CN102802394A - Wave-absorbing material - Google Patents
Wave-absorbing material Download PDFInfo
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- CN102802394A CN102802394A CN2012102751345A CN201210275134A CN102802394A CN 102802394 A CN102802394 A CN 102802394A CN 2012102751345 A CN2012102751345 A CN 2012102751345A CN 201210275134 A CN201210275134 A CN 201210275134A CN 102802394 A CN102802394 A CN 102802394A
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Abstract
The invention relates to a wave-absorbing material which comprises at least one material slice layer, each material slice layer comprises three layers of substrates; the substrates are a first substrate, a second substrate and a third substrate from top to bottom respectively; each substrate comprises at least one substrate unit; a metal microstructure is adhered to the upper surface of each substrate unit; the metal microstructure adhered to the upper surface of the substrate unit of the first substrate is at least one hollow annular structure of the same size; the metal microstructure adhered to the upper surface of the substrate unit of the second substrate is an opened annular structure, and two ends of an opening ring respectively rotate inwards so as to form two spiral structures; the spiral structures are not intersected mutually; and the metal microstructure adhered to the upper surface of the substrate unit of the third substrate and the metal microstructure adhered to the substrate unit of the second substrate are complementary mutually. The wave-absorbing material with the structure has a better wave-absorbing property.
Description
Technical field
The present invention relates to a kind of novel artificial electromagnetic material, more particularly, relate to a kind of absorbing material with better absorbing property.
Background technology
Along with development of modern science and technology, electromagenetic wave radiation increases the influence of environment day by day.On the airport, airplane flight can't take off overdue because of Electromagnetic Interference; In hospital, mobile phone regular meeting disturbs the operate as normal of various electronic instrument for diagnosing and curing diseases devices.Therefore, administer electromagnetic pollution, seek a kind of material---the absorbing material that can keep out and weaken electromagenetic wave radiation, become a big problem of material science.
Absorbing material is meant and can effectively be absorbed into the one type of material of electromagnetic wave energy that is mapped to its surface, and incident electromagnetic wave is changed into heat energy to its various loss mechanism through material or other form of energy reaches the purpose of inhaling ripple.Absorbing material has structural type and application type, and the former mainly is wedge shape, foam shape, plate shaped etc., and the latter is composited by binding agent, absorbent.
Artificial electromagnetic material is a kind of can the novel artificial synthetic material of electromagnetic wave generation response the composition by substrate with attached to the artificial micro-structural on the substrate.Because the structure that artificial micro-structural normally is arranged into by electric conducting material with certain geometrical pattern; Therefore can produce response to electromagnetic wave; Thereby make ultra material monolithic embody the electromagnetic property that is different from substrate; For example DIELECTRIC CONSTANTS is different with magnetic permeability μ;
can know according to the refractive index formula, and refractive index n is also different.Artificial electromagnetic material becomes the new direction of absorbing material research.Through designing special artificial micro-structural, can obtain and can inhale the material of ripple by wideband, and change the size and dimension of artificial micro-structural, just can change it and inhale the ripple frequency range.
Summary of the invention
The technical problem that the present invention will solve is, designs a kind of absorbing material, and this absorbing material is the artificial electromagnetic material with better absorbing property.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of absorbing material; Comprise at least one sheet of material; Each said sheet of material comprises three laminar substrates; Said substrate from top to bottom is respectively first substrate, second substrate and the 3rd substrate, and every laminar substrate comprises at least one base board unit, and the upper surface of each base board unit is attached with metal micro structure; The metal micro structure that adheres at the upper surface of the base board unit of said first substrate is at least one identical hollow loop configuration of size; The metal micro structure that adheres at the upper surface of the base board unit of said second substrate is that the two ends of open annular structure and split ring are inwardly curled up respectively and formed two helical structures, and said helical structure mutually disjoints; The metal micro structure complementary (promptly the upper surface of place non-cohesive metal micro structure, second substrate on the corresponding position of the upper surface of the 3rd substrate of the upper surface adhesion metal micro-structural of second substrate does not have the place of adhesion metal micro-structural to enclose metal micro structure in the corresponding place of the upper surface of the 3rd substrate) that on the base board unit of metal micro structure that the upper surface of the base board unit of said the 3rd substrate adheres to and said second substrate, adheres to.
