CN102773230A

CN102773230A - Cleaning media, method of manufacturing cleaning media, and dry-type cleaning device

Info

Publication number: CN102773230A
Application number: CN201210146706XA
Authority: CN
Inventors: 冈本洋一; 渕上明弘; 塚原兴治; 村田省蔵; 种子田裕介
Original assignee: Ricoh Co Ltd
Current assignee: Ricoh Co Ltd
Priority date: 2011-05-11
Filing date: 2012-05-11
Publication date: 2012-11-14
Also published as: EP2522460A2; EP2522460A3; JP5541297B2; JP2012250227A

Abstract

Cleaning media (PC) having a thin shape and used in a dry-type cleaning device for cleaning a cleaning target by being blown by an air flow and collided with the cleaning target includes a fracture induction part (LY) inducing fracture and being formed so that, upon being fractured along the fracture induction part into pieces, at least one acute-angle part is formed in at least one of the pieces.

Description

The method and the dry type cleaning apparatus of cleaning medium, manufacturing cleaning medium

Technical field

The present invention relates to the method and the dry type cleaning apparatus of a kind of cleaning medium, manufacturing cleaning medium; Said cleaning medium is used for dry cleaning; Cleaning medium through fly by air-flow (blowing) slim (thin slice) shape cleans target so that cleaning medium collides, and cleans this cleaning target.

Background technology

In manufacturing a product, the process of the permanent plant (anchor clamps) that is used for manufacturing a product in cleaning is widely used and utilizes the method for clean liquid or solvent.But; As wherein not needing dry run also not need the dry type cleaning method of liquid waste processing; Proposed to have the cleaning medium of slim (thin slice) shape, like the film fragment and cleaning medium and cleaning target are collided, made the technology that the cleaning target obtains cleaning through flying.

In order to remove the dirt of firm attachment, like film, the method that the film fragment that known usefulness has a sharp edges is cut the cleaning target is effective.For example, the disclosed patent application of japanese 2010-279850 number (below be called patent document 1) disclose in cleaning course, suitably break off with the material behavior of the material that produces new edge with have the structure of the cleaning medium of groove.

In patent document 1; Fig. 9 to 13 shows such structure; That is: the form that on one or two surface of the cleaning medium with rectangular shape, is parallel to one side of cleaning medium with groove forms groove, makes new edge be formed on the rectangle fragment that the groove at cleaning medium goes out to separate.In addition, before separating, be the right angle basically with the angle of afterwards cleaning medium.

In addition, in patent document 1, Figure 14,15,18 and 19 shows the improvement embodiment of the cross section of groove, and Figure 16 and 17 shows the embodiment that forms polytype rectangular cross section groove, and they are shown in Figure 12 and 13.

In addition, in Figure 20 of patent document 1, can think that groove is used as air flow path, be attached to the cleaning medium on the sidewall surfaces so that peel off by electrostatic force.

In addition, the paragraph of patent document 1 [0032] has been described the combination in any that cleaning medium can have any and they in the different shape that comprises circle, triangle, rectangle and star.

Aforesaid dry type cleaning method is used for cleaning the process of permanent plant (anchor clamps), and this permanent plant (anchor clamps) is used in the automatic welding process of product removal process or circuit board.

Summary of the invention

According to an aspect of the present invention; A kind of cleaning medium with slim shape; This cleaning medium is used in the dry type cleaning apparatus, is used for through being blown by air-flow and colliding and clean said cleaning target with the cleaning target, and this cleaning medium comprises breaking induces part; This breaks and induces part to bring out to break and form when inducing partial rupture in blocks along breaking, at least one sheet, form at least one acute angle portion.

According to a further aspect in the invention, a kind of method of making cleaning medium comprises: on strip material and along a plurality of the breaking of vertical formation of strip material, induce part; And on respect to the direction of said fore-and-aft tilt, cut said strip material, to obtain cleaning medium.

Description of drawings

When combining advantages, other purposes of the present invention, feature and advantage will become clearer from the following description, among the figure:

Fig. 1 is the view that illustrates according to the major part of the dry type cleaning apparatus of embodiment of the present invention;

Fig. 2 A and 2B are the views that is illustrated schematically in the clean operation in the dry type cleaning apparatus of Fig. 1;

Fig. 3 is the view that utilizes the exemplary cleaning course of dry type cleaning apparatus;

Fig. 4 is at the photograph image that utilizes according to the cleaning target before the cleaning medium cleaning of an embodiment;

Fig. 5 is the photograph image of the cleaning target after utilizing the cleaning medium cleaning;

Fig. 6 A to 6D is the view that the forms of collision of the cleaning medium in the patent document 1 is shown;

Fig. 7 A to 7C is the vertical view according to the cleaning medium of an embodiment;

Fig. 8 A to 8C illustrates the situation of the new acute angle portion that when cleaning medium separates in corresponding frangible portion office, produces;

Fig. 9 A to 9C is illustrated under the situation that does not form frangible part on the cleaning medium, the state of the acute angle portion that after cleaning medium uses special time period, uses up;

Figure 10 forms on it to break to induce the photograph image of cleaning medium partly;

Figure 11 is the photograph image of the cleaning medium of fracture;

Figure 12 A to 12C is that angle and acute angle portion that the acute angle portion of cleaning medium is shown get into the view of the relation between the easness in the pore;

Figure 13 is based on test and the angle of acute angle portion is shown and gets into the relation between the entering possibility in the pore;

