CN102781680A - Transfer film for baking purposes, and process for production of glass plate involving baked material - Google Patents
Transfer film for baking purposes, and process for production of glass plate involving baked material Download PDFInfo
- Publication number
- CN102781680A CN102781680A CN2011800114524A CN201180011452A CN102781680A CN 102781680 A CN102781680 A CN 102781680A CN 2011800114524 A CN2011800114524 A CN 2011800114524A CN 201180011452 A CN201180011452 A CN 201180011452A CN 102781680 A CN102781680 A CN 102781680A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive layer
- black
- conductive
- transfer printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/1271—Supports; Mounting means for mounting on windscreens
Landscapes
- Decoration By Transfer Pictures (AREA)
- Laminated Bodies (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Disclosed is a transfer film for baking purposes, which has excellent electrical conductivity and chemical resistance, good appearance, and excellent transferring properties. Specifically disclosed is a transfer film for baking purposes, which comprises a film base material having a releasability and a transfer layer arranged on the film base material and comprising a black-layer-attached conductive layer, wherein the black-layer-attached conductive layer comprises a conductive layer comprising at least a conductive material and a black layer comprising at least a black pigment. Each of the conductive layer and the black layer additionally comprises a glass frit and an organic binder that can be removed by baking, and the black-layer-attached conductive layer is produced by laminating the black layer and the conductive layer on each other so that the conductive layer can be covered with the black layer.
Description
Technical field
The present invention relates to be used for the transfer film of decorative pattern such as conductive pattern such as formation wiring circuit or electrode or pattern on substrates such as glass, particularly be suitable on the vehicle mounted glass pane, forming the sintering transfer film of the sintered body of antenna pattern.
Background technology
At present, forming conductive pattern such as circuit on the substrate, forming the electrode pattern of plasma display panel, on the vehicle mounted glass plate, forming antenna etc. and on substrates such as glass, all be employed in each field through the operation that sintering is given conductive layer.
At present; As the method that on substrates such as glass plate, forms the sintered body of conductive layer; Usually the method below using promptly, is used the conductive paste of conductive materials such as containing silver and frit; On substrates such as glass plate, directly form conductive layer, carry out sintering then through printing processes such as serigraphys.
But; In the method; Under the situation of the printed patterns that directly forms small size on the large-area substrate or form under the situation of duplexer of printed patterns, need guarantee the position of substrate accurately and position, thereby need large-scale drying equipment or high-precision location device; Therefore, the problem that has cost up.
As the method that addresses this is that; For example in patent documentation 1, record a kind of transfer-type printed patterns formation method; This method is the method at formation circuit pattern on glass,, on transfer film, forms the printed patterns that is made up of glass cream that is; This printed patterns heat is transferred on the substrate, and the printed patterns that then heat is transferred on the substrate carries out sintering.
The method of record is to be formed with on the surface on the transfer paper of easy peel ply with serigraphy to form circuit in patent documentation 1, then this circuit heat is transferred on the substrate such as glass.According to the method for record in the patent documentation 1, expectation can with the area of the substrate independent printed patterns of the area of formations needs irrespectively, do not need large-scale drying equipment or high-precision location device etc., can reduce cost.
In addition, recently, forming on the transparent substrates such as glass plate under the situation of conductive layer, need the color settings of conductive layer is dark-coloured for more.This be because, when sintering on substrate with conductive paste in contained silver when being the conductive material of principal component because the color development of silver colloid, its colour changed into yellow of conductive layer, in appearance, the aesthetic property variation.
As the technology that is used to address this is that; In patent documentation 2, record a kind of glass pane with sintered body; The glass pane of this band sintered body is the surface that the conductive paste printing that contains silver and glass ingredient is formed at glass plate, range upon range ofly above that again contains at least a pigment paste of cupric oxide and chromium oxide and forms.
In addition; In patent documentation 3, record conductive paste and this conductive paste is printed onto on the glass plate and sintering and form the band electric conductor glass plate of electric conductor, this conductive paste comprises powder, low-melting glass and the organic lacquer of conductive material such as the powder, silver of the sintered glass ceramics of coloring components such as containing chromium oxide, cobalt oxide, cupric oxide.
Patent documentation 1: (Japan) spy opens the 2000-151080 communique
Patent documentation 2: (Japan) spy opens the 2008-44800 communique
Patent documentation 3: (Japan) spy opens flat 11-322361 communique
But the conductive layer behind the sintering that obtains for the method through patent documentation 1 record is from the requirement to durability etc.; In order to make it have medicine performances such as sulfuric-resisting or salt solution; Need to increase the ratio of frit,, need to increase live width or carry out thick filmization in order to reduce the resistance value of conductive layer with respect to conductive material; Therefore, be difficult to obtain the balance of electric conductivity and outward appearance.
In addition, like the technology of record in patent documentation 2 or the patent documentation 3, think that on conductive paste, carrying out pigment paste method of printing or use contains in the method for conductive paste of coloring components, can not fully obtain the balance of printing precision or electric conductivity and outward appearance.
Summary of the invention
The object of the invention is to solve these prior art problems, and a kind of sintering transfer film is provided, its electric conductivity and anti-medicine excellent performance, and outward appearance is good, and transfer printing property is excellent.
Sintering transfer printing type film of the present invention possesses the transfer printing layer of being located on the film substrate with fissility; Transfer printing layer has band black layer conductive layer; Band black layer conductive layer is made up of conductive layer that contains conductive material at least and the black layer that contains black pigment at least; Conductive layer and black layer also contain frit and through the removable organic bond of sintering, band black layer conductive layer is through forming with range upon range of black layer of mode and the conductive layer that covers conductive layer with black layer.
According to an embodiment of the present invention, band black layer conductive layer forms through the face that is covered the film substrate side with fissility of conductive layer by black layer.
According to another embodiment of the present invention, band black layer conductive layer must form with the face of the film substrate opposition side with fissility through covering conductive layer by black layer.
