CN102753332A - Measurement method and condition setting method for cross-linking density of a tested body, laminate treatment method for a laminate plate processing product, measurement device and adjusting device for cross-linking density of a tested body - Google Patents

Measurement method and condition setting method for cross-linking density of a tested body, laminate treatment method for a laminate plate processing product, measurement device and adjusting device for cross-linking density of a tested body Download PDF

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Publication number
CN102753332A
CN102753332A CN2011800088924A CN201180008892A CN102753332A CN 102753332 A CN102753332 A CN 102753332A CN 2011800088924 A CN2011800088924 A CN 2011800088924A CN 201180008892 A CN201180008892 A CN 201180008892A CN 102753332 A CN102753332 A CN 102753332A
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China
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mentioned
crosslink density
thin slice
lamination process
substrate
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仲滨秀齐
饭田浩贵
中野裕嗣
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Nisshinbo Holdings Inc
Nisshinbo Mechatronics Inc
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Nisshinbo Holdings Inc
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Publication of CN102753332A publication Critical patent/CN102753332A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/44—Resins; rubber; leather
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/82—Testing the joint
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Abstract

The disclosed method and device for rapidly analysing cross-link density enable the easy and accurate measurement of cross-link density in the lamination process. An object (1A) to be tested is prepared by sandwiching a sheet for measuring cross-link density between a transparent substrate and a rear surface material. The object (1A) to be tested is placed in a lamination means (100) and lamination is implemented. The object (1A) to be tested is taken out from the lamination means (100), the transparent substrate and rear surface material are detached from the sheet for measuring cross-link density, and the sheet for measuring cross-link density is removed. A reference point and at least one comparison point on the sheet for measuring cross-link density are chosen and the cross-link density of the points is measured. The sheet for measuring cross-link density exhibits a cross-linking reaction by lamination and bonds with neither the transparent substrate nor the rear surface material by the cross-linking reaction.

Description

By the lamination treatment method of measuring method, the condition enactment method of being tested the crosslink density of body of the crosslink density of test body, lamination process product, tested the crosslink density of body measurement mechanism, tested the adjusting device of the crosslink density of body
Technical field
The present invention relates to a kind ofly be used to make the technology of lamination process product and make required measuring technique and adjustment technology.
Background technology
In recent years, as green energy resource, solar cell receives publicity, and, well-known have a kind of with products such as solar cells as the lamination process product of so-called " lamination process " and the technology of making.Usually; Solar cell is supplied with the such mode of solar module; This solar module is to be shaped through implementing following lamination treatment: the lamination process product is carried put on the heating plate of laminater, Yi Bian utilize barrier film (diaphragm) to carry out cramping (hereinafter to be referred as making " lamination treatment " on one side in laminater, carry out heat treated in a vacuum.In this manual too), this lamination process product is between transparency carrier that is made up of glass, fluororesin etc. and the backing material that formed by P ET resin etc., to sandwich semiconductor substrates such as silicon photocell and ethylene-vinyl acetate copolymer resin packing materials such as (EVA) and they are cascaded.At this, in above-mentioned heat treated and pressurized treatments, so-called cross-linking reaction can take place and form covalent bond in packing material, thus the function (for example with reference to patent documentation 1) of performance sealing semiconductor substrate.If carry out this cross-linking reaction fully, even then transparent base and expand contraction mutually bonding with packing material, both also can not peel off, and can not receive the influence of the temperature difference in the environment for use of solar cell.In addition, the known in the past technology (for example with reference to patent documentation 2) that has a kind of crosslinked condition to keep watch on and carry out as required the change etc. of crosslinked condition to the lamination treatment in the laminater.
Patent documentation 1: TOHKEMY 2009-201777 communique
Patent documentation 2: TOHKEMY 2009-165898 communique
But usually, when in laminater, carrying out lamination treatment, the lamination process product has produced the temperature difference of each position.Particularly, owing to the warpage that the thermal expansion that is accompanied by transparency carrier produces, the periphery of transparency carrier, four jiaos the most variation of conducted state of heat.Its result, formed lamination process product also exist be easy to produce periphery, four jiaos crosslink density reduces, the crosslink density of central portion so such problem of deviation because of the different crosslink densities that produce in position that raises.
On the other hand, because packing material has along with crosslink density its sealing that rises improves because of elasticity, but the opposite if too high characteristic that then can become fragile of sealing, therefore, common filling materials has and the corresponding best crosslink density of its purpose.Yet; In the invention that patent documentation 1 and 2 is put down in writing; Owing to there is not the structure of optimized adjustment of conducted state and crosslink density of the heat of this each position that is used to be suitable for the lamination process product; Therefore there is in order to make high-quality product operator's the burden excessive such problem that is easy to become.
In addition, in the invention that patent documentation 1 and 2 is put down in writing, when packing material generation cross-linking reaction; Packing material and transparency carrier covalent bond such as EVA are therefore in the invention that patent documentation 1 and 2 is put down in writing, under the situation that crosslink density is measured; There is following problem: in order to separate mutually bonding transparency carrier and packing material; Need to destroy the lamination converted products, the operator's that breakdown operation and measurement and affirmation crosslink density are required operation is excessive, and the startup of production line is slack-off.
Summary of the invention
The present invention accomplishes in view of the above problems; Its problem is to provide a kind of and can measures and can promptly resolve crosslink density the crosslink density in the lamination treatment of lamination process product especially easily and accurately, thus can promptly realize high-quality lamination process product production line startup by the lamination treatment method of measuring method, the condition enactment method of being tested the crosslink density of body of the crosslink density of test body, lamination process product, tested the crosslink density of body measurement mechanism, tested the adjusting device of the crosslink density of body.
In order to realize this problem; The above-mentioned measuring method by the crosslink density of test body of the 1st technical scheme is characterised in that; Comprise following operation: the preparation quilt is tested the operation of body, and this is tested body and cascades with thin slice and to them through utilizing first substrate and relative second substrate that disposes with above-mentioned first substrate to sandwich tabular crosslink density measurement; Be configured on the lamination process parts by the test body above-mentioned, to above-mentioned operation of being carried out the lamination treatment of heat treated and pressurized treatments behind at least a portion formation vacuum state of test body enforcement with above-mentioned lamination process parts; From above-mentioned lamination process parts, take out and accomplished the above-mentioned of above-mentioned lamination treatment, take out the operation of above-mentioned crosslink density measurement with thin slice through above-mentioned first substrate and above-mentioned second substrate are peeled off with thin slice from above-mentioned crosslink density measurement by the test body; And on the above-mentioned crosslink density of above-mentioned taking-up is measured with thin slice selected reference position and at least one comparison position and measure the operation of the crosslink density of said reference position and above-mentioned comparison position; Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.
