CN102749803B

CN102749803B - Method for producing radioactive curing structure

Info

Publication number: CN102749803B
Application number: CN201210114081.9A
Authority: CN
Inventors: J.A.罗克; G.W.弗利; Y-H.赖; K.E.纽曼; A.J.雅各布森; W.B.卡特; P.D.布鲁尔; H.D.阮; J.A.科罗奇斯卡
Original assignee: GM Global Technology Operations LLC
Current assignee: GM Global Technology Operations LLC
Priority date: 2011-04-18
Filing date: 2012-04-18
Publication date: 2015-05-20
Anticipated expiration: 2032-04-18
Also published as: DE102012206049A1; CN102749803A

Abstract

The present invention relates to layered radiation-sensitive materials with varying sensitivity, and especially provides a method for fabricating a radiation-cured structure. The method includes the steps of providing a first radiation-sensitive material and a second radiation-sensitive material adjacent the first radiation-sensitive material. The first radiation-sensitive material has a first sensitivity. The second radiation-sensitive material has the first sensitivity and a second sensitivity different from the first sensitivity. At least one mask is placed between at least one radiation source and the first and second radiation-sensitive materials. The mask has a plurality of substantially radiation-transparent apertures. The first and second radiation-sensitive materials are then exposed to a plurality of radiation beams through the radiation-transparent apertures in the mask to form a first construct in the first radiation-sensitive material and a second construct in the second radiation-sensitive material. The first construct and the second construct cooperate to form the radiation-cured structure.

Description

For making the method for radiation curing structure

the cross reference of related application

The application is the U.S. Patent Application Serial Number No.12/339 submitted on Dec 19th, 2008, the part continuation application of 308.The full content of above-mentioned application is incorporated in the application by reference at this.

Technical field

The present invention relates to radiation curing material, relating more specifically to a kind of method for making baroque radiation curing material.

Background technology

The people such as Jacobsen are at " " Compression behavior of micro-scale truss structures formed from self-propagating polymer waveguides ", Acta Materialia 55, (2007) 6724-6733 " in describe the microstructure of radiation curing, the full content of the document is incorporated in the application by reference at this.Jacobsen in U.S. Patent No. 7,382, disclose the method and system that a kind of manufacture has the polymeric material of orderly micro-truss-frame structure in 959, the full content of this patent is incorporated in the application by reference at this.This system comprises: chosen with at least one collimated light source producing collimated light beam; Be there is the reservoir of the light monomer being suitable for being polymerized by collimated light beam; And mask, this mask has at least one hole and is placed between this at least one collimated light source and this reservoir.This at least one hole is suitable for guiding a part for collimated light beam to enter light monomer, forms at least one polymer waveguide with a part of volume by light monomer.Jacobsen is further disclose the micro-truss material produced by the method and system in the U.S. Patent application of 11/801,908 at sequence number, and the full content of this patented claim is incorporated in the application by reference at this.The people such as Kewitsch in U.S. Patent No. 6,274, also illustrate in 288 be exposed to radiation and by formed polymer waveguide produce light self-focusing or from constraint polymeric material, the full content of this patent is incorporated in the application by reference at this.

The goods formed by Bilayer Resist process have also been described, such as, the people such as Orvek in U.S. Patent No. 4,770, describe these goods in 739, the full content of this patent is incorporated in the application by reference at this.First erosion resistant of nearly UV line or near ultraviolet ray sensitivity is deposited on the end face of an object.Second erosion resistant of deep UV sensitivity is deposited on the first erosion resistant.Make the second erosion resistant be exposed to deep UV have pattern illumination under, then remove exposed region.The first erosion resistant is irradiated by the flood exposure of nearly UV line or near ultraviolet ray or blanket exposure.Thus Bilayer Resist goods are formed.

The known method of making microstructure in addition comprises rapid prototyping process, the German abbreviation of such as stereolithography, fused deposition modeling and LIGA(photoetching, plating and modeling).The rapid prototyping process for the production of microstructure of uniqueness is called as an electrochemical fabrication, such as, and the EFAB developed by the Microfabrica company being positioned at California Van Nuys ^tM.Electrochemical fabrication process usually from blank substrate with expecting style sacrificial material.During manufacture process, expendable material supports microstructure as framing scaffold.Then, structured material is deposited on expendable material.Then, expendable material and structured material by accurately floating, and repeat this process until microstructure is fully assembled.Such as by high etch selectivity technique, expendable material is finally removed, to leave the microstructure be all made up of structured material.Use electrochemical fabrication to contribute to producing the microstructure of the geometric complexity with supranormal levels, this complicacy comprises carries out the ability of assembling with independent, the independent parts formed.But the Rapid prototyping methods of electrochemical fabrication and other routines involves great expense and expends time in, particularly for the application of such as automotive fuel cell.

Therefore need a kind of method for making radiation curing structure, the method more saves cost and time compared with the Rapid prototyping methods of routine always.Be desirable to, the method contributes to saving the cost formed for the radiation curing parts in fuel cell and other application.

Summary of the invention

According to the present invention, develop a kind of method for making radiation curing structure astoundingly, compared with the Rapid prototyping methods of routine, the method more saves cost and time, and contributes to saving the cost formed for the radiation curing fuel cell component in fuel cell and other application.

In a first embodiment, a kind of method for making radiation curing structure comprises the steps: the second radiation-sensitive materials providing the first radiation-sensitive materials and contiguous first radiation-sensitive materials.First radiation-sensitive materials has the first susceptibility.Second radiation-sensitive materials has this first susceptibility and is different from the second susceptibility of this first susceptibility.At least one mask is placed between at least one radiation source and these radiation-sensitive materials.Mask has the radiation transmission hole of the multiple basic transmission be formed in wherein.Then make the first and second radiation-sensitive materials be exposed to multiple radiation beams through the radiation transmission hole in this at least one mask, thus second in the first structure formed in the first radiation-sensitive materials and the second radiation-sensitive materials construct.First structure and second constructs and cooperates with each other to form radiation curing structure.

In another embodiment, a kind of method for making radiation curing structure comprises the steps: to provide the first radiation curable material, this first radiation curable material has the first susceptibility, and this first susceptibility comprises the first solidification rate, the first trigger rate, the susceptibility to the first radiation frequency, the susceptibility to the first radiation magnitude and at least one in the susceptibility of the first emission types; Second radiation curable material of contiguous first radiation curable material is provided, this second radiation curable material has this first susceptibility and the second susceptibility, this second susceptibility comprises the second solidification rate, the second trigger rate, the susceptibility to the second radiation frequency, the susceptibility to the second radiation magnitude and at least one in the susceptibility of the second emission types, and the second susceptibility is different from the first susceptibility; Be placed on by least one mask between at least one radiation source and the first and second radiation curable material, this mask has the radiation transmission hole of the multiple basic transmission be formed in wherein; And make the first and second radiation curable material be exposed to multiple radiation beams through the radiation transmission hole in this mask, thus second in the first structure formed in the first radiation curable material and the second radiation curable material constructs.First structure and second constructs and cooperates with each other to form radiation curing structure.

In another embodiment, a kind of method for making radiation curing structure comprises the steps: to provide the first radiation-curable decomposing material, this first radiation-curable decomposing material has the first susceptibility, and this first susceptibility comprises the first decomposition rate, the susceptibility to the first radiation frequency, the susceptibility to the first radiation magnitude and at least one in the susceptibility of the first emission types; Second radiation-curable decomposing material of this first radiation-curable decomposing material contiguous is provided, this second radiation-curable decomposing material has this first susceptibility and the second susceptibility, this second susceptibility comprises the second decomposition rate, the susceptibility to the second radiation frequency, the susceptibility to the second radiation magnitude and at least one in the susceptibility of the second emission types, and the second susceptibility is different from the first susceptibility; Be placed on by mask between at least one radiation source and the first and second radiation-curable decomposing materials, this mask has the radiation transmission hole of the multiple basic transmission be formed in wherein; And make the first and second radiation-curable decomposing materials be exposed to multiple radiation beams through the radiation transmission hole in this mask, thus second in the first structure formed in the first radiation-curable decomposing material and the second radiation-curable decomposing material constructs.First structure and second constructs and cooperates with each other to form radiation curing structure.

