CN102751075A - Network type pulse transformation structure applicable to lead-free process - Google Patents
Network type pulse transformation structure applicable to lead-free process Download PDFInfo
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- CN102751075A CN102751075A CN2012102428128A CN201210242812A CN102751075A CN 102751075 A CN102751075 A CN 102751075A CN 2012102428128 A CN2012102428128 A CN 2012102428128A CN 201210242812 A CN201210242812 A CN 201210242812A CN 102751075 A CN102751075 A CN 102751075A
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Abstract
The invention relates to a network type pulse transformation structure applicable to lead-free process. The structure comprises a transformation structure module shell, wherein regularly arranged metal pins are arranged at the bottoms of two sides of the transformation structure module shell, and an inward depression groove is arranged at the bottom surface of the transformation structure module shell; and the groove consists of one complete groove unit, or at least two inward depression groove units which are distributed on the bottom surface evenly at certain intervals. The inward depression groove is arranged at the bottom surface of the transformation structure module shell, thus being capable of better solving the high-temperature resistance problem in backflow.
Description
Technical field
The present invention relates to a kind of network of leadless process that is applicable to and use the pulse transforming structure.
Background technology
At present, a lot of about the information of leadless welding material and pb-free solder technology, for the factory of needs exploitation pb-free solder technology, these information of correct choice, and it is just extremely important organically to combine them.Develop a pb-free solder production line sound, high accepted product percentage, need carefully plan, and will for the enforcement of plan make an effort and strict process keep watch on the quality of guaranteeing product with make technology be in slave mode.These controls are relevant with many changes, as material, equipment, compatibling problem, pollution problem, statistics technology controlling and process program-etc.
Adopt leadless welding material, can produce serious influence welding procedure.Therefore, in exploitation pb-free solder technology, must all related fields of welding procedure be optimized.For welding method, select according to the actual conditions of oneself, like component type: surface mounted component, through-hole mounting element; The situation of wiring board; What and distribution situation of element etc. on the plate.For the welding of surface mounted component, need to adopt the method for Reflow Soldering; For the through-hole mounting element, can according to circumstances select wave-soldering, immersed solder or spray fuse method to weld.Wave-soldering is more suitable for going up in entire plate (large-scale) welding of through-hole mounting element; Immersed solder be more suitable in entire plate (small-sized) go up or plate on the welding of regional area through-hole mounting element; Office's surfacing agent is more suitable for individual elements or the welding of through-hole mounting element on a small quantity on plate.In addition, it is also noted that the whole process of pb-free solder is than the length of solder containing pb, and required welding temperature wants high, this be since the fusing point of lead-free solder than the height of solder containing pb, and the weaker again cause of its wettability.
The network that is applicable to leadless process that uses at present is packaged in the plastics with pulse transforming structure (network is used pulse transformer), the destruction that the network transformer of protection completion circuit design does not receive external force or steam.Begin from July, 2006; European Union and China come into effect the ROHS decree; Six kinds of harmful elements; Comprise lead, cadmium, mercury, Cr VI, gather bromo biphenyl (PBB) and gather bromo biphenyl ether (PBDE), will be disabled in the electronics information product, and wherein strong and obvious with the impact that leadless process was brought.
Welding process is the most formidable difficulty in the leadless process, and the difference of wherein assembling temperature is the main reason of initiation problem.The melting temperature of tradition eutectic tin-lead alloy is 183 ℃, and the melting temperature of tin zinc bismuth and SAC alloy then is respectively 198 ℃ and 217 ℃, is high than leypewter all.Therefore, if desire obtains identical weldering property and solder joint quality, in leadless process, certainly will to improve the peak temperature of Reflow Soldering curve and can reach.Yet the raising of assembling temperature has brought huge impact to element.Wherein the peak temperature of the plumbous processing procedure of tin is 220 ℃, and the peak temperature of leadless process then must be increased to about 240 ℃, can guarantee preferable welding quality.Yet; The heat resisting temperature of the plumbous element of tradition tin is merely 240 ℃; Certainly will can't directly apply in the high-temp leadless processing procedure, its element shows the heat that leadless process produced that element can't the bear high temperature stress that rises of splashing behind leadless process, cause the element material to deform and break.
Summary of the invention
Technical problem to be solved by this invention provide a kind of when crossing high temperature can the not deform network that is applicable to leadless process that breaks of element material use the pulse transforming structure.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: the network that is applicable to leadless process is used the pulse transforming structure; Comprise transformation construction module shell; Transformation construction module shell two side bottoms have regularly arranged metal pins, and the bottom surface of said transformation construction module shell has the groove that indent forms; Groove is made up of a complete chase unit, and perhaps groove is evenly distributed on the bottom surface with certain spacing by the chase unit of 2 indents constitutes at least.
Said depth of groove be 1-2mm (according to the mechanism of the product size decision degree of depth and width, with can eliminate preferably this during high temperature this product internal sizes generation thermal stress be standard).
Said bottom surface is the side between the bottom metal pin of transformation construction module shell both sides.
Also be provided with the first pin position on the said bottom surface and indicate the hole.
The diameter that the said first pin position indicates the hole is 1-2mm, and the degree of depth is 0.03-0.05mm.