According to an embodiment more of the present invention, band black layer conductive layer is through forming with range upon range of two black layers of the mode that clips conductive layer.
In the present invention, also can be, conductive layer has the conductive pattern that possesses power supply, and band black layer conductive layer is formed at the part except that power supply of conductive layer.
In addition, in the present invention, also can be, conductive layer has the conductive pattern of elongated shape, and the width of the pattern of black layer is wideer than the width of the conductive pattern of conductive layer.
And then, in the present invention, also can be, transfer printing layer also has resin bed, and this resin bed is laminated in the face of the film substrate side with fissility of being with the black layer conductive layer and the one side at least of opposite sides, and contains through the removable organic matter of sintering.
According to the present invention,, can improve outward appearance through conductive layer being covered with black layer; Improve the visuognosis degree; And, if in the stacked on top of one another of band black layer conductive layer by the resin bed that constitutes through the removable organic matter of sintering, just can further improve transfer printing property.
Sintering transfer printing type film of the present invention is through peeling off film substrate; The transfer printing layer that will have band black layer conductive layer is pasted on the glass plate; While sintering conductive layer and black layer; Can make the glass plate of the sintered body that possesses band black layer conductive layer, be particularly useful for vehicle mounted glass pane as the sintered body that possesses band black layer conductive layer.
Sintering transfer film transfer printing property of the present invention is excellent, has guaranteed electric conductivity, simultaneously, can on substrates such as glass, form the sintered body of visuognosis degree and anti-medicine excellent performance.
Description of drawings
Fig. 1 is the amplification profile illustraton of model of structure of the transfer film of an expression embodiment of the present invention;
Fig. 2 is the amplification profile illustraton of model of structure of the transfer film of expression another embodiment of the present invention;
Fig. 3 is the amplification profile illustraton of model of the structure of the expression transfer film of an embodiment more of the present invention;
Fig. 4 is the illustraton of model of pattern that expression can be used in the conductive layer of embodiment of the present invention;
Fig. 5 is the front elevation of vehicle mounted glass pane of sintered body that possesses the band black layer conductive layer of embodiment of the present invention.
Symbol description
1 film substrate
2,21,22 band black layer conductive layers
3 transfer printing layers
4 protective layers
5,51,52 black layers
6 conductive layers
7 intermediate layers
8 adhesive linkages
9 glass plates
10 power supplies
11 half tones
12 wiring parts
The specific embodiment
Below, the present invention is elaborated.
Fig. 1 is the amplification profile illustraton of model of structure of the sintering transfer printing type film of example first embodiment of the invention.
With reference to Fig. 1, on the film substrate with fissility 1, range upon range of have a transfer printing layer 3 that contains band black layer conductive layer 2.In order to improve transfer printing property, but the resin bed that has the organic matter removed by sintering to form in the stacked on top of one another of band black layer conductive layer 2.Particularly, constituting of the sintering transfer printing type film of this embodiment stacks gradually matcoveredn 4, black layer 5, conductive layer 6, intermediate layer 7, adhesive linkage 8 on the film substrate with fissility 1.
In order to form such lit-par-lit structure, for example, at first; Intermediate layer 7 usefulness coating liquid are coated to formation intermediate layer 7 on the temporary support body, use the version of pattern to utilize the serigraphy cream of printed conductive layer 6 usefulness above that, form conductive layer 6; Then, utilize serigraphy to use the cream of pattern process black layer 5 usefulness, form black layer 5 with the mode that covers conductive layer 6; On this black layer 5, apply the coating liquid of protective layer 4 usefulness again; Form protective layer 4, and on this protective layer 4, fit and have the film substrate 1 of fissility, obtain the first cascade thing.On the other hand, on another temporary support body, apply the bonding agent of adhesive linkage 8 usefulness, form adhesive linkage 8, obtain second sandwich.At last, peel off the temporary support body, the intermediate layer 7 of first cascade thing and the adhesive linkage 8 of second sandwich are fitted, just can make sintering transfer printing type film of the present invention from the first cascade thing.
Fig. 2 is the amplification profile illustraton of model of structure of the sintering transfer printing type film of example second embodiment of the invention.Among Fig. 2, the situation of the conductive layer 6 in the band black layer conductive layer 2 and the relation of black layer 5 and Fig. 1 is opposite up and down.
In order to form such lit-par-lit structure, for example, at first with first embodiment likewise, on the temporary support body, form intermediate layer 7.In second embodiment, the cream of process black layer 5 usefulness at first on intermediate layer 7 forms black layer 5, and printed conductive layer 6 use cream on this black layer 5 then, to be formed conductive layer 6 by the mode of black layer 5 coverings.Below, likewise form protective layer 4 with first embodiment, on protective layer 4, fitting has the film substrate 1 of fissility; Obtain the first cascade thing; On the other hand, on another temporary support body, form adhesive linkage 8, obtain second sandwich; Peel off the temporary support body from the first cascade thing, the intermediate layer 7 of first cascade thing and adhesive linkage 8 applyings of second sandwich are got final product.
Fig. 3 is the amplification profile illustraton of model of structure of the sintering transfer printing type film of example third embodiment of the invention.In Fig. 3, be formed with two black layers 51,52 with the mode that clips conductive layer 6.
This lit-par-lit structure can obtain through making up aforesaid method for first embodiment and second embodiment.
Fig. 4 representes half tone 11; This half tone 11 possesses when making sintering transfer printing type film of the present invention; The cream of black layer 5 usefulness or the cream of conductive layer 6 usefulness are carried out serigraphy and forms band black layer conductive layer 21 spendable patterns, are the half tones that possesses power supply 10 and wiring part 12.
Fig. 5 is the front elevation of glass plate 9 that possesses the sintered body of the band black layer conductive layer 22 that uses sintering transfer printing type thin film fabrication of the present invention.