Figure 14 A to 14C illustrates the embodiment of the cross section of the frangible part shown in Fig. 7 A to 7C;

Figure 15 A illustrates the embodiment of cleaning medium in the fracture of different frangible portion office with 15B;

Figure 16 A to 16C illustrates the improvement embodiment of frangible part;

Figure 17 A and 17B are illustrated in respectively to break and induce partial rupture before with afterwards, another improvement embodiment that breaks and induce part (frangible part);

Figure 18 A to 18D is illustrated in another example of improving the rupture process of the cleaning medium among the embodiment jointly, and this breaks and induces part to form with zigzag;

Figure 19 A and 19B illustrate to have and form another embodiment that breaks that breaking of line of discontinuity induced the cleaning medium of part;

Figure 20 is the view that the process of making the cleaning medium with parallelogram shape is shown; And

Figure 21 is the view that the process of making the cleaning medium with trapezoidal shape is shown.

The specific embodiment

The cleaning medium of prior art is applicable to effective cleaning broad (smooth) zone.But this cleaning medium is not enough to clean the inboard of pore or sunk part.That is, have meticulous or during labyrinth, the cleaning target can not be by even cleaning (that is, the some parts of cleaning target be by abundant cleaning) when the cleaning target.

More particularly, much clean target and have pore (hole) and sunk part.In this case, for example, if the size of cleaning medium greater than the size of pore and sunk part, has only the acute angle portion (or corner) of cleaning medium can enter into pore and sunk part.

In addition, when cleaning medium was used repeatedly, acute angle part branch is rounding (pulverizing, passivation or disconnection) gradually.As a result, when cleaning medium uses in time repeatedly, cleaning medium will more be difficult to enter into pore and sunk part.

The diameter in the hole that forms on the metal mask that for example, in the installation process of printed circuit board (PCB), uses is approximately 0.2mm.

On the other hand, can clean this pore etc., to depend on that fly energy or the kinetic energy (that is, in collision, be applied on the cleaning target collision energy) of quality can correspondingly reduce if the size of cleaning medium reduces to make.Therefore, basic clean-up performance can reduce inevitably.

In addition, clean pore and sunk part,, will inevitably bring extra cost in order to make this small-sized cleaning medium through the size that reduces film fragment etc.

In addition; Even described in patent document 1; Simply form (manufacturing) cleaning medium through forming groove, make cleaning medium be easy under the situation of groove place fracture, the shape at the new edge that breaks produces can produce under limited control at random; As a result, the possibility that produces (cleaning medium) angle part with the acute angle that is suitable for cleaning pore and sunk part can become very low.

The present invention considers existing situation and makes; And a kind of cleaning medium can be provided; Even comprise under the situation of pore and sunk part in the cleaning target; This cleaning medium also can accurately prevent to clean the generation of the inhomogeneous cleaning of target, and helps to improve the clean-up performance of dry cleaning.

In addition, the present invention can provide a kind of low-cost (processing) this cleaning medium of making.

For this purpose; In embodiments of the present invention; Under very little control, break the at random characteristic of (separation) of slim shape cleaning medium obtains correcting (improvement); Make cleaning medium under the condition (controlled) of rule, more desirably break (separation), and can form the acute angle portion that gets into pore and sunk part.

In other words, according to this embodiment, breaking of cleaning medium can be controlled intentionally.

Below, will illustrate and describe embodiment of the present invention.

At first, before the details of description, the cleaning mechanism of dry type cleaning apparatus is described according to the characteristic of the cleaning medium of this embodiment.

Fig. 1 illustrates according to the major part of the dry type cleaning apparatus of embodiment (cabinet).As shown in Figure 1, dry cleaning cabinet (below abbreviate cabinet as) 10 comprises top cabinet 10A and bottom cabinet 10B, and this top cabinet and bottom cabinet are processed by the hollow body with taper.

In addition, dry cleaning cabinet 10 is connected with the bottom surface side of bottom cabinet 10B through the bottom surface side with top cabinet 10A and is integral (formation) by top cabinet 10A and bottom cabinet 10B.

In addition, between top cabinet 10A and bottom cabinet 10B, tabular separating plate 10C is arranged on the corresponding position, bottom surface with the taper of cabinet as porous element.

In the cabinet 10A of top, inner tube element 10D is provided, this inner tube element 10D has drum, as the part of cabinet 10, makes that the cylinder axis of inner tube element 10D is identical with the circular cone axis of top cabinet 10A.In addition, in Fig. 1, inner tube element 10D bottom contacts with separating plate 10C.

The summit side of bottom cabinet 10B (that is, the downside in Fig. 1) is opened as tube shape, to form the air drawn mouth, so that be connected on the suction means 20A via suction lead 20B.Suction means 20A and suction lead 20B constitute suction unit.As suction means 20A, for example, can fully use vacuum motor, vavuum pump or utilize air-flow or the low pressure generator of current.

Near the bottom surface of top cabinet 10A part has cylindrical shape (cylindrical shape part).In addition, opening portion 10E is formed on the part of cylindrical shape part.Opening portion 10E forms through the cross-sectional cut cylindrical shape part along the cylinder axis that is parallel to the cylindrical shape part, and has rectangular shape.

In addition, have the hollow circuit cylinder 10F of the cylindrical shape of penetrating part, this hollow circuit cylinder 10F and top cabinet 10A are integrally formed.Below, hollow circuit cylinder 10F is called inlet 10F.