Scheme 1.for making a method for radiation curing structure, the method comprises the steps:

There is provided the first radiation-sensitive materials, described first radiation-sensitive materials has the first susceptibility;

Contiguous described first radiation-sensitive materials provides the second radiation-sensitive materials, and described second radiation-sensitive materials has described first susceptibility and is different from the second susceptibility of described first susceptibility;

Be placed on by least one mask between at least one radiation source and described first and second radiation-sensitive materials, described mask has the radiation transmission hole of multiple basic transmission;

Described first and second radiation-sensitive materials are made to be exposed to multiple radiation beams through the radiation transmission hole in described mask; And

At least in described first radiation-sensitive materials, form the first structure and in described second radiation-sensitive materials, form the second structure, described first structure and described second constructs and cooperates with each other to form described radiation curing structure.

Scheme 2.method as described in scheme 1, wherein, at least one in described first and second radiation-sensitive materials is the one in radiation curable material and radiation-curable decomposing material.

Scheme 3.method as described in scheme 1, wherein, at least one in described first and second susceptibilitys be solidification rate, trigger rate, decomposition rate, the susceptibility to radiation frequency, the susceptibility to radiation magnitude, at least one in the susceptibility of emission types.

Scheme 4.method as described in scheme 1, be included in further make described first and second radiation-sensitive materials be exposed to the step of described multiple radiation beam after remove the step of the uncured portion of described first and second radiation-sensitive materials.

Scheme 5.method as described in scheme 1, comprises further and is applied on described second radiation-sensitive materials by the 3rd radiation-sensitive materials, and described 3rd radiation-sensitive materials has the 3rd susceptibility.

Scheme 6.method as described in scheme 5, wherein, making after described 3rd radiation-sensitive materials is exposed to the step of described multiple radiation beam, described 3rd radiation-sensitive materials forms the 3rd structure, and described 3rd structure constructs with described first and described second constructs and cooperate with each other to form described radiation curing structure.

Scheme 7.method as described in scheme 5, wherein, described 3rd susceptibility is substantially identical with described first susceptibility.

Scheme 8.method as described in scheme 5, wherein, described 3rd susceptibility is different from described first susceptibility and described second susceptibility.

Scheme 9.method as described in scheme 1, comprises further and provides the step of substrate and described first radiation-sensitive materials is applied to described suprabasil step.

Scheme 10.method as described in scheme 1, comprise further described radiation curing structure is metallized, at least one in the step of carbonization and porcelain.

Scheme 11.method as described in scheme 1, wherein, described multiple radiation beam comprises multiple first radiation beam and multiple second radiation beam.

Scheme 12.method as described in scheme 11, wherein, is different from described multiple second radiation beam at least one in frequency, amplitude and type of described multiple first radiation beam.

Scheme 13.method as described in scheme 11, wherein, at cross sectional shape and relative at least one in the incident angle on the surface of in described first radiation-sensitive materials and described second radiation-sensitive materials, described first radiation beam is different from described second radiation beam.

Scheme 14.method as described in scheme 13, wherein, described multiple first radiation beam is provided by first radiation source with the first mask, and described multiple second radiation beam is provided by second radiation source with the second mask.

Scheme 15.method as described in scheme 14, wherein, at least one in described first radiation-sensitive materials and described second radiation-sensitive materials is the one in negative resist and positive corrosion-resisting agent.

Scheme 16.method as described in scheme 14, wherein, at least one in described first radiation-sensitive materials and described second radiation-sensitive materials is liquid light monomer.

Scheme 17.method as described in scheme 14, wherein, described forming step be included in make described radiation-sensitive materials be exposed to the step of described multiple radiation beam after step that described first radiation-sensitive materials and described second radiation-sensitive materials are heated, heating inspires the polymerization of at least one in described first radiation-sensitive materials and described second radiation-sensitive materials, crosslinked and at least one item in decomposing.

Scheme 18.method as described in scheme 1, be included in the step applying filtering layer between described first radiation-sensitive materials and described second radiation-sensitive materials further, described filtering layer stops one in described first and second radiation-sensitive materials to be exposed to described multiple radiation beam at least partially.

Scheme 19.for making a method for radiation curing structure, the method comprises the steps:

First radiation curable material is provided, described first radiation curable material has the first susceptibility, and described first susceptibility comprises the first solidification rate, the first trigger rate, the susceptibility to the first radiation frequency, the susceptibility to the first radiation magnitude and at least one in the susceptibility of the first emission types;

Contiguous described first radiation curable material provides the second radiation curable material, described second radiation curable material has described first susceptibility and the second susceptibility, described second susceptibility comprises the second solidification rate, the second trigger rate, the susceptibility to the second radiation frequency, the susceptibility to the second radiation magnitude and at least one in the susceptibility of the second emission types, and described second susceptibility is different from described first susceptibility;

Be placed on by least one mask between at least one radiation source and described first and second radiation curable material, described mask has the radiation transmission hole of multiple basic transmission;

Described first and second radiation curable material are made to be exposed to multiple radiation beams through the radiation transmission hole in described mask; And

At least in described first radiation curable material, form the first structure and in described second radiation curable material, form the second structure, described first structure and described second constructs and cooperates with each other to form described radiation curing structure.

Scheme 20.for making a method for radiation curing structure, the method comprises the steps:

First radiation-curable decomposing material is provided, described first radiation-curable decomposing material has the first susceptibility, and described first susceptibility comprises the first decomposition rate, the susceptibility to the first radiation frequency, the susceptibility to the first radiation magnitude and at least one in the susceptibility of the first emission types;

Contiguous described first radiation-curable decomposing material provides the second radiation-curable decomposing material, described second radiation-curable decomposing material has described first susceptibility and the second susceptibility, described second susceptibility comprises the second decomposition rate, the susceptibility to the second radiation frequency, the susceptibility to the second radiation magnitude and at least one in the susceptibility of the second emission types, and described second susceptibility is different from described first susceptibility;

Be placed on by mask between radiation source and described first and second radiation-curable decomposing materials, described mask has the radiation transmission hole of multiple basic transmission;

Described first and second radiation-curable decomposing materials are made to be exposed to multiple radiation beams through the radiation transmission hole in described mask; And

At least in described first radiation-curable decomposing material, form the first structure and in described second radiation-curable decomposing material, form the second structure, described first structure is different from described second structure, and described first structure and described second constructs and cooperates with each other to form described radiation curing structure.

Accompanying drawing explanation

For a person skilled in the art, above-mentioned and other advantages of the present invention will in the following detailed description, particularly when considering in conjunction with accompanying drawing described herein, is easy to become apparent.

Fig. 1 is the indicative flowchart of the method for making radiation curing microstructure according to an embodiment of the invention, illustrated therein is radiation curing microstructure by being formed of radiation-sensitive materials with varying sensitivity;

Fig. 2 is the indicative flowchart of the method for making radiation curing microstructure according to another embodiment of the invention, illustrated therein is radiation curing microstructure by being formed of radiation curable material with varying sensitivity;

Fig. 3 is the indicative flowchart of the method for making radiation curing microstructure according to still another embodiment of the invention, illustrated therein is radiation curing microstructure by being formed of radiation-curable decomposing material with varying sensitivity;

Fig. 4 A-4C is schematic cross-sectional side face front elevation, illustrated therein is the method for making radiation curing microstructure according to an embodiment of the invention; And

Fig. 5 A-5C is schematic cross-sectional side face front elevation, illustrated therein is the method for making radiation curing microstructure according to another embodiment of the invention.