As the film substrate with fissility 1, the application property when considering transfer printing, the preferred use has flexible base material, for example can use plastics such as polyethylene, polyimides, polyethylene terephthalate, acrylic acid or paper etc.In addition, the thickness of base material is not special to be limited, the viewpoint of the balance of the pressure when needing only from transfer printing or the bendability of heat transmitting and film; Selected only thickness gets final product; But, from making or constructing and consider suitable 25～250 μ m of use, preferred 35～125 μ m; The more preferably thickness of 50～75 μ m.
The conductive layer 6 that uses among the present invention contain be useful on the conductive material that embodies the electric conductivity behind the sintering, be used for embodying the frit of mechanicalness intensity with the substrate heat welding, through the removable organic bond of sintering.
As conductive material, can use the powder of Au, Ag, Cu etc. or contain the powder of their alloy, as long as suitable select to use with sintering after the corresponding material of function expected.From the viewpoint of the sintered body that forms conductive layer, excellent electric conductivity is selected in expectation, and can be in atmosphere sintering and cheap material, can suitably use Ag, Ag-Pd, Ag-Pt etc. with the conductive material of Ag as principal component.
For band black layer conductive layer 2 is being carried on behind the sintering on the substrate, make its durability raising etc., conductive layer 6 of the present invention contains frit.Consider the balance of sintering temperature or percent thermal shrinkage etc., frit can suitably be selected suitable composition.
The organic matter adhesive that is contained as conductive layer 6 of the present invention, but so long as the material that sintering is removed gets final product not special the qualification.The material that is easy to remove as the thermal decomposition of carrying out through sintering; Can enumerate out: resins such as acrylic acid, methylcellulose, nitrocellulose, ethyl cellulose, vinylacetate, polyvinyl butyral resin, polyvinyl acetal, polyvinyl alcohol, polyethylene glycol oxide, polyester, can use or mix these materials of use separately.In addition, as organic principle, be purpose filming before the sintering paid flexibility, also can add plasticizer.Plasticizer can suitably be selected from fatty acid ester or phosphate etc. and use.
Black layer 5 used in the present invention also contains frit and passes through the removable organic bond of sintering except black pigment.Black pigment can be disguised from performance behind sintering, and chromium oxide, cobalt oxide and the cupric oxide that is used for making outward appearance manifest black selected more than one black pigment.Frit for medicine performance such as performance mechanicalness intensity, sulfuric-resisting or salt solution and can with the material of substrate heat welding.As frit and organic bond, can suitably select and use and the identical material of conductive layer 6 employed materials.
The black layer 5 that uses among the present invention contains inorganic pigment composition and the organic bond that is made up of black pigment and frit.Therefore, consider the balance of agglutinating property and bendability, preferably the mixing ratio (P/R ratio) with inorganic pigment composition and organic bond is chosen to be 80/20～95/5 ratio.Think that when being higher than 95/5 the bendability variation produces broken string, crackle; When being lower than 80/20; The generation of the thermal decomposition gas of the organic bond during sintering increases, and therefore, is easy to generate defectives such as space in the band black layer conductive layer behind the sintering; It is bad to be easy to generate sintering, but is not limited to above-mentioned preferred range.
In addition, the black pigment that is contained in the black layer 5 and the ratio of frit, from the balance of disguised and anti-medicine property, selected only ratio gets final product, and is preferably 20/80.And think when comparing with 20/80 ratio, frit for a long time, disguised (degree of blackness) reduces, when comparing with 20/80 ratio, black pigment for a long time, anti-medicine property variation, but be not limited to above-mentioned preferred range.
According to first embodiment of the invention, as shown in Figure 1, band black layer conductive layer 2 is through forming with the face covering of black layer 5 with 1 side of the film substrate with fissility of conductive layer 6.According to the present invention, black layer 5 except black pigment, with conductive layer 6 likewise; Contain frit and pass through the removable organic bond of sintering; Therefore, have the transfer printing type film that this layer constitutes, also can it be fitted on the substrate such as glass plate even be set at; Sintered body through the band black layer conductive layer 2 that on substrate, carries out sintering, can form having desired characteristic.
Second embodiment of the invention, as shown in Figure 2, band black layer conductive layer 2 forms through the face with 1 opposition side of the film substrate with fissility by black layer 5 covering conductive layers 6.
According to the 3rd embodiment of the present invention, as shown in Figure 3, band black layer conductive layer 2 is through forming with range upon range of first black layer 51 of the mode that clips conductive layer 6 and second black layer, 52 these two black layers.According to this mode, owing to be from two directions up and down therefore conductive layer 6 coverings, can further be improved electric conductivity or outward appearance efficiently with two black layers 51 and 52.In addition, the present invention is the invention that utilizes the technology of transfer printing type film, therefore, a plurality of black layers can be set accurately.
In the present invention, under conductive layer 6 situation, also can be with black layer conductive layer 2 in the part formation except that power supply of conductive layer 6 for layer with the conductive pattern that possesses power supply.
Under the situation that will form as linear pattern such as wiring circuit or antenna pattern with black layer conductive layer 2, the line width of preferred black layer 5 is wideer than the live width of conductive layer 6.The pattern width of preferred black layer 5 is than more than the wide 0.2mm of the pattern width of conductive layer 6.Under the situation of not enough 0.2mm, consider from the problem of printing precision or positioning accuracy, think can produce conductive layer 6, but be not limited to above-mentioned preferred range from problems such as black layer 5 expose.
For slug type transfer film of the present invention, through in the stacked on top of one another of band black layer conductive layer 2 by the resin bed that forms through the removable organic matter of sintering, can further improve transfer printing property.As resin bed, can be provided for the adhesive linkage 8 of substrate bonding such as glass, be used to prevent that adhesive linkage 8 from immersing the intermediate layer 7 of conductive layers 6 or black layer 5 etc., being used to prevent protective layer 4 that the mechanicalness of conductive layer 6 and black layer 5 after the transfer printing construction is damaged etc.