Adopt the 1st technical scheme, can easily compare contrast being measured by the crosslink density of a plurality of positions of test body to this a plurality of positions relative crosslink density each other.In addition; The identical cross-linking reaction of packing material with the lamination process product of the reality of using lamination treatment to make can be obtained, and first substrate can be do not destroyed and the second substrate ground is easily peeled off them and take out the crosslink density measurement that cross-linking reaction has taken place and use thin slice.Thus; Can measure the crosslink density in the lamination treatment of lamination process product especially easily and accurately; And can promptly resolve, thereby can promptly realize the startup of the production line of high-quality lamination process product crosslink density.
According to the 1st technical scheme; The above-mentioned measuring method by the crosslink density of test body of the 2nd technical scheme is characterised in that this measuring method of being tested the crosslink density of body comprises the operation whether crosslink density of above-mentioned comparison position is judged with respect to the ratio of the crosslink density of said reference position in the permissible range of regulation.Adopt the 2nd technical scheme, can easily reduce the deviation of the crosslink density that the difference because of the position of lamination process product produces, easily regularization condition is set and is made lamination process product integral body become best crosslink density.Thus, the lamination process product can easily obtain to obtain higher sealing by elasticity and can not become fragile, proper crosslinking density.So, can make high-quality lamination process product.
According to the 1st technical scheme or the 2nd technical scheme, the above-mentioned measuring method by the crosslink density of test body of the 3rd technical scheme is characterised in that the said reference position is that above-mentioned crosslink density is measured the substantial middle portion with thin slice.Adopting the 3rd technical scheme, can be that benchmark is adjusted crosslink density with the position that can obtain better crosslink density, can easily make the good such adjustment that becomes of the whole crosslink density of lamination process product.
According to the 2nd technical scheme or the 3rd technical scheme, the above-mentioned measuring method by the crosslink density of test body of the 4th technical scheme is characterised in that the permissible range of afore mentioned rules is meant more than the specific ratio.Adopt the 4th technical scheme, the permissible range of regulation is meant more than the specific ratio, thus, can more easily make the good such adjustment that becomes of the whole crosslink density of lamination process product.
According in the 1st technical scheme to the 4 technical schemes each, the above-mentioned measuring method by the crosslink density of test body of the 5th technical scheme is characterised in that above-mentioned lamination process parts are the laminater of solar module manufacturing usefulness.Adopt the 5th technical scheme, the lamination process parts are the laminater of solar module manufacturing usefulness, thus, can make high-quality solar module.
The above-mentioned condition enactment method by the crosslink density of test body of the 6th technical scheme is characterised in that; This condition enactment method of being tested the crosslink density of body comprises following operation: obtain and utilize in the 2nd technical scheme to the 5 technical schemes each described by the aforementioned proportion of the crosslink density of the above-mentioned comparison position that measuring method obtained of the crosslink density of test body with respect to the crosslink density of said reference position; Under the situation in the permissible range that aforementioned proportion is not being stipulated; Through adjustment to above-mentioned that implemented by the test body, at least a portion of lamination process parts is formed the defined terms of being carried out the lamination treatment of heat treated and pressurized treatments behind the vacuum states, thereby aforementioned proportion adjusted to the operation in the permissible range of afore mentioned rules.Adopt the 6th technical scheme; Utilize by the proportional meter of the crosslink density of the crosslink density of the reference position of test body and comparison position and calculate both difference; And this ratio adjusted in the permissible range of regulation, thereby can easily make by the whole crosslink density of test body near the such adjustment of the crosslink density of reference position.So, can easily reduce the deviation of the crosslink density that the difference because of the position of lamination process product produces, easily regularization condition is set and is made lamination process product integral body become best crosslink density.Thus, the lamination process product can easily obtain to obtain higher sealing by elasticity and can not become fragile, proper crosslinking density.So, can make high-quality lamination process product.
According to the 6th technical scheme; The above-mentioned condition enactment method by the crosslink density of test body of the 7th technical scheme is characterised in that the condition of afore mentioned rules is temperature, pressure, any at least condition in the processing time of the above-mentioned lamination treatment in the above-mentioned lamination process parts.Adopt the 7th technical scheme,, can easily make by the crosslink density of test body integral body near the such adjustment of the crosslink density of reference position through changing the factor that can in heat treated and pressurized treatments, change.
The lamination treatment method of the lamination process product of the 8th technical scheme is implemented at least a portion with the lamination process parts to the lamination process product and is formed the lamination treatment of carrying out heat treated and pressurized treatments behind the vacuum state; This lamination process product through utilize first substrate and with above-mentioned first substrate relatively second base plate seals of configuration comprise packing material the lamination process product content and they are cascaded; It is characterized in that the lamination treatment method of this lamination process product comprises following operation: the measurement operation of utilizing any measuring method of being tested the crosslink density of body in the 1st technical scheme to the 5 technical schemes to carry out; The condition enactment operation of utilizing the condition enactment method of crosslink density by the test body of the 6th technical scheme or the 7th technical scheme to carry out; Adjustment lamination process component condition is set, and makes it possible to be carried out the operation of above-mentioned lamination treatment by the adjusted above-mentioned crosslink density of above-mentioned condition enactment operation; And utilize above-mentioned adjusted above-mentioned lamination process parts above-mentioned lamination process product to be carried out the operation of above-mentioned lamination treatment; Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.Adopt the 8th technical scheme; Can measure the crosslink density in the lamination treatment of lamination process product simply; And can easily reduce the deviation of the crosslink density that the difference because of the position produces; Easily regularization condition is set and is made lamination process product integral body become best crosslink density, can make high-quality lamination process product.
The measurement mechanism by the crosslink density of test body of the 9th technical scheme is prepared by the test body; This tested body utilize first substrate and with above-mentioned first substrate relatively second substrate of configuration sandwich tabular crosslink density and measure and cascade with thin slice and to them; This measurement mechanism of being tested the crosslink density of body forms the above-mentioned by the test body of the lamination treatment of carrying out heat treated and pressurized treatments behind the vacuum state to having implemented with at least a portion of lamination process parts; Carry out the measurement of crosslink density; It is characterized in that, comprising: the lamination process parts, it is carried out above-mentioned lamination treatment to above-mentioned by the test body; Crosslink density is measured and is obtained parts with thin slice; It takes out has accomplished above-mentioned lamination treatment above-mentioned by the test body from above-mentioned lamination process parts, take out above-mentioned crosslink density and measure and use thin slice through making above-mentioned first substrate and above-mentioned second substrate measure to peel off with thin slice from above-mentioned crosslink density; And the crosslink density measurement component, the crosslink density that it is selected reference position and at least one comparison position and measure said reference position and above-mentioned comparison position on the above-mentioned crosslink density that utilizes above-mentioned crosslink density measurement to obtain the parts taking-up with thin slice is measured with thin slice; Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.Adopt the 9th technical scheme, can play the effect identical with the 1st technical scheme.