The invention has the beneficial effects as follows: the present invention is through offering the groove of indent in the bottom surface of transformation construction module shell, and anti-245 ℃～265 ℃ high temperature 8-10 do not have explosion second when crossing backflow with solving; Have the reservation exhaust groove at the bottom of the product, product internal sizes generation thermal stress when crossing high temperature is utilized this groove to discharge stress and is prevented explosion.Overall structure of the present invention is simple, be convenient to industrialization manufacturing and popularization.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is that the A-A of Fig. 1 is to cutaway view.
Embodiment
Extremely shown in Figure 2 referring to Fig. 1; The network that is applicable to leadless process of present embodiment is used the pulse transforming structure; Comprise transformation construction module shell 3,3 liang of side bottoms of transformation construction module shell have regularly arranged metal pins 1, and the bottom surface of said transformation construction module shell 3 has the groove 3 of indent; Said groove 3 degree of depth are 1mm; Said bottom surface is the side between transformation construction module shell 3 both sides bottom metal pins 1.
This is applicable to that the network of leadless process uses the pulse transforming shaping structures to be matsurface; Moulding can not have burr, and moulding is bad, buckling deformation; Formal mould must be stamped the acupuncture point number, and font is positive regular script, and font size is No. 12, and the position is in the center, bottom (indicating with concave surface); Bottom groove degree of depth 1mm, it is 1.6mm that the first pin position indicates hole 4 its diameters, the degree of depth is 0.03mm.
Through overtesting, adopt the transformation structure with a chase unit of present embodiment, or have the transformation structure of 2 chase units, in the no explosion in 10 seconds of 260 ℃ of high temperature, can adopt leadless process to process preferably.
Groove shapes of the present invention can be rectangle; Or middle part as shown in Figure 1 is rectangle, and two ends are semicircular groove; Or adopt and to be easy to other shapes of on transformation construction module shell, being shaped.
Claims (5)
1. the network that is applicable to leadless process is used the pulse transforming structure; Comprise transformation construction module shell (3); Transformation construction module shell (3) two side bottoms have regularly arranged metal pins (1); It is characterized in that the bottom surface of said transformation construction module shell (3) has the groove (3) that indent forms; Groove (3) is made up of a complete chase unit, and perhaps groove (3) is evenly distributed on the bottom surface with certain spacing by the chase unit of 2 indents constitutes at least.
2. the network of leadless process that is applicable to according to claim 1 is used the pulse transforming structure, it is characterized in that, said groove (3) degree of depth is 1-2mm.
3. the network of leadless process that is applicable to according to claim 1 is used the pulse transforming structure, it is characterized in that, said bottom surface is for being positioned at the side between transformation construction module shell (3) the both sides bottom metal pins (1).
4. use the pulse transforming structure according to each described network of leadless process that is applicable to of claim 1 to 3, it is characterized in that, also be provided with the first pin position on the said bottom surface and indicate hole (4).
5. the network of leadless process that is applicable to according to claim 4 is used the pulse transforming structure, it is characterized in that, the diameter that the said first pin position indicates hole (4) is 1-2mm, and the degree of depth is 0.03-0.05mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102428128A CN102751075A (en) | 2012-07-14 | 2012-07-14 | Network type pulse transformation structure applicable to lead-free process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102428128A CN102751075A (en) | 2012-07-14 | 2012-07-14 | Network type pulse transformation structure applicable to lead-free process |
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| Publication Number | Publication Date |
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| CN102751075A true CN102751075A (en) | 2012-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012102428128A Pending CN102751075A (en) | 2012-07-14 | 2012-07-14 | Network type pulse transformation structure applicable to lead-free process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204345A (en) * | 1998-01-12 | 1999-07-30 | Tdk Corp | Structure for connecting coil device and circuit board device |
| CN201336210Y (en) * | 2008-12-19 | 2009-10-28 | 东莞创慈磁性元件有限公司 | Embedded-type heat-dissipating voltage transformer |
| CN102208251A (en) * | 2011-02-22 | 2011-10-05 | 东莞市铭普实业有限公司 | Four-port 100Mbps (million bits per second) network transformer in 40 PIN encapsulation structure |
| CN202720992U (en) * | 2012-07-14 | 2013-02-06 | 成都生辉电子科技有限公司 | Network pulse voltage transformation structure suitable for lead-free process |
-
2012
- 2012-07-14 CN CN2012102428128A patent/CN102751075A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204345A (en) * | 1998-01-12 | 1999-07-30 | Tdk Corp | Structure for connecting coil device and circuit board device |
| CN201336210Y (en) * | 2008-12-19 | 2009-10-28 | 东莞创慈磁性元件有限公司 | Embedded-type heat-dissipating voltage transformer |
| CN102208251A (en) * | 2011-02-22 | 2011-10-05 | 东莞市铭普实业有限公司 | Four-port 100Mbps (million bits per second) network transformer in 40 PIN encapsulation structure |
| CN202720992U (en) * | 2012-07-14 | 2013-02-06 | 成都生辉电子科技有限公司 | Network pulse voltage transformation structure suitable for lead-free process |
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Application publication date: 20121024 |