CN205488574U - Absorbent structure - Google Patents
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- CN205488574U CN205488574U CN201521139082.4U CN201521139082U CN205488574U CN 205488574 U CN205488574 U CN 205488574U CN 201521139082 U CN201521139082 U CN 201521139082U CN 205488574 U CN205488574 U CN 205488574U
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Abstract
The utility model discloses an absorbent structure. Absorbent structure includes: at least one laminated structure, laminated structure includes the base plate and is located the resistance layer on the base plate, the resistance layer includes a plurality of cross frame structure of mutual derangement, cross frame structure forms by two frame -shaped construction are crossing, and two frame -shaped construction's length is different. This absorbent structure can be as the electromagnetic absorbing material of specific frequency channel to show the polarization selection nature of TE ripples and TM ripples, the electromagnetic wave energy that is reflected when the TE ripples incides can 0.53dB with 5.08dB between, can the electromagnetic wave energy that is reflected when the TM ripples incides be less than 10GHz.
Description
Technical field
This utility model relates to electromagnetic wave absorbent material, relates more specifically to absorbent structure.
Background technology
Electromagnetic wave absorbent material (i.e. absorbing material) can absorb the electromagnetic wave of incidence, thus reduces
The reflection of electromagnetic wave and radiation.Absorbing material can reduce the electromagnetic wave leakage of electronic system, thus
May be used for reducing the interference between electronic system, improve Electro Magnetic Compatibility.
If additionally, using absorbing material as the eyelid covering of aircraft, then the thunder of aircraft can be reduced
Reach scattering resonance state (RCS, i.e. Radar Cross Section).Such as, the wing of aircraft is machine
The important sources of body RCS.Use the RCS that can be substantially reduced body that absorbing material covers, from
And reduce the radar detectivity of aircraft, it is achieved stealth effect.
According to different purposes, absorbing material does not require nothing more than good absorbing property, and counterweight
Other performances such as amount, thickness and bandwidth also require.Single absorbing material is difficult to disclosure satisfy that band
Composite request in terms of width and mechanical strength.Absorbent structure is to obtain lightweight broad-band band absorbing material
Important means.
But, along with technology develops, more and more higher to the performance requirement of absorbing material.Expect into one
The absorbent structure of step exploitation has the absorbing property of improvement and TE ripple and TM wave table is revealed pole
Change selectivity.
Utility model content
In view of the above problems, problem to be solved in the utility model is to provide a kind of by resistive layer
Design improves the wave filter of absorbing property.
For reaching above-mentioned purpose, it is provided that a kind of absorbent structure, it is characterised in that including: at least
Individual laminated construction, described laminated construction includes substrate and the resistive layer being positioned on substrate,
Wherein, described resistive layer includes multiple cross frame structures that mutual dislocation arranges, described ten
Word frame structure is formed by two strip cabinet frame structures are crossing, and the length of two strip cabinet frame structures is different.
Preferably, described cross frame structure plurality of rows, the described cross frame structure of adjacent lines
Stagger setting.
Preferably, the array that described resistive layer is made up of multiple construction units, each construction unit bag
Including the first conductive structure and the second conductive structure, described first conductive structure includes being formed by bus
Rectangle frame, four limits of described rectangle frame are respectively provided with breach, and the both sides of breach are provided with to extension
The conductive line stretched, described second conductive structure includes the cross framework knot being positioned at described rectangle frame
Structure；The first direction of described construction unit is the length direction of described rectangle frame, and second direction is institute
State the width of rectangle frame, in the first direction and a second direction, construction unit described in adjacent two
Described conductive line be connected to each other formed described mutual dislocation arrangement multiple cross frame structures.
Preferably, the gap width being positioned on the long limit of described rectangle frame be positioned at described rectangle frame minor face
On gap width different.
Preferably, the conductive line length being positioned on the long limit of described rectangle frame be positioned at described rectangle frame
Conductive line length on minor face is different.
Preferably, described cross frame structure includes the first frame-shaped construction and being arranged in a mutually vertical manner
Two frame-shaped constructions, described first frame-shaped construction extends along described first direction, described second shaped as frame knot
Structure extends along described second direction, and the length of described first frame-shaped construction is more than described second shaped as frame knot
The length of structure.
Preferably, the width of described first frame-shaped construction is more than the width of described second frame-shaped construction.
Preferably, described first frame-shaped construction, described second frame-shaped construction, described rectangle frame and
The live width of described conductive line is identical.
Preferably, described cross frame structure is placed in the middle in described construction unit.
Preferably, described resistive layer is clipped between two substrates.
Preferably, described substrate is medium substrate.