As the used adhesive linkage 8 of the present invention, not special the qualification, but so long as to baseplate-laminating the time, have the organic matter that the sintering of the cementability of appropriateness removes and get final product, can use bonding agents such as the acrylic acid series that has cementability at normal temperatures, rubber system.In addition, under the situation of constructing, also can use the organic matter that under laminating temperature, softens through heat lamination etc.Adhesive linkage 8 also can be according to the mode of cover tape black layer conductive layer 2, on whole of the film substrate with fissility 1, forms, also can form with the identical pattern of black layer conductive layer 2.
Adhesive linkage 8 can be that the mode of 1～20 μ m, preferred 2～10 μ m forms according to thickness.Think when thickness less than 1 μ m, bonding force deficiency and the reduction of transfer printing property, when thickness during greater than 20 μ m, the generation of thermal decomposition gas increases, and therefore, band black layer conductive layer 2 is easy to generate defective, makes sintering bad easily, but is not limited to above-mentioned preferred range.The thickness of adhesive linkage 8 preferably in the scope that can keep bonding force, forms film as far as possible.
The present invention can be provided with intermediate layer 7 between band black layer conductive layer 2 and adhesive linkage 8.The effect to the immersion of band black layer conductive layer 2 of solvent that the employed bonding agent of the formation that prevents adhesive linkage 8 contains and organic matter can be taken in intermediate layer 7.
As intermediate layer 7 employed materials; Not special the qualification, but so long as the organic matter that sintering is removed get final product, can from the same material of conductive layer or the employed organic bond of black layer select; Particularly, can suitably use glass transformation temperature is the macromolecule resin more than 50 ℃.
Intermediate layer 7 also can form on whole of the film substrate with fissility 1 according to the mode of cover tape black layer conductive layer 2, also can form with the identical pattern of black layer conductive layer 2.The thickness in intermediate layer 7 is preferably more than the 0.5 μ m, in order to stablize the barrier effect, it is desirable to more than the 1 μ m.Think that the generation of thermal decomposition gas increases when the thickening of intermediate layer, therefore, band black layer conductive layer is easy to generate defective, makes sintering bad, but is not limited to above-mentioned scope.From above-mentioned viewpoint, it is the thickness below the 10 μ m that intermediate layer 7 it is desirable to, and better is is the thickness below the 5 μ m, preferably forms film as far as possible.
Among the present invention, on the band black layer conductive layer 2 before the sintering on being transferred to substrate, to prevent to adhere to foreign matter damage etc. taking place is purpose, and protective layer 4 can be set.Band black layer conductive layer 2 before the sintering because be mostly conductive material or the content of the inorganic pigment composition that black pigment, frit are such is many, organic bond contain proportional few situation, therefore, hard, the crisp trend of membranous existence that sintering is preceding.Therefore, when making transfer film crooked, crackle takes place in band black layer conductive layer 2 easily.Therefore, protective layer 4 also can be taken on the effect of the generation that prevents with film the crackle when crooked etc.
As the material that protective layer 4 uses, not special the qualification, but so long as the organic matter that sintering is removed get final product, can from the organic matter identical materials of conductive layer or black layer use select.
Protective layer 4 also can be according to the mode of cover tape black layer conductive layer 2, on whole of the film substrate with fissility 1, forms, also can form with the identical pattern of black layer conductive layer 2.The thickness of protective layer 4 is preferably 3～6 μ m.
According to an embodiment of the present invention, seize the formation of being with black layer conductive layer 2 on both sides by the arms, therefore, improved bendability, improved construction operation property to the applying of substrate or transfer printing etc. owing to can be set at protective layer 4 and intermediate layer 7.In addition; Even form the situation of band black layer conductive layer 2 with shapes such as fine rule or round dots, also can have the mode of 1 whole of the film substrate of fissility according to covering, form protective layer 4 or intermediate layer 7, adhesive linkage 8; Thus; Do not rely on the pattern form or the size of band black layer conductive layer 2, can increase the contact area with substrate, can keep bonding force fully.In addition, because the present invention is the technology of having utilized the transfer printing type film, therefore, having also can a plurality of band black layer of primary transfer conductive layer 2, can also improve advantages such as positional precision.
Among the present invention,, can use application pattern such as mode of printing such as serigraphy or hectographic printing or gravure coating as the method for each layer that on the film substrate with fissility 1, forms transfer printing layer 3.Under the situation that forms pattern, suitably use printing process.In addition, under the situation that forms same layer on the broad area, also suitably use coating method.
When on the film substrate with fissility 1, forming each layer of transfer printing layer 3, can make and use inorganic pigment that each layer contained or organic matter to disperse or dissolve in the solvent and the coating liquid (cream) that forms.As solvent; Consider inorganic pigment dispersed and organic dissolubility, be suitable for the boiling point of printing process etc.; Can be separately or mix that to use water system, alcohol system, ketone system, fat system, ether system, hydrocarbon be equal solvent; As required, bubble countermeasure and viscosity when printing in order to regulate also can be used additives such as antifoaming agent or tackifier.Solvent or additive can use volatilization when on the film substrate with fissility, forming each layer of transfer printing layer, or can volatilize or decompose the material of removing through sintering.
Sintering transfer printing type film of the present invention be with baseplate-laminating such as glass plate after, the film substrate 1 that will have fissility is peeled off, and on substrate, carries out sintering, thus, decomposes and removes organic matter, can form the sintered body of band black layer conductive layer 2.
Embodiment
Below, concrete example of the present invention is described.The present invention is not limited to these embodiment.
(embodiment 1)
(making of black layer cream)
With the composite pigment of chromium oxide and cupric oxide, frit, and organic bond, disperse and make black layer cream with three rollers.As organic bond, using acrylic resin is BR102 (Mitsubishi's staple fibre (strain) system), and two (2-butoxyethyl group) ether (with the pure pharmaceutical worker's industry of light (strain) system) dissolves, and is adjusted to the organic bond of P/R=80/20.
Below, in this part specification,, under with the state of sintering transfer printing type film transfer after substrate, the black layer note of being located on the conductive layer is made black OC layer for the black layer that uses black layer cream to form, the black layer note of being located under the conductive layer is made black AC layer.