Embodiment

Detailed description below and accompanying drawing describe and show various embodiment of the present invention.This description and accompanying drawing are used for those skilled in the art being made and using the present invention, and also not intended to be limits the scope of the invention by any way.For disclosed method, the step wherein provided is actually exemplary, thus optional or crucial.

As shown in Figure 1, the present invention includes method 100, the method is used at least making radiation curing structure by the first radiation-sensitive materials and the second radiation-sensitive materials.Radiation curing structure is by multiple radiation curing formation of structure, and these radiation curings structure is during by multiple radiation curing element or structural attitude, to be formed in the first radiation-sensitive materials and the second radiation-sensitive materials independently each.Radiation curing structure during to be formed in the first radiation-sensitive materials and the second radiation-sensitive materials each cooperates with each other to form radiation curing structure.

First method 100 can comprise the step 102 providing substrate.This substrate can be formed by any material forming polymer architecture thereon that allows.In certain embodiments, substrate is substantially flat thin plate.But, one skilled in the art will appreciate that substrate can be configured to provide the radiation curing structure with intended shape.Substrate can be nonconducting, such as plastics, or can be conduction, such as stainless steel.Substrate can have the some holes be formed in wherein, and this some holes contributes to after making radiation curing structure, remove unnecessary uncured radiation-sensitive materials.

In order to bonding on radiation curing structure and stripping, substrate can be provided with coating further or carry out surface treatment.As non-limiting example, substrate can have the coating being suitable for bonding uncured radiation-sensitive materials.Surface treatment can contribute to the polymkeric substance of solidification to peel off from substrate further.Particularly, during the making of radiation curing structure, be placed on flat surfaces or fixing base at the back side of substrate, and the back side of substrate has coating, this coating prevents from less desirable pollution or the coat of metal appear in the substrate of such as Reusability.Fixing base can be the vacuum chuck with the porous facilitating earth pressure release, and such as, substrate keeps in position by its selectivity during manufacturing process.Those skilled in the art can select the suitable surface treatment comprising coating as required.

Method 100 comprises further the first radiation-sensitive materials is applied to suprabasil step 104, and the second radiation-sensitive materials is applied to the step 106 on the first radiation-sensitive materials.Should be understood that, can using the first radiation-sensitive materials as such as not needing the self-supporting film of substrate to provide, to replace the above-mentioned step 102 providing substrate.The step 104 applying the first radiation-sensitive materials can comprise lamination first radiation-sensitive materials and the second radiation-sensitive materials in advance alternatively with the step 106 applying the second radiation-sensitive materials, and is applied to by the first radiation-sensitive materials of lamination in advance and the second radiation-sensitive materials in substrate.

Radiation-sensitive materials according to the present invention comprises radiation curable material and radiation-curable decomposing material.Term " radiation curable material " is restricted to any material of at least one in causing by being exposed to radiation, being polymerized and being cross-linked in this article.Should be understood that, after causing by being exposed to radiation, also can complete the polymerization of radiation curable material at least in part by improving temperature or be cross-linked.Term " radiation-curable decomposing material " is restricted in this article and removes any material of at least one that is crosslinked and that cut off in polymer backbone by being exposed to radiation.As non-limiting example, by the crosslinked abundant fracture of radiation-curable decomposing material and/or the cut-out of its polymer backbone, radiation-curable decomposing material can be made to dissolve in solvent.

As non-limiting example, radiation curable material can comprise the one in liquid light monomer and substantially solid-state radiation-curable polymer.Liquid light monomer can be if Jacobsen is in U.S. Patent No. 7,382,959 and at Application U.S. Serial No 11/801, and the monomer described in 908.Other non-limiting example of appropriate light monomer comprises the monomer be polymerized by free radical polymerization mode when being exposed to ultraviolet (wavelength is between about 250 nanometers with about 400 nanometers) radiation.Light monomer can comprise any suitable radical photopolymerization thing material, such as urethane (polycarbamate), acrylate, methacrylate and cation type polymer, such as photo-curing epoxy resin.Suitable liquid light monomer can show the change of refractive index when photopolymerization, such as to provide the waveguide of self propagation.Other light monomers also can be used as required.

Suitable substantially solid-state radiation-curable polymer can comprise negativity resist polymer.Negativity resist polymer stands light-initiated process, and this process causes negativity resist polymer by being such as polymerized or polycondensation and solidifying.If polymerization or polycondensation reaction occurred in the substantially identical time, so this process is referred to as " photocuring ".As long as reactant is generated by light-initiated process and needs subsequent step-such as heating to produce polymerization or polycondensation, this process is just referred to as " light-initiated ".Should be understood that, even if may be required for completing polymerization procedure that Post RDBMS heats, but the basicly stable structural attitude in negativity photoresist polymkeric substance also can be exposed between radiation era at first and produced.Substantially solid-state radiation-curable polymer only can experience elicitation procedure, and due to inherent stability and the limited diffusivity of the chemical substance in solid-state radiation-curable polymer, so solidification process also can occur very late, and obvious feature is not had to degenerate.Should be understood that, when elicitation procedure starts, most of light initiation polymerization thing just starts solidification process, but the power reacted under Exposure Temperature is very little, to such an extent as to considerably less (if any) polymerization or polycondensation can occur before solidification temperature negativity resist polymer being heated to expectation.

A kind of special negativity resist polymer is the SU-8 2000 based on epoxy resin ^tM, this polymkeric substance is the commodity of the Microchem company being positioned at Massachusetts Newton.SU-8 2000 ^tMnegativity resist polymer solidifies by ultraviolet radiation.Should be understood that, also can use the polymkeric substance of other substantially solid-state radiation-hardenables.

As non-limiting example, radiation-curable decomposing material can comprise positive resist polymkeric substance.Positive resist polymkeric substance starts as cross-linked polymer, but can photoinitiator be comprised, when being exposed to particular radiation, this photoinitiator produces chemical substance, and these chemical substances carry out decomposing copolymer by least one item disconnected in crosslinked and cut-out polymer backbone.This decomposition makes the region that positive resist polymkeric substance to be exposed to radiation be soluble.The region conductively-closed that positive resist polymkeric substance retains and non-exposed, herein above-described negativity resist polymer is also like this.In certain embodiments, positive resist polymkeric substance is radiosensitive to such as ultraviolet or electron beam, and without the need to photoinitiator.Such as, positive resist polymkeric substance self may be destroyed because of radiation and remaining fracture chain becomes and can dissolve in a solvent.The positive resist polymkeric substance of other types also can use as required.

First radiation-sensitive materials has the first susceptibility.Second radiation-sensitive materials has the second susceptibility being different from the first susceptibility.First radiation-sensitive materials and the second radiation-sensitive materials all share the embodiment of the first susceptibility or the second susceptibility also within the scope of the invention.As disclosed herein, for radiation curable material, susceptibility is solidification rate, trigger rate, the susceptibility to radiation frequency, the susceptibility to radiation magnitude and at least one in the susceptibility of emission types.For radiation-curable decomposing material, susceptibility is decomposition rate, the susceptibility to radiation frequency, the susceptibility to radiation magnitude and at least one in the susceptibility of emission types.Should be understood that, the first and second radiation-sensitive materials are applied to suprabasil step 104,106 time, by the step 110 making the first and second radiation-sensitive materials be exposed to the radiation selected for the first and second susceptibilitys respectively, different radiation curing structures can be formed in the first and second radiation-sensitive materials.Thus the radiation curing structure with high-level geometric complexity can be produced.