Inlet 10F extends on the direction that is arranged essentially parallel to separating plate 10C, and vertical cylindrical shape radial direction inclination partly with respect to top cabinet 10A of inlet 10F, and is arranged essentially parallel to the tangent line of the circumferential surface of inner tube element 10D.In addition, in inlet 10F, the outlet side of cabinet 10A inside is positioned to face opening portion 10E on top.In the inboard of inlet 10F, form air flow path.

Separating plate 10C is a discoid element, and this discoid element has punching hole, and is such as stamped metal, and is arranged on the part place on the border between bottom cabinet 10B and the top cabinet 10A, shown on the downside of Fig. 1.On the upside of Fig. 1, symbol " PC " expression slim (thin slice) shape clean chips.The set of the clean chips PC of slim (thin slice) shape constitutes cleaning medium.Therefore, below, symbol PC also representes cleaning medium.

Then, with reference to Fig. 2 A and 2B the clean operation with the dry type cleaning apparatus cleaning cleaning target of as above constructing is described.

Fig. 2 A and 2B are the views that is illustrated schematically in the clean operation in the dry type cleaning apparatus of Fig. 1.

The upside of Fig. 2 A and 2B and downside are similar among Fig. 1 those and illustrate.The situation that air was sucked by suction unit when more particularly, Fig. 2 B was illustrated in opening portion 10E and is opened (release).On the other hand, Fig. 2 A is illustrated in opening portion 10E and is cleaned the surface of target CO when sealing (sealing), the situation that air is sucked by suction unit.

Before clean operation, cleaning medium PC is received (depositing) in the cabinet 10A of the top of dry cleaning cabinet 10.For this purpose, the slim shape cleaning medium PC of appropriate amount is incorporated in the cabinet 10A of top through proper method through the opening portion 10E that is formed on the cabinet 10A of top.

For example, shown in Fig. 2 B, suction means 20A can be drawn the air that comprises in the cabinet 10 from bottom cabinet 10B side by driving through suction lead 20B.Thus, in the cabinet 10A of top, produce negative pressure.

Because this negative pressure produces air current A F (seeing the upside of Fig. 2 B).Then, through utilizing air current A F, the clean chips PC of desired quantity can be inhaled among the cabinet 10A of top through opening portion 10E, thus " cleaning medium " is incorporated in the cabinet 10A of top.

The cleaning medium of introducing as stated be bonded to (attached to) on the separating plate 10C as porous element, and deposit (holding) in the cabinet 10A of top, shown in Fig. 2 B middle and upper part.Air in the cabinet 10A of top is drawn by suction unit, makes in the cabinet 10A of top, to produce negative pressure.

In addition, extraneous air is incorporated in the cabinet 10A of top through inlet 10F.But the flow velocity of introducing the air in the cabinet 10A of top through inlet 10F and flow (flow) are owing to air current A F and smaller.

Therefore, can produce circulating air air-flow RF, but the circulating current RF that produced possibly not have enough intensity (energy) (blowing afloat) cleaning medium that flies.

The clean chips PC that is incorporated in the cabinet 10A of top is bonded on (being adsorbed on) separating plate 10C as stated.As a result, the respective aperture of sealing separating plate 10C on the clean chips PC function.

So along with the amount that is bonded at the clean chips PC on the separating plate 10C increases, the gross area of separating plate 10C that can make clean chips PC pass the hole of separating plate 10C diminishes, and corresponding the dying down of suction force of the absorbing air in the cabinet 10A of top.

Therefore, in the time of in the clean chips PC of specified quantitative is introduced in top cabinet 10A, in fact the further absorption of clean chips PC is stopped.

Thus, the clean chips PC that in the cabinet 10A of top, can introduce and deposit appropriate amount is as cleaning medium, and this appropriate amount is corresponding to the absorption performance of suction unit.

Cleaning medium as stated be received (depositing) in the cabinet 10A of top after, the opening portion 10E of top cabinet 10A closely contacts with the surface (being stained with the surface of the stain of will be cleaned (removal) on it) of cleaning target CO, shown in Fig. 2 A.

When opening portion 10E closely contacted (face seal of the target that is cleaned CO) with the surface of cleaning target CO, the air suction through opening portion 10E was stopped.As a result, the negative pressure in opening portion 10E is increased suddenly, and also increases through the flow and the air velocity (flow rate) of inlet 10F inhaled air.Air the inlet 10F adjusted, and air from the inlet 10F outlet be blown into the opening portion 10E as air blast.

To be remained on clean chips PC on the separating plate 10C towards blowing by the air-flow that blown with the surface of the cleaning target CO of tight contact the (sealing) opening portion 10E.

Air-flow becomes the mobile in a looping fashion circulating current RF of inwall of the cabinet 10A along top, and a part of air-flow is drawn through the hole of separating plate 10C by suction unit.

When the circulating current RF that in the cabinet 10A of top, flows with above-mentioned loop shape form turned back to the outlet of inlet 10F, circulating current RF added through inlet 10F and introduces and from the air-flow that the outlet of inlet 10F blows out, and is accelerated.Thus, can in the cabinet 10A of top, form (produce, keep) stable circulating current RF.

Clean chips PC circulates (flying) in the cabinet 10A of top through circulating current RF, and repeatedly with the surface of cleaning target CO (stain) collision.Because the impact of collision, dirt is fractured into fine particle or powder, and with the surface isolation of cleaning target CO.