(making of sintering transfer printing type film)
According to following sequentially built sintering transfer printing type film.
As the temporary support body, prepare to be provided with PET film " A70 " (the Supreme Being people DuPont of silicone-based peel ply
Films (strain) system, film dimensions 20cm * 30cm; Thickness 50 μ m); In addition; As intermediate layer and protective layer used coating liquid, prepare methylcellulose " maporose60MP-4000 " (pine the pharmacy of this grease (strain) system) respectively and make the mixed solution of water/IPA=8/2 process the coating liquid of the 2wt% aqueous solution.
In addition, as the cream that conductive layer is used, prepare to contain the conductive layer cream " H4170 " (clear flourish chemical industry (strain) system) of frit, Ag powder and organic bond.
At first, on whole of the side with fissility of temporary support body, apply the coating liquid that the intermediate layer is used with the silk ingot, making thickness is 1.5 μ m, forms the intermediate layer.
On the intermediate layer, use the version of pattern shown in Figure 4, through serigraphy printed conductive layer cream, be of a size of the mode that width 0.2mm * length 50mm, power supply 10 be of a size of 5mm * 5mm, thickness 10 μ m with wiring part 12 and form conductive layer.
Then; Through serigraphy to the part of removing power supply 10 in the pattern shown in Figure 4, be the part of wiring part 12; The black layer cream that printing is made as stated makes to be of a size of width 0.4mm * length 50mm, thickness 5 μ m, forms black OC layer with the mode that covers conductive layer.
On this black OC layer, use a silk ingot to apply above-mentioned protective layer used coating liquid, making thickness is 5 μ m, forms protective layer with whole mode of the side with fissility that covers the temporary support body.
The lit-par-lit structure that forms like this with reference to Fig. 1, is seen from the cross section perpendicular to the length direction of wiring part 12; Become following state, that is, the temporary support body is arranged in the position of adhesive linkage 8; In being in this figure, on the face of the side with fissility of downside, at first be formed with intermediate layer 7, next is formed with conductive layer 6; Be formed with black OC layer 5 with the mode that covers conductive layer 6, also be formed with protective layer 4.
Then, prepare as PET film film substrate, that be coated with little adhesive linkage " SRL-0504 " (Linking (strain) system) with fissility of the present invention.Little bonding plane of this PET film and the protective layer that is formed at as stated on the temporary support body are fitted, pressurize from the temporary support body, make the first cascade thing with the pressure of rubber rollers with 0.5kg/cm.
Like this,, obtain to have on the film substrate of fissility, from beginning to be formed with successively protective layer 4, black OC layer 5, conductive layer 6, and the sandwich in intermediate layer 7 (under this state, also residual on it temporary support body arranged) down with reference to Fig. 1.
On the other hand, as another temporary support body, prepare to be provided with the PET film " A31 " (Supreme Being people DuPont Films (strain) system, film dimensions 20cm * 30cm, thickness 50um) of silicone-based peel ply.On whole of the side with fissility of this another temporary support body, use the silk ingot to apply an acrylic acid series bonding agent " SK1309 " (combining chemical industry (strain) system of grinding), making thickness is 5 μ m, makes second sandwich.
At last, peel the temporary support body, the intermediate layer of first cascade thing and the adhesive linkage of second sandwich are fitted, make the sintering transfer printing type film that can be used as sintering transfer printing type film of the present invention from the first cascade thing.
Like this, with reference to Fig. 1, obtain on intermediate layer 7, further to be formed with the sintering transfer printing type film of adhesive linkage 8.
In addition,, under this state, do not peel above-mentioned another temporary support body, but remain unchanged and keep from second sandwich in order to prevent booty attached on the adhesive linkage.
(possessing the making of the substrate of the sintered body of being with the black layer conductive layer)
According to following order, make the substrate of the sintered body that possesses band black layer conductive layer.
As substrate, and the glass plate that preparation is made with suspension method (size 10cm * 10cm).
From the sintering transfer printing type film of making as stated, residual above-mentioned another temporary support body is peeled, adhesive linkage is exposed, the adhesive linkage side of sintering transfer printing type film is fitted on the glass plate.With the film substrate that will have fissility is the mode of upside, the applying thing is disposed on the platform of approximate horizontal.From the film substrate with fissility, the use rubber rollers is pressurizeed to glass plate with the pressure of 0.5kg/cm.The film substrate that will have fissility is peeled off, and has made transfer printing and has contained the glass plate of the duplexer (transfer printing layer) of band black layer conductive layer.
Use sintering furnace " P90 " (DENKEN (strain) system), be configured under the state of approximate horizontal, the sintering transfer printing has the glass plate of the transfer printing layer that contains band black layer conductive layer.Sintering is in atmospheric environment, to be warming up to 600 ℃ with 20 ℃/min of programming rate from room temperature, with its temperature maintenance 30 minutes, afterwards, stop heating, carries out under the condition below 100 ℃ through in stove, placing to be cooled to.Cooled glass plate is taken out from sintering furnace, obtain being formed with the glass substrate of the sintered body of being with the black layer conductive layer.
(embodiment 2)
At first, identical with embodiment 1, on the temporary support body, form the intermediate layer.
In embodiment 2; On the intermediate layer, at first, through serigraphy process black layer cream; Be of a size of the mode that width 0.4mm * length 50mm, power supply 10 are of a size of 5.4mm * 5.4mm, thickness 5 μ m with the wiring part 12 of pattern shown in Figure 4, form black AC layer.
Then; On this black AC layer; Through serigraphy printed conductive layer cream, make the wiring part 12 of pattern shown in Figure 4 be of a size of width 0.2mm * length 50mm, power supply 10 is of a size of 5mm * 5mm, thickness 10 μ m, form conductive layer with the mode that is covered by black AC layer.
, apply protective layer used coating liquid with the silk ingot above that, making thickness is 5 μ m, forms protective layer with whole mode of the side with fissility that covers the temporary support body.