In preferred implementation of the present invention, the upper surface of the base board unit of said first substrate is attached with a plurality of hollow loop configuration, and a plurality of hollow loop configuration is with respect to the central point distribution of said base board unit.
In preferred implementation of the present invention; Be attached with five hollow loop configuration on the upper surface of the base board unit of said first substrate; The center of one of them hollow loop configuration overlaps with the center of base board unit, all the other four hollow annular even structure be distributed in the hollow loop configuration that is positioned at the center around.
In preferred implementation of the present invention, said hollow loop configuration is a circular rings.
In preferred implementation of the present invention, said hollow loop configuration is the polygon ring.
In preferred implementation of the present invention, the opening direction of the split ring of the metal micro structure on the adjacent base board unit of said second substrate is vertical each other.
In preferred implementation of the present invention, said split ring is the rectangular aperture ring, and it is the helical structure at right angle that the inward at both ends helically wound of said split ring becomes bending angle.
In preferred implementation of the present invention, said split ring is the circular open ring, and the inward at both ends of said split ring is curled up rounded helical structure; Perhaps said split ring is the elliptical openings ring, and the inward at both ends of said split ring is curled up the ovalize helical structure.
In preferred implementation of the present invention, said artificial micro-structural is processed by electric conducting material; Said substrate is ceramic material, FR-4 (glass-epoxy), F4B (polytetrafluoroethylglass glass cloth), polymer matrix composites, ferroelectric material, ferrite material, ferromagnetic material or epoxy glass cloth laminated board.
In preferred implementation of the present invention, said artificial micro-structural is processed by silver, copper, ITO (Indium Tin Oxide, indium tin oxide), graphite or CNT; Said artificial micro-structural through etching, plating, brill quarter, photoetching, electronics is carved or ion is carved and is attached on the said substrate.
Embodiment of the present invention has following beneficial effect: the absorbing material with said structure has microwave absorbing property preferably.
Description of drawings
To combine accompanying drawing and embodiment that the present invention is described further below, in the accompanying drawing:
Fig. 1 is the front view of the absorbing material among the embodiment;
Fig. 2 is the sketch map that the upper surface of first substrate among Fig. 1 adheres to artificial micro-structural;
Fig. 3 is the sketch map that the upper surface of second substrate among Fig. 1 adheres to artificial micro-structural;
Fig. 4 is the sketch map that the upper surface of the 3rd substrate among Fig. 1 adheres to artificial micro-structural;
Fig. 5 is its S of absorbing material among Fig. 1
11The characteristic Simulation sketch map.
Embodiment
Present embodiment provides a kind of absorbing material; As shown in Figure 1; Comprise an artificial electromagnetic material lamella; Can certainly comprise a plurality of artificial electromagnetic material lamellas, when having a plurality of artificial electromagnetic material lamella, adjacent artificial electromagnetic material lamella is along can be through mechanical connection, welding perpendicular to the direction of its upper and lower surfaces or between adjacent artificial electromagnetic material lamella, fill the material that can connect the two both modes such as bonding are assembled into one.Artificial electromagnetic material lamella shown in Fig. 1 comprises three laminar substrates; Three laminar substrates are respectively first substrate 1, second substrate 2 and the 3rd substrate 3 from top to bottom; Be attached with artificial micro-structural on every laminar substrate; Adjacent substrate is an one through adhesive bond, can certainly be assembled into one through modes such as mechanical connection or welding.Every laminar substrate is divided at least one base board unit virtually, and the upper surface of each base board unit is attached with metal micro structure.The metal surface that sheet metal 7 equivalence of the 3rd substrate 3 lower surfaces is adhered to during for the absorbing material practical application, for example the airplane skin surface adhered to of absorbing material, tub surface etc.; If the apparatus surface of absorbing material application is the non-metal shell surface certainly, then can directly adheres to the layer of metal layer and get final product at absorbing material the 3rd substrate 3 lower surfaces.