Preferably, described absorbent structure includes multiple laminated construction, in the plurality of laminated construction
The structure of resistive layer is identical but resistivity different.
Preferably, described absorbent structure includes multiple laminated construction, in the plurality of laminated construction
The physical dimension of resistive layer is different to obtain different resistivity.
This utility model, by designing resistive layer on substrate, is rung by the electromagnetism of associated lamination structure
Answer feature to change microwave absorbing property, such that it is able to improve the absorbing property of absorbent structure.This suction ripple is tied
TE ripple and TM wave table are revealed different absorbent properties by structure, absorb TM ripple in a large number when low frequency
And weak absorbing TM ripple during high frequency, though simultaneously high frequency or low frequency time equal weak absorbing TE ripple, work as TE
The electromagnetic wave energy reflected during ripple incidence can be between-0.53dB and-5.08dB, when TM ripple enters
The electromagnetic wave energy reflected when penetrating can be less than-10GHz, thus obtains polarization selectivity.
Accompanying drawing explanation
By description to this utility model embodiment referring to the drawings, of the present utility model above-mentioned
And other objects, features and advantages will be apparent from, in the accompanying drawings:
Fig. 1 is shown as the perspective view of the absorbent structure of reference examples；
Fig. 2 illustrates the perspective view of the absorbent structure according to this utility model embodiment；
Fig. 3 is shown in the absorbent structure according to this utility model embodiment the construction unit of employing
Top view；
Fig. 4 illustrates the sectional view of the absorbent structure according to this utility model embodiment；
Fig. 5 illustrates the simulated properties curve of the S11 parameter of the absorbent structure according to reference examples；
Fig. 6 illustrates the simulated properties of the S11 parameter of the absorbent structure according to this utility model embodiment
Curve.
Detailed description of the invention
It is more fully described this utility model hereinafter with reference to accompanying drawing.In various figures, identical
Element uses similar reference to represent.For the sake of clarity, the various piece in accompanying drawing does not has
Have drawn to scale.Furthermore, it is possible to not shown part known to some.
Should be appreciated that when describing certain structure, when by one layer, a region is referred to as being positioned at another
When layer, another region " above " or " top ", can refer to be located immediately at another floor, another district
Above territory, or itself and another layer, also comprise other layer or region between another region.
Further, if this structure overturn, this floor, a region will be located in another floor, another district
Territory " below " or " lower section ".If be located immediately at above another layer, another region to describe
Situation, will use " A is directly on B " or the statement of " A and adjoins on B therewith " herein
Mode.
This utility model can present in a variety of manners, some of them example explained below.
Fig. 1 is shown as the perspective view of the absorbent structure of reference examples.Absorbent structure 100
Multiple layers including stacking.First resistive layer 115 is positioned on first substrate 112, forms first and folds
Rotating fields.Second resistive layer 125 is positioned on second substrate 122, forms the second laminated construction.This
Outward, the 3rd substrate 116 covers at the first resistive layer 115.
The battle array that first resistive layer 115 and the second resistive layer 125 are made up of multiple construction units respectively
Row.Each construction unit includes the first conductive pattern of being spaced apart and two the second conductive patterns,
First conductive pattern includes I-shaped structure and the first lines intersected with I-shaped structure, first
Lines are paralleled with the lines at I-shaped structure two ends, and the second conductive pattern includes rectangle frame, respectively
Being arranged at the two ends of I-shaped structure, rectangle frame is provided with opening, the two ends of I-shaped structure are divided
Not in opening penetrates rectangle frame.
Fig. 2 illustrates the perspective view of the absorbent structure according to this utility model embodiment.Figure
4 sectional views illustrating the absorbent structure according to this utility model embodiment.This absorbent structure 200 wraps
Including multiple laminated construction of stacking, laminated construction includes substrate and the resistive layer being positioned on substrate, its
In, the first resistive layer 215 in resistive layer is positioned on first substrate 112, forms the first lamination knot
Structure.The second resistive layer 225 in resistive layer is positioned on second substrate 122, forms the second lamination knot
Structure.The 3rd resistive layer 235 in resistive layer is positioned on the 3rd substrate 132.Additionally, tetrabasal
116 cover at the first resistive layer 215.
In order to illustrate the first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235, by
Tetrabasal 116 separates and illustrates, the arrow instruction in figure separates the movement of relevant layers from absorbent structure
Direction.
First resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235 include mutually respectively
Multiple cross frame structures of Heterogeneous Permutation, cross frame structure is formed by two strip cabinet frame structures are crossing,
Two strip cabinet frame structures are respectively the first frame-shaped construction and the second frame-shaped construction, the length of two strip cabinet frame structures
Degree difference.Further first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235
Cross frame structure is plurality of rows, and the cross frame structure of adjacent lines staggers setting.