The lit-par-lit structure that forms like this sees that from the cross section of the direction vertical with the length direction of wiring part 12 its state does; With reference to Fig. 2, become following state, promptly; In the position of adhesive linkage 8 the temporary support body is arranged, in being in this figure, on the face of the side with fissility of downside, at first be formed with intermediate layer 7; Next is formed with black AC layer 5, is formed with conductive layer 6 with the mode that is covered by black AC layer 5, also is formed with protective layer 4.
Then, identical with embodiment 1, preparing coating has the PET film " SRL-0504 " (Linking (strain) system) of little adhesive linkage, and little bonding plane of this PET film and the protective layer that is formed at as stated on the temporary support body are fitted, and makes the first cascade thing.
In addition; From the first cascade thing temporary support body is peeled off; With the intermediate layer of first cascade thing with embodiment 1 in the adhesive linkage of same second sandwich of the adhesive linkage that uses fit, make can be used as the sintering transfer printing type film that sintering transfer printing type film of the present invention uses.
Afterwards, through the method same, make the glass substrate of the sintered body that is formed with band black layer conductive layer with embodiment 1.
(embodiment 3)
At first, identical with embodiment 1, on the temporary support body, form the intermediate layer.
Then; Identical with embodiment 2, on the intermediate layer, through serigraphy process black layer cream; Make the wiring part 12 of pattern shown in Figure 4 be of a size of width 0.4mm * length 50mm, power supply 10 is of a size of 5.4mm * 5.4mm, thickness 5 μ m, forms black AC layer.
Then; On this black AC layer; Through serigraphy printed conductive layer cream, make the wiring part of pattern shown in Figure 4 be of a size of width 0.2mm * length 50mm, power supply 10 is of a size of 5mm * 5mm, thickness 10 μ m, form conductive layer with the mode that is covered by black AC layer.
In embodiment 3, further on this conductive layer, through serigraphy to the part except that power supply 10 in the pattern shown in Figure 4; It is the part of wiring part 12; Process black layer cream makes to be of a size of width 0.4mm * length 50mm, thickness 5 μ m, forms black OC layer with the mode that covers conductive layer.
On this black OC layer, use a silk ingot to apply above-mentioned protective layer used coating liquid, making thickness is 5 μ m, forms protective layer with whole mode of the side with fissility that covers the temporary support body.
The lit-par-lit structure that forms is like this seen from the cross section of the direction vertical with the length direction of wiring part 12, with reference to Fig. 3; Become following state, that is, the temporary support body is arranged in the position of adhesive linkage 8; In being in this figure, on the face of the side with fissility of downside, at first be formed with intermediate layer 7, next is formed with black AC layer 52; Mode to be surrounded by black AC layer 52 is formed with conductive layer 6, is formed with black OC layer 51 with the mode that covers conductive layer 6, also is formed with protective layer 4.
Then, with embodiment 1 likewise, preparing coating has the PET film " SRL-0504 " (Linking (strain) system) of little adhesive linkage, and little bonding plane of this PET film and the protective layer that is formed at as stated on the temporary support body are fitted, and makes the first cascade thing.
In addition; Peel off the temporary support body from the first cascade thing; With the intermediate layer of first cascade thing with embodiment 1 in the adhesive linkage of same second sandwich of the adhesive linkage that uses fit, make can be used as the sintering transfer printing type film that sintering transfer printing type film of the present invention uses.
Afterwards, through the method same, make the glass substrate of the sintered body that is formed with band black layer conductive layer with embodiment 1.
(comparative example 1)
At first, identical with embodiment 1, on the temporary support body, form the intermediate layer.
Then,, be of a size of the mode printed conductive layer cream that width 0.2mm * length 50mm, power supply 10 are of a size of 5mm * 5mm, thickness 10 μ m with the wiring part 12 of pattern shown in Figure 4 above that through serigraphy.
Then, use a silk ingot to apply above-mentioned protective layer used coating liquid, making thickness is 5 μ m, forms protective layer with whole mode of the side with fissility that covers the temporary support body.
Then, identical with embodiment 1, preparing coating the PET film " SRL-0504 " of little adhesive linkage (Linking (strain) system), little bonding plane of this PET film and the protective layer that is formed at as stated on the temporary support body are fitted, make the first cascade thing.
In addition, peel off the temporary support body from the first cascade thing, with the intermediate layer of first cascade thing with embodiment 1 in the adhesive linkage of identical second sandwich of the adhesive linkage that uses fit, make the sintering transfer printing type film that is used for comparative example.
Afterwards, through the method identical, make the glass substrate of the sintered body that is formed with the conductive layer that black layer is not set with embodiment 1.
(evaluation)
Various evaluations below the glass substrate that is formed with in embodiment 1～3 and comparative example 1 sintered body of making carried out.
(seal tightness test)
Stick adhesive tape (registration mark) on the sintered body on being formed at glass substrate (among the embodiment 1～3 for the sintered body of band black layer conductive layer, in comparative example 1, be the sintered body of conductive layer); Glass substrate is carried out 90 degree to be peeled off; To peel off 10% above sintered body from glass substrate, note does *; The part of peeling off is lower than 10% situation note makes △; The note that can not peel off does zero.
(acid resisting test)
Make dipping 0.1N-sulfuric acid on the glass substrate that is formed with sintered body, flooded 2 hours, use pure water rinsing then, after putting cold 1 hour, carry out the evaluation same with seal tightness test at 80 ℃.
(test of visuognosis degree)
Use spectrophotometer (KONICA MINOLTA HOLDINGS (strain) system), measure the brightness that is formed at the sintered body on the glass substrate.
The purpose of raising of visuognosis degree that is provided with the sintered body of the conductive layer that black layer brings from evaluation is considered; Embodiment 1 is measured from the sintering side; Embodiment 2 to be measured from the glass substrate side, embodiment 3 is measured from sintering side and glass substrate side, in order to compare; To comparative example 1, measure from sintering side and glass substrate side.