As shown in Figure 2; First substrate 1 is divided into four base board units virtually; The upper surface of each base board unit adheres to five hollow circular beckets 4 that size is identical, and the quantity of becket is not limited to five certainly, also can be other different quantity; Cavity ring is not limited to hollow circular rings simultaneously, also can be hollow polygon ring.Five hollow circular beckets among Fig. 2, the center of one of them hollow circular becket overlaps with the center of base board unit, all the other four hollow circular beckets be evenly distributed on the hollow circular becket that is positioned at the center around.
Comprise four base board units on second substrate 2 shown in Figure 3, adhere to an artificial micro-structural 5 on each base board unit, this micro-structural is the rectangular aperture ring, and the inward at both ends helically wound of rectangular aperture ring to become bending angle be the helical structure at right angle; The opening direction of the split ring of the micro-structural on the adjacent substrate unit is vertical each other; Certainly split ring also can be the circular open ring, and the inward at both ends of split ring is curled up rounded helical structure; Split ring also can be the elliptical openings ring, and the inward at both ends of split ring is curled up the ovalize helical structure.
The metal micro structure shape complementarity that adheres on the shape of the metal micro structure 6 that adheres on the 3rd substrate 3 as shown in Figure 4 and second substrate 2, promptly the upper surface of the place of the upper surface adhesion metal micro-structural of second substrate 2 non-cohesive metal micro structure, second substrate 2 on the corresponding position of the upper surface of the 3rd substrate 3 does not have the place of adhesion metal micro-structural to enclose metal micro structure in the corresponding place of the upper surface of the 3rd substrate 3
Metal micro structure is processed by copper cash, can certainly for other electric conducting material such as silver, ITO, graphite or CNT etc.Artificial micro-structural is through on the substrate of etched mode attached to correspondence, and can certainly adopt plating, bore quarter, on the substrate of mode attached to correspondence such as photoetching, ion quarter,
The material of substrate is selected epoxy glass cloth laminated board for use, can certainly be ceramic material, FR-4, F4B, polymer matrix composites, ferroelectric material, ferrite material or ferromagnetic material etc.
Fig. 5 is its S of absorbing material with said structure
11The characteristic Simulation sketch map can be known by Fig. 5, in 5.7GHz ~ 15.1GHz frequency range, and S
11Less than-5dB; This absorbing material has absorbing property preferably in above-mentioned frequency range.
Can further adjust the suction ripple frequency range of absorbing material through the number of plies that changes substrate in the medium substrate, the shape and size of artificial micro-structural, make it satisfy the demand of special frequency microwave absorbing property.
Combine accompanying drawing that embodiments of the invention are described above; But the present invention is not limited to above-mentioned embodiment, and above-mentioned embodiment only is schematically, rather than restrictive; Those of ordinary skill in the art is under enlightenment of the present invention; Also can make a lot of distortion not breaking away under the scope situation that aim of the present invention and claim protect, can be the same or different such as the base board unit size of each substrate, these all belong within the protection of the present invention.
Claims (10)
1. absorbing material; It is characterized in that: comprise at least one sheet of material; Each said sheet of material comprises three laminar substrates; Said substrate from top to bottom is respectively first substrate, second substrate and the 3rd substrate, and every laminar substrate comprises at least one base board unit, and the upper surface of each base board unit is attached with metal micro structure; The metal micro structure that adheres at the upper surface of the base board unit of said first substrate is at least one identical hollow loop configuration of size; The metal micro structure that adheres at the upper surface of the base board unit of said second substrate is that the two ends of open annular structure and split ring are inwardly curled up respectively and formed two helical structures, and said helical structure mutually disjoints; The metal micro structure that the upper surface of the metal micro structure that adheres at the upper surface of the base board unit of said the 3rd substrate and the base board unit of said second substrate adheres to is complementary.
2. absorbing material according to claim 1 is characterized in that, the upper surface of the base board unit of said first substrate is attached with a plurality of hollow loop configuration, and a plurality of hollow loop configuration is with respect to the central point distribution of said base board unit.
3. absorbing material according to claim 2; It is characterized in that; Be attached with five hollow loop configuration on the upper surface of the base board unit of said first substrate; The center of one of them hollow loop configuration overlaps with the center of base board unit, all the other four hollow annular even structure be distributed in the hollow loop configuration that is positioned at the center around.