Should be appreciated that further, have the first susceptibility the first radiation-sensitive materials and share the first susceptibility but the use also with the second radiation-sensitive materials of the second susceptibility being different from the first susceptibility also within the scope of the invention.Also it is to be further understood that reclaim reason to manufacture on a large scale and being correlated with, Lazer's sensitivity of the first radiation-sensitive materials and the second radiation-sensitive materials or overlapping susceptibility may be particularly advantageous.

In yet another embodiment, method 100 can comprise the step be applied to by the 3rd radiation-sensitive materials on the second radiation-sensitive materials.3rd radiation-sensitive materials has the 3rd susceptibility.As required, the 3rd susceptibility can be identical or different from the first and second susceptibilitys.In one example, the 3rd susceptibility is substantially identical with the first susceptibility.In specific example, the 3rd susceptibility is not identical with the first and second susceptibilitys.In an example the most specific, the 3rd susceptibility is not identical with the second susceptibility, and substantially identical with the first susceptibility.One skilled in the art will appreciate that obtained radiation curing structure thus can be formed as having the layer of basic same configuration, heteroid layer is arranged between the layer of same configuration.It is to be further understood that within the scope of the invention, the radiation-sensitive materials of any desired number can be adopted in the arranging of the setting of any expectation-such as stacked setting or other form.

After the first and second radiation-sensitive materials are applied to suprabasil step 104,106, method 100 comprises the step 108 be placed on by least one mask between at least one radiation source and the first and second radiation-sensitive materials.In certain embodiments, mask is provided as the integral part of radiation source.Multiple mask and multiple radiation source can be used.Mask has the radiation transmission hole of multiple basic transmission.Such as, in the embodiment also with the 3rd radiation-sensitive materials, mask is placed between at least one radiation source and first, second, and third radiation-sensitive materials.Should be understood that, as required, the first mask and the first radiation source can be placed on the first side of the first and second radiation-sensitive materials, and the second mask and the second radiation source can be placed on the second side of the first and second radiation-sensitive materials.

The material forming mask can be the radiation transmissive material of basic transmission, the quartz glass of such as transmission such as ultraviolet (UV) radiation.Hole can be the radiation transmission opening of hole or basic transmission, is formed in these holes or the opening opaque radiation blocking coating on the radiation transmission mask material being arranged at basic transmission.In an illustrative embodiment, mask has multiple holes that diameter is approximately 10 microns.As another non-limiting example, mask material can comprise crown glass, Pyrex glass and such as step the one of drawing in the polyethylene terephthalate of film.Mask can be lifted open after exposure, and can mask be cleaned to reuse.Also multiple masks with different pattern and dissimilar multiple holes can be adopted.Hole can have the shape of the cross sectional shape providing expectation for radiation curing element.Such as, hole may be substantially of circle, to make the radiation curing element with elliptical shape in cross-section.As required, those skilled in the art can select suitable mask material, hole size and dimension and formed structure configuration.

Method 100 comprises the step 110 making the first and second radiation-sensitive materials be exposed to multiple radiation beam.Radiation beam is projected through the radiation transmission hole at least one mask and is contacted the first and second radiation-sensitive materials.Those skilled in the art can as required selective radiation source to produce electromagnetic radiation or particle radiation.Such as, by providing the mercury-arc lamp of ultraviolet radiation wire harness to produce the radiation beam for exposure radiation sensitive material.One skilled in the art will appreciate that the radiation beam that also can use other wavelength, such as infrared ray visible ray and X-ray radiation, and from the radiation beam of other radiation sources, such as incandescent lamp and laser.Also particle radiation can be used, such as, from the electron beam in cathode ray source.Should be appreciated that further, as required, radiation beam can be collimation, partly collimation or uncollimated.

Multiple radiation beam can comprise such as multiple first radiation beam and multiple second radiation beam.In certain embodiments, at least one in frequency, amplitude and type, the first radiation beam can be different from the second radiation beam.As required, the first and second radiation-sensitive materials simultaneously or can sequentially be exposed to multiple radiation beam.At cross sectional shape and relative at least one in the incident angle on the surface of in first, second and optional 3rd radiation-sensitive materials, the first radiation beam can be different from the second radiation beam.As another non-limiting example, multiple first radiation beam is provided by first radiation source with the first mask, and multiple second radiation beam is provided by second radiation source with the second mask.The radiation frequency of any desired type, radiation magnitude, emission types, cross sectional shape, angle, mask and radiation source can be used within the scope of the invention.

Expose about while the first and second radiation-sensitive materials, apply the step 104 of the first and second radiation-sensitive materials, 106 and expose the step 110 of the first and second radiation-sensitive materials and be described in the above.Should be understood that, the first and second radiation-sensitive materials also can the mode of non-concurrent expose.Such as, each in the first and second radiation-sensitive materials can independently be applied, and is then exposed to radiation beam.As another example, first the first radiation-sensitive materials can be applied in, and is then exposed to the first radiation beam.Subsequently, the second radiation-sensitive materials can be applied on the first radiation-sensitive materials.Second radiation-sensitive materials can have higher susceptibility and be exposed to for second radiation beam a period of time, and this time length can not affect the first radiation-sensitive materials substantially.By this way, the structural attitude in the first radiation-sensitive materials that susceptibility is more weak there will not be in the second radiation-sensitive materials that susceptibility is stronger.

At least one substantially solid-state radiation-sensitive materials also can use together with the radiation-sensitive materials of at least one liquid state.Such as, when expecting to expose simultaneously, the first substantially solid-state radiation-sensitive materials can be applied in substrate.Then, the second radiation-sensitive materials of liquid state is applied on the first substantially solid-state radiation-sensitive materials.Each can being chosen as in first and second radiation-sensitive materials has different susceptibilitys.If the sensitivity difference between the first and second radiation-sensitive materials is a kind of speed, the structural attitude in the radiation-sensitive materials that so susceptibility is more weak will appear in the stronger radiation-sensitive materials of susceptibility.Structural attitude in the radiation-sensitive materials that susceptibility is stronger there will not be in the radiation-sensitive materials that susceptibility is more weak.If sensitivity difference is owing to radiation frequency or emission types, so specific to the first and second radiation-sensitive materials, structural attitude can independently produce.By making the first and second radiation-sensitive materials be exposed to radiation frequency and emission types simultaneously, the structural attitude on the interphase border between leap first and second radiation-sensitive materials can be formed.Such as, the first and second radiation-sensitive materials can be made to be exposed to provide incomplete solidification, then can to remove remaining uncured material, and the combination curing obtaining interphase boundary is solidified to the first and second radiation-sensitive materials simultaneously.

When expecting that carrying out non-concurrent exposes, the first substantially solid-state radiation-sensitive materials can be applied, then make it be exposed to radiation beam.Then, the second radiation-sensitive materials of liquid state is applied on the first substantially solid-state radiation-sensitive materials.Usually, the susceptibility of the second liquid radiation-sensitive materials can be chosen as the susceptibility higher than the first substantially solid-state radiation-sensitive materials.Thus the structural attitude be formed in the second liquid radiation-sensitive materials there will not be in the first substantially solid-state radiation-sensitive materials.

Those skilled in the art will appreciate that the first and second radiation-sensitive materials can comprise the layer liquid such as with variable depth.As non-limiting example, the radiation-sensitive materials of liquid state can be applied in substrate and to make it be exposed to form the structural attitude expected subsequently.Then, additional liquid radiation sensitive material can be added to increase the height of initial liquid radiation sensitive material.Expose additional liquid radiation sensitive material, and control intensity and the open-assembly time of radiation beam, with the liquid radiation curable material of one deck making new structural attitude only run through new.Alternatively, intensity and the open-assembly time of radiation beam can be controlled, to make new structural attitude expand to be formed in the structural attitude in initial liquid radiation sensitive material.