Evaluation is to be determined in the display packing of the look of JIS Z8729-2004 the L* value of being stipulated, when the glass substrate side is measured, the note of the situation 10 or more is done *, be lower than 10 situation and remember work zero.In addition, when measuring from the sintering side, the note of the situation more than 50 is done *, will be lower than 50 situation note work zero.
Expression is to embodiment 1～3, and the evaluation result of comparative example 1 in the table 1.
[table 1]
In embodiment 1, embodiment 2, sealing, acid resistance are good, but the visuognosis degree the during unilateral observation that is never covered by black layer is in critical field.In this, like embodiment 3, in the formation that up and down cover of black layer with conductive layer, sealing, acid resistance and visuognosis degree all obtain the best result.
On the other hand, comparative example 1 sealing is good, but acid resistance and visuognosis degree are poor.
Can know from this result, when adopting black layer, just not improve the visuognosis degree,, also improve acid resistance or sealing through covering conductive layer with black layer according to the present invention.
(comparative example 2)
At first, identical with embodiment 1, on the temporary support body, form the intermediate layer.
Then, above that, through serigraphy with the wiring part 12 of pattern shown in Figure 4 be of a size of width 0.2mm * length 50mm, power supply 10 be of a size of 5mm * 5mm, thick be the mode process black layer cream of 5 μ m, form black AC layer.
Then; On this black AC layer; Through serigraphy with the wiring part 12 of the pattern of Fig. 4 be of a size of width 0.2mm * length 50mm, power supply 10 is of a size of 5mm * 5mm (promptly; The pattern identical with the situation of black layer cream), thickness is the mode printed conductive layer cream of 10 μ m, forms conductive layer.
And then; On this conductive layer, through serigraphy to the part except that power supply 10 in the pattern shown in Figure 4, promptly, to wiring part 12 parts; Be of a size of width 0.2mm * length 50mm, thickness is the mode process black layer cream of 5 μ m, printing forms black OC layer on conductive layer.
On this black OC layer, use a silk ingot to apply above-mentioned protective layer used liquid, making thickness is 5 μ m, whole mode with the side with fissility that covers the temporary support body forms protective layer.
Then, identical with embodiment 1, preparing coating has the PET film " SRL-0504 " (Linking (strain) system) of little adhesive linkage, and little bonding plane of this PET film and the protective layer that is formed at as stated on the temporary support body are fitted, and makes the first cascade thing.
In addition, peel off the temporary support body from the first cascade thing, with the intermediate layer of first cascade thing with and the adhesive linkage of same second sandwich of the adhesive linkage that in embodiment 1, uses fit, make the sintering transfer printing type film that is used for comparative example.
Afterwards, through the method identical, make the glass substrate of the sintered body that is formed with band black layer conductive layer with embodiment 1.
(evaluation)
Through to being formed with the glass substrate of the sintered body of in comparative example 2, making,, carry out following evaluation with the contrast of the glass substrate that is formed with the sintered body of in embodiment 3, making.
(stackability test)
Observe with optical loupes ((strain) ESCHENBACH optics Japan system, * 10); Band black layer conductive layer before the sintering that on glass substrate, forms; The situation note that conductive layer has got in the black layer is done zero, with conductive layer from the situation note that black layer exposes do *.
(acid resisting test)
Through with the identical method of situation of embodiment 1～3 and comparative example 1, carry out acid proof evaluation.
Table 2 expression is to the evaluation result of embodiment 3 and comparative example 2.
[table 2]
| Embodiment/comparative example | Embodiment 3 | Comparative example 2 |
| Stackability | ?○ | ?× |
| Acid resistance | ?○ | ?△ |
Embodiment 3 stackabilities and acid resistance are good, and comparative example 2 stackabilities are poor, and acid resistance is variation also.
Utilizability on the industry
According to sintering transfer film of the present invention, can on substrates such as glass, form transfer printing property excellence, guarantee electric conductivity, simultaneously the excellent sintered body of visuognosis degree and resistance to chemical reagents.
Therefore, can sintering transfer film of the present invention be applicable to the product of using as the vehicle mounted glass pane of the situation that forms antenna on the front windshield of paying attention to the good automobile in the visual field etc.
Claims (8)
1. a sintering transfer printing type film possesses the transfer printing layer of being located on the film substrate with fissility, it is characterized in that,
Said transfer printing layer has band black layer conductive layer, and this band black layer conductive layer is made up of conductive layer that contains conductive material at least and the black layer that contains black pigment at least,
Said conductive layer and said black layer also contain frit and pass through the removable organic bond of sintering,
Said band black layer conductive layer is through forming with range upon range of said black layer of mode and the said conductive layer that covers said conductive layer with said black layer.
2. sintering transfer printing type film as claimed in claim 1 is characterized in that,
Said band black layer conductive layer forms through the said face with film substrate side of fissility that is covered said conductive layer by said black layer.
3. according to claim 1 or claim 2 sintering transfer printing type film is characterized in that,
Said band black layer conductive layer is through being covered forming with said face with film substrate opposition side of fissility of said conductive layer by said black layer.
4. like each described sintering transfer printing type film in the claim 1 ~ 3, it is characterized in that,
Said band black layer conductive layer is through forming with range upon range of two the said black layers of the mode that clips said conductive layer.
5. like each described sintering transfer printing type film in the claim 1 ~ 4, it is characterized in that,
Said conductive layer has the conductive pattern that possesses power supply,
Said band black layer conductive layer is formed at the part except that said power supply of said conductive layer.
6. like each described sintering transfer printing type film in the claim 1 ~ 5, it is characterized in that,
Said conductive layer has the conductive pattern of elongated shape,
The width of the pattern of said black layer is wideer than the width of the conductive pattern of said conductive layer.
7. like each described sintering transfer printing type film in the claim 1 ~ 6, it is characterized in that,
Said transfer printing layer also has resin bed, the one side at least of the face of said film substrate side with fissility that said resin bed is laminated in said band black layer conductive layer and the face of opposition side, and contain through the removable organic matter of sintering.