Separated dirt is discharged to the outside of dry cleaning cabinet 10 by suction unit through the hole of separating plate 10C.

The circulating current RF that in the cabinet 10A of top, forms (generations) has the circulation axis with surface (surface of the top cabinet 10A side) quadrature of separating plate 10C, and it is mobile to make that circulating current RF is parallel to the surface of separating plate 10C.

Therefore; Circulating current RF blows the clean chips PC that is adsorbed on the separating plate 10C in the horizontal; And between clean chips PC and separating plate 10C, flow (entering), thus clean chips PC is peeled off (separation) and blows afloat clean chips PC once more from separating plate 10C.

In addition, as stated, opening portion 10E is closed (sealing), and the negative pressure in the cabinet 10A of top is increased to the negative pressure that is substantially equal in the cabinet 10B of bottom.The result dies down the power that clean chips PC adheres on the separating plate 10C.Therefore, clean chips PC is blown afloat (flying) more easily.

In addition, circulating current RF is accelerated on constant direction.Therefore, circulating current RF is easier to be produced as quick air-flow, and this further helps the rapid movement of clean chips PC.In addition, according to simulation of air flow, circulating current RF circulated repeatedly in the cabinet 10A of top before being drawn through porous element (separating plate 10C); Therefore, the flow of circulating current RF becomes five to six times of flow of the air-flow of blowing over through air flow path (inlet 10F).

Because bigger flow, more cleaning medium is blown afloat (flying).In addition, the clean chips PC of Rapid Cycle is not easy to adhere on the separating plate 10C, and the dirt that adheres on the clean chips PC is easy to separated with clean chips PC by centrifugal force.

Fig. 3 illustrates the embodiment of the clean operation (process) that utilizes dry type cleaning apparatus.In the embodiment of cleaning course, the cleaning target is a metal mask 100, and it is used for soldering paste (solder paste) and applies process.Metal mask 100 comprises a plurality of mask open part 101 as opening, and soldering paste SP adheres to (adhesion) on the periphery of mask open part 101.The soldering paste SP that adheres to wants removed cleaning target.

For this purpose; The clean operation person grips the bottom cabinet 10B of dry cleaning cabinet 10 and the coupling part between the suction lead 20B with hand HD; And when the air in the cabinet 10A of top is drawn by suction unit, the opening portion 10E of top cabinet 10A is pressed down on the part (part that will be cleaned) of cleaning target.

Before being pressed down on the part that will be cleaned at opening portion 10E, because the absorption of the air in the cabinet 10A of top, the clean chips PC of cleaning medium attracted on the separating plate 10C.Because clean chips PC is to the attraction of separating plate 10C, even in that opening portion 10E is as shown in Figure 3 when facing down, clean chips PC can not discharge from opening portion 10E yet.

Obviously, after opening portion 10E was pressed down to the part that will be cleaned, cabinet (opening portion 10E) was in fact sealed.Therefore, the clean chips PC of no cleaning medium is discharged from.

When opening portion 10E was depressed into the part that will be cleaned, the amount and the speed of the air of introducing through inlet 10F increased suddenly, and this produces strong circulating current RF.Because this strong circulating current RF, the clean chips PC that is adsorbed onto on the separating plate 10C is blown afloat, and collides with the soldering paste (dirt) that adheres on the part that will be cleaned, and removes soldering paste (dirt) from the part that will be cleaned.

The clean operation person is with held cabinet 10, and moves cabinet 10 with respect to metal mask 100, and the part that must be cleaned is moved successively, removes whole soldering paste.

Figure 4 and 5 are illustrated in respectively and utilize before the actual cleaning of carrying out according to the cleaning medium of the embodiment that describes below and state afterwards.When the state of Figure 4 and 5 was contrasted, the soldering paste that obviously adheres on the periphery of mask open part 101 was removed fully.

In addition, when opening portion 10E moved with respect to the part that will be cleaned, if opening portion 10E separates with the part that will be cleaned, because the absorption of clean chips PC and flying, clean chips PC can not discharge (leakage) from the inboard of cabinet 10.

Therefore, the quantity of the clean chips PC of the medium that can keep clean, and since the degeneration of the quantity of the cleaning medium clean-up performance due to reducing can not take place.

Fig. 6 A to 6D illustrates with reference to the fracture mode of the cleaning medium of patent document 1 and collision situation.

Below, term " pencil hardness " is meant the method data measured that defines based among the K-5600-5-4 of Japanese Industrial Standards (JIS).These data are corresponding to not damaging and the nib of the hardest pencil of crooked (assessment) to be tested cleaning medium PC with slim shape number.

In addition, term " folding strength " is meant based on the method data measured that defines among the JIS P8115.These data are corresponding to the number of times that angle and the R=0.38mm of cleaning medium with 135 degree bends back and forth of being assessed with slim shape.

In addition, the cleaning medium that forms when friable material has when surpassing 10 folding strength, and before shown in Fig. 6 A, producing burr, cleaning medium is easy to the center burst at cleaning medium.

Therefore, the edge of cleaning medium (angle) part is held.Because the marginal portion that cleaning medium keeps, the amount that is cut into the cleaning target by cleaning medium can obviously not descend.

Therefore, with respect to the film like object that adheres on the cleaning target, the clean-up performance of cleaning medium (removal ability) can obviously not degenerated in time.