Making after the first and second materials are exposed to the step 110 of multiple radiation beam, method 100 comprises the step 112 correspondingly being formed the first and second structures by the first and second radiation-sensitive materials.It should be understood that, the step 112 forming the first and second structures can directly be produced by the step 110 making the first and second radiation-sensitive materials be exposed to multiple radiation beam.Alternatively, making after the first and second radiation-sensitive materials are exposed to the step 110 of multiple radiation beam, forming step 112 can comprise the aftertreatment to the first radiation-sensitive materials and the second radiation-sensitive materials further.Such as, aftertreatment can comprise the heating to the first and second radiation-sensitive materials.When in the first radiation-sensitive materials and the second radiation-sensitive materials, at least one is when subjected to by being exposed to radiation beam the radiation curable material to a certain degree caused, heating can inspire the polymerization of at least one and at least one in being cross-linked in the first radiation-sensitive materials and the second radiation-sensitive materials.In substituting embodiment, when in the first radiation-sensitive materials and the second radiation-sensitive materials, at least one is when subjected to by being exposed to radiation beam the radiation-curable decomposing material to a certain degree decomposed, heating can to inspire in the first radiation-sensitive materials and the second radiation-sensitive materials at least one decomposition.As required, suitable temperature and heat time can be selected.

First radiation-sensitive materials is exposed and in the first radiation-sensitive materials, forms the first structure.Second radiation-sensitive materials is exposed and in the second radiation-sensitive materials, forms the second structure.When making the 3rd radiation-sensitive materials be exposed to radiation beam, the 3rd radiation-sensitive materials forms the 3rd structure.First structure, the second structure and optional 3rd structure are formed by multiple radiation curing element, and cooperate with each other to form radiation curing structure.Should be understood that, various radiation curing element can be formed according to this method, such as, comprise truss members, radiation curing thin plate and solid-state radiation curable polymer structure.

In certain embodiments, radiation curing structure comprises micro-truss-frame structure.Micro-truss-frame structure can have along first direction extend multiple first truss members, along second direction extend multiple second truss members, along third direction extend multiple 3rd truss members and along fourth direction extend multiple 4th truss members.First, second, third and fourth truss members can run through mutually at multiple Nodes.Should be understood that, first, second, third and fourth truss members can not run through mutually or runs through mutually at multiple Nodes on interrupted basis as required.First, second, third and fourth truss members forms the cellular structure of the self-supporting of continuous print solid.

Although as described above, micro-truss-frame structure with multiple first, second, third and fourth truss members can have the symmetry in 4 plaiting offices, but those skilled in the art should be understood that, can use other layouts of micro-truss-frame structure within the scope of the invention, such as 3 foldings are symmetrical and 6 folding symmetries.Such as, specified arrangement can be selected to increase the connectivity of micro-truss-frame structure, and reduction bend under a load and the susceptibility of warpage to micro-truss-frame structure.As required, symmetrical or asymmetrical layout can be selected.Also can select to make the intensity of micro-truss-frame structure and the optimized layout of rigidity.Those skilled in the art should be appreciated that further, can use other layouts of micro-truss-frame structure as required.

Jacobsen in U.S. Patent No. 7,382,959 and U.S. Patent Application Serial Number 11/801, describe the exemplary layout of micro-truss-frame structure in 908.Such as, multiple first truss members is limited by the polymkeric substance truss waveguide of multiple first self propagation.Multiple second truss members is limited by the polymkeric substance truss waveguide of multiple second self propagation.Multiple 3rd truss members is limited by the polymkeric substance truss waveguide of multiple 3rd self propagation.Multiple 4th truss members is limited by the polymkeric substance truss waveguide of multiple 4th self propagation.As required, other appropriate method forming micro-truss-frame structure can also be used.

One skilled in the art will appreciate that specific micro-truss-frame structure can design as required, such as, at least one by following method: the angle 1) selecting truss members relative each other and pattern; 2) encapsulation or the relative density of the cellular structure formed is adjusted; And 3) select the section shape and size of truss members.Especially, the truss members having oval truss cross sectional shape can stop degeneration when thermal expansivity exists difference.As required, also other cross sectional shapes can be used.

Should be understood that, according to the present invention, radiation curing structure can be made by radiation curable material and combinationally using of radiation-curable decomposing material.Such as, radiation curing structure can be formed by negative resist as described above and positive corrosion-resisting agent.In the uncured state, each in negative resist and positive corrosion-resisting agent can be applied adjacent to each other.Negativity and the positive corrosion-resisting agent with different radiosensitivity can be selected.During making negative resist be exposed to the step 110 of radiation beam, negative resist can by light-initiated or solidify at least partly.Exposing negative resist with after forming structural attitude and removing the uncured material of residue, uncured positive corrosion-resisting agent and negative resist can united solidify.Thus the structural attitude of negative resist is cross-linked at interphase boundary and positive corrosion-resisting agent.Then, make positive corrosion-resisting agent be exposed to radiation beam with the Region Decomposition positive resist material expected, and do not affect the structure be formed in negative resist.Thus radiation curing structure can be formed by the first radiation curable material and the second radiation-curable decomposing material.

Method 100 of the present invention can comprise the step of the uncured portion removing the first and second radiation-sensitive materials further.Should be understood that, within the scope of the invention, term " uncured radiation-sensitive materials " also can comprise the radiation-sensitive materials be decomposed.Uncured part can be the remainders uncured after being exposed to radiation beam of the first and second radiation curable material, or the first and second radiation-curable decomposing materials are by being exposed to radiation beam and cut-off or become solubilized part in a solvent.The step removing uncured part usually occurs in and makes the first and second radiation-sensitive materials be exposed to multiple radiation beam with after solidifying at least one in the step 110 of the first and second radiation-sensitive materials.As non-limiting example, the step removing the uncured part of the first and second radiation-sensitive materials can comprise by solvent washing radiation curing structure.One skilled in the art will appreciate that, during removing the step of uncured part of the first and second radiation-sensitive materials, suitable solvent can not make the radiation curing structure degradation of exposure substantially.

It should be understood that, after making radiation curing structure, radiation curing structure can be further processed to improve at least one in intensity, conductivity and environmental resistance.As nonrestrictive example, method of the present invention may further include at least one in the step of metallization, carbonization and porcelain radiation curing structure.Such as, the complex comprising radiation curing structure also if the people such as Jacobsen are in U.S. Patent Application Serial Number 12/008, can be formed disclosed in 479 like that, and the full content of this patented claim is incorporated in the application by reference at this.

In one embodiment, radiation curing structured metallization can be made by carrying out plating with metallic coating to radiation curing element.Metallic coating can be such as oxidation resistant, anti-reduction and acidproof substantially.Metallic coating can comprise the noble metal being selected from the set be made up of following metal: such as, ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), iridium (Ir), platinum (Pt) and osmium (Os), and the alloy of aforementioned several metal.In certain embodiments, metallic coating is gold (Au).In another specific embodiment, metallic coating is tantalum (Ta).Another kind of suitable metallic coating can comprise nickel (Ni) alloy, the alloy of such as nickel and chromium (Cr) or nickel and cobalt (Co).It should be recognized by those skilled in the art that metallic coating can comprise potpourri or the alloy of above-mentioned metal.As required, other conductance metal and materials can also be used.

By at least one in following technique by metal coating deposits in radiation curing structure: electron beam evaporation, magnetron sputtering, physical vapour deposition (PVD), chemical vapor deposition, ald, electrolytic deposition, electroless deposition, flame jet deposition, brush plating and other similar technique.Also the electroplating technology based on solution comprising and radiation curing structure to be immersed in electroplating bath can be used.Coating in pulpous state pulverulence metal and subsequently roasting pulpous state powder also can use in the mode forming metallic coating.Those skilled in the art can select more than a kind of deposition technique to consider the difference between the visual line characteristics of selected deposition technique and non-line-of-sight feature.In certain embodiments, metallic coating can be deposited on the inside and outside surface of radiation curing structure substantially equably.As required, the suitable method for spray metal in radiation curing structure can be selected.