The adjusting device by the crosslink density of test body of the 10th technical scheme is prepared by the test body; This is tested body and is cascaded with thin slice and to them through utilizing first substrate and relative second substrate that disposes with above-mentioned first substrate to sandwich tabular crosslink density measurement; This adjusting device of being tested the crosslink density of body carries out in the employed above-mentioned lamination process parts of lamination treatment of heat treated and pressurized treatments after at least a portion with the lamination process parts forms vacuum state; The crosslink density by the test body in the above-mentioned lamination treatment process is adjusted; It is characterized in that, comprising: above-mentioned lamination process parts; Crosslink density is measured and is obtained parts with thin slice; It takes out has accomplished above-mentioned lamination treatment above-mentioned by the test body from above-mentioned lamination process parts, take out above-mentioned crosslink density and measure and use thin slice through making above-mentioned first substrate and above-mentioned second substrate measure to peel off with thin slice from above-mentioned crosslink density; The crosslink density measurement component, the crosslink density that it is selected reference position and at least one comparison position and measure said reference position and above-mentioned comparison position on the above-mentioned crosslink density that utilizes above-mentioned crosslink density measurement to obtain the parts taking-up with thin slice is measured with thin slice; The crosslink density analysis component, whether it judges in the permissible range of regulation with respect to the ratio of the crosslink density of said reference position utilizing above-mentioned crosslink density measurement component crosslink density that measure, above-mentioned comparison position; And lamination process condition enactment parts; It is according to the judged result of crosslink density analysis component;, through adjusting the defined terms of above-mentioned lamination treatment, thereby aforementioned proportion is adjusted in the permissible range of afore mentioned rules not under the situation in the permissible range of regulation at aforementioned proportion; Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.Adopt the 10th technical scheme, can play the effect identical with the 6th technical scheme.
Description of drawings
Fig. 1 is the cutaway view of a structure example of the solar module in this embodiment of expression.
(a) of Fig. 2 is the cutaway view of the structure of being tested body in this embodiment of expression, and (b) of Fig. 2 is that the crosslink density in this embodiment is measured the cutaway view with thin slice.
Fig. 3 is the functional block diagram of measurement Adjustment System of the crosslink density of this embodiment.
Fig. 4 is the integrally-built figure of the lamination process parts of this embodiment of expression.
Fig. 5 is to carried out the sectional view of the lamination portion of lamination by test body, solar module in the lamination process parts of this embodiment.
Fig. 6 is the sectional view of lamination process parts when lamination treatment of this embodiment.
Fig. 7 is the flow chart of operation of measurement Adjustment System of the crosslink density of this embodiment of expression.
Fig. 8 be expression in this embodiment by the test body, utilize transparency carrier and backing material to sandwich the cutaway view of crosslink density measurement with the state of thin slice.
Fig. 9 be expression in this embodiment by the test body, after lamination treatment, draw back transparency carrier and backing material respectively and make them measure the cutaway view of the state that strips down with thin slice from crosslink density.
Figure 10 be schematically show in this embodiment, on crosslink density is measured with thin slice selected reference position and comparison position and obtain the figure of the state of measured sheet.
Description of reference numerals
1 crosslink density is measured and is used thin slice; 1A is tested body; 1B 1Dummy block will (reference position); 1B 2, 1B 6, 1B 31, 1B 35Dummy block will (comparison position); 10 solar modules (lamination process product); 11 transparency carriers (first substrate); 12 backing materials (second substrate); 13,14 packing materials (content); 15 tandems (string) (content); 100 lamination process parts; 400 crosslink densities are measured and are obtained parts with thin slice; 500 crosslink density measurement components; 600 crosslink density analysis component; 700 lamination process condition enactment parts.
The specific embodiment
Based on Fig. 1～Figure 10 embodiment of the present invention is described.
<1>The lamination process product
At first, explain in this embodiment as object, as the solar module of lamination process product and be used to measure crosslink density by the test body.
Fig. 1 be expression in this embodiment, that used the crystal class element, as the cutaway view of a structure example of the solar module of " lamination process product ".This solar module 10 is in the lamination process parts (afterwards stating) of the measurement Adjustment System (afterwards stating) that constitutes this embodiment, to make to form.Solar module 10 has the transparency carrier 11 and and configuration, conduct " second substrate " the relatively backing material 12 of transparency carrier 11 of conduct " first substrate ".Between transparency carrier 11 and backing material 12, be sealed with packing material 13,14, tandem 15 as " content ".In packing material 13,14, use EVA (ethene-vinyl acetate) resin, PVB (polyvinyl butyral resin) resin etc.Tandem 15 is at electrode 16, connects the structure that the solar cell device 18 as the crystal class element forms by lead-in wire 19 between 17.
<2>By the test body
On the other hand, Fig. 2 (a) is the cutaway view of the structure of being tested body 1A in this embodiment of expression.This is tested body 1A and is used for measuring crosslink density at the lamination process parts (afterwards stating) of the measurement Adjustment System (afterwards stating) that constitutes this embodiment.1A is identical with solar module 10 shown in Figure 1 for quilt test body, the backing material 12 that has transparency carrier 11 and dispose relatively with transparency carrier 11.And, utilize transparency carrier 11 and backing material 12 to sandwich crosslink density and measure with thin slice 1 and carry out range upon range of with thin slice 1, backing material 12 this transparency carrier 11, crosslink density measurement.
<3>Thin slice is used in the crosslink density measurement
On the other hand, Fig. 2 (b) is that the crosslink density of expression in this embodiment measured the cutaway view with the structure of thin slice 1.It is 0.1 * 10 that this crosslink density measurement uses thin slice 1 on supporting mass 2, to have crosslink density -4Mol/cc～10 * 10 -4The rubber sheet layer 3 of mol/cc, and be tabular.As supporting mass 2, get final product so long as under the temperature of investigation Temperature Distribution, have the thin slice base material of the hear resistance that can keep shape, anti-intensity, can use any material.For example, can consider to use plastic tab, paper, synthetic paper, nonwoven, sheet metal etc.On the other hand; As rubber sheet layer 3, can use with the different polypropylene of cis-to be the natural rubber of main component or ACM (ACM), acrylonitrile-butadiene rubber (NBR), isoprene rubber (IR), polyurethane rubber (U), EP rubbers (ECM, EPDM), chlorohydrin rubber (CO, ECO), neoprene (CR), silicon rubber (Q), butadiene-styrene rubber (SBR), butadiene rubber (BR), fluorubber (FKM), butyl rubber synthetic rubber such as (IIR).In addition, rubber sheet layer 3 also can, copolymerization mixing with other resin combinations so long as rubber constituent becomes main component gets final product.