The cleaning medium that forms when friable material has when being less than or equal to 52 folding strength, and the burr that the collision repeatedly of cleaning medium is produced maybe not can be stayed on the cleaning medium, but cleaning medium can that kind break and separate shown in Fig. 6 B.In this case, because burr can not be retained on the cleaning medium, the marginal portion of cleaning medium can be held.

When cleaning medium is easy to plastic deformation (plastic deformation), the edge part branch of cleaning medium greatly is out of shape, shown in Fig. 6 C, to increase contact area and to reduce impulsive force.As a result, the contact force of the edge part office of cleaning medium can be disperseed when collision, and clean-up performance is descended.

Therefore, cleaning medium is cut into the amount of cleaning in the target and can reduces.Therefore, with respect to the film like object that adheres on the cleaning target, the clean-up performance of cleaning medium (removal performance) can be degenerated.

When cleaning medium was easy to ductile fracture (ductile fractured), the plastic deformation meeting of the break surface of cleaning medium was carried out, to increase contact area and to reduce impulsive force, shown in Fig. 6 D.As a result, the contact force of the edge part office of cleaning medium is disperseed when collision, and thus, clean-up performance is degenerated.

Therefore, with respect to the film like object that is attached on the cleaning target, the clean-up performance of cleaning medium (removal ability) weakens.

In patent document 1, select the pencil hardness and the best material of folding strength of cleaning medium, so that suitably produce new edge, and clean-up performance is degenerated.

Below, description is according to the details of the configuration of the clean chips PC of this embodiment.

Fig. 7 A to 7C illustrates the embodiment according to the surface configuration of the clean chips PC of this embodiment.Fig. 7 A illustrates the clean chips PC-1 with parallelogram shape, and Fig. 7 B illustrates the clean chips PC-2 with trapezoidal shape, and Fig. 7 C illustrates has triangular shaped clean chips PC-3.At this, term " surface configuration " is meant the shape in the face of the surface of the direction of the thickness direction that is orthogonal to clean chips (cleaning medium).

In having the clean chips PC-1 of parallelogram shape, a plurality of breaking induced the linear formation of partial L Y, and making breaks induces partial L Y to be arranged essentially parallel to the minor face e1 of parallelogram.In addition, adjacent breaking induces the distance between the partial L Y substantially the same parallelogram is vertical.

Similarly, have on the clean chips PC-2 of trapezoidal shape, a plurality of breaking induces that partial L Y is linear to be formed, and making breaks induces partial L Y to give birth to basically to be parallel to trapezoidal top or following formation.In addition, induce the distance between the partial L Y substantially the same adjacent breaking on the trapezoidal short transverse.

Similarly, in having triangular shaped clean chips PC-3, a plurality of breaking induced the linear formation of partial L Y, and making breaks induces partial L Y to be arranged essentially parallel to leg-of-mutton side.In addition, induce the distance between the partial L Y substantially the same adjacent breaking on the leg-of-mutton short transverse.

At this, term " breaks and induces part " and is meant because the part (notion) of breaking and being brought out of cleaning medium when being applied on the cleaning medium such as the stress of collision etc.For example, the notion of inducing part of breaking comprises the notion of frangible part.

In other words, break and induce part to be meant to control failure mode to produce the factor of acute angle corner portions wittingly through getting rid of the accidental situation about producing of acute angle corner portions.

The intensity of inducing part of breaking is determined to be when stress repetition is applied to that having breaks and induces on the cleaning medium of part, breaks and induces part (reliably) to break.The setting details of stress is described below.

These cleaning mediums have corresponding polygon surface shape, wherein have a plurality of (under these situation of cleaning medium, being two) acute angle portion.

As stated, owing to be applied to the stress of cleaning medium (clean chips) PC repeatedly, cleaning medium PC induces partial L Y fracture along breaking.Cleaning medium PC in this embodiment has a plurality of acute angle corner portions (below abbreviate acute angle portion as) SC; This acute angle portion can get into pore or the sunk part of cleaning target CO; Even before cleaning medium breaks (that is, even when cleaning medium is used at first).

Therefore, though under the primary condition that just begun of cleaning and only have limited quantity break break and induce part, the clean-up performance (that is, entering pore and the ability of sunk part to clean) of cleaning pore and sunk part also might be provided.

Fig. 8 A to 8C illustrates when cleaning medium breaks accordingly and induces the situation that produces new acute angle portion when partly (frangible part) located to break (separation).

Fig. 8 A illustrates the situation that the clean chips PC-1 with parallelogram shape is broken into three; Fig. 8 B illustrates the situation that the clean chips PC-2 with trapezoidal shape is broken into two, and Fig. 8 C illustrates and has the situation that triangular shaped clean chips PC-3 is broken into two.

In those cleaning mediums, after in cleaning course, breaking, produce new acute angle portion NSC.

Therefore, even when acute angle portion SC (gradually) is by rounding (pulverizing, passivation, fracture) before breaking of cleaning medium taken place,, breaking of cleaning medium can produce new acute angle portion NSC after taking place.Therefore, in cleaning course, the clean-up performance of can keep clean pore and sunk part.

On the other hand; Inducing under the situation of partial L Y not being formed with on the cleaning medium PC to break shown in Fig. 9 A to 9C; When the cleaning medium PC with polygonal shape comprised acute angle portion SC, along with cleaning medium PC collides with the cleaning target repeatedly, acute angle portion was easy to by rounding.