Those skilled in the art will appreciate that radiation curing structure can be carbonized.The carbonization of radiation curing structure can impel radiation curing structure to become to have electric conductivity.Jacobsen is in U.S. Patent Application Serial Number 11/870, and disclose a kind of method that open vesicular carbon structure and polymer template material make this structure in 379, the full content of this patented claim is incorporated in the application by reference at this.Also the suitable method of other carbonization radiation curing structures can be used.

Should be understood that, can by coating suitable metal oxide or pottery carries out porcelain to radiation curing structure in radiation curing structure.In some exemplary embodiment, can at coated with metal oxide in radiation curing structure at least partially or pottery to obtain bending strength and the conductivity of aspiration level.The people such as Gross are at U.S. Patent Application Serial Number No.12/074, and disclose suitable ceramic structure in 727 and radiation curing structure is carried out to the method for porcelain, the full content of this patented claim is incorporated in the application by reference at this.Also other can be used to carry out the suitable method of porcelain to radiation curing structure.

Method 100 of the present invention can be included in the step applying filtering layer between the first radiation-sensitive materials and the second radiation-sensitive materials.Filtering layer can be another radiation sensitive material layer, and the responsive radiation of the first and second radiation-sensitive materials can not penetrate this filtering layer substantially.Exemplarily, when exposure the first radiation-sensitive materials, this filtering layer prevents the second radiation-sensitive materials to be exposed to multiple radiation beam at least partially.In specific example, filtering layer is optical filter layer.Such as, filtering layer can be arranged between the first radiation-sensitive materials and the second radiation-sensitive materials.Thus when the second radiation-sensitive materials is exposed to the radiation beam from radiation source, filtering layer can stop the radiation beam with selected frequency, amplitude or type to cause forming the first structure in the first radiation-sensitive materials.Filtering layer also can have the radiosensitivity of the susceptibility being different from the first and second radiation-sensitive materials.Therefore, as required, the another kind structure of radiation curing structure also can be formed in filtering layer.

Except below, the embodiments of the invention shown in Fig. 2 with Fig. 3 are similar to the embodiment shown in Fig. 1.For brevity, the step similar with Fig. 1 illustrated in figs. 2 and 3 uses the identical Reference numeral in 200s with 300s instead of 100s to carry out repetition.

As shown in Figure 2, the first radiation curable material has the first susceptibility and the second radiation curable material has the second susceptibility being different from the first susceptibility.Method 200 comprises: the step 202 providing substrate; First radiation curable material is applied to suprabasil step 204; Second radiation curable material is applied to the step 206 in the first radiation curable material; At least one mask is placed on the step 208 between at least one radiation source and the first and second radiation curable material; And make the first and second radiation curable material be exposed to the step 210 of multiple radiation beam by the radiation transmission hole at least one mask.Method 200 comprises the step 212 of the first and second radiation curable material solidifications making to have the first and second different susceptibilitys.Thus the first structure in the first radiation curable material and the second structure in the second radiation curable material are produced and cooperate with each other to form radiation curing structure.It is to be further understood that before the step 212 of solidification second radiation curable material, the first radiation curable material can be uncured at least partly at the interphase boundary of the material with the second radiation-hardenable.After removing uncured radiation curable material, the first and second radiation curable material can be cured to realize bonding at interphase boundary simultaneously.Solidify the uncured at least partly of the first radiation curable material before the step 212 of the second radiation curable material and can improve the adhesion that first is configured to the second structure.It should be further understood that, as required, sensitivity difference between first radiation curable material and the second radiation curable material makes the first structure in the first radiation curable material can be formed before the second structure in the second radiation curable material, or vice versa.

In illustrated examples, the first and second radiation curable material are chosen as has different susceptibilitys to radiation frequency.In certain embodiments, the first and second radiation curable material are light initiation polymerization things.Such as, the first and second radiation curable material can be applied together and eachly be had a susceptibility to different radiation frequencies.First and second radiation curable material side by side or one after the other can be exposed to different radiation frequencies.Such as, after the feature of the first and second structures is initiated in the first and second radiation curable material, each solidification temperature that simultaneously can be heated to expectation in the first and second radiation curable material.Heating can impel the polymerization of the first and second structures and at least one in being cross-linked to occur.Because to be eachly cured at same time in the first and second structures, carries out being polymerized or being cross-linked so the interfacial structural attitude of passing through between the first and second radiation curable material can cross over interphase border.Thus the adhesion level of expectation can be provided between the first and second structures.

In another embodiment, the first and second radiation curable material are photo-curable polymers.If each possessive construction feature in the first and second radiation curable material exposes substantially simultaneously, reaction in each so in the first and second radiation curable material also occurs substantially simultaneously, and polyreaction is crossed over the interphase border between the first and second radiation curable material and occurs.When structural attitude can not expose due to the restriction of such as mask or radiation source all simultaneously, each another the structural attitude that can not enter in the first and second radiation curable material in the first and second radiation curable material can independently be formed.On every side on border, the structural attitude of crossing the boundary can be formed in the first and second radiation curable material simultaneously.Should be understood that, if such as in process-exposed period first and second radiation curable material one as described above is not solidified completely, so these restrictions may can not be very serious.

In another illustrated examples, the first and second radiation curable material are chosen as has different trigger rates.It should be understood that, the light-initiated process of method 200 of the present invention can be radiation intensity and the function of at least one in open-assembly time.Can to be changed in them any one to change process-exposed.The structural attitude had in one of slower trigger rate be formed in such as the first and second radiation curable material is expected to be brought into having in of higher trigger rate in the first and second radiation curable material adjacent thereto.Such as, additional structural attitude can be increased to having in of higher trigger rate in the first and second radiation curable material.After elicitation procedure, the first and second structure solidifications can be made by the temperature of raising first and second radiation curable material.It should be understood that, in order to enable structural attitude cross over interphase border, all features must be initiated before solidification process starts.

In another illustrated examples, the first and second radiation curable material are chosen as has different solidification rates.The first and second radiation curable material that process has a different solidification rate are with to process first and second radiation curable material with different trigger rate closely similar.Should be understood that, the first and second being solidificated between exposure period of structure occur.But in curing rate, identical effect is also suitable for.Such as, the structural attitude had in of slower solidification rate be formed in the first and second radiation curable material is supposed to appear at having in of higher solidification rate in the first and second radiation curable material.As required, there is of higher solidification rate can comprise supplementary features in the first and second radiation curable material.

In additional illustrated examples, the first and second radiation curable material are chosen as the varying sensitivity had emission types.As described above, multiple emission types can be used for causing curing reaction.Usually, solidify (at least one in such as, causing, be polymerized and be cross-linked) electromagnetic radiation by some form is initiated.But other forms of radiation such as particle-beam radiation also can be used for causing solidification in addition.

For light initiation polymerization system system, when the first and second radiation curable material also have the varying sensitivity to emission types, this process and the similar process changing radiation frequency.First and second radiation curable material are applied separately, and have the susceptibility to dissimilar radiation.Then, the first and second radiation curable material can by simultaneously or be one after the other exposed to dissimilar radiation.After structural attitude in the first and second radiation curable material is initiated, each in the first and second radiation curable material is subsequently heated solidification temperature, and the polymerization of possessive construction feature and/or be cross-linked occurs under this solidification temperature.Because structural attitude was formed in the substantially identical time, there is polymerization so the structural attitude of passing through the interphase border between the first and second radiation curable material desirably crosses over interphase border and/or be cross-linked.