Describe concrete structure for convenience, multiple cross frame structures that mutual dislocation arranges are divided into
Multiple construction units, the first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235 points
It not to be formed by multiple construction unit 2150 arrays.Fig. 3 is shown according to this utility model embodiment
Absorbent structure in the top view of construction unit that uses.
Each construction unit 2150 includes the first conductive structure and the second conductive structure, the first conduction knot
Structure includes the rectangle frame 2153 formed by bus, and four limits of rectangle frame 2153 are respectively provided with breach 2154,
The both sides of breach 2154 are provided with outward extending conductive line 2155.Wherein, it is positioned at rectangle
Breach 2154 width on the long limit of frame 2153 and the breach 2154 being positioned on rectangle frame 2153 minor face
Width can be identical, it is also possible to different, it is preferred that to be positioned at the breach on the long limit of rectangle frame 2153
2154 width are less than breach 2154 width being positioned on rectangle frame 2153 minor face.It is positioned at rectangle frame
The length of the conductive line 2155 on 2153 long limits and the conductor wire being positioned on rectangle frame 2153 minor face
Bar 2155 length can be the same or different, it is preferred that is positioned on the long limit of rectangle frame 2153
The length of conductive line 2155 is more than conductive line 2155 length being positioned on rectangle frame 2153 minor face.
Second conductive structure includes the cross frame structure formed by bus being positioned at rectangle frame 2153
2151.Preferably, four ends of cross frame structure 2151 respectively with the four of rectangle frame 2153
Individual breach 2154 is correspondingly arranged.
The first direction of construction unit is the length direction of rectangle frame 2153, and second direction is rectangle frame
The width of 2153, in the first direction and a second direction, the conductor wire of adjacent construction unit
Bar 2155 is connected to each other, thus forms multiple cross frame structures of above-mentioned mutual dislocation arrangement.
Cross frame structure 2151 includes the first frame-shaped construction and the second frame-shaped construction being arranged in a mutually vertical manner,
First frame-shaped construction extends in a first direction, and the second frame-shaped construction extends in a second direction.Cross frame
Body structure 2151 pattern axisymmetricly.Preferably, in the first direction and a second direction, cross frame
Body structure 2151 is placed in the middle in construction unit.
In examples as shown in figure 3, the length of the first frame-shaped construction is more than the length of the second frame-shaped construction
Degree, the width of the first frame-shaped construction more than the width of the second frame-shaped construction, and the first frame-shaped construction,
The live width of the second frame-shaped construction, rectangle frame 2153 and conductive line 2155 is identical.But, should
Size relationship is not necessary, can be appropriately modified according to simulation result.
The lengths table of this construction unit 2150 is shown as L1, and width means is W1.Cross framework is tied
The lengths table of the first frame-shaped construction in structure 2151 is shown as L2, and width means is W2, the second frame
The lengths table of shape structure is shown as L3, and width means is W3, and live width is expressed as w1.Rectangle frame 2153
Lengths table be shown as L4, width means is L4, is positioned at the breach 2154 on the long limit of rectangle frame 2153
Width is w2, and breach 2154 width being positioned on rectangle frame 2153 minor face is w3.
First resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235 can be by arbitrarily
Conductive material forms.Here conductive material, can be that the electric conductivity such as gold, silver, copper is good
Metal material, or one or both the alloy material being mainly composed of in gold, silver, copper, also
Can be the electrically conductive nonmetallic materials such as CNT, Al-Doped ZnO, indium tin oxide.
In this utility model, the first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235
The preferred copper of material or silver.First resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235
It can be arbitrary substance form.Here physical form, can be selected from solid, liquid, stream shape
One in body and powder, as long as it can maintain specific shape.Leading of such as liquid
Electric material can be contained among cavity, pipeline, capsule and limit its shape.
First substrate 112, second substrate the 122, the 3rd substrate 132 and tetrabasal 116 can divide
Wei medium substrate.The material of medium substrate has multiple choices, and such as pottery, FR4, F4B are (poly-
Tetrafluoroethene), HDPE (high density polyethylene (HDPE), High Density Polyethylene), ABS
(Acrylonitrile Butadiene Styrene) etc..Such as, the relative dielectric constant of medium substrate
More than 2, loss angle tangent is less than 0.1.First resistive layer the 215, second resistive layer 225 and the 3rd
Resistive layer 235 can be attached on medium substrate by modes such as printing, plating, bonding, hot pressing.
First resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235 are respectively provided with difference
Resistivity.In an example, the first resistive layer the 215, second resistive layer 225 and the 3rd electricity
Resistance layer 235 includes same configuration and equivalently-sized construction unit respectively, but due to the conduction used
Material is different, it is possible to obtain different resistivity.Use electrically conductive ink formed the first resistive layer 215,
During the construction unit of the second resistive layer 225 and the 3rd resistive layer 235, can be by changing conductive oil
The resistivity of ink obtains different resistivity.In another example, the first resistive layer 215,
Second resistive layer 225 includes same configuration respectively with the 3rd resistive layer 235 but the different structure of size
Unit, even if the conductive material used is identical, it is also possible to obtain different resistivity.
In an example, the first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235
It it is the patterned metal layer on medium substrate.First resistive layer the 215, second resistive layer 225 and
Three resistive layers 235 are by etch, electroplate, bore the multiple sides such as quarter, photoetching, electronics quarter or ion quarter
Method is attached on medium substrate.Wherein, etching is preferably manufacturing process, and its step is in design
After the plane pattern of good suitable man-made microstructure, first integrally it is attached to a tinsel be situated between
On matter substrate, then by etching machines, solvent is utilized to get rid of artificial with the chemical reaction of metal
Foil parts beyond micro structure predetermined pattern, remaining i.e. can get man-made microstructure.At another
In individual example, first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235 can be by
Electrically conductive ink printing is formed on medium substrate.
Fig. 5 illustrates the simulated properties curve of the S11 parameter of the absorbent structure according to reference examples.This suction
Construction unit in wave structure is as shown in Figure 1.
Can be absorbed at 3.52 to 13.29GHz from figure 5 it can be seen that TE involves TM ripple
And the energy absorbed differs.Under same frequency range, TE incidence wave and TM incidence wave version are inhaled
The energy received differs, and this is to absorb TM ripple in a large number and absorb the bandwidth thunder of TE ripple on a small quantity
Reach suction ripple material
Fig. 6 illustrates the simulated properties of the S11 parameter of the absorbent structure according to this utility model embodiment
Curve.
Construction unit in this absorbent structure as it is shown on figure 3, its structure as shown in Figure 4, including
One, the second laminated construction and third layer stack structure.
In simulations, it is assumed that the first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235
The structure of construction unit identical.Different materials is used to form first resistive layer the 215, second electricity
Resistance layer 225 and the 3rd resistive layer 235 so that the resistivity of the first resistive layer 215 is 20 Ω/Sq,
The resistivity of the second resistive layer 225 is 80 Ω/Sq, and the resistivity of the 3rd resistive layer 235 is 600 Ω/Sq.
In first resistive layer the 215, second resistive layer 225 and the 3rd resistive layer 235, Mei Gejie
Length L1 of structure unit 2150 and width W1 are respectively 15 millimeters and 9 millimeters, and thickness is 0.02
Millimeter.Length L2 of the first frame-shaped construction in cross frame structure 2151 is 12.5 millimeters, wide
Degree W2 is 2 millimeters, and length L3 of the second frame-shaped construction is 3 millimeters, and width W3 is 1.5 millis
Rice, live width w1 is 0.5 millimeter.Length L4 and the width W4 of rectangle frame 2153 are respectively 14.5
Millimeter and 8 millimeters, the breach 2154 width w2 being positioned on the long limit of rectangle frame 2153 is 2.5 millimeters,
The breach 2154 width w3 being positioned on rectangle frame 2153 minor face is 6 millimeters.
First substrate 112, second substrate the 122, the 3rd substrate 132 and the material of tetrabasal 116
Identical, it is FR4 substrate, relative dielectric constant 3.0, the thickness of tetrabasal 116 is 0.4
Millimeter, remaining substrate thickness is 3.2 millimeters.
Additionally, in order to test reflection of electromagnetic wave characteristic, the 3rd substrate 132 with the 3rd resistive layer
The 235 relative layers of copper that a surface configuration thickness is 0.018 millimeter.
The result carrying out emulating for the absorbent structure of above-mentioned parameter shows, by a small quantity during TE ripple incidence
Absorb and absorbed in a large number during TM ripple incidence.Figure 6 illustrates TE ripple and the S11 of TM ripple
Simulation curve, in simulations, the incident angle of TE ripple and TM ripple is zero, i.e. front is incident.
It will be seen that the S11 of TE ripple is at-0.53dB and-5.08dB at 3.05 to 22.48GHz wave band
Between, the S11 of TM ripple is below-10dB at 3.05 to 22.48GHz wave band.It is to say,
Under same frequency range, the energy that TE incidence wave and TM incidence wave version absorb differs,
This is to absorb TM ripple in a large number and absorb the bandwidth radar-wave absorbing material of TE ripple on a small quantity.With reference examples
Comparing, the absorption region of the present embodiment is bigger.