In addition, crosslink density measure thickness with thin slice 1 form with the thickness of the part of the packing material 13,14 of solar module 10 and tandem 15 about equally.That is, in this embodiment, the thickness that crosslink density is measured with thin slice 1 forms about 1mm.But, also can form the thickness about 2mm～3mm.
In addition, crosslink density is measured with thin slice 1 has packing material 13,14 other crosslink densities of ad eundem with solar module 10, expects that it forms the crosslink density roughly the same with packing material 13,14 in the lamination treatment of lamination process parts.Particularly, expect that it is 0.1 * 10 -4Mol/cc～10 * 10 -4The crosslink density of mol/cc.
And the expectation crosslink density is measured with the supporting mass 2 of thin slice 1 and rubber sheet layer 3 and is formed by following material, that is, even, all can not produce bonding material with transparency carrier 11 and backing material 12 because this crosslink density is measured the cross-linking reaction with thin slice 1 yet.That is, the filler of expectation as the silane coupled material of the packing material that is filled in solar module 10 usually 13,14 can not be mixed into the crosslink density measurement with in the thin slice 1.
<4>The measurement Adjustment System of the crosslink density of this embodiment (is tested body The adjusting device of the crosslink density of the measurement mechanism of crosslink density and quilt test body) knot Structure
Fig. 3 is the functional block diagram of measurement Adjustment System 100A of the crosslink density of this embodiment.As shown in the drawing, the measurement Adjustment System 100A of the crosslink density of this embodiment comprises that lamination process parts 100, crosslink density are measured and obtains parts 400, crosslink density measurement component 500, crosslink density analysis component 600 and lamination process condition enactment parts 700 with thin slice.
In addition, the measurement mechanism of being tested the crosslink density of body of the present invention is realized with the structure that thin slice obtains parts 400 and crosslink density measurement component 500 by lamination process parts 100, crosslink density measurement.In addition, the adjusting device of being tested the crosslink density of body of the present invention is realized with the structure that thin slice obtains parts 400, crosslink density measurement component 500, crosslink density analysis component 600 and lamination process condition enactment parts 700 by lamination process parts 100, crosslink density measurement.
<4-4-1>The lamination process parts
Lamination process parts 100 can use the laminater of solar module manufacturing usefulness.Lamination process parts 100 are used for solar module 10, quilt are tested body 1A and carried out lamination treatment.After state the concrete structure to lamination process parts 100 described.
<4-1-2>The detailed structure of lamination process parts
Fig. 4 is the integrally-built figure of the lamination process parts 100 of this embodiment of expression.Lamination process parts 100 have upper shell 110, lower house 120 and conveyer belt 130.The solar module 10 by before test body 1A, the enforcement lamination treatment that conveyer belt 130 will be implemented before the lamination treatment is transported between upper shell 110 and the lower house 120.On lamination process parts 100, be provided be used for implement before the lamination treatment be transported to lamination process parts 100 by test body 1A, solar module 10 move into conveyer 200.In addition, taken out of conveyer 300 by test body 1A, solar module 10 after being used for taking out of lamination being provided with on the lamination process parts 100 from lamination process parts 100.Move into conveyer 200 and take out of conveyer 300 setting that links to each other.Be handed off to conveyer belt 130 by test body 1A, solar module 10 from moving into conveyer 200, and be handed off to from conveyer belt 130 and take out of conveyer 300.In addition, on lamination process parts 100, be provided with the lowering or hoisting gear (not shown) that upper shell 110 is gone up and down with respect to lower house 120 with keeping level.
Fig. 5 is to carried out the sectional view of the lamination portion 101 of lamination by test body 1A, solar module 10 in lamination process parts 100.Fig. 6 is the sectional views of lamination process parts 100 when lamination treatment.
In upper shell 110, be formed with the space that opening downwards forms.Mode with the horizontal subdivision space in this space is provided with barrier film 112.Barrier film 112 has stable on heating rubber molding by silicon class rubber etc.In upper shell 110, be formed with the space (upper chamber 113) that is separated by barrier film 112.
In addition, be connected with upper chamber 113 and be used in upper chamber 113 air inlet and the air intake-exhaust mouth 114 of exhaust in the upper chamber 113 being provided with on the upper surface of upper shell 110.
In lower house 120, be formed with to above the space (lower chambers 121) that forms of opening.In this space, be provided with heating plate 122 (flat heater).Heating plate 122 is arranged at the bottom surface of lower house 120 by setting support member supports with the mode that keeps level.In this case, heating plate 122 is supported with the mode that its surface becomes with the roughly the same height of the opening surface of lower chambers 121.
In addition, be connected with lower chambers 121 and be used in lower chambers 121 air inlet and the air intake-exhaust mouth 123 of exhaust in the lower chambers 121 being provided with on the lower surface of lower house 120.
Between upper shell 110 and lower house 120 and above hot plate 122, be provided with conveyer belt 130 with the mode that moves freely.Conveyer belt 130 from Fig. 4 move into conveyer 200 receive before the lamination treatment by test body 1A, solar module 10, exactly with its be transported to lamination portion 101 middle position, be the central portion of heating plate 122.In addition, conveyer belt 130 with after the lamination treatment be handed off to Fig. 4 by test body 1A, solar module 10 take out of conveyer 300.
In addition, between upper shell 110 and lower house 120 and above conveyer belt 130, be provided with and be used to prevent that the packing material of fusion is attached to the peeling sheet 140 of barrier film.
<4-2>Crosslink density is measured and is obtained parts with thin slice
Crosslink density shown in Figure 3 measure with thin slice obtain parts 400 from the lamination process parts, takes out accomplished lamination treatment by test body 1A, form this transparency carrier 11 of being tested body and backing material 12 and measure to peel off from crosslink density and take out the crosslink density measurement through making with thin slice 1 with thin slice 1.