4. absorbing material according to claim 2 is characterized in that, said hollow loop configuration is a circular rings.
5. absorbing material according to claim 2 is characterized in that, said hollow loop configuration is the polygon ring.
6. absorbing material according to claim 1 is characterized in that, the opening direction of the split ring of the metal micro structure on the adjacent base board unit of said second substrate is vertical each other.
7. absorbing material according to claim 6 is characterized in that, said split ring is the rectangular aperture ring, and it is the helical structure at right angle that the inward at both ends helically wound of said split ring becomes bending angle.
8. absorbing material according to claim 6 is characterized in that, said split ring is the circular open ring, and the inward at both ends of said split ring is curled up rounded helical structure; Perhaps said split ring is the elliptical openings ring, and the inward at both ends of said split ring is curled up the ovalize helical structure.
9. according to the arbitrary described absorbing material of claim 1 to 8, it is characterized in that said artificial micro-structural is processed by electric conducting material; Said substrate is ceramic material, FR-4, F4B, polymer matrix composites, ferroelectric material, ferrite material, ferromagnetic material or epoxy glass cloth laminated board.
10. according to the arbitrary described absorbing material of claim 1 to 8, it is characterized in that said artificial micro-structural is processed by silver, copper, ITO, graphite or CNT; Said artificial micro-structural through etching, plating, brill quarter, photoetching, electronics is carved or ion is carved and is attached on the said substrate.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106332533A (en) * | 2015-07-10 | 2017-01-11 | 深圳光启尖端技术有限责任公司 | Wave-absorbing metamaterial |
CN106341974A (en) * | 2015-07-10 | 2017-01-18 | 深圳光启尖端技术有限责任公司 | Wave-absorbing metamaterial and wave-absorbing device |
CN107057148A (en) * | 2017-01-24 | 2017-08-18 | 北京理工大学珠海学院 | A kind of preparation method of absorbing material |
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JP2006049354A (en) * | 2004-07-30 | 2006-02-16 | Kumagai Gumi Co Ltd | Electromagnetic wave absorber and building interior construction method |
CN102480044A (en) * | 2011-08-31 | 2012-05-30 | 深圳光启高等理工研究院 | Base station antenna |
CN102480004A (en) * | 2011-03-29 | 2012-05-30 | 深圳光启高等理工研究院 | Metamaterial with spatial clearance and preparation method of metamaterial |
CN102593595A (en) * | 2012-02-29 | 2012-07-18 | 深圳光启创新技术有限公司 | Negative magnetic permeability metamaterial |
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2012
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Patent Citations (4)
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JP2006049354A (en) * | 2004-07-30 | 2006-02-16 | Kumagai Gumi Co Ltd | Electromagnetic wave absorber and building interior construction method |
CN102480004A (en) * | 2011-03-29 | 2012-05-30 | 深圳光启高等理工研究院 | Metamaterial with spatial clearance and preparation method of metamaterial |
CN102480044A (en) * | 2011-08-31 | 2012-05-30 | 深圳光启高等理工研究院 | Base station antenna |
CN102593595A (en) * | 2012-02-29 | 2012-07-18 | 深圳光启创新技术有限公司 | Negative magnetic permeability metamaterial |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106332533A (en) * | 2015-07-10 | 2017-01-11 | 深圳光启尖端技术有限责任公司 | Wave-absorbing metamaterial |
CN106341974A (en) * | 2015-07-10 | 2017-01-18 | 深圳光启尖端技术有限责任公司 | Wave-absorbing metamaterial and wave-absorbing device |
CN106341974B (en) * | 2015-07-10 | 2019-10-15 | 深圳光启尖端技术有限责任公司 | A kind of absorbing meta-material and inhale wave apparatus |
CN106332533B (en) * | 2015-07-10 | 2020-03-20 | 深圳光启尖端技术有限责任公司 | Wave-absorbing metamaterial |
CN107057148A (en) * | 2017-01-24 | 2017-08-18 | 北京理工大学珠海学院 | A kind of preparation method of absorbing material |
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Effective date of registration: 20210406 Address after: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 18B, building a, CIC international business center, 1061 Xiangmei Road, Futian District, Shenzhen, Guangdong 518034 Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |
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