8. a manufacturing approach that possesses the glass plate of sintered body is characterized in that,
Possess:
Have the operation that transfer printing layer is set on the film substrate of fissility, said transfer printing layer has band black layer conductive layer, and this band black layer conductive layer is made up of conductive layer that contains conductive material at least and the black layer that contains black pigment at least;
The transfer printing layer that will have said band black layer conductive layer pastes the operation on the glass plate;
The operation that said film substrate is peeled off from said transfer printing layer; And
The operation of while said conductive layer of sintering and said black layer,
Said conductive layer and said black layer also contain frit and pass through the removable organic bond of sintering,
Said band black layer conductive layer is through forming with range upon range of said black layer of mode and the said conductive layer that covers said conductive layer with said black layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-076983 | 2010-03-30 | ||
| JP2010076983A JP5600458B2 (en) | 2010-03-30 | 2010-03-30 | Manufacturing method of glass plate provided with transfer-type film for baking and fired body |
| PCT/JP2011/057811 WO2011122623A1 (en) | 2010-03-30 | 2011-03-29 | Transfer film for baking purposes, and process for production of glass plate involving baked material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102781680A true CN102781680A (en) | 2012-11-14 |
Family
ID=44712318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011800114524A Pending CN102781680A (en) | 2010-03-30 | 2011-03-29 | Transfer film for baking purposes, and process for production of glass plate involving baked material |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5600458B2 (en) |
| CN (1) | CN102781680A (en) |
| WO (1) | WO2011122623A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114175860A (en) * | 2019-08-08 | 2022-03-11 | 株式会社村田制作所 | Resin multilayer substrate and method for manufacturing resin multilayer substrate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2555592B (en) * | 2016-11-02 | 2019-02-27 | Conductive Transfers Ltd | Transfer for application to a surface |
| GB2577286B (en) * | 2018-09-19 | 2022-12-14 | Conductive Transfers Ltd | Transfer including an electrical component |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151080A (en) * | 1998-09-07 | 2000-05-30 | Asahi Glass Co Ltd | Transfer print patterning method and glass with print pattern formed thereon using the same |
| JP2002293669A (en) * | 2001-03-28 | 2002-10-09 | Fuji Photo Film Co Ltd | Method of manufacturing decorated pottery body |
| CN101007477A (en) * | 2006-01-25 | 2007-08-01 | 优立企业有限公司 | Transfer thin film |
| CN101630125A (en) * | 2008-07-14 | 2010-01-20 | 可隆股份有限公司 | Film transfer material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5040031B2 (en) * | 2007-06-13 | 2012-10-03 | 株式会社トッパンＴｄｋレーベル | Transfer film for baking |
-
2010
- 2010-03-30 JP JP2010076983A patent/JP5600458B2/en active Active
-
2011
- 2011-03-29 WO PCT/JP2011/057811 patent/WO2011122623A1/en active Application Filing
- 2011-03-29 CN CN2011800114524A patent/CN102781680A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151080A (en) * | 1998-09-07 | 2000-05-30 | Asahi Glass Co Ltd | Transfer print patterning method and glass with print pattern formed thereon using the same |
| JP2002293669A (en) * | 2001-03-28 | 2002-10-09 | Fuji Photo Film Co Ltd | Method of manufacturing decorated pottery body |
| CN101007477A (en) * | 2006-01-25 | 2007-08-01 | 优立企业有限公司 | Transfer thin film |
| CN101630125A (en) * | 2008-07-14 | 2010-01-20 | 可隆股份有限公司 | Film transfer material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114175860A (en) * | 2019-08-08 | 2022-03-11 | 株式会社村田制作所 | Resin multilayer substrate and method for manufacturing resin multilayer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5600458B2 (en) | 2014-10-01 |
| WO2011122623A1 (en) | 2011-10-06 |
| JP2011207044A (en) | 2011-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105265029B (en) | Flexible printed circuit board and its manufacture method | |
| US4968553A (en) | Graphic architectural glass | |
| US20110083719A1 (en) | Electronic device | |
| US9029709B2 (en) | Transparent flexible printed wiring board and method for manufacturing the same | |
| CZ281055B6 (en) | Process for producing singly- or doubly-curved layered glass pane, particularly for motor vehicles | |
| CN103666296A (en) | Double-sided adhesive film and manufacturing method thereof | |
| CN102781680A (en) | Transfer film for baking purposes, and process for production of glass plate involving baked material | |
| CN109888078A (en) | Manufacturing method, electronic device and the light-emitting diode of cermet lamination heat-radiating substrate | |
| US20230294382A1 (en) | Functional laminated glass articles and methods of making the same | |
| JP5307360B2 (en) | Transfer film for firing and method for forming substrate with functional pattern | |
| TW201609997A (en) | Colored composition for decoration, decorative material, substrate having decorative material, transfer material, touch panel, and information display device | |
| CN114656899A (en) | Glue for laminating and laminating ceramic green sheets and preparation method of ceramic packaging base | |
| CN207388443U (en) | Plate, the device for preparing plate, mobile terminal shell and electronic equipment | |
| CN102821958A (en) | Method for producing transfer body | |
| JP5229529B2 (en) | Transfer film for firing and method for forming substrate with functional pattern | |
| CN102325437A (en) | Glazing process for aluminum housing of electronic product | |
| JP2010143802A (en) | Silicon oxide gel film, transparent conductive film and substrate in which transparent conductive film is laid and method for producing those | |
| CN202225509U (en) | Film coated colorful glass | |
| CN202826780U (en) | Transfer printing membrane assembly and shell comprising same | |
| CN212560080U (en) | Mobile phone texture color-changing film, mobile phone shell with color-changing effect and mobile phone | |
| CN103085517A (en) | Printed cup fast fabricating process | |
| JP5040031B2 (en) | Transfer film for baking | |
| CN102355805A (en) | Surface glazing technology for aluminium shell of electronic product | |
| CN203254863U (en) | Stereoscopic color crystal glass | |
| EP2165851A1 (en) | Transfer films for burning and method of forming substrate with functional pattern |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121114 |