Crosslink density is measured and to be obtained parts 400 with thin slice and be provided with and be used for measuring with the required structure of thin slice 1 from implemented the crosslink density that taken out by test body 1A lamination treatment, that be used for measuring crosslink density at lamination process parts 100.For example, be provided with and be used for drawing back respectively by the transparency carrier 11 of test body 1A and backing material 12 and from extracting the crosslink density measurement between transparency carrier 11 and the backing material 12 out with the mechanism of thin slice 1, the control assembly that is used to make this mechanism action, driver etc.
<4-3>The crosslink density measurement component
Crosslink density measurement component 500 shown in Figure 3 is selected the crosslink density of a reference position and at least one comparison position and measuring basis position and comparison position on the crosslink density that utilizes the crosslink density measurement to obtain parts 400 taking-ups with thin slice is measured with thin slice 1.
Crosslink density measurement component 500 is provided with and is used to measure the crosslink density required structure of crosslink density measurement with each position of thin slice 1.Particularly, be provided with the images of positions processing mechanism that is used for specified measurement crosslink density on crosslink density is measured with thin slice 1 etc.
<4-4>Crosslink density analysis component 、<4-5>Lamination process condition enactment parts
Whether 600 pairs of crosslink density analysis component shown in Figure 3 crosslink density that measure, comparison position in crosslink density measurement component 500 is judged in the permissible range of regulation with respect to the ratio of the crosslink density of reference position.
Lamination process condition enactment parts 700 obtain the ratio of being judged by crosslink density analysis component 600; Under the situation in the permissible range that this ratio is not being stipulated; Through the defined terms of adjustment lamination treatment, thereby aforementioned proportion is adjusted in the permissible range of regulation.
Crosslink density analysis component 600 shown in Figure 3 and lamination process condition enactment parts 700 have at least one CPU respectively, carry out the processing of various data, the calculating of numerical value.Particularly; A plurality of measured values that crosslink density analysis component 600 obtains according to the measurement through crosslink density measurement component 500, the ratio of the crosslink density of a selected respectively reference position and comparison position and calculating reference position and the crosslink density of comparison position.Lamination process condition enactment parts 700 are adjusted the heating condition of lamination process parts 100 according to each numerical value that the crosslink density analysis component calculates.
<5>The process flow of the measurement Adjustment System of the crosslink density of this embodiment
The operation of this embodiment then, is described.Fig. 7 is the flow chart of operation of measurement Adjustment System 100A of the crosslink density of this embodiment of expression.Below, use the operation of the measurement Adjustment System 100A of this flowchart text crosslink density.
Step S1
At first; The person of utilization of the measurement Adjustment System 100A of crosslink density measures transparency carrier shown in Figure 2 11, backing material 12 and crosslink density with thin slice 1 alignment; And use these members, prepare shown in Figure 8, utilize transparency carrier 11 and backing material 12 to sandwich crosslink density to measure with what thin slice 1 formed and tested body 1A (step S1).
Step S2
Then, ready being carried by test body 1A put moving on the conveyer 200 at lamination process parts 100.To be handed off on the conveyer belt 130 from moving into conveyer 200 by test body 1A.Thus, as shown in Figure 5, conveyer belt 130 will be transported to the middle position of lamination portion 101 by test body 1A, and it is configured in this position (step S2).In addition, the measurement Adjustment System 100A of crosslink density also can constitute not use and move into conveyer 200 and will directly be configured in the lamination portion 101 by test body 1A.Under this state, lowering or hoisting gear descends upper shell 110.Thus, as shown in Figure 6, in the inside of upper shell 110 with lower house 120, upper chamber 113 and lower chambers 121 are retained as air-tight state respectively.
Step S3
Then, 100 pairs of quilt tests of lamination process parts body 1A carries out lamination treatment (step S3).Particularly, carry out vacuum draw in the 114 pairs of upper chamber 113 of air intake-exhaust mouth via upper shell 110.Likewise, carry out vacuum draw in lamination process parts 100 123 pairs of lower chambers 121 of air intake-exhaust mouth via lower house 120.
Tested body 1A and be included in by the crosslink density measurement of the inside of test body 1A and carry out heat treated with thin slice 1 by each heater module that constitutes heating plate 122, crosslink density is measured and is presented cross-linking reaction with thin slice 1 through this lamination treatment.
Then, the vacuum state ground of lamination process parts 100 maintenance lower chambers 121 imports to upper chamber 113 via the air intake-exhaust mouth 114 of upper shell 110 with atmosphere.Thus, between upper chamber 113 and lower chambers 121, produce draught head and barrier film 112 is released downwards, thereby utilize barrier film 112 and heating plate 122 crampings released to be tested body 1A downwards.
After lamination treatment finished, lamination process parts 100 imported to lower chambers 121 via the air intake-exhaust mouth 123 of lower house 120 with atmosphere.At this moment, lowering or hoisting gear rises upper shell 110, and conveyer belt 130 is taken out of conveyer 300 with being handed off to by test body 1A after the lamination treatment.In addition, the measurement Adjustment System 100A of crosslink density also can constitute not use and take out of conveyer 300 and from lamination portion 101, directly take out by test body 1A.
Step S4
Then, crosslink density is measured and to be obtained the crosslink density that test body 1A taken out lamination treatment after of parts 400 on taking out of conveyer 300 with thin slice and measure with thin slice 1 (step S4).Promptly; As shown in Figure 9; Crosslink density is measured and to be obtained parts 400 with thin slice and draw back respectively and by the transparency carrier 11 of test body 1A and backing material 12 they are measured to peel off with thin slice 1 from crosslink density, from extraction crosslink density measurement between transparency carrier 11 and the backing material 12 with thin slice 1 with its taking-up.Crosslink density is measured with thin slice 1 and is presented cross-linking reaction through lamination treatment; But all can not produce bonding because of this cross-linking reaction with transparency carrier 11 and backing material 12; Therefore; Can be easily transparency carrier 11 and backing material 12 be measured from crosslink density respectively and draw back with thin slice 1, can not destroy by test body 1A and easily only take out present cross-linking reaction the crosslink density measurement with thin slice 1.
Step S5
Then, crosslink density measurement component 500 is selected reference position and comparison position on the crosslink density that takes out is measured with thin slice 1, and measures the crosslink density (step S5) of this reference position and comparison position.
The specific embodiment of step S 5
Figure 10 is shown schematically in crosslink density to measure with selected reference position and comparison position on the thin slice 1 and obtain the figure of the state of measured sheet.Particularly, as shown in the drawing,, crosslink density sets n (n>=1, n=35 in Figure 10) dummy block will 1B on measuring with thin slice 1 1, 1B 2, 1B 3... 1B n, (in Figure 10, be to be positioned at crosslink density to measure four jiaos dummy block will 1B with thin slice 1 to the dummy block will of appointment 2, 1B 6, 1B N-4, 1B nAnd be positioned at the dummy block will 1B of substantial middle portion 1) the measurement crosslink density.Below, be that example describes with the situation of n=35 shown in Figure 10.