For photo-curable polymer system, when each structural attitude of the first and second radiation curable material can both expose substantially simultaneously, so the solidification of the first and second radiation curable material can occur simultaneously.Thus the polyreaction produced can be crossed over the interphase border between the first and second radiation curable material and occur.When structural attitude can not all be exposed due to the restriction of such as mask or radiation source substantially simultaneously, the structural attitude that can not enter the second radiation curable material in the first radiation curable material can independently be formed.On every side on interphase border, the structural attitude of passing through interphase border can be formed in the first and second radiation curable material simultaneously.

As shown in Figure 3, the first radiation-curable decomposing material has the first susceptibility, and the second radiation-curable decomposing material has the second susceptibility being different from the first susceptibility.Method 300 comprises: the step 302 providing substrate; First radiation-curable decomposing material is applied to suprabasil step 304; Second radiation-curable decomposing material is applied to the step 306 on the first radiation-curable decomposing material; At least one mask is placed on the step 308 between at least one radiation source and the first and second radiation-curable decomposing materials; And make the first and second radiation-curable decomposing materials be exposed to the step 310 of multiple radiation beam by the radiation transmission hole at least one mask.Method 300 comprises the step 312 of decomposing and having the first and second radiation-curable decomposing materials of the first and second different susceptibilitys further.Thus the first structure in the first radiation-curable decomposing material and the second structure in the second radiation-curable decomposing material are formed and are cooperated with each other to form radiation curing structure.Should be understood that, sensitivity difference between first radiation-curable decomposing material and the second radiation-curable decomposing material makes the first structure in the first radiation-curable decomposing material can be formed before the second structure in the second radiation-curable decomposing material, or as required, vice versa.

In illustrated examples, the first and second radiation-curable decomposing materials are chosen as the varying sensitivity had radiation frequency.When the first and second radiation-curable decomposing materials are such as positive corrosion-resisting agents, the first and second radiation-curable decomposing materials make the first and second radiation-curable decomposing materials be exposed to the step 310 of radiation beam before be desirably sufficiently solidified with crosslinked together.Thus the structural attitude expected can be crossed over the interphase border between the first and second radiation-curable decomposing materials and produce.It should be understood that, the first and second radiation-curable decomposing materials can be exposed to the radiation beam of different frequency by any order, and then exposed region can by dissolution with solvents to leave the first and second structures of expectation.

In another illustrated examples, the first and second radiation-curable decomposing materials are chosen as has different decomposition rates.Should be understood that, when the decomposition rate of the first and second radiation-curable decomposing materials is different, complicated structure can be produced.Those skilled in the art are appreciated that, will be appeared in formed whole radiation curing structure by the hole making the step 310 exposed with the slowest decomposition rate in the first and second radiation-curable decomposing materials produce.Additional materials can remove in one of high de-agglomeration speed from having the first and second radiation-curable decomposing materials, and can not have another of slower decomposition rate in the radiation-curable decomposing material of appreciable impact first and second.But the marked difference between each decomposition rate is normally expected.As non-limiting example, when only there being two kinds of radiation-curable decomposing materials, the decomposition rate difference of about 10:1 is just enough; When there being three kinds of radiation-curable decomposing materials, the decomposition rate difference of about 100:1 is just enough; When there being the radiation-curable decomposing material more than three kinds, the decomposition rate difference of about 10,000:1 is just enough.As required, the corresponding decomposition rate of radiation-curable decomposing material can be selected.

In another illustrated examples, the first and second radiation-curable decomposing materials may be selected to be the varying sensitivity had emission types.By have the method for radiation curing structure is formed to the first and second radiation-curable decomposing materials of the susceptibility of different emission types can to mentioned above to have the method for varying sensitivity to frequency similar.As non-limiting example, the first radiation-curable decomposing material can to electromagnetic radiation sensitivity, and the second radiation-curable decomposing material can be responsive to particle-beam radiation.But should be understood that, be desirably chosen as to the first radiation-curable decomposing material of electromagnetic radiation sensitivity the minimum sensivitity had particle-beam radiation, vice versa.

Be surprisingly found out that, according to method 100,200,300 of the present invention, the selectivity of stacked radiation-sensitive materials exposes can reduce to minimum by the production cost of radiation curing structure and Production Time.By all lamination operation being concentrated in together, the making of complicated radiation curing structure can be carried out now on identical production line with identical equipment.Do not move radiation-sensitive materials by the radiation source of unlatching masked, different radiation-sensitive materials just can be made to be exposed to multiple radiation beam.Thus method 100,200,300 prevents the dislocation that usually causes when location mask and radiation-sensitive materials repeatedly and tolerance issues.Radiation curing structure of the present invention also can be made when not needing the finishing operations performed in dynamo-electric manufacturing process.Also single clean operation can be used after radiation curing structure is made to remove uncured radiation-sensitive materials.Similarly, single metallization, carbonization and porcelainization operation also can be used to make radiation curing structure with the feature making radiation curing structure have expectation.

Referring now to Fig. 4 A-4C, method of the present invention can comprise the special susceptibility method of use and make microstructure 400.Although microstructure 400 is depicted as cantilever at Fig. 4 A-4C, should be understood that, the formation of other shapes of microstructure 400 also within the scope of the present invention.

First the method making microstructure 400 comprises the step providing the first radiation-sensitive materials and the second radiation-sensitive materials, such as, respectively as the ground floor 402 be arranged in above substrate 406 and the second layer 404.Ground floor 402 has the first susceptibility, and the second layer 404 has the second susceptibility being different from the first susceptibility.Then the first mask 408 is placed between at least one radiation source (not shown) and first and second layer 402,404.First mask 408 has the first radiation transmission hole 410 of at least one the basic transmission be formed in wherein.Then make ground floor 402 and the second layer 404 be exposed to multiple first radiation beam 412, the first radiation-sensitive materials of ground floor 402 is to this radiation beam sensitivity and the second radiation-sensitive materials of the second layer 404 is responsive to it.Multiple first radiation beam 412 constructs with form microstructure 400 in ground floor 402 first through the first radiation transmission hole 410 in the first mask 408.Then replace the first mask 408 with the second mask 414, this second mask has the second radiation transmission hole 416 of at least one the basic transmission be formed in wherein.Then make ground floor 402 and the second layer 404 be exposed to multiple second radiation beam 418, the second radiation-sensitive materials of the second layer 404 is to this radiation beam sensitivity and the first radiation-sensitive materials of ground floor 402 is responsive to it.Multiple second radiation beam 418 constructs with form microstructure 400 in the second layer 404 second through the second radiation transmission hole 416 in the second mask 414.Remove the second mask 414 and remove the first and second unnecessary radiation-sensitive materials from substrate 406.The microstructure 400 formed by the first and second tectonic syntaxiss is provided thus.

In another embodiment shown in Fig. 5 A-5C, method of the present invention can comprise the susceptibility method making microstructure 500 using overlap.Although microstructure 500 is truss and grid network shown in Fig. 5 A-5C, should be understood that, the formation of other shapes also within the scope of the present invention.

First the method making microstructure 500 comprises the step providing the first radiation-sensitive materials and the second radiation-sensitive materials, such as, respectively as ground floor 502 and the second layer 504.Ground floor 502 is arranged in above substrate 502, and the second layer 504 is arranged in above ground floor 502.Ground floor 502 has the first susceptibility, and the second layer 504 has the second susceptibility being different from the first susceptibility.In this embodiment, the second layer 504 also shares the first susceptibility with ground floor 502.Then the first mask 508 is placed between at least one radiation source (not shown) and first and second layer 502,504.First mask 508 has the first radiation transmission hole 510 of at least one the basic transmission be formed in wherein.Then make ground floor 502 and the second layer 504 be exposed to multiple first radiation beam 512, the first radiation-sensitive materials of ground floor 502 is to this radiation beam sensitivity and the second radiation-sensitive materials of the second layer 504 is also responsive to it.Multiple first radiation beam 512 constructs with form microstructure 500 in ground floor 502 and the second layer 504 first through the first radiation transmission hole 510 in the first mask 508.Then replace the first mask 508 with the second mask 514, this second mask has the second radiation transmission hole 516 of at least one the basic transmission be formed in wherein.Then make ground floor 502 and the second layer 504 be exposed to multiple second radiation beam 518, the second radiation-sensitive materials of the second layer 504 is to this radiation beam sensitivity and the first radiation-sensitive materials of ground floor 502 is responsive to it.Multiple second radiation beam 518 constructs with form microstructure 500 in the second layer 504 second through the second radiation transmission hole 516 in the second mask 514.Remove the second mask 514 and remove the first and second unnecessary radiation-sensitive materials from substrate 506.The microstructure 500 formed by the first and second tectonic syntaxiss is provided thus.