Therefore, for the clean-up performance of keep clean pore and sunk part, need (continuously) to introduce new cleaning medium.As a result, a large amount of cleaning mediums must be consumed.

On the other hand, in the cleaning medium of this embodiment, a lot of acute angle portion SC can produce from single (each) cleaning medium PC with mode progressively successively.Therefore, can significantly reduce the consumption of cleaning medium PC.

In order to use more acute angle portion SC, preferably, adjacent breaking induces spacing (distance) between the partial L Y in the scope from about 1mm to about 3mm.

Figure 10 and 11 is broken into before a lot of sheets and the photograph image that has the cleaning medium of inducing partial L Y of breaking afterwards at cleaning medium.

Shape of threads (threadlike) or linear resin flake (that is cleaning medium) of inducing partial L Y that breaks that forms on it shown in figure 10 induces partial L Y place to be broken into multi-disc shown in figure 11 breaking along with use gradually.That is, because the characteristic of " break and induce partial L Y ", cleaning medium breaks and produces new acute angle portion SC.

Therefore, induce partial L Y, can use resin flake (cleaning medium) for a long time, and need not change through on cleaning medium, forming to break as stated.

The break angle acute angle portion of inducing partial L Y of the angle and depending on that Figure 12 A to 12C illustrates the acute angle portion of cleaning medium gets into the relation between the easy property of pore.

Shown in Figure 12 A, when spending more than or equal to 60, acute angle portion SC is difficult to enter into the hole h1 of diameter greater than the thickness t of cleaning target CO when the angle of the acute angle portion SC of cleaning medium (below be called drift angle).

Shown in Figure 12 B, when the angle of the acute angle portion SC of cleaning medium PC is 45 when spending, acute angle portion SC might enter into the hole h2 that diameter is substantially equal to clean the thickness t of target CO.

Shown in Figure 12 C, when the angle of the acute angle portion SC of cleaning medium is less than or equal to 20 when spending, acute angle portion SC might enter into the hole h3 of diameter less than the thickness t of cleaning target CO.

But the intensity of acute angle portion SC reduces inevitably.Therefore, be difficult to keep for a long time the acute angle shape.

Therefore, in order to get into pore and sunk part, preferably the drift angle of acute angle portion SC is spent more than or equal to 20 and is less than or equal to 45 and spends.

For example; Angle and the acute angle portion SC of acute angle portion SC that Figure 13 illustrates the resin flake (that is cleaning medium) of thickness 100 μ m gets into the result of the test of the relation between the probability of pore of the diameter of phi d=0.3mm on the corrosion resistant plate that is formed on thickness t=0.15mm.

The probability that acute angle portion gets into pore is measured through the percentage (%) that utilizes the impact paper that is placed on the corrosion resistant plate rear side to measure the pore that acute angle portion SC gets under the condition that moves with the speed of 2mm/s with respect to corrosion resistant plate at the cleaning cabinet.

The angle that Figure 13 is illustrated in acute angle portion SC is 30 when spending, and acute angle portion SC enters into pore with high probability, on the other hand, and when the angle of acute angle portion SC is that 60 degree are that the entering probability that acute angle portion SC gets into pore is very low.

In addition; When slim (thin slice) shape cleaning medium with acute angle portion SC is used (that is, having used long-time section) repeatedly, because collision repeatedly; Acute angle portion SC can be by rounding (pulverizing, passivation, fragmentation), has reduced the entering probability that acute angle portion SC enters into pore thus.

But, when having, the cleaning medium of slim (thin slice) shape breaks when inducing partial L Y to produce new acute angle portion SC to break, and the reduction that acute angle portion SC gets into the entering probability of pore can be suppressed.As a result, can keep acute angle portion SC to enter into the higher entering probability of pore for a long time.

The reduction that acute angle portion SC enters into the entering probability of pore means the reduction of removing removal (cleaning) ability that is attached to the soldering paste on the metal mask, as stated.

According to The above results, preferably, the angle of acute angle portion SC that is used to clean the cleaning medium of pore and sunk part is less than or equal to 45 degree; More preferably; Be less than or equal to 30 degree, and form to break and induce partial L Y, produce new acute angle portion SC to break.Thus, the life-span of cleaning medium can be extended.

The details of the structure of inducing partial L Y of breaking then, is described with reference to Figure 14 A to 14C.

Breaking shown in Figure 14 A to 14C induced partial L Y to form linear channel or changed part.At this, be different from patent document 1, inducing the size of the groove of partial L Y breaking of this embodiment is not to confirm as the path passed through as air to blow afloat the cleaning medium that is attached on the wall surface.

That is, the size of groove is not to be specified to have enough width and can produce at random so that break.Specifically, breaking in this embodiment induces the size of the groove of partial L Y to be meant extremely thin and striated (streaky) size, makes that break line is linear equably to form.

But when the shape of groove or transformation cross section partly was V (del) shape, the common apex portion at V-arrangement of breaking took place.Therefore, the size of the size of the width of groove and groove is uncorrelated.

Term " linearity " notion not only comprise the notion of strict straight line, and comprise a little (crooked) wave or the zigzag line that changes, and not only comprise continuous lines, and comprise line of discontinuity.

But, in order to make cleaning medium easily, when line is straight and is that continuous line is favourable.

The breaking of Figure 14 A induces partial L Y-1 to utilize blade or instrument to form to have V the groove of (indentation) shape cross section.

Breaking of Figure 14 B induces partial L Y-2 to utilize blade or instrument to form the groove with rectangular cross section.

The breaking of Figure 14 C induces partial L Y-3 to utilize heat, ultraviolet ray, laser etc. or break through chemical treatment transformation (reduction) through physical treatment to induce the characteristic of partial L Y-3 (material) to form, to be formed with striated transformation (frangible) part.The description that changes the size of part is similar to the description of the size of groove.

Carrying out on the part that changes (reduction) processing, stress can be concentrated and intensity can reduce.Therefore, when stress repetition is applied on the cleaning medium, be easier to take place fatigue fracture (breaking) in the transition office.

The cleaning medium that Figure 15 A and 15B schematically show that having breaks brings out partial L Y-1 brings out the example of breaking in partial L Y-1 place in different breaking.

Because collide repeatedly with the cleaning target, stress repetition is applied to break brings out on the partial L Y-1 (that is, groove), makes cleaning medium finally bring out partial L Y-1 along breaking and breaks.Cleaning medium PC can break at core, shown in Figure 15 A; Perhaps partial rupture on the edge of is shown in Figure 15 B.

Preferably, the material of cleaning medium is a folding strength more than or equal to 0 and less than 65 material.But, induce the effect of part (groove or change part) owing to break, also can use folding strength greater than 65 material.

That is, because part is induced in breaking in this embodiment, the failure mode of cleaning medium can be controlled.Therefore, be different from patent document 1, might produce new edge and acute angle portion, and needn't strictly set (confirming) pencil hardness and folding strength.Therefore, can increase the free degree of the selection material of cleaning medium.

Then, describe to break with reference to Figure 16 A to 16C and induce the improvement embodiment of part (fatigue fraction).

Induce in the form (pattern) of partial L Y-1 breaking of Figure 16 A, comprise that the group of three types groove g1, g2 and g3 with V-arrangement cross section is concatenated to form.Groove g1, g2 and g3 differ from one another at the degree of depth and the width of the thickness direction of cleaning medium PC.

Bring out in the form of partial L Y-2 breaking of Figure 16 B; The group that comprises three types of groove g4, g5 and g6 of (trapezoidal) cross section that has rectangle is concatenated to form, and groove g4, g5 and the g6 degree of depth and the width on the thickness direction of cleaning medium PC differs from one another.

Induce in the form of partial L Y-3 breaking of Figure 16 C, comprise that the group of three types transformation part v1, v2 and v3 is concatenated to form.This transformation part v1, v2 and the degree of depth and the width of v3 on the thickness direction of cleaning medium PC differ from one another.But, for example, can use the width that wherein changes part v1, v2 and v3 to be set to equal values and only change the form that the degree of depth of part v1, v2 and v3 differs from one another.

In addition, in the foregoing description, described groove or transformation part and had similar each other shape.But, the rupture strength value that groove or transformation part can have configurations differing from one and differ from one another.

Figure 17 A and 17B are illustrated in respectively to break and bring out partial rupture before with afterwards, another improvement embodiment that this breaks and brings out part (frangible part).

Above-mentioned be in the embodiment, suppose to break and bring out that part (frangible part) is linear to be formed.But in this embodiment (embodiment), the breaking of cleaning medium PC-1 brought out partial L Y and also can curve form be formed.

Bring out partial L Y when breaking and be when crooked, bring out that partial L Y is linear to be formed when comparing with breaking, it is more sharp-pointed that the angle of acute angle portion SC can become.

Figure 18 A to 18D illustrates jointly to break and brings out the embodiment that part forms with the zigzag mode.

In this case, break bring out the part can break successively according to the mode of Figure 18 A to 18D.Therefore, compare, might produce more substantial new acute angle portion NSC with the situation of bringing out partial linear formation and substantially the same distance arrangement shown in Fig. 7 A of breaking.

Figure 19 A and 19B illustrate to break and bring out another embodiment that breaks that part forms the cleaning medium of discontinuous line (perforation line).

In addition, in this case, always need the degree of depth on thickness direction do not controlled or line forms with the hemisection form.That is, line forms through on the thickness direction of cleaning medium, cutting fully.In addition, through regulating Cutting Length " a " to Cutting Length not " b " ratio, can regulate the easy degree (seeing Figure 19 A) of breaking.

That is, have different Cutting Lengths through formation " a " to Cutting Length not " b " breaking of ratio bring out part, can be in the different moment and break successively so that cleaning medium brings out part in different breaking.

As stated; The mode that differs from one another through the degree of depth and/or the width that brings out part to break forms to break brings out part; When cleaning medium was used (using long-time section) repeatedly, cleaning medium was easy to bring out the part place and at first break having breaking of the big degree of depth and/or width.

Then, when cleaning medium was used, cleaning medium was easy to bring out according to breaking the order that reduces of the degree of depth and/or the width of part and brings out the part place and break breaking gradually.As a result, can produce new edge and acute angle portion gradually.

Bring out part for example has same size through formation groove and under situation about evenly forming breaking, a plurality of breaking brought out part and is easy in identical time range implosion.That is, the moment of new edge generation concentrates on certain period of time.

On the other hand, bring out under the situation of part like said formation in this embodiment breaking, even use long-time section at cleaning medium, new edge is (gradually, successively) generation continuously.As a result, can stablize clean-up performance.

That is, in cleaning course, can control breaks brings out the part order of breaking in time, and slows down to break and bring out the concentrated of moment that partial rupture and new edge and acute angle portion produce.

For example, bring out under the situation in the resin film (cleaning medium) that partly is formed on 100 μ m thickness, obtain the following result shown in the table 1 breaking shown in Figure 14 A.That is, break through change and to bring out the degree of depth of part, can control (changes) resin flake and bring out the part place and break the time cycle before breaking.

Table 1

Break and bring out the degree of depth of part	The result
		0-20μm	Crack-free or breaking with breaking to bring out on the part different directions
20-80μm	After 1 to 10 minute, break
		80 μ m or bigger	Break fast

Then, with reference to Figure 20 and 21 method of making above-mentioned cleaning medium is described.

Figure 20 schematically shows the process of the cleaning medium PC-1 with parallelogram shape of manufacturing shown in Fig. 7 A.

At first, bring out in (frangible) part forming process breaking, as the belt flake TL of base material when moving direction moves, the breaking of striated brought out part and formed along the direction that is parallel to moving direction.In this process, preferably, breaking to bring out partly to form makes the formed degree of depth and/or the width that brings out part that break differ from one another.

Then, in cutting process, when moving direction moves, belt flake TL cuts on the direction that tilts with respect to moving direction.Through cutting in an inclined direction, might form (generation) and be used for removing the pore of (cleaning) cleaning target or the acute angle portion SC of the dirt in the sunk part.

Figure 21 schematically shows the process of making the cleaning medium PC-3 with trapezoidal shape as shown in Figure 3.

At first, bring out in the part forming process breaking, as belt flake (material) TL of base material when moving direction moves, striated breaks and brings out part and form being parallel on the direction of moving direction.

In this process, preferably, breaking to bring out partly to form makes the formed degree of depth and/or the width that brings out part that break differ from one another.

Then, in cutting process, when moving direction moves, belt flake TL cuts on the direction that tilts with respect to moving direction.

In addition, shown in figure 21, the cut direction in cutting process (1) is opposite with respect to the cut direction in direction that is orthogonal to moving direction and the cutting process (2).

In addition, cutting process (1) and cutting process (2) hocket, and make the cleaning medium PC-3 that is cut have trapezoidal shape.

Through on the direction that tilts with respect to moving direction, cutting, might form (generation) and be used for removing the pore of (cleaning) cleaning target or the acute angle portion SC of the dirt in the sunk part.

According to this embodiment, can clean and be formed on pore and the inboard of sunk part of cleaning on the target, and keep the clean-up performance in the whole cleaning course.

Therefore, can be effectively and carry out high-quality dry cleaning equably, and do not have any remaining not cleaning part.

Though described the present invention with respect to specific implementations from the clear disclosed purpose of complete sum; But therefore appending claims is not restricted, and is interpreted as embodying interior all improvement and the alternative structure of the basic instruction that falls within this statement fully that those skilled in the art can make.

The application based on and Japanese patent application 2011-106438 number that requires to submit on May 11st, 2011 and the rights and interests of 2012-009262 number priority of submission on January 19th, 2012, the full content of these priority applications is incorporated into this by reference.

Claims

1. cleaning medium, this cleaning medium have slim shape and are used for through being blown by air-flow and cleaning the dry cleaning of this cleaning target with the collision of cleaning target, and said cleaning medium comprises:

Break and bring out part, this breaks and brings out part and be configured to induce and break and be formed: bring out partial rupture along breaking when in blocks at it, forming at least one acute angle portion in a slice at least.

2. cleaning medium as claimed in claim 1, wherein, said breaking brought out part and formed groove.

3. cleaning medium as claimed in claim 1, wherein, said break bring out the part be through change break bring out the part material behavior form.

4. like claim 2 or 3 described cleaning mediums, wherein, said breaking brought out part and formed continuous lines or discontinuous line.

5. cleaning medium as claimed in claim 4, wherein, the surface configuration of said cleaning medium be parallelogram shape, trapezoidal shape and triangular shaped in any.

6. cleaning medium as claimed in claim 5, wherein, said break bring out the part on the direction on a limit that is basically parallel to said surface configuration, form.

7. like each described cleaning medium in the claim 1 to 3, wherein, said cleaning medium comprises that a plurality of breaking bring out part, and

Wherein said a plurality of rupture strength value of at least two of bringing out in the part of breaking differs from one another, to confirm the order of breaking.

8. cleaning medium as claimed in claim 7, wherein, it is different and set that the rupture strength value that differs from one another is based on break on the thickness direction of the cleaning medium degree of depth of bringing out part.

9. the method for each described cleaning medium in manufacturing such as the claim 1 to 3, this method comprises:

On strip material and along a plurality of the breaking of vertical formation of strip material, bring out part; And

Along cutting said strip material, to obtain cleaning medium with respect to the direction of said fore-and-aft tilt.

10. the method for manufacturing cleaning medium as claimed in claim 9, wherein, in cutting process, strip material to be being cut with respect to constant direction longitudinally, to obtain cleaning medium with parallelogram shape.

11. the method for manufacturing cleaning medium as claimed in claim 9; Wherein, In cutting process; Alternately cut on first and second directions in the strip material, said first direction is relative with said second direction with respect to the said direction longitudinally of quadrature, to obtain to have triangular shaped cleaning medium.

12. a dry type cleaning apparatus is used for cleaning this cleaning target through blowing clean chips with slim shape and clean chips being collided with the cleaning target, said dry type cleaning apparatus comprises:

Like each described cleaning medium in the claim 1 to 3 as clean chips.