric material, ferrite material or ferromagnetic material etc..
Fig. 5 is its S of absorbing material with said structure11Characteristic Simulation schematic diagram, as shown in Figure 5, in 5.7GHz ~ 15.1GHz frequency range, S11Less than-5dB；This absorbing material has preferable absorbing property in above-mentioned frequency range.
By changing the number of plies of substrate in medium substrate, the shape and size of man-made microstructure can adjust the suction ripple frequency range of absorbing material further so that it is meet the special frequency channel demand to microwave absorbing property.
Above in conjunction with accompanying drawing, embodiments of the invention are described; but the invention is not limited in above-mentioned detailed description of the invention; above-mentioned detailed description of the invention is only schematically; rather than it is restrictive; those of ordinary skill in the art is under the enlightenment of the present invention; it may also be made that many variations in the case of without departing from present inventive concept and scope of the claimed protection, the base board unit size of the most each substrate can be the same or different, within these belong to the protection of the present invention.
Claims (9)
1. an absorbing material, it is characterized in that: include at least one sheet of material, each described sheet of material includes three laminar substrates, described substrate is from top to bottom respectively first substrate, second substrate and the 3rd substrate, every laminar substrate includes at least one base board unit, the upper surface of each base board unit is attached with metal micro structure, also includes the sheet metal being positioned at the lower surface of described 3rd substrate；At least one hollow annular structure identical sized by the metal micro structure of the upper surface attachment of the base board unit of described first substrate；Curling up two helical structures of formation respectively inwards at the two ends that metal micro structure is open annular structure and split ring of the upper surface attachment of the base board unit of described second substrate, described helical structure mutually disjoints；Complementary with the metal micro structure of the upper surface attachment of the base board unit of described second substrate at the metal micro structure of the upper surface attachment of the base board unit of described 3rd substrate, the opening direction of the split ring of the metal micro structure on the adjacent base board unit of described second substrate is mutually perpendicular to；Described split ring is rectangular aperture ring, circular open ring or elliptical openings ring.
Absorbing material the most according to claim 1, it is characterised in that the upper surface of the base board unit of described first substrate is attached with multiple hollow annular structure, and multiple hollow annular structure is distributed relative to the central point of described base board unit.
Absorbing material the most according to claim 2, it is characterized in that, five hollow annular structure it are attached with on the upper surface of the base board unit of described first substrate, the center of one of them hollow annular structure and the center superposition of base board unit, remaining four hollow annular structure is evenly distributed on the surrounding of the hollow annular structure being positioned at center.
Absorbing material the most according to claim 2, it is characterised in that described hollow annular structure is circular rings.
Absorbing material the most according to claim 2, it is characterised in that described hollow annular structure is polygon ring.
Absorbing material the most according to claim 1, it is characterised in that when described split ring is rectangular aperture ring, the helical structure that the inward at both ends helically wound of described split ring becomes bending angle to be right angle.
Absorbing material the most according to claim 1, it is characterised in that when described split ring is circular open ring, the inward at both ends of described split ring curls up rounded helical structure；Or when described split ring is elliptical openings ring, the inward at both ends of described split ring curls up ovalize helical structure.
8. according to the arbitrary described absorbing material of claim 1 to 7, it is characterised in that described metal micro structure is made of an electrically conducting material；Described substrate is ceramic material, FR-4, F4B, polymer matrix composites, ferroelectric material, ferrite material, ferromagnetic material or epoxy glass cloth laminated board.
9. according to the arbitrary described absorbing material of claim 1 to 7, it is characterised in that described metal micro structure is made up of silver, copper, ITO, graphite or CNT；Described metal micro structure is carved be attached on described substrate by being etched, electroplate, bore quarter, photoetching, electronics quarter or ion.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210275134.5A CN102802394B (en) | 2012-08-03 | 2012-08-03 | A kind of absorbing material |
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| CN201210275134.5A CN102802394B (en) | 2012-08-03 | 2012-08-03 | A kind of absorbing material |
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| CN102802394A CN102802394A (en) | 2012-11-28 |
| CN102802394B true CN102802394B (en) | 2016-08-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106341974B (en) * | 2015-07-10 | 2019-10-15 | 深圳光启尖端技术有限责任公司 | A kind of absorbing meta-material and inhale wave apparatus |
| CN106332533B (en) * | 2015-07-10 | 2020-03-20 | 深圳光启尖端技术有限责任公司 | Wave-absorbing metamaterial |
| CN107057148A (en) * | 2017-01-24 | 2017-08-18 | 北京理工大学珠海学院 | A kind of preparation method of absorbing material |
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| CN102480004A (en) * | 2011-03-29 | 2012-05-30 | 深圳光启高等理工研究院 | Metamaterial with spatial clearance and preparation method of metamaterial |
| CN102480044A (en) * | 2011-08-31 | 2012-05-30 | 深圳光启高等理工研究院 | Base station antenna |
| CN102593595A (en) * | 2012-02-29 | 2012-07-18 | 深圳光启创新技术有限公司 | Negative magnetic permeability metamaterial |
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| JP2006049354A (en) * | 2004-07-30 | 2006-02-16 | Kumagai Gumi Co Ltd | Electromagnetic wave absorber and building interior construction method |
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| CN102480004A (en) * | 2011-03-29 | 2012-05-30 | 深圳光启高等理工研究院 | Metamaterial with spatial clearance and preparation method of metamaterial |
| CN102480044A (en) * | 2011-08-31 | 2012-05-30 | 深圳光启高等理工研究院 | Base station antenna |
| CN102593595A (en) * | 2012-02-29 | 2012-07-18 | 深圳光启创新技术有限公司 | Negative magnetic permeability metamaterial |
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Effective date of registration: 20210406 Address after: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 18B, building a, CIC international business center, 1061 Xiangmei Road, Futian District, Shenzhen, Guangdong 518034 Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |