CN102794531B - Module soldering flux separation and dripping prevention mechanism - Google Patents
Module soldering flux separation and dripping prevention mechanism Download PDFInfo
- Publication number
- CN102794531B CN102794531B CN201110142110.8A CN201110142110A CN102794531B CN 102794531 B CN102794531 B CN 102794531B CN 201110142110 A CN201110142110 A CN 201110142110A CN 102794531 B CN102794531 B CN 102794531B
- Authority
- CN
- China
- Prior art keywords
- flange
- division board
- thermocouple
- scaling powder
- blowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a module soldering flux separation and dripping prevention mechanism. The mechanism consists of an isolation plate, a blowing flange and a thermocouple flange; the isolation plate has a rectangular structure; each of long sides of two sides is provided with two grooves which are used for clamping and fixing; and the blowing flange and the thermocouple flange are arranged on the upper surface of the isolation plate. Compared with the prior art, the module soldering flux separation and dripping prevention mechanism has the advantages that air in steam and condensed soldering flux liquid are separated, the condensed soldering flux liquid of a reflow oven can be effectively prevented from dripping, and the influence on the quality of a product can be avoided, so that yield can be reduced greatly, the quality stability can be improved, and the cost of the product can be saved.
Description
Technical field
The present invention relates to a kind of antidrip dropping control device, especially relate to the anti-drippage of a kind of module scaling powder separation mechanism.
Background technology
Reflow soldering (Reflow Oven) is the equipment for the circuit board that is loaded with electronic devices and components being carried out to soldering.It is by a kind of heating environment is provided, thereby solder(ing) paste being heated melt allows surface-pasted components and parts and circuit board combine reliably by solder(ing) paste alloy.The solder(ing) paste that soldering is used is that the scaling powder of smectic and powder scolder are made to paste, be coated in the soldering position of the each components and parts of circuit board by printing, and accurate placement electronic component thereon, utilize reflow soldering to carry out heat fused, reach the reliable soldering to components and parts.
Scaling powder in solder(ing) paste is the mixture taking rosin as main component normally, is to ensure brazing process auxiliary material smoothly.The Main Function of scaling powder is the oxide of removing scolder and welded mother metal surface, makes metal surface reach necessary cleannes, and the oxidation again on surface while preventing from welding reduces solder surface tension force, improves welding performance.When heat fused solder(ing) paste, scaling powder can gasify and become steam.Except heating module, reflow soldering has a refrigerating module to ensure metallurgy characteristic and reduce plate temperature.In air return brazier, scaling powder steam was directly discharged body of heater before cooling, can not leave scaling powder condensate in refrigerating module.In most nitrogen protection reflow solderings; in order to reduce the consumption of nitrogen; internal mix gas will recycle; scaling powder steam can not directly be discharged body of heater; therefore scaling powder steam has an opportunity fully to contact with refrigerating module; make its temperature lower than 110C, and occur condensation, these scaling powder condensate liquids cognition are attached on the return port wooden partition of refrigerating module.In the time that liquid scaling powder is stacked into certain degree, just can form drop, finally drip, and have very large probability to drop onto on wiring board, cause the off quality of wiring board even to scrap.This problem also has same problem at our BW module reflow soldering newly developed.In order to prevent this type of event, way general in industry increases scaling powder gathering system, and the scaling powder of regular manual wipping cooling zone backflow orifice surface, maintenance is cleaned in return-flow system inside, but still have a small amount of scaling powder condensed fluid to drip.
Summary of the invention
Object of the present invention is exactly to provide a kind of module scaling powder of the scaling powder liquid that has separated the gas in steam and condensation to separate anti-drippage mechanism in order to overcome the defect that above-mentioned prior art exists.
Object of the present invention can be achieved through the following technical solutions:
The anti-drippage of a kind of module scaling powder separation mechanism, it is characterized in that, this mechanism is made up of division board, blowing flange and thermocouple flange, described division board is rectangular configuration, on the long limit of both sides, respectively offer two and establish fixing groove for blocking, described blowing flange and thermocouple flange are located at the upper surface of division board.
Described blowing flange is truncated cone-shaped structure, and the outside of blowing flange is evenly provided with 3 screws, and blowing flange is fixed on division board through screw, between screw and division board, is provided with pad.
On described blowing flange, be arranged with scaling powder condensate collector tube.