In this embodiment, will measure the dummy block will 1B of crosslink density 2, 1B 6, 1B 31, 1B 35And be positioned at central authorities dummy block will 1B 1In a dummy block will as the reference position, other at least one dummy block will as comparison position, are analyzed crosslink density.Thereby; Expectation will be included in measure become benchmark when crosslink density is measured the crosslink density with thin slice 1 the position in an interior dummy block will as the reference position, the position that the relation between desire utilization and the reference position of will comprising seeks to adjust crosslink density in interior one or more dummy block will as comparison position.
Then, in this embodiment, the reference position is chosen to be as crosslink density and measures the dummy block will 1B with the substantial middle portion of thin slice 1 1, comparison position is chosen to be and is positioned at four jiao the dummy block will 1B of crosslink density measurement with thin slice 1 2, 1B 6, 1B 31, 1B 35So selected reason is that when making solar module 10, substantial middle portion is the position that crosslink density raises the most easily, and comprising four jiaos is the position that crosslink density reduces the most easily at interior periphery.That is, measure the crosslink density that the substantial middle portion uses thin slice 1 seeks to adjust periphery as benchmark with crosslink density and can reduce the deviation of the crosslink density that when making solar module 10, produces, so be effective.
But the selected aforesaid way that is not limited to of reference position, comparison position so long as can reduce the position of the deviation of the crosslink density that when making solar module 10, produces easily, just can be chosen to be reference position and comparison position with the optional position.That is the dummy block will 1B of reference position, 1Also can be that crosslink density is measured the position except that substantial middle portion with thin slice 1, for example also can be the upper left dummy block will 1B among Figure 10 2The position, comparison position also can be that crosslink density is measured the position except that peripheral part with thin slice 1, for example also can be with the dummy block will 1B substantial middle portion of thin slice 1, among Figure 10 as the crosslink density measurement 1Position etc.
And in this embodiment, making comparison position is dummy block will 1B 2, 1B 6, 1B 31, 1B 35This 4 point, but comparison position both can also can be less than 4 points more than 4.
In this embodiment, utilize known swelling method that the crosslink density of reference position and comparison position is measured.Therefore, shown in figure 10, crosslink density measurement component 500 is from the dummy block will 1B of reference position 1Substantial middle and the dummy block will 1B of comparison position 2, 1B 6, 1B 31, 1B 35Substantial middle cut out respectively suitable size, the measured sheet 1C about 1 centimeter square for example 1, 1C 2, 1C 6, 1C 31, 1C 35Then, to these measured sheet 1C 1, 1C 2, 1C 6, 1C 31, 1C 35Carry out known swell test respectively, measure crosslink density.
In addition, crosslink density measurement component 500 also can utilize any measuring method except that swelling method to measure crosslink density.For example, the crosslink density can also be envisaged to use a known measurement section 500 pulse NMR method (Japanese Rubber Association Journals: VOL? 78,255 (2005), Lu Yan Yan, who also Nagata, etc.), measuring crosslink density.Under the situation that packing material 13,14 is formed by the EVA resin; Because packing material 13,14 can be because of the cross-linking reaction crystallization; Therefore can't utilize the PULSED NMR method to measure; But do not have crystal because the crosslink density of this embodiment is measured with thin slice 1, therefore can utilize the PULSED NMR method to measure.In addition, under the situation of utilizing the PULSED NMR method to measure, can therefore need not to cut out respectively measured sheet 1C directly measuring from taking out between transparency carrier 11 and the backing material 12 under the state of crosslink density measurement with thin slice 1 1, 1C 2, 1C 6, 1C 31, 1C 35Just can measure, thereby can seek the simplified measurement operation.
Step S6
Then, whether 600 pairs of crosslink density analysis component crosslink density that measure, comparison position in crosslink density measurement component 500 judges (step S6) with respect to the ratio of the crosslink density of reference position in the permissible range of regulation.
The specific embodiment of step S6
At this; If the crosslink density of packing material 13,14 is low excessively; Then when outdoor application solar module 10, cause moisture to get into the inside of packing material 13,14 easily and corrode the such state of affairs of tandem 15; On the other hand, if the crosslink density of packing material 13,14 is too high, then packing material 13,14 becomes fragile and takes place damaged easily.Therefore, the scope of the regulation that the crosslink density of packing material 13,14 was both only low high only is in order to ensure the required permissible range of the quality of product, and crosslink density analysis component 600 makes above-mentioned crosslink density be in adjustment such in this permissible range.
Particularly, crosslink density analysis component 600 is based on the dummy block will 1B of following formula (1) to the reference position 1And the dummy block will 1B of comparison position 2, 1B 6, 1B 31, 1B 35Crosslink density judge.
Pxy＝Bxy/A···（1）
Wherein, Pxy: crosslinking degree; Bxy: the crosslink density of each position; X: crosslinking time; Y: (at this is dummy block will 1B to the positional information of solar module 10 1～dummy block will 1B 35 Consecutive number 1～35); A: crosslink density is measured carried out the crosslink density under the crosslinked state (for example using the EPDM synthetic to carry out the state of lamination treatment with stipulated time, set point of temperature, authorized pressure) ideally with thin slice 1.
Then, crosslink density analysis component 600 according to the condition that whether satisfies following formula (2) and formula (3) to whether in the permissible range of regulation, judging.
Below, explanation formula (2).
C≤Pxy≤D···（2）
Formula (2) is to be used for each dummy block will 1B 1, 1B 2, 1B 6, 1B 31, 1B 35The formula whether in the permissible range of regulation, judged of crosslinking degree.Wherein, numerical value C, D can suitably confirm according to packing material 13, the 14 desired crosslink densities of solar module 10.
Explanation formula (3).
{ (crosslink density of each comparison position)/(crosslink density of reference position) } >=E (3)
Formula (3) is the dummy block will 1B that is used for the reference position 1Crosslink density and the dummy block will 1B of each comparison position 2, 1B 6, 1B 31, 1B 35Crosslinking degree between the formula whether in the permissible range of regulation, judged of difference.That is the uneven degree in position of expression crosslink density.Wherein, preferably numerical value E is set at 0.8, but also can suitably increases and decreases according to solar module 10 desired crosslink densities.
Step S7 → step S9
Then, in above-mentioned formula (2) and (3) all (step S7 be " being ") under the situation in permissible range, lamination process condition enactment parts 700 do not change lamination process parts 100 setting manufacturing solar module 10 (step S9).
Step S7 → step S8
On the other hand, in above-mentioned formula (2) and (3), comprise under the situation of the numerical value in permissible range not (step S7 is " deny "), lamination process condition enactment parts 700 are adjusted the condition (step S8) of the lamination treatment of lamination process parts 100.Particularly, can change pressure, temperature, any at least setting (particularly temperature, time) in the processing time in the lamination treatment that the dummy block will of the comparison position of the condition that do not satisfy above-mentioned formula (2) is carried out.Lamination process condition enactment parts 700 send to the control assembly (not shown) of lamination process parts 100 with the adjustment result's of step S8 data, change the setting of the program etc. of control assembly (not shown).
After the processing of step S8, turn back to step S1, continue later processing be judged as " being " until step S7.
6, the effect of this embodiment
More than, in this embodiment, can easily compare contrast to being measured by the crosslink density of a plurality of positions of test body 1A to this a plurality of positions relative crosslink density each other.In addition; In this embodiment; Can obtain the cross-linking reaction identical, and can not destroy transparency carrier 11 and backing material 12 ground and easily they peeled off and take out the crosslink density that cross-linking reaction has taken place and measure with thin slice 1 with the packing material of actual solar module 10 13,14.Thus; Can measure the crosslink density in the lamination treatment of solar module 10 especially easily and accurately; And, can promptly resolve, thereby can promptly realize the startup of the production line of high-quality solar module 10 crosslink density.
7, the variation of this embodiment
In addition; In this embodiment; The measurement that to carry out the crosslink density in the solar module 10 that has utilized the crystal class element and adjustment are as object; But be not limited to this, the measurement that also can the crosslink density to the packing material in the so-called film class solar module be carried out and adjustment are as object.
In this embodiment; The measurement that to carry out the crosslink density in the solar module 10 and adjustment be as object, but also can use this embodiment in the measurement that the crosslink density in all lamination process products except that solar module 10 is carried out and in adjusting.
In this embodiment; Crosslink density is measured obtain parts 400, crosslink density measurement component 500, crosslink density analysis component 600, lamination process condition enactment parts 700 to be the parts of automatic control, but also can be constituted a manual part or whole above-mentioned parts in the above-mentioned parts of control by the person of utilization of the measurement Adjustment System 100A of crosslink density with thin slice.
Above-mentioned embodiment is illustration of the present invention, and is self-evident, do not represent that the present invention is only for scheduling above-mentioned embodiment.

Claims (10)

1. a measuring method of being tested the crosslink density of body is characterized in that,
This measuring method of being tested the crosslink density of body comprises following operation:
The preparation quilt is tested the operation of body, and this is tested body and cascades with thin slice and to them through utilizing first substrate and relative second substrate that disposes with above-mentioned first substrate to sandwich tabular crosslink density measurement;
Be configured on the lamination process parts by the test body above-mentioned, to above-mentioned operation of being carried out the lamination treatment of heat treated and pressurized treatments behind at least a portion formation vacuum state of test body enforcement with above-mentioned lamination process parts;
From above-mentioned lamination process parts, take out and accomplished the above-mentioned of above-mentioned lamination treatment, take out the operation of above-mentioned crosslink density measurement with thin slice through above-mentioned first substrate and above-mentioned second substrate are peeled off with thin slice from above-mentioned crosslink density measurement by the test body; And
Selected reference position and at least one comparison position and measure the operation of the crosslink density of said reference position and above-mentioned comparison position on the above-mentioned crosslink density of above-mentioned taking-up is measured with thin slice;
Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.
2. the measuring method of being tested the crosslink density of body according to claim 1 is characterized in that,
This measuring method of being tested the crosslink density of body comprises the operation whether crosslink density of above-mentioned comparison position is judged with respect to the ratio of the crosslink density of said reference position in the permissible range of regulation.
3. the measuring method of being tested the crosslink density of body according to claim 1 and 2 is characterized in that,
The said reference position is that above-mentioned crosslink density is measured the substantial middle portion with thin slice.
4. according to claim 2 or the 3 described measuring methods of being tested the crosslink density of body, it is characterized in that,
The permissible range of afore mentioned rules is meant more than the specific ratio.
5. according to each described measuring method of being tested the crosslink density of body in the claim 1 to 4, it is characterized in that,
Above-mentioned lamination process parts are the laminater of solar module manufacturing usefulness.
6. a condition enactment method of being tested the crosslink density of body is characterized in that,
This condition enactment method of being tested the crosslink density of body comprises following operation:
Obtain and utilize in the claim 2 to 5 each described by the aforementioned proportion of the crosslink density of the above-mentioned comparison position that measuring method obtained of the crosslink density of test body with respect to the crosslink density of said reference position; Under the situation in the permissible range that aforementioned proportion is not being stipulated; Through adjustment to above-mentioned that implemented by the test body, at least a portion of lamination process parts is formed the defined terms of being carried out the lamination treatment of heat treated and pressurized treatments behind the vacuum states, thereby aforementioned proportion adjusted to the operation in the permissible range of afore mentioned rules.
7. the condition enactment method of being tested the crosslink density of body according to claim 6 is characterized in that,
The condition of afore mentioned rules is temperature, pressure, any at least condition in the processing time of the above-mentioned lamination treatment in the above-mentioned lamination process parts.
8. the lamination treatment method of a lamination process product; It is implemented at least a portion with the lamination process parts to the lamination process product and forms the lamination treatment of carrying out heat treated and pressurized treatments behind the vacuum state; This lamination process product through utilize first substrate and with above-mentioned first substrate relatively second base plate seals of configuration comprise packing material the lamination process product content and they are cascaded; It is characterized in that
The lamination treatment method of this lamination process product comprises following operation:
Utilize each described measurement operation of being undertaken in the claim 1 to 5 by the measuring method of the crosslink density of test body;
Utilize claim 6 or 7 described condition enactment operations of being undertaken by the condition enactment method of the crosslink density of test body;
Adjustment lamination process component condition is set, and makes it possible to be carried out the operation of above-mentioned lamination treatment by the adjusted above-mentioned crosslink density of above-mentioned condition enactment operation; And
Utilize above-mentioned adjusted above-mentioned lamination process parts above-mentioned lamination process product to be carried out the operation of above-mentioned lamination treatment;
Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.
9. one kind by the measurement mechanism of crosslink density of test body; Prepare by the test body; This tested body utilize first substrate and with above-mentioned first substrate relatively second substrate of configuration sandwich tabular crosslink density and measure and cascade with thin slice and to them; This measurement mechanism of being tested the crosslink density of body forms the above-mentioned by the test body of the lamination treatment of carrying out heat treated and pressurized treatments behind the vacuum state to having implemented with at least a portion of lamination process parts; Carry out the measurement of crosslink density, it is characterized in that, comprising:
The lamination process parts, it is carried out above-mentioned lamination treatment to above-mentioned by the test body;
Crosslink density is measured and is obtained parts with thin slice; It takes out has accomplished above-mentioned lamination treatment above-mentioned by the test body from above-mentioned lamination process parts, take out above-mentioned crosslink density and measure and use thin slice through making above-mentioned first substrate and above-mentioned second substrate measure to peel off with thin slice from above-mentioned crosslink density; And
The crosslink density measurement component, the crosslink density that it is selected reference position and at least one comparison position and measure said reference position and above-mentioned comparison position on the above-mentioned crosslink density that utilizes above-mentioned crosslink density measurement to obtain the parts taking-up with thin slice is measured with thin slice;
Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.
10. one kind by the adjusting device of crosslink density of test body; Prepare by the test body; This is tested body and is cascaded with thin slice and to them through utilizing first substrate and relative second substrate that disposes with above-mentioned first substrate to sandwich tabular crosslink density measurement; This adjusting device of being tested the crosslink density of body carries out in the employed above-mentioned lamination process parts of lamination treatment of heat treated and pressurized treatments after at least a portion with the lamination process parts forms vacuum state; The crosslink density by the test body in the above-mentioned lamination treatment process is adjusted, and it is characterized in that, comprising:
Above-mentioned lamination process parts;
Crosslink density is measured and is obtained parts with thin slice; It takes out has accomplished above-mentioned lamination treatment above-mentioned by the test body from above-mentioned lamination process parts, take out above-mentioned crosslink density and measure and use thin slice through making above-mentioned first substrate and above-mentioned second substrate measure to peel off with thin slice from above-mentioned crosslink density;
The crosslink density measurement component, the crosslink density that it is selected reference position and at least one comparison position and measure said reference position and above-mentioned comparison position on the above-mentioned crosslink density that utilizes above-mentioned crosslink density measurement to obtain the parts taking-up with thin slice is measured with thin slice;
The crosslink density analysis component, whether it judges in the permissible range of regulation with respect to the ratio of the crosslink density of said reference position utilizing above-mentioned crosslink density measurement component crosslink density that measure, above-mentioned comparison position; And
Lamination process condition enactment parts; It is according to the judged result of crosslink density analysis component;, through adjusting the defined terms of above-mentioned lamination treatment, thereby aforementioned proportion is adjusted in the permissible range of afore mentioned rules not under the situation in the permissible range of regulation at aforementioned proportion;
Above-mentioned crosslink density is measured to have through above-mentioned lamination treatment with thin slice and is presented cross-linking reaction, and all can not produce bonding structure because of above-mentioned cross-linking reaction with above-mentioned first substrate and above-mentioned second substrate.
CN2011800088924A 2010-03-09 2011-03-09 Measurement method and condition setting method for cross-linking density of a tested body, laminate treatment method for a laminate plate processing product, measurement device and adjusting device for cross-linking density of a tested body Pending CN102753332A (en)

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JP2010-052424 2010-03-09
JP2010052424A JP2011183710A (en) 2010-03-09 2010-03-09 Method for measuring crosslinking density of test target, method for setting condition of crosslinking density of test target, method for lamination treatment of lamination processed product, instrument for measuring crosslinking density of test target, and device for adjusting crosslinking density of test target
PCT/JP2011/056142 WO2011111868A1 (en) 2010-03-09 2011-03-09 Method for measuring cross-link density of object to be tested, method for setting conditions of cross-link density of object to be tested, lamination method for laminated product, device for measuring cross-link density of object to be tested, and device for adjusting cross-link density of object to be tested

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104626549A (en) * 2014-12-08 2015-05-20 上海小糸车灯有限公司 Method and device for detecting ultrasonic welding quality of inner lens of automobile lamp
CN112881662A (en) * 2021-02-01 2021-06-01 中策橡胶集团有限公司 Method for detecting reinforcing degree of filler in rubber and application of filler

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102866159B (en) * 2012-08-01 2014-11-26 西北工业大学 Dyeing stripping method and dyeing stripping device for layer detection of hole forming of composite laminate plates
CN112834548B (en) * 2021-01-08 2022-08-19 上海纽迈电子科技有限公司 Cross-linking density measuring method and device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003344322A (en) * 2002-05-29 2003-12-03 Inoac Corp Method of measuring cross-link density in foam
JP2007240359A (en) * 2006-03-09 2007-09-20 Mitsui Chemical Analysis & Consulting Service Inc Method for measuring cross-link density of cross-linked polymer
JP2008117926A (en) * 2006-11-02 2008-05-22 Mitsui Chemicals Inc Solar battery module manufacturing method and its manufacturing apparatus
CN101232058A (en) * 2007-01-26 2008-07-30 财团法人工业技术研究院 Translucent type thin-film solar cell module and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04204364A (en) * 1990-11-30 1992-07-24 Mazda Motor Corp Method for inspecting cross-linking degree of reinforcement-added resin
JP4086353B2 (en) * 1998-02-05 2008-05-14 キヤノン株式会社 LAMINATE MANUFACTURING METHOD AND SOLAR CELL MODULE MANUFACTURING METHOD

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003344322A (en) * 2002-05-29 2003-12-03 Inoac Corp Method of measuring cross-link density in foam
JP2007240359A (en) * 2006-03-09 2007-09-20 Mitsui Chemical Analysis & Consulting Service Inc Method for measuring cross-link density of cross-linked polymer
JP2008117926A (en) * 2006-11-02 2008-05-22 Mitsui Chemicals Inc Solar battery module manufacturing method and its manufacturing apparatus
CN101232058A (en) * 2007-01-26 2008-07-30 财团法人工业技术研究院 Translucent type thin-film solar cell module and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104626549A (en) * 2014-12-08 2015-05-20 上海小糸车灯有限公司 Method and device for detecting ultrasonic welding quality of inner lens of automobile lamp
CN104626549B (en) * 2014-12-08 2016-12-07 上海小糸车灯有限公司 Lens quality determining method and device in the car light of ultrasonic bonding
CN112881662A (en) * 2021-02-01 2021-06-01 中策橡胶集团有限公司 Method for detecting reinforcing degree of filler in rubber and application of filler

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