Exemplarily property embodiment, microstructure 500 is the fully-integrated flow field truss and diamond grid dispersive medium that are formed by two of resist melting layers.As non-limitative example, ground floor 502 can comprise the PerMX buied from E.I. du Pont de Nemours and company ^tMresist, and the second layer 504 can comprise SU-8 ^tMresist.PerMX ^tMthe ground floor 502 that resist is formed is arranged in the bottom in substrate 506, and SU-8 ^tMthe second layer 504 that resist is formed is arranged in the top layer on ground floor 502.Such as, PerMX ^tMand SU-8 ^tMall share ultraviolet identical first susceptibility of the predetermined wavelength to about 365 nanometers.As described herein, under the UV exposure effect of the predetermined wavelength of 365 nanometers of having an appointment, flow field polymkeric substance truss is formed in PerMX ^tMthe ground floor 502 formed and SU-8 ^tMin the second layer 504 that layer is formed.Only has SU-8 ^tMthe second layer 504 that resist is formed has extra light trigger, and it such as allows lattice to be optionally formed in the second layer 504 when being exposed to the visible ray of predetermined wavelength of about 470 nanometers.Once be exposed to the visible ray of the predetermined wavelength of about 470 nanometers, diamond grid is just formed in the second layer 504.After this twice exposure, be wholely stackedly developed the non-exposed region removing ground floor 502 and the second layer 504.Construct the single associating microstructure 500 comprising flow field polymkeric substance truss and diamond grid thus.

Advantageously, the integrated level that obtained higher than fuel cell configurations and the standard photolithography process of prior art of the integrated level that provides of the method shown in Fig. 4 A-4C and 5A-5C.

Also be surprisingly found out that, Fig. 5 A-5C shows overlapping susceptibility embodiment, wherein ground floor 502 has the first susceptibility, and the second layer 504 has the first susceptibility and the second susceptibility, this embodiment is satisfactory especially in extensive manufacturing operation, in these extensive manufacturing operations, it is difficult point that equipment aims at cost, mask fabrication tolerance and polymer recovery.Especially, when microstructure 500 be arranged through ground floor 502 with both second layers 504 to be firmly connected between these two time, overlapping susceptibility minimizes the demand of relative to each other accurately aiming to the first and second masks 508,514, otherwise this is by necessary for the complete cross-section at the interphase place be to provide between ground floor 502 and the second layer 504.According to the ratio of full fuel cell component, when not using overlapping susceptibility method, even if the little thermal dilation difference between the first mask 508 with the second mask 514 also will change significant interval and makes aiming in gamut be difficult to be guaranteed.Overlapping susceptibility embodiment advantageously allows to produce for the angled of continuous structure feature and vertical features by minimum number of steps within the same layer further.

When be desirably in single clear operation reclaim do not expose polymkeric substance, it is to be further understood that when removing the first and second radiation-sensitive materials from substrate 506, the ground floor 502 of recovery and the light trigger of the second layer 504 normally mix.In special susceptibility process, the potpourri of the radiation-sensitive materials of recovery is not easy to be suitable for reusing in ground floor 502 or the second layer 504.But, in overlapping susceptibility method, the second radiation-sensitive materials radiation-sensitive materials of the recovery with Lazer's sensitivity being added to the primary radiation sensitive material such as second layer 504 with Lazer's sensitivity proves acceptable.Therefore, method of the present invention is satisfactory especially in extensive manufacturing operation.

Although show some representational embodiment and details in order to demonstrate the invention, but it will be apparent to those skilled in the art that, can make various change when not deviating from scope of the present invention, scope of the present invention will be set forth in the following claims further.

Claims

1., for making a method for radiation curing structure, the method comprises the steps:

Substrate provides the first radiation curable material, described first radiation curable material has the first susceptibility, and described first susceptibility comprises the first solidification rate, the first trigger rate, the susceptibility to the first radiation frequency, the susceptibility to the first radiation magnitude and at least one in the susceptibility of the first emission types;

Contiguous described first radiation curable material provides the second radiation curable material, described second radiation curable material has the second susceptibility, described second susceptibility comprises the second solidification rate, the second trigger rate, the susceptibility to the second radiation frequency, the susceptibility to the second radiation magnitude and at least one in the susceptibility of the second emission types, and described second susceptibility is different from described first susceptibility;

Be placed on by first mask between at least one radiation source and the first and second radiation curable material, described first mask has the radiation transmission hole of multiple basic transmission;

The first and second radiation curable material are made to be exposed to multiple first radiation beams through the radiation transmission hole in described first mask; Wherein, the first radiation curable material is responsive to the first radiation beam, and the second radiation curable material is insensitive to the first radiation beam;

Multiple first radiation beam constructs to form first in the first radiation curable material through the radiation transmission hole in the first mask;

Replace the first mask with the second mask, the second mask has the radiation transmission hole of multiple basic transmission;

The first and second radiation curable material are made to be exposed to multiple second radiation beams through the radiation transmission hole in described second mask; Wherein, the second radiation curable material is responsive to the second radiation beam, and the first radiation curable material is insensitive to the second radiation beam;

Multiple second radiation beam constructs to form second in the second radiation curable material through the radiation transmission hole in the second mask;

Remove the second mask and remove the first and second unnecessary radiation curable material from substrate;

And

Described first structure and described second constructs and cooperates with each other to form described radiation curing structure thus.

2., for making a method for radiation curing structure, the method comprises the steps:

Substrate provides the first radiation-curable decomposing material, described first radiation-curable decomposing material has the first susceptibility, and described first susceptibility comprises the first decomposition rate, the susceptibility to the first radiation frequency, the susceptibility to the first radiation magnitude and at least one in the susceptibility of the first emission types;

Be placed on by first mask between radiation source and the first and second radiation-curable decomposing materials, described first mask has the radiation transmission hole of multiple basic transmission;

The first and second radiation-curable decomposing materials are made to be exposed to multiple first radiation beams through the radiation transmission hole in described first mask, wherein, the first radiation-curable decomposing material is to the first radiation beam is responsive and the second radiation-curable decomposing material is also responsive to the first radiation beam;

Multiple first radiation beam constructs to form first in the first radiation-curable decomposing material and the second radiation-curable decomposing material through the radiation transmission hole in the first mask;

Replace the first mask with the second mask, described second mask has the radiation transmission hole of multiple basic transmission;

The first and second radiation-curable decomposing materials are made to be exposed to multiple second radiation beams through the radiation transmission hole in described second mask, wherein, second radiation-curable decomposing material is responsive to the second radiation beam, and the first radiation-curable decomposing material is insensitive to the second radiation beam;

Multiple second radiation beam constructs to form second in the second radiation-curable decomposing material through the radiation transmission hole in the second mask;

Remove the second mask and remove the first and second unnecessary radiation-curable decomposing materials from substrate;

Described first structure and described second constructs and cooperates with each other to form described radiation curing structure thus; And

Reclaim the first and second radiation-curable decomposing materials removed to be added in original second radiation-curable decomposing material.