The middle part of described thermocouple flange is provided with sealing ring, and both sides are provided with screw, and thermocouple flange is fixed on division board through screw, between screw and division board, is provided with pad.
In described thermocouple flange, be inserted with thermocouple well.
Compared with prior art, the present invention has separated gas in steam and the scaling powder liquid of condensation, the drippage that has effectively prevented reflux brazier soldering flux condensed fluid gets off, also can not impact the quality of product, so just improve and reduced the fraction defective of product and the stability of quality greatly, also saved the cost of product.
Brief description of the drawings
Fig. 1 is main TV structure schematic diagram of the present invention;
Fig. 2 is plan structure schematic diagram of the present invention;
Fig. 3 is perspective view of the present invention;
Fig. 4 is the local structure for amplifying schematic diagram of thermocouple flange.
In figure, 1 is that division board, 2 is that blowing flange, 3 is that thermocouple flange, 4 is that sealing ring, 5 is that screw, 6 is pad.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Embodiment
The anti-drippage of a kind of module scaling powder separation mechanism, its structure as shown in Figures 1 to 3, this mechanism is made up of division board 1, blowing flange 2 and thermocouple flange 3, division board 1 is rectangular configuration, on the long limit of both sides, respectively offer two and establish fixing groove for blocking, blowing flange 2 and thermocouple flange 3 are located at the upper surface of division board 1.
Blowing flange 2 is truncated cone-shaped structure, and the outside of blowing flange 2 is evenly provided with 3 screws 5, and blowing flange 2 is fixed on division board 1 through screw 5, between screw 5 and division board 1, is provided with pad 6.On blowing flange 2, be arranged with scaling powder condensate collector tube.As shown in Figure 4, middle part is provided with sealing ring 4 to the structure of thermocouple flange 3, and both sides are provided with screw 5, and thermocouple flange 3 is fixed on division board 1 through screw 5, between screw 5 and division board 1, is provided with pad 6, in thermocouple flange 3, is inserted with thermocouple well.
Scaling powder in steam is by scaling powder gathering system, great majority can be condensed and collect, but still have part scaling powder liquid and can stay along inwall, then can be by blowing flange 2, due to the conical structure of blowing flange 2, can be the scaling powder fluid separation applications of gas and condensation out, the scaling powder fluid drips of condensation is at division board 1, and gas still can play cooling effect.The gap of thermocouple well and piece-rate system can not make liquid stay due to the sealing of sealing ring 4 and thermocouple flange 3 yet simultaneously, drops onto the surface of product, affects the quality of product.
Claims (3)
1. the anti-drippage of a module scaling powder separation mechanism, it is characterized in that, this mechanism is made up of division board, blowing flange and thermocouple flange, described division board is rectangular configuration, on the long limit of both sides, respectively offer two and establish fixing groove for blocking, described blowing flange and thermocouple flange are located at the upper surface of division board;
Described blowing flange is conical structure, the outside of blowing flange is evenly provided with 3 screws, blowing flange is fixed on division board through screw, between screw and division board, be provided with pad, the middle part of described thermocouple flange is provided with sealing ring, both sides are provided with screw, and thermocouple flange is fixed on division board through screw, between screw and division board, are provided with pad.
2. the anti-drippage of a kind of module scaling powder separation according to claim 1 mechanism, is characterized in that, on described blowing flange, is arranged with scaling powder condensate collector tube.
3. the anti-drippage of a kind of module scaling powder separation according to claim 1 mechanism, is characterized in that, in described thermocouple flange, is inserted with thermocouple well.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110142110.8A CN102794531B (en) | 2011-05-28 | 2011-05-28 | Module soldering flux separation and dripping prevention mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110142110.8A CN102794531B (en) | 2011-05-28 | 2011-05-28 | Module soldering flux separation and dripping prevention mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102794531A CN102794531A (en) | 2012-11-28 |
| CN102794531B true CN102794531B (en) | 2014-11-26 |
Family
ID=47193969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110142110.8A Active CN102794531B (en) | 2011-05-28 | 2011-05-28 | Module soldering flux separation and dripping prevention mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102794531B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5911486A (en) * | 1997-02-26 | 1999-06-15 | Conceptronic, Inc. | Combination product cooling and flux management apparatus |
| CN1338338A (en) * | 2000-08-11 | 2002-03-06 | 中国科学院力学研究所 | Process and equipment for separating multi-phase media from each other |
| CN2753948Y (en) * | 2003-10-28 | 2006-01-25 | 胜利油田胜利工程设计咨询有限责任公司 | Eddy gas purifying separating device |
| CN201164763Y (en) * | 2008-01-18 | 2008-12-17 | 甘肃雪晶生化有限责任公司 | Tconical baffler foam destroyer |
| CN101466203A (en) * | 2007-12-21 | 2009-06-24 | 株式会社田村制作所 | Reflow soldering apparatus |
| CN201757601U (en) * | 2010-06-02 | 2011-03-09 | 沈阳慧宇真空技术有限公司 | Movable temperature measurement device for organic luminescent material sublimation and purification furnace |
| CN202147073U (en) * | 2011-05-28 | 2012-02-22 | 上海朗仕电子设备有限公司 | Device for preventing condensation dripping of soldering flux in reflow oven |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7708183B2 (en) * | 2008-03-28 | 2010-05-04 | Illinois Tool Works Inc. | Reflow solder oven with cooling diffuser |
-
2011
- 2011-05-28 CN CN201110142110.8A patent/CN102794531B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5911486A (en) * | 1997-02-26 | 1999-06-15 | Conceptronic, Inc. | Combination product cooling and flux management apparatus |
| CN1338338A (en) * | 2000-08-11 | 2002-03-06 | 中国科学院力学研究所 | Process and equipment for separating multi-phase media from each other |
| CN2753948Y (en) * | 2003-10-28 | 2006-01-25 | 胜利油田胜利工程设计咨询有限责任公司 | Eddy gas purifying separating device |
| CN101466203A (en) * | 2007-12-21 | 2009-06-24 | 株式会社田村制作所 | Reflow soldering apparatus |
| CN201164763Y (en) * | 2008-01-18 | 2008-12-17 | 甘肃雪晶生化有限责任公司 | Tconical baffler foam destroyer |
| CN201757601U (en) * | 2010-06-02 | 2011-03-09 | 沈阳慧宇真空技术有限公司 | Movable temperature measurement device for organic luminescent material sublimation and purification furnace |
| CN202147073U (en) * | 2011-05-28 | 2012-02-22 | 上海朗仕电子设备有限公司 | Device for preventing condensation dripping of soldering flux in reflow oven |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102794531A (en) | 2012-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FI121739B (en) | smelting System | |
| US7708183B2 (en) | Reflow solder oven with cooling diffuser | |
| US20110315746A1 (en) | Compression box for reflow oven heating and related method | |
| CN103152996A (en) | Through hole reflowing process used for dense-spacing long gold-plated pins | |
| JP5051231B2 (en) | Reflow furnace | |
| US20110211322A1 (en) | Electronic device | |
| CN110248495A (en) | Tin cream Reflow Soldering and glue technique for fixing | |
| CN102794531B (en) | Module soldering flux separation and dripping prevention mechanism | |
| CN202147073U (en) | Device for preventing condensation dripping of soldering flux in reflow oven | |
| CN106102315A (en) | The Wave crest Welding method of printed circuit board (PCB) and printed circuit board (PCB) | |
| CN101612506A (en) | The nitrogen filtering recovery system of reflow soldering | |
| US6493928B1 (en) | Electronic unit manufacturing apparatus | |
| CN1874654B (en) | Soldering method, electronic part, and part-exchanging method | |
| CN207615838U (en) | A kind of scaling powder anti-drip structure | |
| CN201482385U (en) | Gas circulation and purification device for reflow soldering furnace | |
| CN101468417B (en) | Receding aperture plate in cooling module of reflow welding stove | |
| CN204657686U (en) | Vapour phase welder | |
| CN202147074U (en) | Coil type cooler for heater of reflow oven | |
| JP2012121046A (en) | Soldering method and soldering device | |
| CN102794519B (en) | Coil cooler arranged in heating zone | |
| CN102810524A (en) | Power module and production method of power module | |
| CN206614119U (en) | A kind of maintaining prior-warning device for water-cooled scaling powder collector | |
| CN201644976U (en) | Reaction device used for catalyzing solder | |
| CN102188901A (en) | Soldering flux catalytic reaction apparatus | |
| CN104801840A (en) | Air cooling type soldering flux gathering device for reflow soldering furnace |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |