CN102759958A - Computer device - Google Patents
Computer device Download PDFInfo
- Publication number
- CN102759958A CN102759958A CN201110105296XA CN201110105296A CN102759958A CN 102759958 A CN102759958 A CN 102759958A CN 201110105296X A CN201110105296X A CN 201110105296XA CN 201110105296 A CN201110105296 A CN 201110105296A CN 102759958 A CN102759958 A CN 102759958A
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- CN
- China
- Prior art keywords
- computer equipment
- heat radiating
- mainboard
- radiating plate
- metallic heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A computer device comprises a metal housing, a mainboard and a central processor mounted on the mainboard, wherein a metal heat sink is mounted on the central processor; the metal heat sink is in contact with the metal housing to achieve the effect of EMI (Electro-Magnetic Interference) prevention; and the metal heat sink is firmly connected with the central processor through a cooling pad. The computer device provided by the invention has functions of heat dissipation and EMI prevention.
Description
Technical field
The present invention relates to a kind of computer equipment, refer to a kind of computer equipment that has heat radiation and EMI suppression (Electro Magnetic Interference, electromagnetic interference (EMI)) function concurrently especially.
Background technology
Existing computer equipment (like desktop computer, like notebook computer etc.) answers the user to be convenient to carry the demand of carrying; Size design gets more and more littler; The CPU of the computer equipment that has (Central Processing Unit; Central processing unit) space of heating radiator and fan reserve to be installed in the top, only depends on heat pipe or the louvre on conducting strip and the casing etc. on the CPU to dispel the heat for CPU.A traditional notebook computer for example; Comprise that a mainboard and is installed on the CPU on this mainboard; Said CPU top covers a thermal conductive metal plate; Adhere to the soft heat-conducting glue of one deck on this thermal conductive metal plate, this layer heat-conducting glue contacts with the sheet metal of keyboard bottom, so can the sheet metal of heat bottom thermal conductive metal plate, heat-conducting glue and keyboard that CPU distributes be conducted in the atmosphere.Yet traditional computer equipment directly contacts with CPU owing to thermal conductive metal plate, and radiating effect is not good, and CPU is not made EMI suppression and handle, and the ELECTROMAGNETIC RADIATION SIGNATURE that CPU sends can cause harmful effect to external world.
Summary of the invention
In view of above content, be necessary to provide a kind of radiating effect preferable and have the computer equipment of anti-EMI function concurrently.
A kind of computer equipment; Comprise that a metal shell, a mainboard and are installed on the central processing unit on this mainboard; One metallic heat radiating plate is housed on the said central processing unit; Said metallic heat radiating plate contacts with said metal shell reaching the effect of anti-electromagnetic interference (EMI), closely is connected through a cooling pad between said metallic heat radiating plate and the said central processing unit.
A kind of computer equipment; Comprise that a mainboard and is installed on the central processing unit on this mainboard; One metallic heat radiating plate is housed on the said central processing unit, and said metallic heat radiating plate comprises a plate body and a support chip from said plate body extension, and said mainboard is provided with ground pad; The said ground pad of support chip butt of said metallic heat radiating plate is equiped with a cooling pad to reach the effect that prevents electromagnetic interference (EMI) between the plate body of said metallic heat radiating plate and the said central processing unit.
Compared to prior art, closely be connected through a cooling pad between the metallic heat radiating plate of computer equipment of the present invention and the central processing unit, so that be the central processing unit heat radiation faster; In addition, said sheet metal contacts with the metal shell of computer equipment or the ground pad on the mainboard, can reach the function of EMI suppression.
Description of drawings
Fig. 1 is the cut-open view of computer equipment one first preferred embodiments of the present invention.
Fig. 2 is the cut-open view of computer equipment one second preferred embodiments of the present invention.
Fig. 3 is the cut-open view of computer equipment 1 the 3rd preferred embodiments of the present invention.
The main element symbol description
| |
10 |
| |
12 |
| The |
20 |
| |
30 |
| |
40 |
| Metallic |
50 |
| |
52、52A、 |
| Metal clips | |
| 54、54A | |
| Rake | 541 |
| Abutting |
543 |
| |
56、 |
| Support chip | |
| 56B | |
| The |
561 |
| The |
563 |
| |
60 |
Following embodiment will combine above-mentioned accompanying drawing to further specify the present invention.