In the above description, known structural element and step are not described in detail.
It should be appreciated to those skilled in the art that can realize corresponding by various technological means
Structural element and step.It addition, in order to form identical structural element, those skilled in the art are also
Can be designed that method the most identical with process as described above.Although it addition, more than
Respectively describe each embodiment, but it is not intended that the measure in each embodiment can not be favourable
Be used in combination.
Above embodiment of the present utility model is described.But, these embodiments are only
For illustrative purposes, it is not intended to limit scope of the present utility model.Model of the present utility model
Enclose and limited by claims and equivalent thereof.Without departing from scope of the present utility model, this area
Technical staff can make multiple replacement and amendment, and these substitute and amendment all should fall new in this practicality
Within the scope of type.
Claims (12)
1. an absorbent structure, it is characterised in that including:
At least one laminated construction, described laminated construction includes substrate and the resistive layer being positioned on substrate,
Wherein, described resistive layer includes multiple cross frame structures that mutual dislocation arranges, and described cross frame structure is formed by two strip cabinet frame structures are crossing, and the length of two strip cabinet frame structures is different.
Absorbent structure the most according to claim 1, it is characterised in that: described cross frame structure plurality of rows, the described cross frame structure of adjacent lines staggers setting.
Absorbent structure the most according to claim 1 and 2, it is characterized in that: the array that described resistive layer is made up of multiple construction units, each construction unit includes the first conductive structure and the second conductive structure, described first conductive structure includes the rectangle frame formed by bus, four limits of described rectangle frame are respectively provided with breach, the both sides of breach are provided with outward extending conductive line, and described second conductive structure includes the cross frame structure being positioned at described rectangle frame；
The first direction of described construction unit is the length direction of described rectangle frame, second direction is the width of described rectangle frame, in the first direction and a second direction, the described conductive line of construction unit described in adjacent two is connected to each other and forms multiple cross frame structures of described mutual dislocation arrangement.
Absorbent structure the most according to claim 3, it is characterised in that the gap width being positioned on the long limit of described rectangle frame is different from the gap width being positioned on described rectangle frame minor face.
Absorbent structure the most according to claim 3, it is characterised in that the conductive line length being positioned on the long limit of described rectangle frame is different from the conductive line length being positioned on described rectangle frame minor face.
Absorbent structure the most according to claim 3, it is characterized in that, described cross frame structure includes the first frame-shaped construction and the second frame-shaped construction being arranged in a mutually vertical manner, described first frame-shaped construction extends along described first direction, described second frame-shaped construction extends along described second direction, and the length of described first frame-shaped construction is more than the length of described second frame-shaped construction.
Absorbent structure the most according to claim 6, it is characterised in that the width of described first frame-shaped construction is more than the width of described second frame-shaped construction.
Absorbent structure the most according to claim 7, it is characterised in that the live width of described first frame-shaped construction, described second frame-shaped construction, described rectangle frame and described conductive line is identical.
Absorbent structure the most according to claim 3, it is characterised in that described cross frame structure is placed in the middle in described construction unit.
Absorbent structure the most according to claim 1, it is characterised in that described resistive layer is clipped between two substrates.
11. absorbent structures according to claim 1, it is characterised in that described absorbent structure includes multiple laminated construction, and the structure of the resistive layer in the plurality of laminated construction is identical but resistivity different.
12. absorbent structures according to claim 1, it is characterised in that described absorbent structure includes multiple laminated construction, the physical dimension of the resistive layer in the plurality of laminated construction is different to obtain different resistivity.
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| CN201521139082.4U CN205488574U (en) | 2015-12-31 | 2015-12-31 | Absorbent structure |
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| CN201521139082.4U CN205488574U (en) | 2015-12-31 | 2015-12-31 | Absorbent structure |
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| CN205488574U true CN205488574U (en) | 2016-08-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113036443A (en) * | 2021-03-04 | 2021-06-25 | 西安电子科技大学 | Optically transparent electromagnetic super-surface for reducing broadband and wide-angle RCS |
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2015
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113036443A (en) * | 2021-03-04 | 2021-06-25 | 西安电子科技大学 | Optically transparent electromagnetic super-surface for reducing broadband and wide-angle RCS |
| CN113036443B (en) * | 2021-03-04 | 2022-01-28 | 西安电子科技大学 | Optically transparent electromagnetic super-surface for reducing broadband and wide-angle RCS |
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