Embodiment
See also Fig. 1; Computer equipment one first preferred embodiments of the present invention comprises that a mainboard 10, is installed on said mainboard 10 positive CPU mount pads 20, and is installed on the cooling pad 40, that the CPU 30, on the said CPU mount pad 20 is installed on the said CPU 30 and is installed on a metallic heat radiating plate 50 and a metal shell 60 (diagram is merely the part of the metal shell of said computer equipment, and this metal shell 60 links to each other with the ground wire of power supply in said computer equipment energising back) on the said cooling pad 40.Said cooling pad 40 is made up of amalgam of heat-conducting cream, heat-conducting metal or heat-conducting cream and metallic particles etc.Said heat-conducting metal can be the higher metals of coefficient of heat conductivity such as aluminium, copper, silver.Said metallic particles can be alumina particles, copper particle, silver-colored particle etc.
Said metallic heat radiating plate 50 comprises the metal clips 54 that a plate body 52 parallel with said mainboard 10 and established to outwash from said plate body 52, and said metal clips 54 comprises the abutting part 543 that extends from the terminal horizontal of said rake 541 from the rake 541 of said plate body 52 oblique extensions and.The said metal shell 60 of abutting part 543 butts of said metal clips 54 can conduct to the earth with said metal shell 60 with the ELECTROMAGNETIC RADIATION SIGNATURE that CPU 30 produces, and reach the effect of EMI suppression.The opposite side of said plate body 52 extends a pair of support column 56 to the direction at said mainboard 10 places is vertical, and the said mainboard 10 of this terminal butt to support column 56 can reduce the pressure of 50 couples of said CPU 30 of said metallic heat radiating plate, in case CPU 30 is damaged by pressure.
See also Fig. 2; In the present invention's one second preferred embodiments; Said CPU mount pad 20, CPU 30, cooling pad 40 and a metallic heat radiating plate 50A all are installed on the back side of said mainboard 10, convex with the metal clips 54A of an arc on the plate body 52A of said metallic heat radiating plate 50A, the metal shell 60 of the said computer equipment of said metal clips 54A butt; Can the ELECTROMAGNETIC RADIATION SIGNATURE that CPU 30 produces be conducted to the earth with said metal shell 60, and reach the effect of EMI suppression.
In first and second preferred embodiments of the present invention; Said metallic heat radiating plate 50,50A link to each other with said CPU 30 through said cooling pad 40; Because the heat conduction of said cooling pad 40 is fast, and the area of said metallic heat radiating plate 50,50A is big, thereby can be said CPU 30 heat radiations preferably; In addition, said metallic heat radiating plate 50, the metal clips 54 of 50A, 54A closely contact with the metal shell 60 of said computer apparatus, thereby reach the effect of EMI suppression.
See also Fig. 3, in the present invention 1 the 3rd preferred embodiments, said mainboard 10 respectively is provided with a ground pad 12 in the both sides of said CPU mount pad 20.Metallic heat radiating plate 50B on the said CPU 30 comprises that a plate body 52B and extend a pair of support chip 56B to the direction at the place of said mainboard 10 from this plate body 52B, each support chip 56B comprise one from the vertically extending support portion 561 of said plate body 52B and a terminal vertical outwards butt limit 563 of bending from said support portion 561.This can conduct to the earth with the ELECTROMAGNETIC RADIATION SIGNATURE that CPU 30 produces, and reach the effect of EMI suppression the ground pad 12 of the said mainboard 10 of butt limit 563 butts of support chip 56B.
More than be merely preferred embodiments of the present invention, the equivalence that present technique field personnel do according to principle of the present invention changes, and all should be encompassed in protection scope of the present invention.
Claims (10)
1. computer equipment; The metal shell, the mainboard and that comprise an electrical ground connection are installed on the central processing unit on this mainboard; It is characterized in that: a metallic heat radiating plate is housed on the said central processing unit; Said metallic heat radiating plate contacts with said metal shell reaching the effect of anti-electromagnetic interference (EMI), closely is connected through a cooling pad between said heat sink and the said central processing unit.
2. computer equipment as claimed in claim 1 is characterized in that: said cooling pad comprises thermal grease.
3. computer equipment as claimed in claim 1 is characterized in that: said cooling pad comprises the metal of tool heat dissipation characteristics.
4. computer equipment as claimed in claim 1 is characterized in that: folding is provided with a metal clips, the said metal shell of said metal clips butt on the said metallic heat radiating plate.
5. computer equipment as claimed in claim 4 is characterized in that: said metal clips comprises a rake and the abutting part from said rake extension from the oblique extension of said metallic heat radiating plate, the said metal shell of abutting part butt of said metal clips.
6. computer equipment as claimed in claim 4 is characterized in that: said metal clips is curved.
7. computer equipment as claimed in claim 1 is characterized in that: said central processing unit is installed on the front or the back side of said mainboard.
8. computer equipment; Comprise that a mainboard and is installed on the central processing unit on this mainboard; It is characterized in that: a metallic heat radiating plate is housed on the said central processing unit, and said metallic heat radiating plate comprises a plate body and a support chip from said plate body extension, and said mainboard is provided with ground pad; The said ground pad of support chip butt of said metallic heat radiating plate is equiped with a cooling pad to reach the effect that prevents electromagnetic interference (EMI) between the plate body of said metallic heat radiating plate and the said central processing unit.
9. computer equipment as claimed in claim 8 is characterized in that: said cooling pad comprises thermal grease and is mixed in the metallic particles in the said thermal grease.
10. computer equipment as claimed in claim 8; It is characterized in that: the support chip of said metallic heat radiating plate comprises one from the vertically extending support portion of said plate body and one from the terminal vertically extending butt limit of said support portion, the said ground pad of butt limit butt of said support chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110105296XA CN102759958A (en) | 2011-04-26 | 2011-04-26 | Computer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110105296XA CN102759958A (en) | 2011-04-26 | 2011-04-26 | Computer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102759958A true CN102759958A (en) | 2012-10-31 |
Family
ID=47054433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110105296XA Pending CN102759958A (en) | 2011-04-26 | 2011-04-26 | Computer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102759958A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106876347A (en) * | 2015-12-11 | 2017-06-20 | 青岛海尔多媒体有限公司 | A kind of peripheral module and peripheral module attachment means |
| CN107031257A (en) * | 2017-05-16 | 2017-08-11 | 安庆市宏大涛业精啄数控科技有限公司 | A kind of engraving machine dustproof heat abstractor |
| CN110099309A (en) * | 2018-01-31 | 2019-08-06 | 瞻博网络公司 | For combining the optical module in telecommunication apparatus to mitigate the devices, systems, and methods of electromagnetic noise |
| CN108693930B (en) * | 2017-04-11 | 2021-10-08 | 技嘉科技股份有限公司 | Radiator upspring structure and connector module |
-
2011
- 2011-04-26 CN CN201110105296XA patent/CN102759958A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106876347A (en) * | 2015-12-11 | 2017-06-20 | 青岛海尔多媒体有限公司 | A kind of peripheral module and peripheral module attachment means |
| CN106876347B (en) * | 2015-12-11 | 2019-05-21 | 青岛海尔多媒体有限公司 | A kind of peripheral module and peripheral module attachment device |
| CN108693930B (en) * | 2017-04-11 | 2021-10-08 | 技嘉科技股份有限公司 | Radiator upspring structure and connector module |
| CN107031257A (en) * | 2017-05-16 | 2017-08-11 | 安庆市宏大涛业精啄数控科技有限公司 | A kind of engraving machine dustproof heat abstractor |
| CN107031257B (en) * | 2017-05-16 | 2018-11-27 | 安庆市宏大涛业精啄数控科技有限公司 | A kind of engraving machine dustproof radiator |
| CN110099309A (en) * | 2018-01-31 | 2019-08-06 | 瞻博网络公司 | For combining the optical module in telecommunication apparatus to mitigate the devices, systems, and methods of electromagnetic noise |
| CN110099309B (en) * | 2018-01-31 | 2022-05-31 | 瞻博网络公司 | Apparatus, system and method for mitigating electromagnetic noise in conjunction with optical modules in telecommunications equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121031 |